JP2004170824A - Connection structure and connection method of flexible printed wiring board - Google Patents

Connection structure and connection method of flexible printed wiring board Download PDF

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Publication number
JP2004170824A
JP2004170824A JP2002338683A JP2002338683A JP2004170824A JP 2004170824 A JP2004170824 A JP 2004170824A JP 2002338683 A JP2002338683 A JP 2002338683A JP 2002338683 A JP2002338683 A JP 2002338683A JP 2004170824 A JP2004170824 A JP 2004170824A
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Prior art keywords
flexible printed
wiring board
fpc
printed wiring
confirmation
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JP3853729B2 (en
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Hiroaki Kondo
弘章 近藤
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NEC Saitama Ltd
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NEC Saitama Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that it is not desirable with respect to environmental confidence to provide a terminal for confirmation on the way of a wiring on an LCD from an FPC connection part to an IC connection part or a display element and it can not be made clear that a fault is caused by disconnection of an FPC conductive body wiring or an ACF connection part. <P>SOLUTION: A transparent substrate 1b of a liquid crystal display is connected to the FPC conductive body wiring 7 on a flexible printed wiring board (FPC) 6 by using an anisotropic conductive film (ACF) 5. The FPC 6 and the FPC conductive body wiring 7 have a structure having curved parts wherein a prescribed length parts from their tips are curved in the direction in which the parts are far from the transparent substrate 1b and a tip part to be the curved part of the conductive body wiring 7 is specified to be a conductive body wiring part 7a for confirmation, which is separated from the transparent substrate 1b. Since a part where a pin for measurement comes in contact with is made the electrode terminal of the conductive body wiring part for confirmation to be an excess part of the FPC conductive body wiring, confirmation can be easily performed without spoiling reliability by a scratch and breakage. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明はフレキシブルプリント配線板の接続構造及び接続方法に係り、特に液晶表示装置の電源及び信号入力用としてフレキシブルプリント配線板を接続するフレキシブルプリント配線板の接続構造及び接続方法に関する。
