JP5239428B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to an electro-optical device, an electro-optical device inspection method, and an electronic apparatus, and more particularly, to an electro-optical device inspection structure and an inspection method in which a circuit device and a wiring board are mounted on an electro-optical panel.

  In general, an IC chip constituting a circuit device such as a driver IC is mounted on an electro-optical panel such as a liquid crystal display panel, and an FPC (flexible wiring board) that is a wiring board for inputting a signal and a power supply potential from the outside is mounted. An electro-optical device is known. In this type of electro-optical device, an IC chip or FPC is mounted on an electro-optical panel via an ACF (anisotropic conductive film) by thermocompression bonding. By visually confirming the collapsed state of the conductive particles of the ACF from the back side of the mounting part (one glass substrate) of the electro-optical panel, it is determined whether the electro-optical panel, the IC chip, and the FPC are in a conductive connection state. We were inspecting for defects.

Further, as described in the following Patent Document 1, the inspection method for mounting defects as described above is configured for a mounting structure of a printed circuit board and a flexible wiring board so as to straddle the mounting portions of both boards. It is known that an inspection wiring pattern is provided and a pair of inspection terminals is formed on the inspection wiring pattern.
Japanese Patent Laid-Open No. 2004-95872

  However, in the above-described inspection method for mounting defects by visual inspection, it is necessary to accurately determine the collapse state of the conductive particles of the ACF by visual inspection. There is a problem that it is difficult to ensure and it takes a long time for inspection because of visual inspection.

  Furthermore, even inspectors who are appropriately trained tend to have individual differences, there is a problem that it is difficult to perform a highly accurate inspection to ensure long-term electrical reliability. For example, if the conductive particles are not sufficiently crushed, the conductive connection state may be lost over time even if the conductive connection state is initially obtained. It is extremely difficult to make a reliable determination, and therefore causes a decrease in yield and an increase in manufacturing cost.

  On the other hand, in the method described in Patent Document 1, it is necessary to provide a pair of inspection terminals on at least one of the two substrates. Therefore, the conductive connection state of the structure in which the IC chip and the FPC are mounted on the electro-optical panel is confirmed. In order to test, an inspection pattern and an inspection terminal for inspecting the electroconductive panel and the conductive connection portion of the IC chip, and an inspection pattern and an inspection terminal for inspecting the electroconductive panel and the conductive connection portion of the FPC, respectively. It is necessary to provide the device, and there is a possibility that the size of the apparatus is increased in order to secure the formation space.

  Therefore, the present invention solves the above-mentioned problems, and the problem is that in an electro-optical device in which a circuit device and a wiring board are mounted on an electro-optical panel, improvement in inspection accuracy of mounting defects and reduction in inspection time are achieved. Is to plan. Another object is to realize a more preferable inspection structure for downsizing the apparatus.

