JP3853729B2 - Flexible printed wiring board connection structure and connection method - Google Patents

Flexible printed wiring board connection structure and connection method Download PDF

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JP3853729B2
JP3853729B2 JP2002338683A JP2002338683A JP3853729B2 JP 3853729 B2 JP3853729 B2 JP 3853729B2 JP 2002338683 A JP2002338683 A JP 2002338683A JP 2002338683 A JP2002338683 A JP 2002338683A JP 3853729 B2 JP3853729 B2 JP 3853729B2
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flexible printed
wiring board
printed wiring
conductor wiring
conductor
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JP2004170824A (en
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弘章 近藤
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埼玉日本電気株式会社
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Description

【０００１】
【発明の属する技術分野】
本発明はフレキシブルプリント配線板の接続構造及び接続方法に係り、特に液晶表示装置の電源及び信号入力用としてフレキシブルプリント配線板を接続するフレキシブルプリント配線板の接続構造及び接続方法に関する。
【０００２】
【従来の技術】
図８は従来のフレキシブルプリント配線板の接続方法により接続された液晶表示装置（ＬＣＤ）とフレキシブルプリント配線板（ＦＰＣ）の一例の接続状態を示す平面図、図９は図８のＡ−Ａ’ 線に沿う断面図、図１０は図９の拡大断面図を示す。図８〜図１０において、液晶表示装置（ＬＣＤ）１は、偏光板１ａと透明基板１ｂとからなり、その透明基板１ｂがフレキシブルプリント配線板（ＦＰＣ）２上のＦＰＣ導体配線４に、異方性導電膜（ＡＣＦ：Anisotropic Conductive Film)５を用いてＬＣＤに接続している。なお、符号３はＬＣＤとＦＰＣの接続部を示す。
【０００３】
このように、液晶表示装置（ＬＣＤ）１へ信号を入力するために、従来はフレキシブルプリント配線板（ＦＰＣ）２を異方性導電膜（ＡＣＦ)５を用いてＬＣＤ１に接続している。なお、従来のＬＣＤ１とＦＰＣ２の接続方法においては、ＦＰＣ２からＬＣＤ１に接続された配線４は、ＬＣＤ１上の主に透明電極１ｂによる配線により、ＩＣ電極や表示素子まで到達するのが一般的である。
【０００４】
ところで、近年の携帯電話などにおけるＬＣＤ１の大画面化、機能拡大、カラー化に伴い、接続するＦＰＣ２に半導体集積回路（ＩＣ）を実装するＣＯＦ（Clip On FPC）を使用する場合が増加している。また、信号入力本数の増加に伴いＣＯＦされるドライバＩＣの接続ピッチが微細化し、それに伴いＬＣＤ１とＦＰＣ２の接続部３における電極数も増加するので各端子の導体幅が細くなり、微細ピッチの導体配線を形成するためにＦＰＣ２の導体の厚みが薄くなってきている。
【０００５】
一方、携帯電話の軽量化や薄型化に伴い携帯電話の筐体の剛性は小さく、筐体とＬＣＤの隙間も狭くなっており、加えて大画面化されてきていることから表示部分の面積が広くなり、更に筐体の剛性が低下している。これらに伴い、装置組立時の様々な方向へのＦＰＣの変形やユーザに使用される際の落下等による衝撃から、ＬＣＤ１とＦＰＣ２の接続部３においてＦＰＣ２の銅配線４の断線による表示不具合が発生する場合がある。しかし、この断線は非常に微細な場合があり、顕微鏡による観察では断線の判断を明確に行うことができず、導通抵抗を測定し電気的に不具合を確認したい要求がある。また、ＬＣＤ１とＦＰＣ２の接続後にＦＰＣ２から信号入力が正常に行われているかを検査したい要求がある。
【０００６】
透明基板１ｂの配線上に直接測定用ピンを接触させて入力信号を測定することは可能であるが、この場合にはＦＰＣ接続部３とＩＣ電極や表示素子を直接結んでいる、電気的に有効であり断線した場合に信号が途切れる配線（以降、有効配線と称す）上に直接測定用ピンが接触することになり、その配線表面には接触による傷、破損が少なからず発生するため、後の環境信頼性に影響を与える可能性がある。
【０００７】