【０００２】
【従来の技術】
図８は従来のフレキシブルプリント配線板の接続方法により接続された液晶表示装置（ＬＣＤ）とフレキシブルプリント配線板（ＦＰＣ）の一例の接続状態を示す平面図、図９は図８のＡ−Ａ’ 線に沿う断面図、図１０は図９の拡大断面図を示す。図８〜図１０において、液晶表示装置（ＬＣＤ）１は、偏光板１ａと透明基板１ｂとからなり、その透明基板１ｂがフレキシブルプリント配線板（ＦＰＣ）２上のＦＰＣ導体配線４に、異方性導電膜（ＡＣＦ：Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ｆｉｌｍ）５を用いてＬＣＤに接続している。なお、符号３はＬＣＤとＦＰＣの接続部を示す。
【０００３】
このように、液晶表示装置（ＬＣＤ）１へ信号を入力するために、従来はフレキシブルプリント配線板（ＦＰＣ）２を異方性導電膜（ＡＣＦ）５を用いてＬＣＤ１に接続している。なお、従来のＬＣＤ１とＦＰＣ２の接続方法においては、ＦＰＣ２からＬＣＤ１に接続された配線４は、ＬＣＤ１上の主に透明電極１ｂによる配線により、ＩＣ電極や表示素子まで到達するのが一般的である。
【０００４】
ところで、近年の携帯電話などにおけるＬＣＤ１の大画面化、機能拡大、カラー化に伴い、接続するＦＰＣ２に半導体集積回路（ＩＣ）を実装するＣＯＦ（Ｃｌｉｐ Ｏｎ ＦＰＣ）を使用する場合が増加している。また、信号入力本数の増加に伴いＣＯＦされるドライバＩＣの接続ピッチが微細化し、それに伴いＬＣＤ１とＦＰＣ２の接続部３における電極数も増加するので各端子の導体幅が細くなり、微細ピッチの導体配線を形成するためにＦＰＣ２の導体の厚みが薄くなってきている。
【０００５】
一方、携帯電話の軽量化や薄型化に伴い携帯電話の筐体の剛性は小さく、筐体とＬＣＤの隙間も狭くなっており、加えて大画面化されてきていることから表示部分の面積が広くなり、更に筐体の剛性が低下している。これらに伴い、装置組立時の様々な方向へのＦＰＣの変形やユーザに使用される際の落下等による衝撃から、ＬＣＤ１とＦＰＣ２の接続部３においてＦＰＣ２の銅配線４の断線による表示不具合が発生する場合がある。しかし、この断線は非常に微細な場合があり、顕微鏡による観察では断線の判断を明確に行うことができず、導通抵抗を測定し電気的に不具合を確認したい要求がある。また、ＬＣＤ１とＦＰＣ２の接続後にＦＰＣ２から信号入力が正常に行われているかを検査したい要求がある。
【０００６】
透明基板１ｂの配線上に直接測定用ピンを接触させて入力信号を測定することは可能であるが、この場合にはＦＰＣ接続部３とＩＣ電極や表示素子を直接結んでいる、電気的に有効であり断線した場合に信号が途切れる配線（以降、有効配線と称す）上に直接測定用ピンが接触することになり、その配線表面には接触による傷、破損が少なからず発生するため、後の環境信頼性に影響を与える可能性がある。
【０００７】
そのため、上記の要求にこたえるために、ＬＣＤ上に形成された配線において有効配線外に確認用端子を設ける方法が従来より知られている（例えば、特許文献１参照）。この特許文献１には、液晶が封入されて重ね合わされている２枚の透明基板のうちの一方の透明基板に、他方の透明基板の一側面からのはみ出し部を一体的に設けて液晶表示素子を構成し、上記一方の透明基板に、他方の透明基板における他側面からの検査用はみ出し部を一体的に設け、この検査用はみ出し部の表面に、両透明基板における各透明電極の各々に対する端子電極を形成し、上記の端子電極に通電用プローブを接触して液晶表示素子の性能を検査することが開示されている。
【０００８】
【特許文献１】
特開平１１−３０７８５号公報（第３−４頁、図２）
【０００９】
【発明が解決しようとする課題】
しかるに、上記のＬＣＤ上に形成された配線において有効配線外に確認用端子を設ける方法は、各端子から確認用端子（特許文献１では検査用はみ出し部に設けられた端子電極）を設ける場合には非常に大きな面積を必要とするため、近年のＬＣＤの大画面化によりＬＣＤの表示面以外の部分は非常に狭くなってきており、大画面化に付随する狭額縁化の妨げとなってしまう可能性が高い。加えて、ＦＰＣ接続部からＩＣ接続部や表示素子までのＬＣＤ上の配線途中に確認用端子を設けることは、この確認用端子表面を少なからず傷つけるため、環境信頼性面で望ましくない。
【００１０】
また、ＬＣＤ上の配線で入力信号を取り出す場合には、ＦＰＣの導体配線との間にＡＣＦによる接続が介在するため、不具合原因がＦＰＣ導体配線の断線にあるのかＡＣＦ接続部にあるのか明確にできない。
【００１１】
本発明は以上の点に鑑みなされたもので、上記の問題点を回避しＦＰＣからの入力信号を確認するためにはフレキシブルプリント配線板の導体配線の外形端で液晶表示装置と接続するのではなく、接続部よりも外側に導体配線を残しておくことにより、液晶表示装置を表示させるための有効な配線を傷つけず、環境信頼性を損なうこともなく、フレキシブルプリント配線板からの信号入力を液晶表示装置と接続後も確認することが可能なフレキシブルプリント配線板の接続構造及び接続方法を提供することを目的とする。
【００１２】
また、本発明の他の目的は、不具合原因がＦＰＣ導体配線の断線にあるのかＡＣＦ接続部にあるのか明確にし得るフレキシブルプリント配線板の接続構造及び接続方法を提供することにある。
【００１３】
【課題を解決するための手段】
