JP2003158354A - Mount inspection method of wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable inspection of mounting state of one wiring board and the other wiring board by forming a dummy electrode terminal only on the one wiring board. SOLUTION: Position deviation of the respective electrode terminals 11, 21 in the case that a printed wiring board 10 as one wiring board and a flexible wiring board 20 as the other wiring board are overlapped is inspected by existence of electrically continuous state between electrode terminals 11a, 11z of the printed wiring board 10 as one wiring board and the dummy electrode terminals D1, D2 for inspection, via an electrode terminal 21 of the other wiring board 20 which is in contact with the dummy electrode terminals D1, D2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board mounting inspection method for inspecting the mounting state of one wiring board having electrode terminals and the other wiring board having electrode terminals.

[0002]

2. Description of the Related Art Conventionally, in the process of connecting circuit boards of general electronic equipment to circuit boards or in the process of modularizing a liquid crystal display panel when manufacturing a liquid crystal display device, electrode terminals provided on one wiring board and other The connection state of both electrode terminals with the electrode terminals provided on the wiring board is an important issue from the past because the fine pitch of the electrode terminals is rapidly advancing in order to secure the reliability of the electronic device. Has become.
In particular, in a liquid crystal display device, a poor conduction between electrode terminals greatly affects display accuracy, and therefore a highly accurate and simple continuity test is required. A liquid crystal display device will be described below as an example of the electronic apparatus.

In the manufacture of a liquid crystal display device, a semiconductor element for driving the liquid crystal panel is mounted on a liquid crystal panel in a modularization process following a so-called cell process for sandwiching the liquid crystal, and the outer periphery of the liquid crystal panel is mounted. A printed wiring board and a flexible wiring board for supplying a transmission signal or power to the semiconductor element are mounted on the semiconductor device.

As a method for electrically connecting these wiring boards, for example, a rubber connection method, a heat sealing method, an anisotropic conductive film method, and a TAB (tape automated bondin) method are used.
Although the g) method, the COG (chip on glass) method and the like have been proposed, the TAB method and the COG method are predominant in use today from the viewpoint of automation of the modularization process and process throughput. In the TAB method, a liquid crystal cell and a printed wiring board are mounted on a TCP (tape carri) mounted with a driver LSI.
er package) is a method of connecting using a flexible wiring board. Note that the COG method is a method in which a driver element for driving is directly mounted on one of a pair of substrates sandwiching a liquid crystal layer.

FIG. 7 is a connection configuration diagram of each wiring board 131a, 120, 110 of the liquid crystal panel L by the TAB method. The liquid crystal panel L includes a pair of glass substrates 131a and 13a.
1b and a liquid crystal layer sandwiched between a pair of glass substrates 131a and 131b, and a printed wiring board 110 is arranged on the outer peripheral edge of one glass substrate 131a via a flexible wiring board 120.

The printed wiring board 110 is mounted with various kinds of electronic parts (not shown) mainly by soldering or ACF, and a driver element input signal input to the driver element IC of the flexible wiring board 120 is input. To transmit. As the printed wiring board 110, a glass epoxy board on which a predetermined copper foil pattern and a solder resist pattern are formed is usually used. On the surface of the printed wiring board 110 on the flexible wiring board 120 side, a plurality of electrode terminals 112 are formed at a predetermined pitch along one side of the printed wiring board 110. The electrode terminal 112 is the printed wiring board 1
It is formed on the surface (front surface) opposite to the surface (rear surface) on which the printed wirings and electronic components 10 are arranged.

