CN113675165A - Display device and method for manufacturing the same - Google Patents
Display device and method for manufacturing the same Download PDFInfo
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- CN113675165A CN113675165A CN202110923402.9A CN202110923402A CN113675165A CN 113675165 A CN113675165 A CN 113675165A CN 202110923402 A CN202110923402 A CN 202110923402A CN 113675165 A CN113675165 A CN 113675165A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 15
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- 239000000523 sample Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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- 239000013013 elastic material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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Abstract
The invention discloses a display device and a manufacturing method thereof, wherein the display device comprises a display panel, a plurality of first conductive patterns, a plurality of first secondary connecting pads and a plurality of second secondary connecting pads. The display panel is provided with a display area and a peripheral area of the peripheral area, the peripheral area is closer to the third surface than the display area, each first main connecting pad at least partially overlaps the corresponding second main connecting pad in the normal direction of the display panel, and the first main connecting pads are arranged along a first direction. The first conductive patterns are respectively electrically connected to the corresponding first main connecting pads and the corresponding second main connecting pads. The first sub-pads are respectively adjacent to and electrically connected to the corresponding first main pads, wherein the length of each first sub-pad is greater than the length of each first main pad in a second direction perpendicular to the first direction. The second sub-pads are respectively adjacent to and electrically connected to the corresponding second main pads, wherein each first sub-pad at least partially overlaps the corresponding second sub-pad in a normal direction of the display panel.
Description
Technical Field
The present invention relates to a display device, and more particularly, to a display device and a method of manufacturing the same.
Background
In response to the diversified applications of display devices, various manufacturing techniques and product designs are continuously developed. In order to provide more versatile applications, narrow-frame or frameless products are proposed. For example, a narrow-frame or frameless product can be applied to a tiled product (e.g., a tiled display panel) in addition to a functional area (e.g., a display area, a touch area, etc.) with a larger area.
Disclosure of Invention
The invention provides a display device which can have a reduced frame width.
The invention provides a method for manufacturing a display device, which can conveniently repair a failed line.
The display device of the invention comprises a display panel, a plurality of first conductive patterns, a plurality of first secondary connecting pads and a plurality of second secondary connecting pads. The display panel is provided with a first surface, a second surface, a third surface between the first surface and the second surface, a display area and a peripheral area, wherein the display area and the peripheral area are opposite, the third surface is arranged between the first surface and the second surface, the display area and the peripheral area are arranged on the first surface, the peripheral area is closer to the third surface than the display area, each first main connecting pad at least partially overlaps the corresponding second main connecting pad in the normal direction of the display panel, and the first main connecting pads are arranged along a first direction. The first conductive patterns are respectively electrically connected to the corresponding first main connecting pads and the corresponding second main connecting pads. The first sub-pads are respectively adjacent to and electrically connected to the corresponding first main pads, wherein the length of each first sub-pad is greater than the length of each first main pad in a second direction perpendicular to the first direction. The second sub-pads are respectively adjacent to and electrically connected to the corresponding second main pads, wherein each first sub-pad at least partially overlaps the corresponding second sub-pad in a normal direction of the display panel.
The invention provides a manufacturing method of a display device, which comprises the steps of providing a display panel, wherein the display panel is provided with a first surface, a second surface, a third surface, a display area and a peripheral area, the third surface is positioned between the first surface and the second surface, the display area is positioned on the first surface, the peripheral area comprises a plurality of first main connecting pads arranged on the peripheral area and a plurality of second main connecting pads arranged on the second surface, the peripheral area is closer to the third surface than the display area, each first main connecting pad at least partially overlaps the corresponding second main connecting pad in the normal direction of the display panel, and the first main connecting pads are arranged along a first direction. A plurality of first sub-pads are formed on the first surface, wherein the first sub-pads are respectively adjacent and electrically connected to the corresponding first main pads, and the length of each first sub-pad is greater than that of each first main pad in a second direction perpendicular to the first direction. And forming a plurality of second secondary connecting pads on the second surface, wherein the second secondary connecting pads are respectively adjacent and electrically connected to the corresponding second main connecting pads, and each first secondary connecting pad is at least partially overlapped with the corresponding second secondary connecting pad in the normal direction of the display panel. A plurality of first conductive patterns are formed on the display panel, wherein the first conductive patterns are electrically connected to the corresponding first main pads and the corresponding second main pads respectively. And detecting a resistance value between at least one of the first main connecting pads and the corresponding second main connecting pad to be used as a basis for judging whether the corresponding first conductive pattern is invalid or not, wherein when the corresponding first conductive pattern is invalid, at least one second conductive pattern is formed on the display panel, and the at least one second conductive pattern is electrically connected with the first secondary connecting pad and the second secondary connecting pad corresponding to the invalid first conductive pattern.