上記の目的を達成するため、第１の発明のフレキシブルプリント配線板の接続構造は、液晶表示装置の透明基板上の電極とフレキシブルプリント配線板の導体配線とを異方性導電膜を介して接続するフレキシブルプリント配線板の接続構造において、フレキシブルプリント配線板の導体配線に、導体配線の先端から所定の長さで、異方性導電膜で透明基板上の電極と接続されない確認用導体配線部を設けたことを特徴とする。
【００１４】
ここで、上記の確認用導体配線部は、測定用ピンが接触する電極端子が設けられていることを特徴とする。この発明では、測定用ピンが接触する部分は有効配線ではなく、ＦＰＣ導体配線の余剰となる確認用導体配線部の電極端子である。
【００１５】
また、上記の目的を達成するため、第３の発明では、第１の発明のフレキシブルプリント配線板の確認用導体配線部を、透明基板上の電極と非接触となるように、透明基板から遠ざかるように確認用導体配線部以外の導体配線に対して屈曲形成されていることを特徴とする。
【００１６】
また、上記の目的を達成するため、第４の発明では、第１の発明の確認用導体配線部を、フレキシブルプリント配線板の導体配線とは異なる線材で、導体配線に電気的に接続されていることを特徴とする。
【００１７】
また、上記の目的を達成するため、第５の発明では、確認用導体配線部は、フレキシブルプリント配線板上に形成された複数の導体配線のうち、特定の一部の導体配線であることを特徴とする。
【００１８】
更に、上記の目的を達成するため、第６の発明のフレキシブルプリント配線板の接続方法は、表面に電極が形成された液晶表示装置の透明基板上に異方性導電膜を貼り付ける第１のステップと、透明基板上の電極と、確認用導体配線部が先端部付近に設けられたフレキシブルプリント配線板の導体配線とを対向させて位置合わせする第２のステップと、フレキシブルプリント配線板の上から加熱ツールを使用して、透明基板上の電極と、フレキシブルプリント配線板の導体配線のうち確認用導体配線部を除く導体配線部とを圧着して接続する第３のステップとを含むことを特徴とする。
【００１９】
【発明の実施の形態】
次に、本発明の実施の形態について図面と共に説明する。図１は本発明になるフレキシブルプリント配線板の接続方法により接続された液晶表示装置（ＬＣＤ）とフレキシブルプリント配線板（ＦＰＣ）の一実施の形態の接続状態を示す平面図、図２は図１のＢ−Ｂ’線に沿う断面図、図３は図２の拡大断面図を示す。図１〜図３において、図８〜図１０と同一部分には同一符号を付してある。図１〜図３において、液晶表示装置（ＬＣＤ）１は、偏光板１ａと透明基板１ｂとからなり、その透明基板１ｂがフレキシブルプリント配線板（ＦＰＣ）６上のＦＰＣ導体配線７に、異方性導電膜（ＡＣＦ）５を用いてＬＣＤ１に接続している。
【００２０】
図２及び図３に示すように、ＦＰＣ６及びＦＰＣ導体配線７は、その先端から所定の長さ部分が透明基板１ｂに対して距離が大となる方向に屈曲した部分を有する構造とされており、その導体配線７の屈曲部分以降の先端部が確認用導体配線部７ａとされ、透明基板１ｂと離間している。また、図３に示すように、導体配線部７のうち、確認用導体配線部７ａ以外の部分がＡＣＦ５により透明基板１ｂに接続されている。
【００２１】
図１０に示すように従来のＬＣＤ１とＦＰＣ２の接続部３はＦＰＣ２のほぼ端までＡＣＦ５で覆われて実装されているが、図３に示すように本実施の形態の接続方法では、ＦＰＣ導体配線７の先端部の確認用導体配線部７ａが覆われないように、ＡＣＦ５でＦＰＣ導体配線７をＬＣＤ１に接続するようにしているため、図４の模式図に示すように入力信号が測定できる測定用ピン９を確認用導体配線部７ａの先端側に接触させることにより、図４のＦＰＣ導体配線７に断線部８があった場合の断線の検出やＦＰＣ実装後の入力信号の測定をすることが可能となる。
【００２２】
ここで、測定用ピン９を接触する部分は有効配線ではなく、ＦＰＣ導体配線７の余剰となる確認用導体配線部７ａであるので、有効配線に対する傷、破損による信頼性に影響を与える可能性はない。本実施の形態では、このように信頼性を損なうことなく狭い面積で測定用ピン９を接触させることができる。
【００２３】
また、ＬＣＤ１上の配線で入力信号を取り出す場合には、図２乃至図４に示すようにＦＰＣの導体配線７との間にＡＣＦ５による接続部３が介在するため、測定用ピン９を用いて断線を検出できた場合、入力信号が取り出せたときは不具合原因がＦＰＣ導体配線７の断線にあることが分かり、入力信号が取り出せないときはＡＣＦ接続部３にあることが分かる。従って、従来は不具合原因がＦＰＣ導体配線の断線にあるのかＡＣＦ接続部にあるのか明確にできなかったのに対し、本実施の形態においてはこの２つを明確に切り分けることが可能となる。
【００２４】
次に、本発明の接続方法の一実施の形態の接続手順について図５と共に説明する。図５は本発明方法の一実施の形態の接続手順を示す各接続工程の素子断面図を示す。まず、図５（Ａ）に示すようにＬＣＤ１の透明基板１ｂにＡＣＦ５を貼り付ける。続いて、図５（Ｂ）に示すように、確認用導体配線部が設けられたフレキシブルプリント配線板６上の導体配線７と、ＬＣＤ１の透明基板１ｂ上の電極１０を対向させて位置合わせする。そして、図５（Ｃ）に示すように、ＦＰＣ６の上から適当な温度、圧力、時間で加熱ツール１１を使用して圧着させる。この手順は従来の接続方法における手順と変わらないが、導体配線部７のうちＡＣＦ５を介して透明基板１ｂに接続されるのは、確認用導体配線部以外の導体配線部であるという本実施の形態特有の接続構造が得られる。
【００２５】