The flexible wiring board 120 used in the TAB method is made of a polyimide film and has a driver element IC mounted thereon. Flexible wiring board 12
0 is patterned with a large number of input electrode terminals 122a and output electrode terminals 122b toward both sides in the longitudinal direction, and these input / output electrode terminals 122a and 122b are arranged at a predetermined pitch. Input / output electrode terminal 122
a and 122b are connected to the input terminal and the output terminal of the driver element IC. The input electrode terminal 122a is connected to the electrode terminal 112 provided on the printed wiring board 110, and the output electrode terminal 122b is connected to the one glass substrate 1.
It is connected to the electrode terminal 132 of 31a. A driving signal for driving the liquid crystal panel is supplied from the electrode terminal 112 of the printed wiring board 110 to the input electrode terminal 122a of the flexible wiring board 120, the driver element IC, and the output electrode terminal 1.
It is transmitted to the electrode terminal 132 of one substrate (glass substrate) 131a of the liquid crystal cell 130 via 12b. In addition,
The wiring pitch of the input electrode terminals 122a is about 200 to 400 μm on the printed wiring board side, and the wiring pitch of the output electrode terminals 122b is about 100 to 200 μm.

Electrode terminal 112 of printed wiring board 110
And the input electrode terminal 12 of the flexible wiring board 120.
2a means soldering or anisotropic conductive adhesive (Anistropic C
onductive film (ACF). On the other hand, between the electrode terminal 132 of the liquid crystal cell 130 and the output electrode terminal 122b of the flexible wiring board 120, an anisotropic conductive adhesive having conductive particles dispersed in a thermosetting resin film is sandwiched therebetween. They are connected by heating and pressure bonding.

In such a liquid crystal panel L, since the connection state between the respective electrode terminals has a great influence on the display accuracy of the liquid crystal panel L, the electrode terminals 11 of the printed wiring board 110.
2 and the input-side electrode terminal 12 of the flexible wiring board 120
Conventionally, the connection point with 2a has been visually inspected, and some methods have been developed to supplement the visual inspection from the viewpoint of its reliability.

The first method for inspecting the connection state of the connection points of the liquid crystal panel is to provide the cutouts 123 at both ends of the flexible wiring board 120 and the dummy electrode terminals D100 on the printed wiring board 110 for inspection. (FIG. 8). When the dummy electrode terminal D100 can be confirmed in the cutout 123 after the flexible wiring board 120 is arranged at a predetermined position of the printed wiring board 110 and connected by soldering or interposing ACF, the flexible wiring board 120 is arranged. It is assumed that there is no deviation and the connection state between the electrode terminal 112 and the input electrode terminal 122a is good. On the other hand, when the dummy electrode terminal D100 cannot be confirmed in the cutout 123, the arrangement of the flexible wiring board 120 is misaligned. , Electrode terminal 112 and input electrode terminal 122a
It is assumed that the connection state with is poor.

A second method is disclosed in Japanese Unexamined Patent Publication No. 6-59269, in which a liquid crystal panel is provided with a first dummy electrode terminal, and an insulating film is provided with a pair of second dummy electrodes connected to the first dummy electrode terminal. Disclosed is a method of inspecting a connection state between an electrode terminal of a liquid crystal panel and an electrode terminal of an insulating film by providing an electrode terminal and inspecting a contact resistance between the first dummy electrode terminal and the second dummy electrode terminal. Has been done.

[0012]

However, in the above-mentioned first conventional connection state inspection method, each notch portion 123 is provided.
Since it is necessary to visually inspect each of them, it is impossible to inspect the mounting state with high accuracy. That is, normally, the electrode terminals are joined together with some deviation, but it was impossible to inspect whether the positional deviation exceeded the allowable limit. In addition, when the printed wiring board 110 and the flexible wiring board 120 are inclined in the thickness direction as a cause of the conduction failure (that is, when the parallelism between the printed wiring board 110 and the flexible wiring board 120 is lost). However, although the dummy electrode terminal D100 is observed from the cutout 123, there is a problem that the conduction failure cannot be detected.