In an embodiment of the invention, a length of each of the first main pads in the first direction is greater than a length of each of the first sub-pads in the first direction.
In an embodiment of the invention, the at least one second conductive pattern is electrically connected between the corresponding first sub-pad and the corresponding second sub-pad.
In an embodiment of the invention, a material of the second conductive pattern is different from a material of the first conductive pattern.
In an embodiment of the invention, the package structure further includes a passivation layer covering the first main pads, the first sub-pads, the second main pads, the second sub-pads, the first conductive patterns and at least one second conductive pattern.
In an embodiment of the invention, the at least one second conductive pattern covers the first secondary pad and the first main pad on the first surface, and covers the second secondary pad and the second main pad on the second surface.
In an embodiment of the invention, an area of each of the first main pads is smaller than an area of each of the second main pads, and an area of each of the first sub-pads is smaller than an area of each of the second sub-pads.
In an embodiment of the invention, each of the first sub-pads is connected to each of the first main pads through a conductive trace, and each of the second sub-pads is connected to each of the second main pads through a conductive trace.
In an embodiment of the invention, in the step of detecting the resistance value between at least one of the first main pads and the corresponding second main pad, the resistance value is obtained by detecting the corresponding first sub-pad and the second sub-pad.
In view of the above, in the display device and the manufacturing method thereof of the present invention, the first sub-pads are respectively adjacent and electrically connected to the corresponding first main pads, and the second sub-pads are respectively adjacent and electrically connected to the corresponding second main pads. When the first conductive pattern between the first main connecting pad and the second main connecting pad is invalid, the newly added second conductive pattern is electrically connected with the first secondary connecting pad and the second secondary connecting pad corresponding to the invalid first conductive pattern so as to repair the bad condition between the first main connecting pad and the second main connecting pad.
Drawings
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Fig. 1A to 5 show some steps of manufacturing a display device according to an embodiment of the invention.
Fig. 6A is a schematic top view of the display device of fig. 3A.
Fig. 6B is a schematic bottom view of the display device of fig. 3B.
Fig. 7A and 7B are schematic top and bottom views of a display device according to another embodiment of the invention.
Fig. 8A and 8B are schematic perspective views of a display device according to another embodiment of the invention at different viewing angles.
Fig. 9 is a schematic perspective view of the display device and the protective layer of fig. 8A.
Description of the symbols
100. 100', 100B, 100C display device
110 display panel
112 first surface
114 third surface
116 second surface
120 first main pad
130 second main connecting pad
140 first conductive pattern
150 etch resist layer
160 first time pad
1601 position
170 the second time connecting pad
1701 position
180. 180B, 180C second conductive pattern
190. 190C protective layer
A1 display area
E1 peripheral area
A-A, B-B
L1, L2, L3, L4 Length
W1, W2 conductive line
X, Y, Z direction
Detailed Description
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, without departing from the spirit or scope of the present invention.
In the drawings, the thickness of layers, films, panels, regions, etc. have been exaggerated for clarity. Like reference numerals refer to like elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Further, "electrically connected" or "coupled" may mean that there are additional elements between the two elements.
Furthermore, relative terms, such as "lower" or "bottom" and "upper" or "top," may be used herein to describe one element's relationship to another element, as illustrated. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" can include both an orientation of "lower" and "upper," depending on the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" may include both an orientation of above and below.