そのため、上記の要求にこたえるために、ＬＣＤ上に形成された配線において有効配線外に確認用端子を設ける方法が従来より知られている（例えば、特許文献１参照）。この特許文献１には、液晶が封入されて重ね合わされている２枚の透明基板のうちの一方の透明基板に、他方の透明基板の一側面からのはみ出し部を一体的に設けて液晶表示素子を構成し、上記一方の透明基板に、他方の透明基板における他側面からの検査用はみ出し部を一体的に設け、この検査用はみ出し部の表面に、両透明基板における各透明電極の各々に対する端子電極を形成し、上記の端子電極に通電用プローブを接触して液晶表示素子の性能を検査することが開示されている。
【０００８】
【特許文献１】
特開平１１−３０７８５号公報（第３−４頁、図２）
【０００９】
【発明が解決しようとする課題】
しかるに、上記のＬＣＤ上に形成された配線において有効配線外に確認用端子を設ける方法は、各端子から確認用端子（特許文献１では検査用はみ出し部に設けられた端子電極）を設ける場合には非常に大きな面積を必要とするため、近年のＬＣＤの大画面化によりＬＣＤの表示面以外の部分は非常に狭くなってきており、大画面化に付随する狭額縁化の妨げとなってしまう可能性が高い。加えて、ＦＰＣ接続部からＩＣ接続部や表示素子までのＬＣＤ上の配線途中に確認用端子を設けることは、この確認用端子表面を少なからず傷つけるため、環境信頼性面で望ましくない。
【００１０】
また、ＬＣＤ上の配線で入力信号を取り出す場合には、ＦＰＣの導体配線との間にＡＣＦによる接続が介在するため、不具合原因がＦＰＣ導体配線の断線にあるのかＡＣＦ接続部にあるのか明確にできない。
【００１１】
本発明は以上の点に鑑みなされたもので、上記の問題点を回避しＦＰＣからの入力信号を確認するためにはフレキシブルプリント配線板の導体配線の外形端で液晶表示装置と接続するのではなく、接続部よりも外側に導体配線を残しておくことにより、液晶表示装置を表示させるための有効な配線を傷つけず、環境信頼性を損なうこともなく、フレキシブルプリント配線板からの信号入力を液晶表示装置と接続後も確認することが可能なフレキシブルプリント配線板の接続構造及び接続方法を提供することを目的とする。
【００１２】
また、本発明の他の目的は、不具合原因がＦＰＣ導体配線の断線にあるのかＡＣＦ接続部にあるのか明確にし得るフレキシブルプリント配線板の接続構造及び接続方法を提供することにある。
【００１３】
【課題を解決するための手段】
上記の目的を達成するため、第１の発明のフレキシブルプリント配線板の接続構造は、液晶表示装置の透明基板上の電極とフレキシブルプリント配線板の導体配線とを異方性導電膜を介して接続するフレキシブルプリント配線板の接続構造において、フレキシブルプリント配線板の導体配線に、導体配線と透明基板との接続部分から延長されて透明基板から離間する所定の長さの、異方性導電膜で透明基板上の電極と接続されない確認用導体配線部を設けたことを特徴とする。
【００１４】
ここで、上記の確認用導体配線部は、測定用ピンが接触する電極端子が設けられていることを特徴とする。この発明では、測定用ピンが接触する部分は有効配線ではなく、ＦＰＣ導体配線の余剰となる確認用導体配線部の電極端子である。
【００１５】
また、上記の目的を達成するため、第３の発明では、第１の発明のフレキシブルプリント配線板の確認用導体配線部を、透明基板上の電極と非接触となるように、透明基板から遠ざかるように確認用導体配線部以外の導体配線に対して屈曲形成されていることを特徴とする。
【００１６】
また、上記の目的を達成するため、第４の発明では、第１の発明の確認用導体配線部を、フレキシブルプリント配線板の導体配線とは異なる線材で、導体配線に電気的に接続されていることを特徴とする。
【００１７】
また、上記の目的を達成するため、第５の発明では、確認用導体配線部は、フレキシブルプリント配線板上に形成された複数の導体配線のうち、特定の一部の導体配線であることを特徴とする。
【００１８】
更に、上記の目的を達成するため、第６の発明のフレキシブルプリント配線板の接続方法は、表面に電極が形成された液晶表示装置の透明基板上に異方性導電膜を貼り付ける第１のステップと、透明基板上の電極と、確認用導体配線部が先端部付近に設けられたフレキシブルプリント配線板の導体配線とを対向させて位置合わせする第２のステップと、フレキシブルプリント配線板の上から加熱ツールを使用して、透明基板上の電極と、フレキシブルプリント配線板の導体配線のうち確認用導体配線部を除く導体配線部とを圧着して接続する第３のステップとを含むことを特徴とする。
【００１９】
【発明の実施の形態】
次に、本発明の実施の形態について図面と共に説明する。図１は本発明になるフレキシブルプリント配線板の接続方法により接続された液晶表示装置（ＬＣＤ）とフレキシブルプリント配線板（ＦＰＣ）の一実施の形態の接続状態を示す平面図、図２は図１のＢ−Ｂ’線に沿う断面図、図３は図２の拡大断面図を示す。図１〜図３において、図８〜図１０と同一部分には同一符号を付してある。図１〜図３において、液晶表示装置（ＬＣＤ）１は、偏光板１ａと透明基板１ｂとからなり、その透明基板１ｂがフレキシブルプリント配線板（ＦＰＣ）６上のＦＰＣ導体配線７に、異方性導電膜（ＡＣＦ)５を用いてＬＣＤ１に接続している。
【００２０】