Further, in the above-mentioned second conventional method, in order to measure the contact resistance of the dummy electrode terminals which face each other, the dummy electrode terminals corresponding to both the liquid crystal panel and the insulating film are formed, and one of the wiring boards is formed. A complicated formation must be made so as to correspond to the other wiring board. Further, in such a method, the dummy electrode terminals are formed on the liquid crystal display panel. However, forming the dummy electrode terminals on the liquid crystal display panel, which is highly required due to the recent trend toward miniaturization, is difficult. Against the request of.

Therefore, an object of the present invention is to make it possible to perform a mounting inspection of one wiring board and the other wiring board only by forming dummy electrode terminals on only one wiring board, which is simple and highly accurate. Another object of the present invention is to provide a mounting inspection method for a flexible wiring board.

[0015]

In order to solve the above-mentioned problems and achieve the above-mentioned object, a wiring board mounting inspection method according to a first aspect of the present invention is characterized in that one wiring board having electrode terminals and one electrode terminal are provided. In a wiring board mounting inspection method for inspecting a mounting state with the other wiring board having, at least one dummy electrode terminal for inspection is arranged on one wiring board at a predetermined interval from any one electrode terminal thereof. , The positional deviation of each electrode terminal when one wiring board and the other wiring board are overlapped, through the electrode terminal of the other wiring board in contact with the dummy electrode terminal for inspection, It is characterized in that the inspection is performed depending on whether or not there is a conduction state between the electrode terminal and the dummy electrode terminal for inspection.

According to the present invention, whether or not there is a conduction state between the arbitrary one electrode terminal and the dummy electrode terminal for inspection through the electrode terminal of the other wiring substrate which is in contact with the dummy electrode terminal for inspection is determined. From the inspection, it is sufficient if the dummy electrode terminals are provided on one wiring board. The inspection of the conduction state is performed by bringing the probe (probe) of the inspection tester into contact. Then, by inspecting whether or not there is a conduction state between any one electrode terminal and the dummy electrode terminal of one substrate, the electrode terminal of the other wiring substrate comes into contact with the corresponding electrode terminal of one wiring substrate, and , If a deviation exceeding a predetermined interval provided between the dummy electrode terminal and the arbitrary one electrode terminal occurs, the dummy electrode terminal and the arbitrary one electrode terminal are brought into conduction with each other. It can be inspected that the conduction failure has occurred due to the displacement of the electrode terminals. On the other hand, the electrode terminals of the other wiring board are in contact with the corresponding electrode terminals of the one wiring board, and there is a gap that does not exceed the predetermined interval provided between the dummy electrode terminal and any one electrode terminal. If it is, or is correctly aligned without deviation, the electrode terminal of the other wiring board does not contact the dummy electrode terminal and the dummy electrode terminal and any one electrode terminal do not become conductive. Therefore, it can be inspected that the conduction failure due to the positional deviation of each electrode terminal does not occur.

The wiring board mounting inspection method according to claim 2 of the present invention is based on the wiring board according to claim 1, and the dummy electrode terminals of the one wiring board are arranged on both left and right sides of the electrode terminal. It is characterized by It should be noted that the electrodes may be arranged on the left and right of the arbitrary one electrode terminal, or may be arranged on the left and right sides of a plurality of (group of) electrode terminals.

According to the present invention, since the dummy electrode terminals are arranged on the left and right sides of the electrode terminals, the presence or absence of the conductive state is inspected not only on the one end side of the one wiring board but also on the other end side thereof. The inspection is performed even when one wiring board and the other wiring board are arranged at an inclination, or when one wiring board and the other wiring board are misaligned in the left or right direction.

The wiring board mounting inspection method according to claim 3 of the present invention is based on the invention of claim 1 or 2, wherein the other wiring board has a liquid crystal layer sandwiched between a pair of substrates. One of the substrates of the liquid crystal display panel, the one wiring substrate is a flexible wiring substrate arranged corresponding to the one substrate, or the other wiring substrate has a liquid crystal layer between a pair of substrates. The flexible wiring board is arranged on the outer periphery of one substrate of the sandwiched liquid crystal display panel, and the one wiring board is a printed wiring board arranged corresponding to the flexible wiring board.