As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable range of deviation of the specified value as determined by one of ordinary skill in the art, taking into account the measurement in question and the specified amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%. Further, as used herein, "about", "approximately" or "substantially" may be selected based on optical properties, etch properties, or other properties, with a more acceptable range of deviation or standard deviation, and not all properties may be applied with one standard deviation.
Exemplary embodiments are described herein with reference to cross-sectional views that are schematic illustrations of idealized embodiments. Thus, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or (and/or) tolerances, are to be expected. Thus, the embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region shown or described as flat may generally have rough and/or nonlinear features. Further, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In general, seamless tiling has been a trend in tiled display devices. The display device can utilize a side wire design to extend the wires on the front side of the display panel to the back side of the display panel through the side surface of the display panel, so that the front side of the display panel is electrically connected to the back side of the display panel, and a chip, an integrated circuit or a wire can be bonded on the back side of the display panel, so that the element configuration of the peripheral area on the front side of the display panel can be reduced, the area of the peripheral area on the front side of the display panel can be reduced, and the screen occupation ratio of the display device can be improved. The above-mentioned side wire design can be obtained by, for example, sputtering copper on the display panel, covering the copper with an anti-etching layer, and etching. However, when the circuit is tested to be defective, the repair (repair) cannot be performed directly, and the conductive material needs to be added on the original conductive pad of the display panel after the original etching-resistant layer is removed. The method of removing the anti-etching layer is, for example, by using a laser, but since the side wires are three-dimensional structures (e.g., U-shaped) distributed on the front, side and back of the display panel, the positioning and control of the laser are not easy. The present invention provides a display device and a method of manufacturing the same, which can solve the above problems.
In the drawings, the X direction, the Y direction, and the Z direction are denoted to show the arrangement relationship of the members in the drawing, and the X direction, the Y direction, and the Z direction intersect with each other, but are not limited to being orthogonal to each other. Fig. 1A to 5 show some steps of manufacturing a display device according to an embodiment of the invention. It should be noted that fig. 1B and fig. 3B are schematic perspective views of fig. 1A and fig. 3A from another perspective, respectively, the cross-sectional structure of fig. 2 may correspond to a line a-a of fig. 1, and the cross-sectional structure of fig. 4 may correspond to a line B-B of fig. 3A.
In fig. 1A, the display panel 110 has a first surface 112, a second surface 116, a third surface 114 between the first surface 112 and the second surface 116, and a display area a1 and a peripheral area E1 (the display area a1 and the peripheral area E1 are schematically distinguished by dashed lines) on the first surface 112. The peripheral region E1 is closer to the third surface 114 than the display region a 1. The display panel 110 has a certain mechanical strength and can support an object, such as a plurality of films and/or a plate on which a plurality of objects are disposed.
Here, the normal direction of the third surface 114 is different from the normal direction of the first surface 112 and is also different from the normal direction of the second surface 116. In some embodiments, the normal direction of the first surface 112 and the normal direction of the second surface 116 may be parallel to each other, but not limited thereto. For example, the first surface 112 and the second surface 116 are planes parallel to the X-Y direction, and the third surface 114 is a plane parallel to the Y-Z direction. In still other embodiments, the features provided on the third surface 114 may be applied to other third surfaces, such as a third surface that is parallel to a plane in the X-Z direction. In some embodiments, a pixel circuit structure (not shown in fig. 1A) including an electrical connection to the first main pad 120 may be further disposed on the first surface 112 of the display panel 110.
In fig. 1A and 1B, a plurality of first main pads 120 are pre-formed in the peripheral region E1 of the first surface 112. A plurality of second main pads 130 are pre-formed on the second surface 116. The first main pads 120 and the second main pads 130 are arranged along the Y direction. In addition, the first main pads 120 and the second main pads 130 may be disposed on a single side of the display panel 110, or disposed on two opposite sides of the display panel 110, and the number and the arrangement of the first main pads 120 and the second main pads 130 may be determined according to actual requirements, as long as the first main pads 120 and the second main pads 130 correspond to each other, which falls within the protection scope of the present invention.