図２及び図３に示すように、ＦＰＣ６及びＦＰＣ導体配線７は、その先端から所定の長さ部分が透明基板１ｂに対して距離が大となる方向に屈曲した部分を有する構造とされており、その導体配線７の屈曲部分以降の先端部が確認用導体配線部７ａとされ、透明基板１ｂと離間している。また、図３に示すように、導体配線部７のうち、確認用導体配線部７ａ以外の部分がＡＣＦ５により透明基板１ｂに接続されている。
【００２１】
図１０に示すように従来のＬＣＤ１とＦＰＣ２の接続部３はＦＰＣ２のほぼ端までＡＣＦ５で覆われて実装されているが、図３に示すように本実施の形態の接続方法では、ＦＰＣ導体配線７の先端部の確認用導体配線部７ａが覆われないように、ＡＣＦ５でＦＰＣ導体配線７をＬＣＤ１に接続するようにしているため、図４の模式図に示すように入力信号が測定できる測定用ピン９を確認用導体配線部７ａの先端側に接触させることにより、図４のＦＰＣ導体配線７に断線部８があった場合の断線の検出やＦＰＣ実装後の入力信号の測定をすることが可能となる。
【００２２】
ここで、測定用ピン９を接触する部分は有効配線ではなく、ＦＰＣ導体配線７の余剰となる確認用導体配線部７ａであるので、有効配線に対する傷、破損による信頼性に影響を与える可能性はない。本実施の形態では、このように信頼性を損なうことなく狭い面積で測定用ピン９を接触させることができる。
【００２３】
また、ＬＣＤ１上の配線で入力信号を取り出す場合には、図２乃至図４に示すようにＦＰＣの導体配線７との間にＡＣＦ５による接続部３が介在するため、測定用ピン９を用いて断線を検出できた場合、入力信号が取り出せたときは不具合原因がＦＰＣ導体配線７の断線にあることが分かり、入力信号が取り出せないときはＡＣＦ接続部３にあることが分かる。従って、従来は不具合原因がＦＰＣ導体配線の断線にあるのかＡＣＦ接続部にあるのか明確にできなかったのに対し、本実施の形態においてはこの２つを明確に切り分けることが可能となる。
【００２４】
次に、本発明の接続方法の一実施の形態の接続手順について図５と共に説明する。図５は本発明方法の一実施の形態の接続手順を示す各接続工程の素子断面図を示す。まず、図５（Ａ）に示すようにＬＣＤ１の透明基板１ｂにＡＣＦ５を貼り付ける。続いて、図５（Ｂ）に示すように、確認用導体配線部が設けられたフレキシブルプリント配線板６上の導体配線７と、ＬＣＤ１の透明基板１ｂ上の電極１０を対向させて位置合わせする。そして、図５（Ｃ）に示すように、ＦＰＣ６の上から適当な温度、圧力、時間で加熱ツール１１を使用して圧着させる。この手順は従来の接続方法における手順と変わらないが、導体配線部７のうちＡＣＦ５を介して透明基板１ｂに接続されるのは、確認用導体配線部以外の導体配線部であるという本実施の形態特有の接続構造が得られる。
【００２５】
図４に示すように、測定用ピン９を確認用導体配線部７ａの該当する電極端子に接触させ、所要する信号が入力されていることを確認することにより、ＦＰＣ６上に形成された、もしくはＬＣＤ１と逆側でＦＰＣと接続された回路基板に形成された回路が正常に動作しているかを確かめることが可能となる。確認用導体配線部７ａは測定用ピン９の先端が接触できる必要があるため、目安として２ｍｍ以上設ける必要がある。
【００２６】
なお、本発明は以上の実施の形態に限定されるものではなく、例えば、確認用導体配線部７ａは導体配線７に設けるのではなく、図６に示すように、導体配線部７ａに接続された他のＦＰＣ１２や線材等を用いても、電気的に信号を確認できればかまわない。また、全ての導体配線４を確認用導体配線部を有する構成として残すのではなく、図７に示すように、ある一部のみを確認用導体配線部１３として残すようにしてもかまわない。
【００２７】
【発明の効果】
以上説明したように、本発明によれば、フレキシブルプリント配線板の導体配線に、導体配線の先端から所定の長さで、異方性導電膜で透明基板上の電極と接続されない確認用導体配線部を設け、測定用ピンが接触する部分は有効配線ではなく、ＦＰＣ導体配線の余剰となる確認用導体配線部の電極端子としたため、フレキシブルプリント配線板から液晶表示装置への入力信号が正常であることを、ワーク（製品）を破壊することなく、傷、破損による信頼性を損なうことなく容易に確認することができ、また、このように信頼性を損なうことなく狭い面積で確認用ピンを接触させることができる。
【００２８】
また、本発明によれば、フレキシブルプリント配線板と液晶表示装置の接続部において、フレキシブルプリント配線板の導体配線に断線が生じる不具合が発生した場合に、従来ではできなかった、異方性導電膜による接続不良とフレキシブルプリント配線板の導体配線の断線とを区別することができる。
【図面の簡単な説明】
【図１】本発明の接続方法の一実施の形態によるＬＣＤとＦＰＣの接続状態を示す平面図である。
【図２】図１中のＢ−Ｂ’線に沿う断面図である。
【図３】図２の拡大断面図である。
【図４】本発明により接続されたＦＰＣ導体配線の断線および測定用ピン接触の様子の一例を示す模式図である。
【図５】本発明方法の一実施の形態の接続手順を示す各接続工程の素子断面図である。
【図６】本発明の接続方法の他の実施の形態を示す断面図である。
【図７】本発明の接続方法の更に他の実施の形態を示す平面図である。
【図８】従来の接続方法の一例によるＬＣＤとＦＰＣの接続状態を示す平面図である。
【図９】図８のＡ−Ａ’線に沿う断面図である。
【図１０】図９の拡大断面図である。