According to the present invention, it is possible to inspect the connection state of each electrode terminal between one substrate of a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates and a corresponding flexible wiring substrate, Further, the connection state of the electrode terminals between the flexible wiring board and the corresponding printed wiring board can be inspected. In any case, according to the present invention, the mounting inspection of one wiring board and the other wiring board can be performed only by forming the dummy electrode terminals on only one wiring board. Further, since it is not necessary to form dummy electrode terminals on one substrate of the liquid crystal display panel, it is possible to carry out a mounting inspection corresponding to a liquid crystal display panel which is highly required to have a narrow frame due to the recent trend toward miniaturization.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

In this embodiment, as shown in FIGS. 1 and 2, the present invention is applied to mounting by a TAB method in a liquid crystal display device. That is, a liquid crystal display panel L in which a liquid crystal layer is sandwiched between a pair of substrates, a printed wiring board 10 disposed on the outer periphery of the liquid crystal display panel L, and a liquid crystal display disposed between the liquid crystal display panel L and the printed wiring board 10. The flexible wiring board 20 is provided with a driving semiconductor element IC for displaying the panel L (see FIG. 1). The electrode terminals 22 of the flexible wiring board 20 and the electrode terminals 32 of the liquid crystal display panel L are correspondingly formed in a linear shape facing each other, and the electrode terminals 21 (21a ... 21z) of the flexible wiring board 20 and the electrodes of the printed wiring board 10 are formed. The terminals 11 (11a ... 11z) are formed in a straight line shape corresponding to each other. The order of continuing is to connect the liquid crystal display panel L and the flexible wiring board 20 first, and then connect the flexible wiring board 20 and the printed wiring board 10. Liquid crystal display panel L and flexible wiring board 20, flexible wiring board 20 and printed wiring board 1
Anisotropic conductive adhesive (Anistropic Conductive Adhesive)
ive film, hereinafter referred to as ACF) or the like. Note that the ACF crimping includes individual crimping in which TCPs are crimped one by one, multi-head batch crimping in which one side of the wiring board is simultaneously crimped by a plurality of crimping heads, and one side of the wiring board is crimped simultaneously by one crimping head There is one head batch compression.

A pair of substrates 31 constituting the liquid crystal panel L
The first substrate 31a of the a and 31b is the second substrate 3
1b, so that both substrates 31a, 3 are formed.
When 1b is superposed, a mounting region that partially projects to the outer peripheral edge of the first substrate 31a is formed, and in this mounting region,
Electrode terminals 32 made of aluminum (Al) or the like are provided. The electrode terminal 32 is an input electrode terminal and transmits a liquid crystal driving signal from the semiconductor element IC to the liquid crystal layer.

The flexible wiring board 20 is made of a polyimide film and has a driver element IC such as an LSI mounted thereon. A large number of input electrode terminals 21 are patterned on the printed wiring board 10 side of the flexible wiring board 20, and a large number of output electrode terminals 22 are formed on the liquid crystal panel L side, which are respectively connected to the driver element ICs. Has been done.

The printed wiring board 10 is usually a glass epoxy board on which a predetermined copper foil pattern and solder resist pattern are formed. This printed wiring board 10
The plurality of electrode terminals 11 are arranged in the flexible wiring board 20.
It is formed at a constant pitch along the side. The electrode terminal 11 is formed on the surface (front surface) opposite to the surface (back surface) on which the printed wiring and electronic components of the printed wiring board 10 are arranged.

On the outer sides of the electrode terminals 11a and 11z at the left and right ends of the electrode terminal 11 of the printed wiring board 10, the first terminals are respectively provided.
The dummy electrode terminal D1 and the second dummy electrode terminal D2 are provided for the continuity test. Leftmost electrode terminal 11a
Is provided with a first lead line H1, and the rightmost electrode terminal 11z is provided with a second lead line H2. First and second lead lines H1, H2
The first and second dummy electrode terminals D1 and D2 are made of aluminum (Al) or the like, and the electrode terminals 11a ...
It is formed in the same process as 11z.