In view of such a situation, the electro-optical device of the present invention includes an electro-optical panel including a plurality of first terminals and a plurality of second terminals, and is mounted on the electro-optical panel, and each of the plurality of first terminals. A circuit device including a plurality of circuit-side terminals that are conductively connected; and a wiring board that is mounted on the electro-optical panel and includes a plurality of substrate-side terminals that are conductively connected to the plurality of second terminals. In the electro-optical device, the plurality of circuit side terminals include two circuit side terminals electrically connected by a wiring portion provided in the circuit device, and one of the two circuit side terminals . The circuit side terminal is derived by a first wiring pattern provided in the electro-optical panel after being conductively connected to a predetermined first terminal of the plurality of first terminals, and the two circuit sides the other terminal Roadside terminals, after which is conductively connected to the other predetermined first terminals of the plurality of first terminals, of the plurality of second terminals by a second wiring pattern provided in the electro-optical panel Connected to a predetermined second terminal, and conductively connected to a predetermined substrate side terminal of the plurality of substrate side terminals, and the first wiring pattern and the predetermined substrate side terminal are connected in series. A first inspection terminal is provided on the first wiring pattern side of the conductive path, and a second inspection terminal is provided on the predetermined substrate side terminal side of the conductive path. A terminal is provided, and the first wiring pattern is connected to another predetermined second terminal arranged outside the predetermined second terminal, and is connected to another of the plurality of board-side terminals. The wiring board is conductively connected to a predetermined board side terminal. The second inspection terminal on the side of the predetermined board side terminal in the conductive path is electrically connected to the predetermined board side terminal. It is provided on the wiring board .
The electro-optical device according to the present invention includes an electro-optical panel including a plurality of first terminals and a plurality of second terminals, and is mounted on the electro-optical panel and is conductively connected to each of the plurality of first terminals. An electro-optical device comprising: a circuit device including a plurality of circuit-side terminals; and a wiring board including a plurality of substrate-side terminals mounted on the electro-optical panel and electrically connected to each of the plurality of second terminals. The plurality of circuit side terminals include two circuit side terminals electrically connected by a wiring portion provided in the circuit device, and one circuit side terminal of the two circuit side terminals. Is electrically conductively connected to a predetermined first terminal of the plurality of first terminals, and then is derived by a first wiring pattern provided in the electro-optical panel, and the other of the two circuit side terminals is Circuit side terminal After conductively connecting to another predetermined first terminal of the plurality of first terminals, a predetermined first of the plurality of second terminals is provided by a second wiring pattern provided in the electro-optical panel. Conductive connection connected to a predetermined substrate-side terminal among the plurality of substrate-side terminals and connected in series between the first wiring pattern and the predetermined substrate-side terminal. A first inspection terminal is provided on the side of the first wiring pattern of the conductive path, and a second inspection terminal is provided on the side of the predetermined board side terminal of the conductive path. The first inspection terminal on the first wiring pattern side in the conductive path is provided on the electro-optical panel, and the second inspection terminal on the predetermined board side terminal side in the conductive path. The terminal is electrically connected to the predetermined board side terminal. Characterized in that provided in a connected the wiring board.

  According to the present invention, the first first terminal and the conductive connection portion of the one circuit side terminal, which are conductively connected to each other by mounting the circuit device on the electro-optical panel, and the wiring substrate to the electro-optical panel are mounted to each other. A wiring pattern for inspection that is connected to one second terminal that is conductively connected to the conductive connection portion of the one board-side terminal, and a pattern in which the wiring pattern for inspection passes through both conductive connection portions, Therefore, whether or not there is a mounting failure in the mounting portion of the circuit device and the mounting portion of the wiring board with respect to the electro-optical panel can be easily detected by looking at the electric resistance between the pair of inspection terminals. Therefore, it is possible to avoid the drawbacks of visual inspection and perform inspection accurately and quickly. In particular, in the case where a single wiring pattern for inspection is provided that constitutes a conductive path that passes through both the conductive connecting portions in series, both the circuit device and the mounting portion of the wiring board for the electro-optical panel can be inspected very easily. Further, it is possible to suppress an increase in size of the apparatus due to the formation space of the inspection pattern and the inspection terminal.

  In one aspect of the present invention, the semiconductor device further includes a conductive connection portion between the other second terminal connected to the inspection wiring pattern and the other substrate-side terminal. In particular, in addition to the above conductive connection portions, other second terminals and other board side terminal conductive connection portions are provided, and when these are connected in series with one inspection wiring pattern, the inspection wiring pattern Since the first and second terminals are indirectly conductively connected via the electro-optical panel and the circuit device, it is possible to provide a pair of inspection terminals on the wiring board. As a result, it is not necessary to provide an inspection terminal in an electro-optical device and a circuit device that are required to be compact, so that the device can be miniaturized.

  In this case, it is preferable to further include a conductive connection portion between the other first terminal connected to the inspection wiring pattern and the other circuit side terminal. According to this, the conductive connection portion between one first terminal and one circuit side terminal, the conductive connection portion between another first terminal and another circuit side terminal, the conduction between one second terminal and one substrate side terminal. Since it is possible to detect the state of the connection part and the conductive connection part of the other second terminal and the other board-side terminal, at least a pair of mounting parts of the circuit device and the wiring board with respect to the electro-optical device are included as detection locations. Thus, mounting defects can be detected more reliably. In particular, by connecting the four conductive connection portions in series, the electric resistance between the pair of inspection terminals can be prevented from being lowered unless all the conductive connection portions are in a good conductive connection state.