図４に示すように、測定用ピン９を確認用導体配線部７ａの該当する電極端子に接触させ、所要する信号が入力されていることを確認することにより、ＦＰＣ６上に形成された、もしくはＬＣＤ１と逆側でＦＰＣと接続された回路基板に形成された回路が正常に動作しているかを確かめることが可能となる。確認用導体配線部７ａは測定用ピン９の先端が接触できる必要があるため、目安として２ｍｍ以上設ける必要がある。
【００２６】
なお、本発明は以上の実施の形態に限定されるものではなく、例えば、確認用導体配線部７ａは導体配線７に設けるのではなく、図６に示すように、導体配線部７ａに接続された他のＦＰＣ１２や線材等を用いても、電気的に信号を確認できればかまわない。また、全ての導体配線４を確認用導体配線部を有する構成として残すのではなく、図７に示すように、ある一部のみを確認用導体配線部１３として残すようにしてもかまわない。
【００２７】
【発明の効果】
以上説明したように、本発明によれば、フレキシブルプリント配線板の導体配線に、導体配線の先端から所定の長さで、異方性導電膜で透明基板上の電極と接続されない確認用導体配線部を設け、測定用ピンが接触する部分は有効配線ではなく、ＦＰＣ導体配線の余剰となる確認用導体配線部の電極端子としたため、フレキシブルプリント配線板から液晶表示装置への入力信号が正常であることを、ワーク（製品）を破壊することなく、傷、破損による信頼性を損なうことなく容易に確認することができ、また、このように信頼性を損なうことなく狭い面積で確認用ピンを接触させることができる。
【００２８】
また、本発明によれば、フレキシブルプリント配線板と液晶表示装置の接続部において、フレキシブルプリント配線板の導体配線に断線が生じる不具合が発生した場合に、従来ではできなかった、異方性導電膜による接続不良とフレキシブルプリント配線板の導体配線の断線とを区別することができる。
【図面の簡単な説明】
【図１】本発明の接続方法の一実施の形態によるＬＣＤとＦＰＣの接続状態を示す平面図である。
【図２】図１中のＢ−Ｂ’線に沿う断面図である。
【図３】図２の拡大断面図である。
【図４】本発明により接続されたＦＰＣ導体配線の断線および測定用ピン接触の様子の一例を示す模式図である。
【図５】本発明方法の一実施の形態の接続手順を示す各接続工程の素子断面図である。
【図６】本発明の接続方法の他の実施の形態を示す断面図である。
【図７】本発明の接続方法の更に他の実施の形態を示す平面図である。
【図８】従来の接続方法の一例によるＬＣＤとＦＰＣの接続状態を示す平面図である。
【図９】図８のＡ−Ａ’線に沿う断面図である。
【図１０】図９の拡大断面図である。
【符号の説明】
１ 液晶表示装置（ＬＣＤ）
１ａ 偏光板
１ｂ 透明基板
２、６ フレキシブルプリント配線板（ＦＰＣ）
３ ＬＣＤとＦＰＣの接続部
４、７ ＦＰＣ導体配線
５ 異方性導電膜（ＡＣＦ）
７ａ 確認用導体配線部
８ ＦＰＣ導体断線部
９ 測定用ピン
１０ ＬＣＤ電極
１１ 加熱ツール
１２ 確認用ＦＰＣ
１３ 確認用導体配線部（一部）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a connection structure and a connection method of a flexible printed wiring board, and more particularly to a connection structure and a connection method of a flexible printed wiring board for connecting a flexible printed wiring board for power supply and signal input of a liquid crystal display device.
[0002]
[Prior art]
FIG. 8 is a plan view showing a connection state of an example of a liquid crystal display (LCD) and a flexible printed wiring board (FPC) connected by a conventional method of connecting a flexible printed wiring board, and FIG. 9 is AA ′ of FIG. FIG. 10 is an enlarged sectional view of FIG. 9 along a line. 8 to 10, a liquid crystal display (LCD) 1 includes a polarizing plate 1a and a transparent substrate 1b, and the transparent substrate 1b is anisotropically connected to the FPC conductor wiring 4 on the flexible printed wiring board (FPC) 2. It is connected to the LCD using an anisotropic conductive film (ACF) 5. Reference numeral 3 denotes a connection between the LCD and the FPC.