The first dummy electrode terminal D1 is an electrode terminal 11 on the leftmost side (arrangement direction LT side) of the printed wiring board 10.
It is formed in a straight line along a. The first dummy electrode terminal D1 is inspected for a conduction state between the input electrode terminal 21a of the flexible wiring board 20 and the electrode terminal 11a of the printed wiring board 10 that is in contact with the input electrode terminal 21a. A predetermined space Sa is provided between the input electrode terminal 11a and the input electrode terminal 11a. This predetermined interval Sa
Is input to the flexible wiring board 20 when the flexible wiring board 20 and the printed wiring board 10 are misaligned by more than the standard value (space dimension) in the modularization of the liquid crystal panel L (when misaligned by more than the allowable range). It is a distance in which the electrode terminal 11a of the printed wiring board 10 and the first dummy electrode terminal D1 are electrically connected to each other through the use electrode terminal 21. That is, in the first dummy electrode terminal D1, if the portion where the input electrode terminal 21 of the flexible wiring board 20 contacts the printed wiring board 10 is designated by the numeral 13 shown by the dotted line in FIGS. 2 and 3, this numeral 13 Has a width extending from the electrode terminal 11a to the first dummy electrode terminal D1. Further, the first dummy electrode terminal D1 is provided with a terminal pad PD via a lead wire. The leftmost electrode terminal 11a is also provided with the terminal pad PH via the lead wire H1, and the distance between the first dummy electrode terminal D1 and the terminal pad PD is reduced. Each electrode terminal 11, 21, 22 is made of aluminum (Al) or the like, and the wiring pitch between the electrode terminal 11 and the input electrode terminal 21 is about 200 to 400 μm.
The wiring pitch of the output electrode terminals 22 is 100 to 200 μ.
It is about m. About half of these values are within the allowable positional deviation range, and the accuracy of the positional deviation can be improved by statistically determining the value.

The second dummy electrode terminal D2 is the electrode terminal 1 at the rightmost end (arrangement direction RT side) of the printed wiring board 10.
It is formed in a straight line along 1z. Similarly, the second dummy electrode terminal D2 is also provided with a predetermined space Sz between the second dummy electrode terminal D2 and the electrode terminal 11z. Further, the second dummy electrode terminal D2 is provided with a terminal pad PD via a lead wire, and the rightmost electrode terminal 11z is also provided with a terminal pad PH via a lead wire H2. The dummy electrode terminal D2 is close to the terminal pad PD. The first dummy electrode terminal D1 and the electrode terminal 1
The predetermined distance Sa between the first dummy electrode terminal D2 and the electrode terminal 11z is the same as the predetermined distance Sa between the first dummy electrode terminal D2 and the electrode terminal 11z.

Here, the first dummy electrode terminal D1 and the second dummy electrode terminal D1
The dummy electrode terminal D2 may not be provided on both outer sides of the electrode terminals 11a and 11z, and may be provided only on one of the electrode terminals 11. In this case, it is sufficient to provide the printed wiring board 10 with one dummy electrode terminal D1 (or D2). In addition, a pair of dummy electrode terminals D1,
D2 is an electrode terminal 11a at both ends of the array of electrode terminals 11,
11z may be provided on any of the electrode terminals 11b ... 11y arranged in the middle of the arrangement, or may be provided on the left and right of each of the electrode terminals 11a ... 11z. Further, the first and second dummy electrode terminals D1 and D2 are
As shown in FIG. 7, the tip portion D1a may be bent so as not to face the one side edge portion of the printed wiring board 10.