In fig. 2, the first main pads 120 at least partially overlap the corresponding second main pads 130 in a normal direction of the display panel 110. For example, the first main pads 120 at least partially overlap the corresponding second main pads 130 in the Z-direction.
With reference to fig. 1A and 1B, a plurality of first sub-pads 160 are formed on the first surface 112, wherein the first sub-pads 160 are respectively adjacent to and electrically connected to the corresponding first main pads 120. A plurality of second sub-pads 170 are formed on the second surface 116, wherein the second sub-pads 170 are respectively adjacent to and electrically connected to the corresponding second main pads 130.
Next, a plurality of first conductive patterns 140 are formed on the display panel 110. The first conductive patterns 140 are disposed in the peripheral region E1 of the display panel 110 and may be arranged along the Y direction. Two ends of the first conductive pattern 140 are respectively connected to the corresponding first main pad 120 and the corresponding second main pad 130. The first conductive patterns 140 may contact and directly cover the corresponding first main pads 120 and the corresponding second main pads 130 to electrically connect the corresponding first main pads 120 and the corresponding second main pads 130.
In this embodiment, the first conductive pattern 140 may continuously extend from the first surface 112 to the third surface 114 and then to the second surface 116. Here, the first conductive patterns 140 are metal wires, and may be formed on the display panel 110 by edge sputtering, but the invention is not limited thereto. For example, the first conductive pattern 140 is formed by sputtering copper on the display panel 110. Next, an etch-resistant layer is formed over the copper, and then a remaining etch-resistant layer 150 (fig. 2) is formed by etching to cover the corresponding first conductive pattern 140. Such an approach can stably control the resistance between the corresponding first main pad 120 and the corresponding second main pad 130. Note that the illustration of the etch-resistant layer 150 of fig. 2 is omitted in the subsequent figures.
In some embodiments, the first conductive pattern 140 may be electrically connected to a pixel circuit structure disposed on the display panel 110. The first main pads 120 are disposed on the first surface 112 of the display panel 110 and are used for providing an electrical transmission channel to electrically connect pixel circuit structures (not shown) on the display panel 110 to the second main pads 130 and to other components on the second surface 116, such as a driving chip, an integrated circuit or traces. In the process of fabricating the first main pad 120 on the first surface 112 of the display panel 110, a pixel circuit structure may be fabricated on the first surface 112. So-called pixel circuit structures may include active (active) elements, capacitors, signal lines, etc. Meanwhile, the first main pad 120 may be connected to a signal line in the pixel circuit structure for transmitting an electrical signal to the pixel circuit structure. In some embodiments, the display device 100 further comprises a functional element disposed on the first surface 112 to provide a desired function. For example, the functional element may include a display element or the like. The pixel circuit structure can be used to drive functional elements, so that the display device 100 provides display functions, and the like.
Under the above configuration, the display device 100 as shown in fig. 2 is obtained. In some embodiments, the electrical properties of the side wires are monitored using upper and lower probes. Since the sub-pads are electrically connected to the corresponding main pads, the upper and lower probes can test the resistance between the corresponding two main pads by contacting the two sub-pads corresponding to each other on the upper and lower surfaces of the display panel, which is not limited in the present invention.
The resistance between at least one of the first main pads 120 and the corresponding second main pad 130 is detected as a criterion for determining whether the corresponding first conductive pattern 140 is failed. When a disconnection or an excessive resistance or an abnormality between at least one of the first main pads 120 and the corresponding second main pad 130 is detected, it is determined to be a failure. In the step of detecting the resistance between at least one of the first main pads 120 and the corresponding second main pad 130, the resistance is obtained by detecting the corresponding first sub-pad 160 and second sub-pad 170. Referring to fig. 3A and 3B, when it is determined that the corresponding first conductive pattern 140 is failed, at least one second conductive pattern 180 is formed on the display panel 110. The second conductive pattern 180 is electrically connected to the first sub-pad 160 and the second sub-pad 170 corresponding to the failed first conductive pattern 140, so as to obtain the repaired display device 100'. It should be noted that, in fig. 3A and 3B, only one second conductive pattern 180 is schematically illustrated, but in practice, the number of the second conductive patterns 180 may depend on the number of the failed first conductive patterns 140, and the invention is not limited thereto.