[0003]
As described above, in order to input a signal to the liquid crystal display (LCD) 1, a flexible printed wiring board (FPC) 2 is conventionally connected to the LCD 1 using an anisotropic conductive film (ACF) 5. In the conventional connection method between the LCD 1 and the FPC 2, the wiring 4 connected from the FPC 2 to the LCD 1 generally reaches the IC electrode or the display element mainly by the transparent electrode 1b on the LCD 1. .
[0004]
By the way, with a recent increase in the screen size, functions, and color of the LCD 1 in a mobile phone or the like, the use of a COF (Clip On FPC) in which a semiconductor integrated circuit (IC) is mounted on an FPC 2 to be connected is increasing. . Also, as the number of signal inputs increases, the connection pitch of the driver ICs subjected to COF becomes finer, and the number of electrodes in the connection portion 3 between the LCD 1 and the FPC 2 also increases. The thickness of the conductor of the FPC 2 has been reduced in order to form a wiring.
[0005]
On the other hand, as the weight and thickness of mobile phones have been reduced, the rigidity of the housing of the mobile phone has become smaller, and the gap between the housing and the LCD has become narrower. It has become wider and the rigidity of the housing has been reduced. Along with these, a display failure due to disconnection of the copper wiring 4 of the FPC 2 occurs at the connection portion 3 between the LCD 1 and the FPC 2 due to an impact due to deformation of the FPC in various directions at the time of assembling the device or dropping when used by the user. May be. However, this disconnection may be extremely fine, and it is not possible to clearly determine the disconnection by observation with a microscope, and there is a demand to measure the conduction resistance and electrically confirm the failure. In addition, there is a request to check whether a signal is normally input from the FPC 2 after the connection between the LCD 1 and the FPC 2.
[0006]
Although it is possible to measure an input signal by directly contacting a measurement pin on the wiring of the transparent substrate 1b, in this case, the FPC connection unit 3 is directly connected to an IC electrode or a display element. The measurement pin directly contacts the wiring that is effective and interrupts the signal if it breaks (hereinafter referred to as the effective wiring), and the surface of the wiring is not damaged or damaged due to the contact. May affect the environmental reliability of the plant.
[0007]
Therefore, in order to meet the above demand, a method of providing a confirmation terminal outside the effective wiring in the wiring formed on the LCD has been conventionally known (for example, see Patent Document 1). Patent Document 1 discloses a liquid crystal display element in which one of two transparent substrates in which liquid crystal is sealed and overlapped with each other is provided integrally with a portion protruding from one side surface of the other transparent substrate. The above-mentioned one transparent substrate is integrally provided with a protruding portion for inspection from the other side surface of the other transparent substrate, and a terminal for each of the transparent electrodes on both transparent substrates is provided on the surface of the protruding portion for inspection. It is disclosed that an electrode is formed and a performance probe of a liquid crystal display element is inspected by contacting an energizing probe with the terminal electrode.
[0008]
[Patent Document 1]
JP-A-11-30785 (page 3-4, FIG. 2)
[0009]
[Problems to be solved by the invention]
However, the above-described method of providing a confirmation terminal outside the effective wiring in the wiring formed on the LCD is performed in the case where a confirmation terminal (a terminal electrode provided in the protruding portion for inspection in Patent Document 1) is provided from each terminal. Requires a very large area, and the size of the LCD other than the display surface is becoming very narrow due to the recent increase in the size of the LCD, which hinders the narrowing of the frame accompanying the increase in the size of the screen. Probability is high. In addition, providing a check terminal in the middle of wiring on the LCD from the FPC connection portion to the IC connection portion and the display element is not desirable in terms of environmental reliability because the surface of the check terminal is damaged to some extent.
[0010]
Also, when an input signal is taken out by wiring on the LCD, since connection by the ACF is interposed between the conductor wiring of the FPC and the connection of the FPC, it is necessary to clearly determine whether the failure is caused by the disconnection of the FPC conductor wiring or the ACF connection part. Can not.
[0011]
The present invention has been made in view of the above points, and in order to avoid the above-described problems and to confirm an input signal from the FPC, it is necessary to connect the liquid crystal display device at the outer end of the conductor wiring of the flexible printed wiring board. In addition, leaving the conductor wiring outside the connection part does not damage the effective wiring for displaying the liquid crystal display device, does not impair the environmental reliability, and allows the signal input from the flexible printed wiring board An object of the present invention is to provide a connection structure and a connection method of a flexible printed wiring board that can be confirmed even after connection with a liquid crystal display device.