Next, a method of inspecting the mounting state of the wiring board of this embodiment will be described. The terminal pad PH of the first lead wire H1 and the terminal pad PD of the first dummy electrode terminal D1 are brought into contact with the probe (probe) of the tester for inspection, and the contact resistance value between them is measured. The electrical connection between the electrode terminal 11 and the other input electrode terminal 21 is inspected. Even if the probe of the inspection tester is not brought into contact with the terminal pads PH and PD, the first or second dummy electrode terminals D1 and D2 and the electrode terminal 11a or the electrode terminal 11z.
May be brought into direct contact with. Then, one electrode terminal 11
It is possible to inspect whether or not the other input electrode terminal 21 and the other input electrode terminal 21 are out of position by a predetermined allowable range or more, which will be specifically described below with reference to the drawings.

In FIG. 3A, when the flexible wiring board 20 is arranged at a predetermined position on the printed wiring board 10 without displacement, that is, the input electrode terminals 21 of the flexible wiring board 20 are electrodes of the printed wiring board 10. Terminal 1
1 shows a mounting state when they are arranged so as to be accurately overlapped with each other without shifting to 1. In this mounted state, the input electrode terminals 21 are arranged so as to overlap the corresponding electrode terminals 11 and are not in contact with the first and second dummy electrode terminals D1 and D2. D2 and the electrode terminals 11a and 11z are not electrically connected.

In FIG. 3B, the flexible wiring board 20 is slightly displaced in the arrangement direction LT and the printed wiring board 1
0, that is, the flexible wiring board 2
Each of the input lead-out electrode terminals 21 of 0 is arranged so as to substantially overlap with the electrode terminal 11 of the printed wiring board 10, and shows a mounted state in which the input lead-out electrode terminals 21 are slightly displaced so as not to exceed the predetermined interval Sa. The input electrode terminals 21 are arranged so as to substantially overlap with the corresponding electrode terminals 11, and are not in contact with the first and second dummy electrode terminals D1 and D2. Also in this case, the dummy electrode terminals D1 and D2 and the electrode terminals 11a and 11
It does not become conductive with z. The positional deviation within this range is within the allowable range.

In FIG. 3C, when the flexible wiring board 20 is arranged on the printed wiring board 10 with a large deviation in the arrangement direction LT, that is, the input electrode terminals 21 of the flexible wiring board 20 are arranged on the printed wiring board 10. 2 shows a mounting state in which the electrode terminals 11 are slightly overlapped with the electrode terminals 11 and are largely displaced by a distance exceeding the predetermined interval Sa. The input electrode terminal 21 corresponds to the corresponding electrode terminal 1
The first dummy electrode terminal D1 is in contact with the first dummy electrode terminal D1. In this case, the dummy electrode terminal D1,
D2 and the electrode terminals 11a and 11z are brought into conduction. If the positional deviation is within this range, the positional deviation exceeds the allowable range.

That is, in the present embodiment, the electrode terminal 11
Since the first dummy electrode terminals D1 are arranged on the side of the arrangement direction LT of, the flexible wiring board 20 is arranged in the arrangement direction LT.
If it deviates to the extent of exceeding the predetermined distance Sa, the first dummy electrode terminal D1 and the electrode terminal 11a are connected via the input electrode terminal 21a.

The second dummy electrode terminal D2 is the electrode terminal 1
It is arranged so as to be along the RT side of the 1z array direction. Therefore, when the flexible wiring board 20 is arranged on the printed wiring board 10 with a large deviation from the predetermined spacing Sz in the arrangement direction RT, the input electrode terminals 21 are slightly different from the corresponding electrode terminals 11. The second dummy electrode terminals D2 are arranged so as to overlap each other (see FIG. 3).
(D)). That is, the second dummy electrode terminal D2 and the electrode terminal 11z are connected via the input electrode terminal 21z.