【符号の説明】
１ 液晶表示装置（ＬＣＤ）
１ａ 偏光板
１ｂ 透明基板
２、６ フレキシブルプリント配線板（ＦＰＣ）
３ ＬＣＤとＦＰＣの接続部
４、７ ＦＰＣ導体配線
５ 異方性導電膜（ＡＣＦ）
７ａ 確認用導体配線部
８ ＦＰＣ導体断線部
９ 測定用ピン
１０ ＬＣＤ電極
１１ 加熱ツール
１２ 確認用ＦＰＣ
１３ 確認用導体配線部（一部）[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a flexible printed wiring board connection structure and connection method, and more particularly to a flexible printed wiring board connection structure and connection method for connecting a flexible printed wiring board for power supply and signal input of a liquid crystal display device.
[0002]
[Prior art]
FIG. 8 is a plan view showing a connection state of an example of a liquid crystal display device (LCD) and a flexible printed wiring board (FPC) connected by a conventional flexible printed wiring board connecting method, and FIG. 9 is an AA ′ of FIG. FIG. 10 is an enlarged sectional view of FIG. 9. 8 to 10, a liquid crystal display (LCD) 1 includes a polarizing plate 1a and a transparent substrate 1b, and the transparent substrate 1b is anisotropic to the FPC conductor wiring 4 on the flexible printed wiring board (FPC) 2. It connects to LCD using the conductive film (ACF: Anisotropic Conductive Film) 5. Reference numeral 3 denotes a connection portion between the LCD and the FPC.
[0003]
As described above, in order to input a signal to the liquid crystal display device (LCD) 1, a flexible printed wiring board (FPC) 2 is conventionally connected to the LCD 1 using an anisotropic conductive film (ACF) 5. In the conventional connection method between the LCD 1 and the FPC 2, the wiring 4 connected from the FPC 2 to the LCD 1 generally reaches the IC electrode and the display element mainly by the wiring of the transparent electrode 1b on the LCD 1. .
[0004]
By the way, with the recent increase in the screen of LCD 1, function expansion, and colorization in mobile phones and the like, the use of COF (Clip On FPC) in which a semiconductor integrated circuit (IC) is mounted on FPC 2 to be connected is increasing. . Further, as the number of signal inputs increases, the connection pitch of the driver IC to be COF becomes finer, and the number of electrodes in the connection portion 3 of the LCD 1 and the FPC 2 also increases accordingly. In order to form the wiring, the thickness of the conductor of the FPC 2 is getting thinner.