[0012]
It is another object of the present invention to provide a connection structure and a connection method for a flexible printed wiring board which can clarify whether a failure is caused by a disconnection of an FPC conductor wiring or an ACF connection portion.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, a connection structure for a flexible printed wiring board according to a first aspect of the present invention connects an electrode on a transparent substrate of a liquid crystal display device and a conductive wiring of the flexible printed wiring board via an anisotropic conductive film. In the connection structure of the flexible printed wiring board, the conductor wiring of the flexible printed wiring board is provided with a check conductor wiring portion that is not connected to the electrode on the transparent substrate with an anisotropic conductive film at a predetermined length from the tip of the conductor wiring. It is characterized by having been provided.
[0014]
Here, the above-mentioned conductor wiring part for confirmation is characterized in that an electrode terminal with which a pin for measurement contacts is provided. According to the present invention, the portion in contact with the measuring pin is not the effective wiring, but the electrode terminal of the checking conductor wiring portion which becomes an excess of the FPC conductor wiring.
[0015]
Further, in order to achieve the above object, in the third invention, the confirmation conductor wiring portion of the flexible printed wiring board of the first invention is moved away from the transparent substrate so as not to be in contact with the electrode on the transparent substrate. As described above, it is characterized by being bent with respect to the conductor wiring other than the confirmation conductor wiring portion.
[0016]
Further, in order to achieve the above object, in the fourth invention, the conductor wire for confirmation of the first invention is electrically connected to the conductor wire with a wire different from the conductor wire of the flexible printed wiring board. It is characterized by having.
[0017]
In order to achieve the above object, in the fifth invention, the confirmation conductor wiring portion is a specific part of a plurality of conductor wirings formed on the flexible printed wiring board. Features.
[0018]
Furthermore, in order to achieve the above object, a method of connecting a flexible printed wiring board according to a sixth aspect of the present invention is a method for connecting an anisotropic conductive film to a transparent substrate of a liquid crystal display device having electrodes formed on a surface thereof. A second step of aligning the electrode on the transparent substrate with the conductor wiring of the flexible printed wiring board provided with the conductor wiring part for confirmation in the vicinity of the tip end, and And a third step of crimping and connecting the electrode on the transparent substrate and the conductor wiring portion of the flexible printed wiring board except the confirmation conductor wiring portion using a heating tool. Features.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a connection state of an embodiment of a liquid crystal display (LCD) and a flexible printed wiring board (FPC) connected by a flexible printed wiring board connection method according to the present invention, and FIG. 3 is a sectional view taken along line BB ′ of FIG. 3, and FIG. 3 is an enlarged sectional view of FIG. 1 to 3, the same parts as those in FIGS. 8 to 10 are denoted by the same reference numerals. 1 to 3, a liquid crystal display (LCD) 1 includes a polarizing plate 1a and a transparent substrate 1b, and the transparent substrate 1b is anisotropically connected to FPC conductor wiring 7 on a flexible printed wiring board (FPC) 6. It is connected to LCD 1 using conductive conductive film (ACF) 5.
[0020]
As shown in FIGS. 2 and 3, the FPC 6 and the FPC conductor wiring 7 have a structure in which a predetermined length from the tip thereof has a portion bent in a direction in which the distance to the transparent substrate 1 b increases. The tip portion of the conductor wiring 7 after the bent portion is a conductor wiring portion 7a for confirmation and is separated from the transparent substrate 1b. In addition, as shown in FIG. 3, portions of the conductor wiring portion 7 other than the confirmation conductor wiring portion 7 a are connected to the transparent substrate 1 b by the ACF 5.
[0021]
As shown in FIG. 10, the conventional connection portion 3 between the LCD 1 and the FPC 2 is mounted so as to be almost covered with the ACF 5 to almost the end of the FPC 2. However, as shown in FIG. Since the FPC conductor wiring 7 is connected to the LCD 1 by the ACF 5 so as not to cover the confirmation conductor wiring portion 7a at the tip end of the measurement 7, the input signal can be measured as shown in the schematic diagram of FIG. By detecting the disconnection 8 in the FPC conductor wiring 7 shown in FIG. 4 by measuring the input signal after mounting the FPC, the contact pin 9 is brought into contact with the tip of the confirmation conductor wiring 7a. Becomes possible.
[0022]
Here, the contacting portion of the measuring pin 9 is not the effective wiring but the surplus conductor wiring portion 7a of the FPC conductor wiring 7, which may affect the reliability due to damage or damage to the effective wiring. There is no. In the present embodiment, the measuring pin 9 can be brought into contact with a small area without deteriorating the reliability as described above.