Referring to fig. 4, in the embodiment, each of the first sub-pads 160 at least partially overlaps the corresponding second sub-pad 170 in the normal direction of the display panel 110. For example, each first sub-pad 160 at least partially overlaps the corresponding second sub-pad 170 in the Z-direction. In the embodiment, the second conductive pattern 180 covers a portion of the first sub-pad 160 and a portion of the second sub-pad 170.
That is, the defect between the first main pad 120 and the second main pad 130 is repaired by additionally adding the second conductive pattern 180. In this way, the process of removing the anti-etching layer 150 on the failed first conductive pattern 140 can be omitted, so as to achieve the effects of shortening the time and improving the process yield.
In fig. 5, a protection layer 190 may be formed on the edge of the display panel 110. The passivation layer 190 covers the plurality of first main pads 120, the plurality of second main pads 130, the plurality of first conductive patterns 140, the plurality of first sub-pads 160, the plurality of second sub-pads 170, and the second conductive patterns 180, so as to achieve the protection effects of insulation.
In the present embodiment, the material of the second conductive pattern 180 is different from the material of the first conductive pattern 140. For example, the second conductive pattern 180 may be formed on the display panel 110 by a transfer printing method. The second conductive pattern 180 is, for example, silver paste. In some manufacturing processes, the second conductive pattern 180 may be coated or applied on a printing tool, and then the printing tool is aligned to and pressed against the third surface 114 of the display panel 110, so that the second conductive pattern 180 on the printing tool is attached to the third surface 114 of the display panel 110. Alternatively, the printing tool may be made of an elastic material, such as rubber or the like. Therefore, when the printing tool is aligned and pressed against the third surface 114 of the display panel 110, the edge end is lightly pressed to attach the second conductive pattern 180 on the printing tool to the edges of the first surface 112 and the second surface 116 of the display panel 110. For example, the printing tool can move toward the display panel 110 along the X direction during the printing process to transfer the second conductive pattern 180 onto the first surface 112, the second surface 116, and the third surface 114. In other embodiments, the second conductive pattern 180 may be attached to the display panel 110 by spraying or other suitable methods, which are not limited to the above.
Fig. 6A is a schematic top view of the display device of fig. 3A. Fig. 6B is a schematic bottom view of the display device of fig. 3B. Referring to fig. 6A, in the present embodiment, the first sub-pads 160 are connected to the first main pads 120 by conductive traces W1. Referring to fig. 6B, in the present embodiment, the second sub-pads 170 are connected to the second main pads 130 by conductive traces W2. In the embodiment, the conductive traces W1 and W2 are straight lines, but in other embodiments, the conductive traces W1 and W2 may also be turning lines, and the disclosure is not limited thereto. In other embodiments, the first sub-pads 160 and the first main pads 120 may be directly connected, and the second sub-pads 170 and the second main pads 130 may be directly connected, which is not limited in the present invention.
Referring to fig. 6A, the length L1 of the first main pad 120 in the first direction is greater than the length L2 of the first sub-pad 160 in the first direction. In a second direction perpendicular to the first direction, the length L4 of the first sub-pads 160 is greater than the length L3 of the first main pads 120. Here, the first direction is, for example, a Y direction, and the second direction is, for example, an X direction. Accordingly, the upper probe may contact where location 1601 of FIG. 6A points. Similarly, the lower probe may also contact the location 1701 of FIG. 6B to measure the resistance between the first main pad 120 and the second main pad 130. Specifically, a position 1601 in fig. 6A is a portion of the second conductive pattern 180 exposed to the first sub-pad 160, and a position 1701 in fig. 6B is a portion of the second conductive pattern 180 exposed to the second sub-pad 170. The region of location 1601 of fig. 6A and location 1701 of fig. 6B is large, which facilitates detection. In other embodiments, the area ranges of the location 1601 and the location 1701 may depend on the actual process requirements, and are not limited thereto.