[0005]
On the other hand, with the reduction in the weight and thickness of mobile phones, the rigidity of the mobile phone housing has been reduced, and the gap between the housing and the LCD has been narrowed. It becomes wider and the rigidity of the housing is further reduced. As a result, display failure due to disconnection of the copper wiring 4 of the FPC 2 occurs at the connection portion 3 between the LCD 1 and the FPC 2 due to deformation caused by deformation of the FPC in various directions at the time of assembling the device or dropping when the device is used There is a case. However, this disconnection may be very fine, and it is not possible to clearly determine the disconnection by observation with a microscope, and there is a demand for measuring the conduction resistance and confirming an electrical failure. In addition, there is a request to check whether signal input from the FPC 2 is normally performed after the connection between the LCD 1 and the FPC 2.
[0006]
Although it is possible to measure the input signal by directly contacting the measurement pin on the wiring of the transparent substrate 1b, in this case, the FPC connection unit 3 is directly connected to the IC electrode or the display element, Since the measurement pins are in direct contact with the wiring that is effective and the signal is interrupted when it is disconnected (hereinafter referred to as effective wiring), the surface of the wiring will be damaged and damaged by contact. May affect environmental reliability.
[0007]
Therefore, in order to meet the above requirements, a method of providing a confirmation terminal outside the effective wiring in the wiring formed on the LCD has been conventionally known (for example, see Patent Document 1). In Patent Document 1, a liquid crystal display element is provided by integrally providing a protruding portion from one side surface of one transparent substrate of two transparent substrates in which liquid crystal is sealed and superimposed. And a protruding portion for inspection from the other side of the other transparent substrate is integrally provided on the one transparent substrate, and a terminal for each of the transparent electrodes on both transparent substrates is provided on the surface of the protruding portion for inspection. It is disclosed that an electrode is formed and a probe for energization is brought into contact with the terminal electrode to inspect the performance of the liquid crystal display element.
[0008]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-30785 (page 3-4, FIG. 2)
[0009]
[Problems to be solved by the invention]
However, the method of providing the confirmation terminal outside the effective wiring in the wiring formed on the LCD is when the confirmation terminal is provided from each terminal (terminal electrode provided in the protruding portion for inspection in Patent Document 1). Requires a very large area, and with the recent increase in the LCD screen, the area other than the display surface of the LCD has become very narrow, which hinders the narrowing of the frame accompanying the increase in the screen size. Probability is high. In addition, providing a confirmation terminal in the middle of the wiring on the LCD from the FPC connection portion to the IC connection portion and the display element is not desirable in terms of environmental reliability because it damages the surface of the confirmation terminal.
[0010]
In addition, when an input signal is taken out by the wiring on the LCD, since the connection by the ACF is interposed between the conductor wiring of the FPC, it is clear whether the cause of failure is the disconnection of the FPC conductor wiring or the ACF connection portion. Can not.
[0011]
The present invention has been made in view of the above points, and in order to avoid the above-described problems and confirm the input signal from the FPC, it is not necessary to connect to the liquid crystal display device at the outer end of the conductor wiring of the flexible printed wiring board. In addition, by leaving the conductor wiring outside the connection part, the effective wiring for displaying the liquid crystal display device is not damaged and the environmental reliability is not impaired, and signal input from the flexible printed wiring board can be performed. An object of the present invention is to provide a connection structure and a connection method for a flexible printed wiring board that can be confirmed after being connected to a liquid crystal display device.
[0012]
Another object of the present invention is to provide a connection structure and a connection method for a flexible printed wiring board that can clarify whether the cause of failure is in the disconnection of the FPC conductor wiring or in the ACF connection portion.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, a flexible printed wiring board connection structure according to a first aspect of the present invention connects an electrode on a transparent substrate of a liquid crystal display device and a conductive wiring of the flexible printed wiring board through an anisotropic conductive film. In the flexible printed wiring board connection structure, the conductive wiring of the flexible printed wiring board is transparent with an anisotropic conductive film of a predetermined length extending from the connection portion between the conductive wiring and the transparent substrate and separated from the transparent substrate. A confirmation conductor wiring portion that is not connected to the electrode on the substrate is provided.