[0023]
When the input signal is taken out by the wiring on the LCD 1, as shown in FIGS. 2 to 4, the connecting portion 3 by the ACF 5 is interposed between the conductor wiring 7 of the FPC and the measuring pin 9. When the disconnection can be detected, when the input signal can be extracted, it can be understood that the cause of the problem is the disconnection of the FPC conductor wiring 7, and when the input signal cannot be extracted, it is in the ACF connection portion 3. Therefore, while it has not conventionally been possible to clarify whether the cause of the failure is due to the disconnection of the FPC conductor wiring or the ACF connection portion, in the present embodiment, the two can be clearly separated.
[0024]
Next, a connection procedure according to an embodiment of the connection method of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view of an element in each connection step showing a connection procedure according to an embodiment of the method of the present invention. First, as shown in FIG. 5A, the ACF 5 is attached to the transparent substrate 1b of the LCD 1. Subsequently, as shown in FIG. 5B, the conductor wiring 7 on the flexible printed wiring board 6 provided with the conductor wiring part for confirmation and the electrode 10 on the transparent substrate 1b of the LCD 1 are positioned so as to face each other. . Then, as shown in FIG. 5C, the FPC 6 is pressure-bonded from above the FPC at an appropriate temperature, pressure, and time using the heating tool 11. This procedure is the same as the procedure in the conventional connection method, but in this embodiment, it is the conductor wiring portion other than the confirmation conductor wiring portion that is connected to the transparent substrate 1b via the ACF 5 in the conductor wiring portion 7. A form-specific connection structure is obtained.
[0025]
As shown in FIG. 4, the measurement pin 9 is formed on the FPC 6 by contacting a corresponding electrode terminal of the confirmation conductor wiring portion 7 a and confirming that a required signal is input, or It is possible to check whether the circuit formed on the circuit board connected to the FPC on the side opposite to the LCD 1 is operating normally. Since the tip of the measuring pin 9 needs to be able to contact the confirmation conductor wiring portion 7a, it is necessary to provide the reference conductor wiring portion 2a at least 2 mm.
[0026]
The present invention is not limited to the above embodiments. For example, the conductor wiring portion 7a for confirmation is not provided in the conductor wiring 7 but is connected to the conductor wiring portion 7a as shown in FIG. Any other FPC 12 or wire may be used as long as the signal can be confirmed electrically. In addition, instead of leaving all the conductor wirings 4 as a configuration having the confirmation conductor wiring portion, as shown in FIG. 7, only a certain part may be left as the confirmation conductor wiring portion 13.
[0027]
【The invention's effect】
As described above, according to the present invention, the conductor wiring of the flexible printed wiring board has a predetermined length from the tip of the conductor wiring, and the confirmation conductor wiring which is not connected to the electrode on the transparent substrate by the anisotropic conductive film. The part where the measuring pin contacts is not the effective wiring, but the electrode terminal of the conductor wiring part for confirmation, which is the surplus of the FPC conductor wiring, so that the input signal from the flexible printed wiring board to the liquid crystal display device is normal. It is possible to easily confirm that there is no damage to the work (product) without damaging the reliability due to scratches or breakage, and to use the pin for checking in a small area without impairing the reliability. Can be contacted.
[0028]
Further, according to the present invention, an anisotropic conductive film that cannot be conventionally formed when a problem occurs in which a disconnection occurs in a conductive wiring of a flexible printed wiring board in a connection portion between the flexible printed wiring board and a liquid crystal display device. And the disconnection of the conductor wiring of the flexible printed wiring board can be distinguished.
[Brief description of the drawings]
FIG. 1 is a plan view showing a connection state between an LCD and an FPC according to an embodiment of a connection method of the present invention.
FIG. 2 is a sectional view taken along the line BB 'in FIG.
FIG. 3 is an enlarged sectional view of FIG. 2;
FIG. 4 is a schematic diagram showing an example of a state of disconnection of FPC conductor wiring connected according to the present invention and contact of a measuring pin.
FIG. 5 is a sectional view of an element in each connection step showing a connection procedure according to an embodiment of the method of the present invention.
FIG. 6 is a cross-sectional view showing another embodiment of the connection method of the present invention.
FIG. 7 is a plan view showing still another embodiment of the connection method of the present invention.
FIG. 8 is a plan view showing a connection state between an LCD and an FPC according to an example of a conventional connection method.