In addition, in the embodiment, considering that the first surface 112 has the display area a1, the area of each first main pad 120 on the first surface 112 is smaller than the area of each second main pad 130 on the second surface 116, and the area of each first sub-pad 160 on the first surface 112 is smaller than the area of each second sub-pad 170 on the second surface 116. In other words, since the second surface 116 is not limited by the display area a1, the areas of the second main pads 130 and the second sub-pads 170 can be designed to be larger for facilitating the probe contact, but the invention is not limited thereto.
Fig. 7A and 7B are schematic top and bottom views of a display device according to another embodiment of the invention. Referring to fig. 7A and 7B, in the present embodiment, a display device 100B is slightly different from the display device 100' of fig. 6A and 6B in that: coverage of the second conductive pattern 180B.
In the embodiment, the second conductive pattern 180B covers the first sub-pad 160 and the first main pad 120 on the first surface 112, and the second conductive pattern 180B covers the second sub-pad 170 and the second main pad 130 on the second surface 116, but the invention is not limited thereto. In the embodiment, the second conductive pattern 180B covers the conductive traces W1, W2, but in other embodiments, the conductive traces W1, W2 may be omitted by electrically connecting the first sub-pad 160 and the first main pad 120 through one end of the second conductive pattern 180B, and electrically connecting the second sub-pad 170 and the second main pad 130 through the other end.
Fig. 8A and 8B are schematic perspective views of a display device according to another embodiment of the invention at different viewing angles. Fig. 9 is a schematic perspective view of the display device and the protective layer of fig. 8A. Referring to fig. 8A and 8B, in the present embodiment, a display device 100C is slightly different from the display device 100' of fig. 6A and 6B in that: a plurality of second conductive patterns 180C are formed on the display panel 110 and electrically connected between the first sub-pads 160 and the second sub-pads 170, respectively. In other words, the second conductive pattern 180C is added between each first sub-pad 160 and the corresponding second sub-pad 170. The advantage of this is that the alignment time can be saved, and the stability of resistance value can be increased by repairing multiple lines simultaneously. Referring to fig. 9, finally, a protection layer 190C may be formed on the edge of the display panel 110 to achieve the protection effects of insulation and the like.
In summary, in the display device and the manufacturing method thereof of the present invention, the first sub-pads are respectively adjacent and electrically connected to the corresponding first main pads, and the second sub-pads are respectively adjacent and electrically connected to the corresponding second main pads. When the first conductive pattern between the first main connecting pad and the second main connecting pad is invalid, the newly added second conductive pattern is electrically connected with the first secondary connecting pad and the second secondary connecting pad corresponding to the invalid first conductive pattern so as to repair the bad condition between the first main connecting pad and the second main connecting pad and achieve the effects of shortening the time course and improving the process yield. In another embodiment, even if the first conductive pattern between one of the first main pads and the corresponding second main pad is not failed, the second conductive pattern is still added between the corresponding first sub-pad and the corresponding second sub-pad, so that the alignment time can be saved, and the multi-line simultaneous repair can further increase the stability of the resistance value.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A display device, comprising:
a display panel having a first surface, a second surface, a third surface between the first surface and the second surface, a display region on the first surface, and a peripheral region, wherein the display region is closer to the third surface than the peripheral region, the peripheral region includes a plurality of first main pads disposed on the peripheral region and a plurality of second main pads disposed on the second surface, each of the first main pads at least partially overlaps the corresponding second main pad in a normal direction of the display panel, and the first main pads are arranged along a first direction;
a plurality of first conductive patterns electrically connected to the corresponding first main pads and the corresponding second main pads, respectively;
a plurality of first sub-pads, each of which is adjacent to and electrically connected to the corresponding first main pad, wherein the length of each first sub-pad is greater than the length of each first main pad in a second direction perpendicular to the first direction; and
and a plurality of second sub-pads which are adjacent to each other and electrically connected to the corresponding second main pads, wherein each of the first sub-pads at least partially overlaps the corresponding second sub-pad in a normal direction of the display panel.
2. The display device of claim 1, wherein the length of each of the first main pads in the first direction is greater than the length of each of the first sub-pads in the first direction.