[0014]
Here, the above-described conductor wiring part for confirmation is characterized in that an electrode terminal with which the measurement pin contacts is provided. In the present invention, the portion where the measurement pin comes into contact is not the effective wiring but the electrode terminal of the confirmation conductor wiring portion that becomes the surplus of the FPC conductor wiring.
[0015]
In order to achieve the above object, in the third invention, the confirmation conductor wiring portion of the flexible printed wiring board of the first invention is moved away from the transparent substrate so as not to be in contact with the electrode on the transparent substrate. As described above, it is bent with respect to the conductor wiring other than the confirmation conductor wiring portion.
[0016]
In order to achieve the above object, in the fourth invention, the confirmation conductor wiring portion of the first invention is electrically connected to the conductor wiring with a wire material different from the conductor wiring of the flexible printed wiring board. It is characterized by being.
[0017]
In order to achieve the above object, in the fifth aspect of the invention, the confirmation conductor wiring portion is a specific part of the plurality of conductor wirings formed on the flexible printed wiring board. Features.
[0018]
Furthermore, in order to achieve the above object, a flexible printed wiring board connection method according to a sixth aspect of the present invention is a first method in which an anisotropic conductive film is attached on a transparent substrate of a liquid crystal display device having electrodes formed on the surface. A step, a second step of aligning the electrodes on the transparent substrate and the conductor wiring of the flexible printed wiring board in which the conductor wiring portion for confirmation is provided in the vicinity of the tip portion, and on the flexible printed wiring board And a third step of crimping and connecting the electrode on the transparent substrate and the conductor wiring portion of the flexible printed wiring board excluding the conductor wiring portion for confirmation using a heating tool. Features.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a connection state of an embodiment of a liquid crystal display device (LCD) and a flexible printed wiring board (FPC) connected by the flexible printed wiring board connecting method according to the present invention, and FIG. FIG. 3 is an enlarged sectional view of FIG. 2. 1 to 3, the same parts as those in FIGS. 8 to 10 are denoted by the same reference numerals. 1 to 3, a liquid crystal display device (LCD) 1 includes a polarizing plate 1a and a transparent substrate 1b, and the transparent substrate 1b is anisotropically connected to an FPC conductor wiring 7 on a flexible printed wiring board (FPC) 6. The conductive film (ACF) 5 is used to connect to the LCD 1.
[0020]
As shown in FIGS. 2 and 3, the FPC 6 and the FPC conductor wiring 7 have a structure in which a predetermined length from the tip thereof is bent in a direction in which the distance from the transparent substrate 1 b becomes large. The leading end portion after the bent portion of the conductor wiring 7 is a conductor wiring portion 7a for confirmation, and is separated from the transparent substrate 1b. Further, as shown in FIG. 3, a portion of the conductor wiring portion 7 other than the confirmation conductor wiring portion 7 a is connected to the transparent substrate 1 b by the ACF 5.
[0021]
As shown in FIG. 10, the connecting portion 3 of the conventional LCD 1 and FPC 2 is covered and mounted with the ACF 5 up to almost the end of the FPC 2, but in the connecting method of the present embodiment as shown in FIG. Since the FPC conductor wiring 7 is connected to the LCD 1 with the ACF 5 so that the confirmation conductor wiring portion 7a at the tip of 7 is not covered, the measurement can measure the input signal as shown in the schematic diagram of FIG. By detecting the disconnection portion 8 in the FPC conductor wiring 7 of FIG. 4 and measuring the input signal after mounting the FPC, the contact pin 9 is brought into contact with the front end side of the confirmation conductor wiring portion 7a. Is possible.
[0022]
Here, the portion that contacts the measurement pin 9 is not an effective wiring, but a confirmation conductor wiring portion 7a that is an excess of the FPC conductor wiring 7, so that the reliability of the effective wiring due to scratches or breakage may be affected. There is no. In the present embodiment, the measurement pin 9 can be brought into contact with a small area without impairing the reliability in this way.
[0023]
Further, when the input signal is taken out by the wiring on the LCD 1, the connecting portion 3 by the ACF 5 is interposed between the conductor wiring 7 of the FPC as shown in FIGS. When the disconnection can be detected, it can be understood that the cause of the malfunction is the disconnection of the FPC conductor wiring 7 when the input signal can be taken out, and the ACF connection portion 3 when the input signal cannot be taken out. Therefore, in the past, it was impossible to clearly determine whether the cause of the failure was the disconnection of the FPC conductor wiring or the ACF connection portion, but in the present embodiment, the two can be clearly separated.