FIG. 9 is a sectional view taken along line AA ′ of FIG. 8;
FIG. 10 is an enlarged sectional view of FIG. 9;
[Explanation of symbols]
1 Liquid crystal display (LCD)
1a Polarizing plate 1b Transparent substrate 2, 6 Flexible printed wiring board (FPC)
3 LCD and FPC connection 4, 7 FPC conductor wiring 5 Anisotropic conductive film (ACF)
7a Conductor wiring part for confirmation 8 FPC conductor disconnection part 9 Measurement pin 10 LCD electrode 11 Heating tool 12 FPC for confirmation
13 Conductor wiring part for confirmation (part)

Claims (6)

液晶表示装置の透明基板上の電極とフレキシブルプリント配線板の導体配線とを異方性導電膜を介して接続するフレキシブルプリント配線板の接続構造において、
前記フレキシブルプリント配線板の導体配線に、該導体配線の先端から所定の長さで、前記異方性導電膜で前記透明基板上の電極と接続されない確認用導体配線部を設けたことを特徴とするフレキシブルプリント配線板の接続構造。In the connection structure of the flexible printed wiring board for connecting the electrode on the transparent substrate of the liquid crystal display device and the conductor wiring of the flexible printed wiring board via the anisotropic conductive film,
The conductor wiring of the flexible printed wiring board is provided with a conductor wiring portion for confirmation that is not connected to the electrode on the transparent substrate with the anisotropic conductive film at a predetermined length from the tip of the conductor wiring. Flexible printed wiring board connection structure. 前記確認用導体配線部は、測定用ピンが接触する電極端子が設けられていることを特徴とする請求項１記載のフレキシブルプリント配線板の接続構造。The connection structure for a flexible printed wiring board according to claim 1, wherein the confirmation conductor wiring portion is provided with an electrode terminal with which a measurement pin contacts. 前記フレキシブルプリント配線板の確認用導体配線部は、前記透明基板上の電極と非接触となるように、前記透明基板から遠ざかるように該確認用導体配線部以外の該導体配線に対して屈曲形成されていることを特徴とする請求項１又は２記載のフレキシブルプリント配線板の接続構造。The checking conductor wiring portion of the flexible printed wiring board is formed to be bent with respect to the conductor wiring other than the checking conductor wiring portion so as to be away from the transparent substrate so as not to be in contact with the electrode on the transparent substrate. The connection structure for a flexible printed wiring board according to claim 1, wherein the connection structure is provided. 前記確認用導体配線部は、前記フレキシブルプリント配線板の導体配線とは異なる線材で、該導体配線に電気的に接続されていることを特徴とする請求項１又は２記載のフレキシブルプリント配線板の接続構造。The flexible printed wiring board according to claim 1, wherein the confirmation conductive wiring portion is electrically connected to the conductive wiring with a wire different from the conductive wiring of the flexible printed wiring board. 4. Connection structure. 前記確認用導体配線部は、前記フレキシブルプリント配線板上に形成された複数の導体配線のうち、特定の一部の導体配線であることを特徴とする請求項１又は２記載のフレキシブルプリント配線板の接続構造。The flexible printed wiring board according to claim 1, wherein the confirmation conductive wiring portion is a specific part of a plurality of conductive wirings formed on the flexible printed wiring board. Connection structure. 表面に電極が形成された液晶表示装置の透明基板上に異方性導電膜を貼り付ける第１のステップと、
前記透明基板上の電極と、確認用導体配線部が先端部付近に設けられたフレキシブルプリント配線板の導体配線とを対向させて位置合わせする第２のステップと、
前記フレキシブルプリント配線板の上から加熱ツールを使用して、前記透明基板上の電極と、前記フレキシブルプリント配線板の導体配線のうち前記確認用導体配線部を除く導体配線部とを圧着して接続する第３のステップと
を含むことを特徴とするフレキシブルプリント配線板の接続方法。A first step of attaching an anisotropic conductive film on a transparent substrate of a liquid crystal display device having electrodes formed on a surface thereof;
A second step of positioning the electrodes on the transparent substrate and the conductor wiring for confirmation by opposing the conductor wiring of the flexible printed wiring board provided near the tip end;
Using a heating tool from above the flexible printed wiring board, the electrodes on the transparent substrate and the conductor wiring portions of the flexible printed wiring board other than the confirmation conductor wiring portion among the conductor wiring portions are crimped and connected. And a third step of connecting the flexible printed wiring board.
JP2002338683A 2002-11-22 2002-11-22 Flexible printed wiring board connection structure and connection method Expired - Fee Related JP3853729B2 (en)

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CN106990565A (en) * 2017-04-20 2017-07-28 深圳市屏柔科技有限公司 A kind of complete machine production technology of liquid crystal handwriting device

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* Cited by examiner, † Cited by third party
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CN100414419C (en) * 2005-12-16 2008-08-27 群康科技(深圳)有限公司 Method and apparatus for adhering driving component
CN113296319A (en) * 2020-02-21 2021-08-24 华为技术有限公司 Display module assembly and display device

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