3. The display device of claim 1, further comprising at least one second conductive pattern electrically connected between the corresponding first sub-pad and the corresponding second sub-pad.
4. The display device according to claim 3, wherein a material of the second conductive pattern is different from a material of the first conductive pattern.
5. The display device of claim 3, further comprising a passivation layer covering the first main pads, the first sub-pads, the second main pads, the second sub-pads, the first conductive patterns and the at least one second conductive pattern.
6. The display device of claim 3, wherein the at least one second conductive pattern covers the first sub-pad and the first main pad on the first surface, and covers the second sub-pad and the second main pad on the second surface.
7. The display device as claimed in claim 1, wherein the area of each of the first main pads is smaller than the area of each of the second main pads, and the area of each of the first sub-pads is smaller than the area of each of the second sub-pads.
8. The display device as claimed in claim 1, wherein each of the first sub-pads is electrically connected to each of the first main pads by a conductive trace, and each of the second sub-pads is electrically connected to each of the second main pads by a conductive trace.
9. A method of manufacturing a display device, comprising:
providing a display panel, which has a first surface, a second surface, a third surface between the first surface and the second surface, a display area on the first surface, and a peripheral area, and includes a plurality of first main pads disposed in the peripheral area and a plurality of second main pads disposed on the second surface, wherein the peripheral area is closer to the third surface than the display area, each of the first main pads at least partially overlaps the corresponding second main pad in a normal direction of the display panel, and the first main pads are arranged along a first direction;
forming a plurality of first sub-pads on the first surface, wherein the first sub-pads are respectively adjacent and electrically connected to the corresponding first main pads, and the length of each first sub-pad is greater than that of each first main pad in a second direction perpendicular to the first direction;
forming a plurality of second secondary connecting pads on the second surface, wherein the second secondary connecting pads are respectively adjacent and electrically connected to the corresponding second main connecting pads, and each first secondary connecting pad is at least partially overlapped with the corresponding second secondary connecting pad in the normal direction of the display panel;
forming a plurality of first conductive patterns on the display panel, wherein the first conductive patterns are respectively and electrically connected to the corresponding first main connecting pad and the corresponding second main connecting pad; and
and detecting a resistance value between at least one of the first main connecting pads and the corresponding second main connecting pad to be used as a basis for judging whether the corresponding first conductive pattern is invalid or not, wherein when the corresponding first conductive pattern is invalid, at least one second conductive pattern is formed on the display panel, and the at least one second conductive pattern is electrically connected with the first secondary connecting pad and the second secondary connecting pad corresponding to the invalid first conductive pattern.
10. The method as claimed in claim 9, wherein in the step of detecting the resistance between at least one of the first main pads and the corresponding second main pad, the resistance is obtained by detecting the corresponding first sub-pad and the second sub-pad.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063065641P | 2020-08-14 | 2020-08-14 | |
| US63/065,641 | 2020-08-14 | ||
| TW110125040A TWI767785B (en) | 2020-08-14 | 2021-07-07 | Display device and manufacturing method thereof |
| TW110125040 | 2021-07-07 |
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| CN113675165A true CN113675165A (en) | 2021-11-19 |
| CN113675165B CN113675165B (en) | 2023-05-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023123553A1 (en) * | 2021-12-28 | 2023-07-06 | 惠州华星光电显示有限公司 | Display panel, display device, and method for manufacturing display panel |
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| CN106814484A (en) * | 2016-12-26 | 2017-06-09 | 友达光电股份有限公司 | Display device |
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| TW202029552A (en) * | 2019-01-30 | 2020-08-01 | 友達光電股份有限公司 | Display panel and manufacturing method thereof |
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| CN106814484A (en) * | 2016-12-26 | 2017-06-09 | 友达光电股份有限公司 | Display device |
| CN107065334A (en) * | 2017-03-09 | 2017-08-18 | 友达光电股份有限公司 | Display panel |
| TW202029552A (en) * | 2019-01-30 | 2020-08-01 | 友達光電股份有限公司 | Display panel and manufacturing method thereof |
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| CN113675165B (en) | 2023-05-02 |
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