[0024]
Next, a connection procedure according to an embodiment of the connection method of the present invention will be described with reference to FIG. FIG. 5 is an element cross-sectional view of each connection process showing a connection procedure of an embodiment of the method of the present invention. First, as shown in FIG. 5A, the ACF 5 is attached to the transparent substrate 1b of the LCD 1. Subsequently, as shown in FIG. 5B, the conductor wiring 7 on the flexible printed wiring board 6 provided with the confirmation conductor wiring portion and the electrode 10 on the transparent substrate 1b of the LCD 1 are opposed to each other and aligned. . Then, as shown in FIG. 5C, the heating tool 11 is used for pressure bonding from above the FPC 6 at an appropriate temperature, pressure, and time. This procedure is the same as the procedure in the conventional connection method, but the conductor wiring portion 7 is connected to the transparent substrate 1b through the ACF 5 in the conductor wiring portion other than the confirmation conductor wiring portion. A form-specific connection structure is obtained.
[0025]
As shown in FIG. 4, the measurement pin 9 is formed on the FPC 6 by contacting the corresponding electrode terminal of the confirmation conductor wiring portion 7a and confirming that a required signal is input, or It is possible to check whether the circuit formed on the circuit board connected to the FPC on the opposite side of the LCD 1 is operating normally. Since the confirmation conductor wiring portion 7a needs to be able to contact the tip of the measurement pin 9, it is necessary to provide 2 mm or more as a guide.
[0026]
The present invention is not limited to the above embodiment. For example, the confirmation conductor wiring portion 7a is not provided in the conductor wiring 7, but is connected to the conductor wiring portion 7a as shown in FIG. Even if other FPCs 12 or wires are used, it is only necessary that the signal can be electrically confirmed. Further, instead of leaving all the conductor wirings 4 as the configuration having the confirmation conductor wiring portion, only a part may be left as the confirmation conductor wiring portion 13 as shown in FIG.
[0027]
【The invention's effect】
As described above, according to the present invention, the conductor wiring for confirmation is not connected to the electrode on the transparent substrate with the anisotropic conductive film, with a predetermined length from the tip of the conductor wiring to the conductor wiring of the flexible printed wiring board. The part where the measurement pin contacts is not the effective wiring, but the electrode terminal of the confirmation conductor wiring part that becomes the surplus of the FPC conductor wiring, so the input signal from the flexible printed wiring board to the liquid crystal display device is normal It can be easily confirmed without damaging the workpiece (product) without damaging the reliability due to scratches or breakage, and the confirmation pin can be installed in a small area without damaging the reliability. Can be contacted.
[0028]
In addition, according to the present invention, in the connection portion between the flexible printed wiring board and the liquid crystal display device, an anisotropic conductive film, which has not been possible in the past, has occurred when a failure occurs in the conductor wiring of the flexible printed wiring board. It is possible to distinguish between a connection failure due to, and disconnection of the conductor wiring of the flexible printed wiring board.
[Brief description of the drawings]
FIG. 1 is a plan view showing a connection state between an LCD and an FPC according to an embodiment of a connection method of the present invention.
FIG. 2 is a cross-sectional view taken along line BB ′ in FIG.
FIG. 3 is an enlarged cross-sectional view of FIG.
FIG. 4 is a schematic diagram showing an example of a state of disconnection of FPC conductor wiring connected according to the present invention and contact with a measurement pin.
FIG. 5 is an element cross-sectional view of each connection step showing a connection procedure according to an embodiment of the method of the present invention.
FIG. 6 is a cross-sectional view showing another embodiment of the connection method of the present invention.
FIG. 7 is a plan view showing still another embodiment of the connection method of the present invention.
FIG. 8 is a plan view showing a connection state between an LCD and an FPC according to an example of a conventional connection method.
9 is a cross-sectional view taken along the line AA ′ of FIG.
10 is an enlarged cross-sectional view of FIG.