Further, in this embodiment, since the first dummy electrode terminal D1 and the second dummy electrode terminal D2 are provided on both left and right sides of the printed wiring board 10, as shown in FIG. It is also possible to detect a conduction failure when the 20 is obliquely displaced. In this case, the second dummy electrode terminal D2 and the electrode terminal 11z are not electrically connected, but the first dummy electrode terminal D1 is electrically connected to the electrode terminal 11a via the input electrode terminal 21a. Flexible wiring board 2 because different results are obtained on both sides
It is possible to inspect whether or not the correct overlay mounting of 0 and the printed wiring board 10 is guaranteed. When the first dummy electrode terminal D1 and the second dummy electrode terminal D2 are provided outside the electrode terminals 11a and 11z of the printed wiring board 10 at the same predetermined intervals Sa and Sz, the left and right directions LT are set. , RT position deviation can be inspected. In other words, it is possible to inspect both when there is a shift to the left LT and when there is a shift to the right RT.

As shown in FIG. 5 (a), by providing a large predetermined distance S between the second dummy electrode terminal D1 and the electrode terminal 11, a deviation smaller than the predetermined distance S is not detected. Only deviations larger than the predetermined interval S are detected. On the other hand, as shown in FIG. 5B, by setting the predetermined interval S small, even a small deviation is detected, so that the allowable range of positional deviation can be adjusted.

As described above, according to the present embodiment, the printed wiring board 10 and the flexible wiring board 20 are mounted by forming at least one of the dummy electrode terminals D1 and D2 only on the printed wiring board 10 of one wiring board. If the inspection can be performed and there is a deviation (positional deviation within an allowable range) that does not exceed the predetermined intervals Sa and Sz, the dummy electrode terminals D1 and D2 and the electrode terminals 11a and 11z are not electrically connected. , The flexible wiring board 20 has a predetermined spacing Sa, S
If the displacement is more than z (positional displacement outside the allowable range), the dummy electrode terminals D1 and D2 and the electrode terminals 11a,
The electrical connection between the flexible wiring board 20 and the printed wiring board 10 can be inspected by the conduction between the wiring board 11 and 11z. When the contact state (contact area) between the electrode terminal 11 and the electrode terminal 21 is narrow, the measured value of the contact resistance in the tester for inspection is higher than when it is wide, and the measured value is different. From this contact resistance value, it is also possible to measure whether or not there is a positional deviation within the allowable range.

Although the flexible wiring board 20 and the printed wiring board 10 are mounted in the present embodiment, the same applies to the relationship between the flexible wiring board 20 and one board 31a constituting the liquid crystal panel L. Can be inspected. In the configuration of the present embodiment, the electrode terminal 21 of the other wiring board 20 is used as it is, and the dummy electrode terminals are formed only on one wiring board to perform the mounting inspection of the one wiring board and the other wiring board. Since it can be performed, the dummy electrode terminals D1 and D2 do not have to be formed on the one substrate 31a of the liquid crystal display panel in the relationship between the one substrate 31a forming the liquid crystal cell 30 and the flexible wiring substrate 20. Therefore, it is possible to perform the mounting state inspection corresponding to the liquid crystal display panel for which a narrow frame is highly required.

In the above, the present invention has been described by applying the present invention to the liquid crystal display panel L mounted by the TAB method, but it is also applied to COG mounting and mounting inspection of general circuit boards of other electronic devices. It is possible.

[0041]

According to the wiring board mounting inspection method of the present invention, by disposing at least one dummy electrode terminal for inspection only on one wiring board, the electrode terminal of the other wiring board is provided. Whether the mounting state of one wiring board and the other wiring board is good or not can be inspected by the presence or absence of conduction, and whether or not one electrode terminal and the other electrode terminal are out of position by a predetermined allowable range or more. Since it can be inspected, it becomes possible to inspect easily and with high accuracy.

[0042]

[Brief description of drawings]

FIG. 1 is a perspective view showing a liquid crystal display panel according to an embodiment of the present invention.