  In another aspect of the present invention, the inspection wiring pattern includes conductive connection portions between other first terminals and other circuit side terminals, and other second terminals and other board side terminals. A conductive path that further passes through the conductive connection portion in series is formed, and between the one first terminal and the one second terminal, between the other first terminal and the other second terminal, In addition to including a wiring portion that conductively connects any three of the circuit side terminal and the other circuit side terminal and between the one board side terminal and the other board side terminal, A pair of inspection terminals is provided between the two. According to this, since one of the pair of inspection terminals can be provided on any one of the electro-optical panel, the circuit device, and the wiring board, the inspection can be easily performed, and the one first terminal and one of the first terminals can be provided. Conductive connection between the circuit side terminals, conductive connection between the other first terminal and other circuit side terminals, conductive connection between one second terminal and one substrate side terminal, and others Since the electrical resistance between the pair of inspection terminals does not decrease unless the conductive connection portions between the second terminal and the other board side terminals are in a good conductive connection state, the circuit device and the wiring board of the electro-optical device are not reduced. Both mounting defects can be reliably detected.

In the present invention, a plurality of the first terminals, a plurality of the second terminals, a plurality of the circuit side terminals, and a plurality of the substrate side terminals are each configured as an array terminal group, and the conductive path It is preferable that the first terminal, the second terminal, the circuit-side terminal, and the board-side terminal constituting the first and second terminals are provided at at least one of both end portions of the array terminal group. According to this, a defect in the conductive connection state between the array terminal groups provided in the mounting region generally tends to occur at both ends of the array terminal group due to thermal expansion during mounting, variation in the pressurization state, etc. By providing the one first terminal, the one second terminal, the one circuit side terminal, and the one substrate side terminal at both ends of the array terminal group, it is possible to detect mounting defects more reliably. . In this case, it is more desirable that the above configuration is provided at both ends.

In addition, in the method of manufacturing the electro-optical device according to the reference invention of the present application , the electro-optical panel includes a first wiring pattern, a predetermined first terminal connected to the first wiring pattern, and another predetermined first. Forming one terminal, a second wiring pattern connected at one end to the other predetermined first terminal, a predetermined second terminal connected to the other end of the second wiring pattern, and wiring A circuit device having one circuit-side terminal and the other circuit-side terminal electrically connected by a unit, the predetermined first terminal, the one circuit-side terminal, and the other predetermined first terminal; A step of mounting on the electro-optical panel so that the other circuit side terminal is conductively connected, and a wiring board having a predetermined substrate side terminal is connected to the predetermined second terminal and the predetermined substrate side The electro-optic filter is connected so that the terminals are conductively connected. A step of mounting the le, and having a measuring a resistance of the conductive path formed between the first wiring pattern and the predetermined substrate-side terminals. In the method, it is preferable that all the conductive connection portions are connected in series in the inspection wiring pattern.

  In one aspect of the present invention, the inspection wiring pattern includes conductive connection portions between the other first terminals and the other circuit side terminals, and other second terminals and the other board side terminals. A conductive path that further passes through the conductive connection portion in series is formed, and the pair of inspection terminals that are conductively connected to the one board side terminal and the other board side terminal on the wiring board, respectively.

  According to another aspect of the present invention, the method includes a circuit mounting step of mounting the circuit device on the electro-optical panel, and then a substrate mounting step of mounting the wiring board on the electro-optical panel. Between the circuit mounting step and the substrate mounting step, a circuit mounting inspection step for performing inspection using a pair of the second terminals to inspect the mounting state of the circuit device is provided, and after the substrate mounting step A board mounting inspection process for performing inspection using the pair of inspection terminals is provided.

  Furthermore, an electronic apparatus according to the present invention includes the electro-optical device according to any one of the above, and a control unit of the electro-optical device. The electronic device is preferably a portable electronic device that is required to be downsized, such as an electronic timepiece, a mobile phone, and a portable information terminal.