[Explanation of symbols]
1 Liquid crystal display (LCD)
1a Polarizing plate 1b Transparent substrate 2, 6 Flexible printed wiring board (FPC)
3 Connection part 4 of LCD and FPC, 7 FPC conductor wiring 5 Anisotropic conductive film (ACF)
7a Conductor wiring part for confirmation 8 FPC conductor disconnection part 9 Measurement pin 10 LCD electrode 11 Heating tool 12 FPC for confirmation
13 Conductor wiring for confirmation (part)

Claims (6)

液晶表示装置の透明基板上の電極とフレキシブルプリント配線板の導体配線とを異方性導電膜を介して接続するフレキシブルプリント配線板の接続構造において、
前記フレキシブルプリント配線板の導体配線に、該導体配線と前記透明基板との接続部分から延長されて該透明基板から離間する所定の長さの、前記異方性導電膜で前記透明基板上の電極と接続されない確認用導体配線部を設けたことを特徴とするフレキシブルプリント配線板の接続構造。In the connection structure of the flexible printed wiring board that connects the electrode on the transparent substrate of the liquid crystal display device and the conductor wiring of the flexible printed wiring board via an anisotropic conductive film,
Electrodes on the transparent substrate with the anisotropic conductive film having a predetermined length extending from a connection portion between the conductor wiring and the transparent substrate to the conductor wiring of the flexible printed wiring board. A flexible printed wiring board connection structure, characterized in that a conductor wiring portion for confirmation that is not connected to the wiring is provided. 前記確認用導体配線部は、測定用ピンが接触する電極端子が設けられていることを特徴とする請求項１記載のフレキシブルプリント配線板の接続構造。The flexible printed wiring board connection structure according to claim 1, wherein the confirmation conductor wiring portion is provided with an electrode terminal with which a measurement pin contacts. 前記フレキシブルプリント配線板の確認用導体配線部は、前記透明基板上の電極と非接触となるように、前記透明基板から遠ざかるように該確認用導体配線部以外の該導体配線に対して屈曲形成されていることを特徴とする請求項１又は２記載のフレキシブルプリント配線板の接続構造。The flexible printed wiring board has a confirmation conductor wiring portion bent with respect to the conductor wiring other than the confirmation conductor wiring portion so as to be away from the transparent substrate so as not to contact the electrode on the transparent substrate. The flexible printed wiring board connection structure according to claim 1, wherein the connection structure is a flexible printed wiring board. 前記確認用導体配線部は、前記フレキシブルプリント配線板の導体配線とは異なる線材で、該導体配線に電気的に接続されていることを特徴とする請求項１又は２記載のフレキシブルプリント配線板の接続構造。3. The flexible printed wiring board according to claim 1, wherein the conductor wiring portion for confirmation is electrically connected to the conductor wiring using a wire material different from the conductor wiring of the flexible printed wiring board. Connection structure. 前記確認用導体配線部は、前記フレキシブルプリント配線板上に形成された複数の導体配線のうち、特定の一部の導体配線であることを特徴とする請求項１又は２記載のフレキシブルプリント配線板の接続構造。The flexible printed wiring board according to claim 1 or 2, wherein the confirmation conductor wiring portion is a specific part of the plurality of conductor wirings formed on the flexible printed wiring board. Connection structure. 表面に電極が形成された液晶表示装置の透明基板上に異方性導電膜を貼り付ける第１のステップと、
前記透明基板上の電極と、確認用導体配線部が先端部付近に設けられたフレキシブルプリント配線板の導体配線とを対向させて位置合わせする第２のステップと、
前記フレキシブルプリント配線板の上から加熱ツールを使用して、前記透明基板上の電極と、前記フレキシブルプリント配線板の導体配線のうち前記確認用導体配線部を除く導体配線部とを圧着して接続する第３のステップと
を含むことを特徴とするフレキシブルプリント配線板の接続方法。A first step of attaching an anisotropic conductive film on a transparent substrate of a liquid crystal display device having electrodes formed on the surface;
A second step of aligning the electrode on the transparent substrate and the conductor wiring of the flexible printed wiring board in which the conductor wiring part for confirmation is provided near the tip part;
Using a heating tool from above the flexible printed wiring board, the electrode on the transparent substrate and the conductor wiring portion excluding the confirmation conductor wiring portion of the conductive wiring of the flexible printed wiring board are connected by pressure bonding And a third step of connecting the flexible printed wiring board.
JP2002338683A 2002-11-22 2002-11-22 Flexible printed wiring board connection structure and connection method Expired - Fee Related JP3853729B2 (en)

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Publication number Priority date Publication date Assignee Title
CN106990565A (en) * 2017-04-20 2017-07-28 深圳市屏柔科技有限公司 A kind of complete machine production technology of liquid crystal handwriting device

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Publication number Priority date Publication date Assignee Title
CN100414419C (en) * 2005-12-16 2008-08-27 群康科技(深圳)有限公司 Method and apparatus for adhering driving component
CN113296319A (en) * 2020-02-21 2021-08-24 华为技术有限公司 Display module assembly and display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106990565A (en) * 2017-04-20 2017-07-28 深圳市屏柔科技有限公司 A kind of complete machine production technology of liquid crystal handwriting device

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