FIG. 2 is a plan view of a connection portion between a printed wiring board and a flexible wiring board in the above embodiment.

3A is a diagram showing a state where the flexible wiring board 20 is arranged at a predetermined position of the printed wiring board 10 without displacement, and FIG. 3B is a view showing the flexible wiring board 20.
Shows a state in which the flexible wiring board 20 is arranged on the printed wiring board 10 with a slight deviation in the arrangement direction LT, and (c) shows that the flexible wiring board 20 is arranged on the printed wiring board 10 with a large deviation in the arrangement direction LT. FIG. 7D is a view showing a state in which the flexible wiring board 20 has the arrangement direction R.
The figure which shows the state at the time of arrange | positioning on the printed wiring board 10 with a large deviation toward T.

FIG. 4 is a plan view showing a state in which the flexible wiring board according to the above-described embodiment is mounted on a printed wiring board with an oblique displacement.

FIG. 5A is a diagram showing a case where a predetermined gap S between the second dummy electrode terminal D1 and the electrode terminal 11 is set large, and FIG. 5B is a diagram showing a predetermined gap between the second dummy electrode terminal D1 and the electrode terminal 11. Diagram when the spacing S is small

FIG. 6 is a diagram showing another example of the above embodiment.

FIG. 7 is a perspective view of a conventional liquid crystal panel.

FIG. 8 is an enlarged plan view of a connection point between a conventional flexible wiring board and a printed wiring board.

[Explanation of symbols]

10 printed wiring board 11 electrode terminals 20 Flexible wiring board 21 Output electrode terminal 22 Input electrode terminals 30, 130 Liquid crystal cell 31a, 31b glass substrates D1 First dummy electrode terminal (dummy electrode terminal) D2 Second dummy electrode terminal (dummy electrode terminal) H1, H2 Lead line L LCD panel IC driver element LT, RT Electrode terminal arrangement direction

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 9/35 G09F 9/35 H05K 1/11 H05K 1/11 Z 3/00 3/00 T 3/40 3/40 Z (72) Inventor Hikaru Fujita 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Kazushige Tanaka 1006 Kadoma, Kadoma City Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor New Hideki Miki 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 2H092 GA40 GA50 GA51 GA61 JB77 NA29 NA30 PA01 PA05 PA06 5C094 AA41 AA43 BA43 DB02 DB05 EA01 EA03 GB10 5E317 AA02 BB02 BB02 BB02 BB02 BB03 BB02 BB02A02 CD04 DD10 EE23 5G435 AA17 AA19 BB12 EE40 EE47 KK05 KK09 KK10

Claims (3)

[Claims] 1. A wiring board mounting inspection method for inspecting a mounting state of one wiring board having an electrode terminal and another wiring board having an electrode terminal, wherein one wiring board is provided with an arbitrary one of the electrode terminals. At least one dummy electrode terminal for continuity inspection is arranged at a predetermined interval, and the positional deviation of each electrode terminal when one wiring board and the other wiring board are overlapped with each other is the dummy electrode terminal for inspection. Via the electrode terminal of the other wiring board that contacts
A mounting inspection method for a wiring board, characterized by inspecting whether or not there is a conduction state between the arbitrary one electrode terminal and a dummy electrode terminal for conduction inspection. 2. The wiring board mounting inspection method according to claim 1, wherein the dummy electrode terminals of the one wiring board are arranged on both left and right sides of the electrode terminal. 3. The other wiring substrate is one substrate of a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates,
The one wiring substrate is a flexible wiring substrate arranged corresponding to the one substrate, or the other wiring substrate is one substrate of a liquid crystal display panel in which a liquid crystal layer is sandwiched between a pair of substrates. 3. The wiring board according to claim 1, wherein the wiring board is a flexible wiring board disposed on the outer periphery of the wiring board, and the one wiring board is a printed wiring board arranged corresponding to the flexible wiring board. Mounting inspection method.