[First Embodiment]
Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a schematic plan view schematically showing the overall configuration of the electro-optical device 100 of the first embodiment, and FIG. 2 is an enlarged partial vertical sectional view showing a mounting portion of the electro-optical device 100 of the first embodiment. .

  The electro-optical device 100 according to the present embodiment includes an electro-optical panel 110 configured by a liquid crystal display panel, a circuit device 120 that is mounted on the electro-optical panel 110 and includes an IC chip that forms a driver circuit, and the electro-optical device. And a wiring board 130 made of a flexible wiring board for supplying a video signal and a driving potential, which is mounted on the panel 110.

  The electro-optical panel 110 is formed by bonding panel substrates 111 and 112 made of glass or the like with a sealing material 113 while maintaining a predetermined interval (about 5 to 10 μm), and liquid crystal is enclosed within a range surrounded by the sealing material 113. ing. An electrode 111a made of a transparent conductor such as ITO (indium tin oxide) is formed on the panel substrate 111, and an electrode 112a made of a transparent conductor or the like is also formed on the panel substrate 112. The electrode 111a and the electrode 112a The planarly overlapping liquid crystal portions constitute pixels (subpixels), and are configured to have an appropriate alignment state according to the electric field applied by both electrodes. On the surfaces of both electrodes 111a and 112a, alignment films 111b and 112b made of polyimide resin or the like for controlling the alignment mode of liquid crystal are formed as necessary. Inside the sealing material 113, the plurality of pixels are arranged to form a drive region (display region). Note that polarizing plates 117 and 118 are disposed (adhered) on the outer surfaces of the panel substrates 111 and 112 as necessary in a region overlapping the driving region in plan view.

  The panel substrate 111 is provided with a substrate overhanging portion 111T that projects outward from the outer shape of the panel substrate 112. The substrate overhanging portion 111T includes a plurality of wirings including wirings that are conductively connected to the electrodes 111a and 112a. 115 is pulled out and extends to the mounting area of the circuit device 120. The plurality of wirings 115 are arranged in the left-right direction in FIG. 1 (hereinafter simply referred to as “width direction”). In addition to the wiring 115, a plurality of wirings 116 extending from the mounting area of the circuit device 120 to the mounting area of the wiring board 130 are formed on the board extension 111T. The plurality of wirings 116 are also arranged in the width direction.

  As shown in FIG. 2, the ends of the plurality of wirings 115 and 116 in the mounting region of the circuit device 120 are the first terminals 115t and 116t, and the end of the wiring 116 in the mounting region of the wiring board 130 is the second terminal 116s. It is said. The plurality of first terminals 115 t and 116 t and the second terminal 116 s are exposed on the surface after the electro-optical panel 110 is formed and before the circuit device 120 and the wiring board 130 are mounted. These wirings 115 and 116 are composed of, for example, a two-layer structure of a metal wiring layer such as aluminum and a transparent conductor layer such as ITO on the panel substrate 111, and the first terminals 115t and 116t and the second terminal 116s are the above-described ones. A metal surface layer made of aluminum, copper, gold or the like is further coated on at least a part of the layer structure constituting the wiring.

  In the circuit device 120, an appropriate semiconductor circuit is formed on a surface layer portion (near the lower surface in the drawing) of a semiconductor substrate 121 made of silicon single crystal or the like. On the surface of the semiconductor substrate 121, circuit side terminals 122 and 123 made of bump electrodes or the like are projected. The circuit side terminals 122 and 123 are each arranged in a line in the width direction. The circuit side terminal 122 is normally conductively connected to the first terminal 115 t provided on the wiring 115 in a one-to-one relationship, and the circuit side terminal 123 is normally connected to the first terminal 116 t provided in the wiring 116 in a one-to-one relationship. Conductive connection.

  In the case of the illustrated example, an ACF (anisotropic conductive material) in which sufficiently fine conductive particles 124a are dispersed in the thermosetting resin on the substrate overhanging portion 111T of the electro-optical panel 110 in comparison with the above terminals. The circuit device 120 is mounted by thermocompression bonding via the film) 124, and the thermosetting resin is cured with the conductive particles 124a interposed between the first terminals 115t and 116t and the circuit side terminals 122 and 123. Thus, both terminals are conductively connected.

  On the other hand, the wiring substrate 130 has a plurality of wirings 132 formed of a wiring pattern made of copper foil or the like formed on the lower surface of the base substrate 131 made of polyimide resin or the like, and a cover film 133 is formed on the wiring 132 if necessary. Is coated. An end portion of the wiring 132 is a board-side terminal 132 s that is exposed without being covered with the cover film 133, and the board-side terminal 132 s is conductively connected to the second terminal 116 s via the ACF 134. The wiring substrate 130 is mounted on the electro-optical panel 110 by the same thermocompression bonding as described above, and the thermosetting resin is cured with the conductive particles 134a interposed between the second terminals 116s and the board-side terminals 132s. Thus, both terminals are conductively connected.

  The conductive particles 124a and 134a in the ACFs 124 and 134 are in a mode in which they are pinched by both terminals during thermocompression bonding and sufficiently crushed (elastically deformed). In this mode, the surrounding thermosetting resin is By curing, a sufficient contact pressure for both terminals is ensured, and both terminals are reliably conductively connected. Therefore, unless a certain amount of elastic deformation of the conductive particles 124a and 134a is ensured, the contact pressure cannot be obtained, the contact resistance of the conductive connection portion becomes high, and the conductive resin becomes conductive due to deterioration over time of the adhesive strength of the surrounding resin. There is also a risk that the connection will be lost. However, in the conventional inspection method, since the elastic deformation amount of the conductive particles 124a and 134a is visually confirmed, there is a large variation in the inspection of the conductive connection state, and thus the reliability of the product, the yield, etc. are reduced. Had come.

  FIG. 3 is an enlarged partial plan view showing both ends in the width direction of the mounting range of the circuit device 120 and the wiring board 130 with respect to the electro-optical panel 110 of the present embodiment, and FIG. 4 is an enlarged partial vertical section of both ends of the mounting range. FIG.

  In the present embodiment, although included in the plurality of first terminals 115t and 116t, it is not actually connected to the wirings 115 and 116, or is connected to wirings that are not substantially used as the wirings 115 and 116. Further, dummy first terminals 115t ′ and 116t ′ for inspection are provided. These dummy first terminals 115t 'and 116t' are arranged at both ends of the array terminal group of the first terminals 115t and 116t, respectively. This is a place where mounting defects are most likely to occur at both ends in the width direction of the mounting region due to misalignment due to an error in the arrangement interval when mounting the circuit device 120 on the electro-optical panel 110, variation in pressure bonding force, and the like. Therefore, it is most preferable to arrange a terminal for inspection at the place in order to increase the inspection accuracy.

  The dummy first terminals 115t ′ and 116t ′ are conductively connected to dummy circuit side terminals 122 ′ and 123 ′ formed in the circuit device 120. The dummy circuit side terminals 122 ′ and 123 ′ are circuit parts that are not actually connected to the circuit among the plurality of circuit side terminals 122, or are not actually used in the circuit of the circuit device 120. Is connected to. The dummy circuit side terminals 122 ′ and 123 ′ are respectively disposed at both ends of the array terminal group of the circuit side terminals 122 and 123 for the same reason as described above.

  In the present embodiment, the dummy second terminals 116s included in the plurality of second terminals 116s but not actually connected to the wiring 116 or connected to a wiring that is not substantially used as the wiring 116 are used. Two terminals 116s '116s "are provided. These dummy second terminals 116s', 116s" are arranged at both ends of the array terminal group of the second terminals 116s, respectively. The reason is the same as in the case of the dummy first terminal and the dummy circuit side terminal. In particular, in the case of the wiring board 130, the coefficient of thermal expansion is significantly higher than that of the panel board 111. Therefore, there is a possibility that the displacement in the width direction between the terminals at both ends of the array terminal group during thermocompression bonding becomes extremely large. Therefore, mounting defects are very likely to occur at both ends of the array terminal group.

  The dummy second terminals 116 s ′ and 116 s ″ are conductively connected to dummy substrate side terminals 132 s ′ and 132 s ″ formed on the wiring board 130. The dummy substrate side terminals 132 s ′ and 132 s ″ are connected to ones of the plurality of substrate side terminals 132 that are not actually connected to the wiring 132 or wiring that is not substantially used as the wiring 132. The dummy substrate side terminals 132s ′ and 132s ″ are respectively disposed at both ends of the array terminal group of the substrate side terminals 132 for the same reason as described above.

  In this embodiment, the conductive connection portion A between the dummy first terminal 115t ′ and the dummy circuit side terminal 122 ′, the conductive connection portion B between the dummy first terminal 116t ′ and the dummy circuit side terminal 123 ′, and the dummy second terminal. A single wiring pattern 140 for inspection passing through the conductive connection portion C of 116s 'and the dummy substrate side terminal 132s' and the conductive connection portion D of the dummy second terminal 116s "and the dummy substrate side terminal 132s" is formed.

  The inspection wiring pattern 140 includes a wiring portion 140a on the electro-optical panel 110 (substrate overhanging portion 111T) for directly conductively connecting the dummy first terminal 115t ′ and the dummy second terminal 116s ′, and the dummy first terminal 116t. ′ And the dummy second terminal 116s ″ are directly conductively connected to the wiring part 140b on the electro-optical panel 110 (substrate extension 111T), the dummy circuit side terminal 122 ′, and the dummy circuit side terminal 123 ′. A wiring portion 140c in the circuit device 120, a wiring portion 140e extending on the wiring substrate 130 from the dummy substrate side terminal 132s ′, a wiring portion 140f extending on the wiring substrate 130 from the dummy substrate side terminal 132s ″, and a wiring portion 140e. And an inspection terminal 140h connected to the wiring part 140f.

  The inspection wiring pattern 140 constitutes a conductive path that passes through each of the conductive connection parts A to D in series. If there is no defect in either of the conductive connection portions A and B, the dummy second terminal 116s ′ and the dummy second terminal 116s ″ are indirectly conductively connected on the electro-optical panel 110 and the circuit device 120. Configured as follows.

  The inspection terminals 140g and 140h are conductively connected to the wiring portions 140e and 140f and project from the upper surface of the wiring board 130 through the through holes provided in the base substrate 131. It is provided so as to be exposed on the surface of the substrate 130. This makes it possible to easily measure the electrical resistance between the inspection terminals 140g and 140h.

  In the present embodiment, it is possible to detect whether or not there is a defect in at least one of the conductive connection parts A to D by measuring the electrical resistance value between the inspection terminals 140g and 140h. Since the electrical resistance value is mainly determined by the connection resistance value of each of the conductive connection parts A to D, for example, the reference resistance value derived based on the total allowable range of the connection resistance values and the measured electrical resistance The presence or absence of mounting failure can be determined by comparing the resistance value. However, in the case of the illustrated example, the case where a single conductive connection portion exceeds the allowable range among the four conductive connection portions A to D, and a plurality of conductive connection portions are within the allowable range, but the connection resistance value is relatively high. Therefore, the reference resistance value may be set slightly lower.

  In the present embodiment, since the inspection terminals 140g and 140h are both provided on the wiring board 130, the inspection wiring pattern 140 is not hindered from downsizing the electro-optical panel 110 and the circuit device 120 that are highly demanded to be compact. Can be configured. Here, since the wiring part 140a can be formed by using the wiring pattern non-formation regions on the left and right ends on the substrate extension part 111T, it can be designed so as not to prevent the electro-optic panel 110 from being downsized. is there.

  In addition, even before the wiring board 130 is mounted, it is possible to inspect whether or not the circuit device 120 is mounted on the electro-optical panel 110 by measuring the electric resistance value between the dummy second terminals 116 s ′ and 116 s ″. There is an advantage that you can.

  Further, in the present embodiment, a plurality of conductive connection portions A and B are provided between the electro-optical panel 110 and the circuit device 120, and a plurality of conductive connection portions C and B are also provided between the electro-optical panel 110 and the wiring board 130. Since D is provided and these are connected in series by a single wiring pattern for inspection 140, it is possible to detect if there is a defective conductive connection state in any of the plurality of conductive connection portions in each mounting portion. Therefore, there is an advantage that detection accuracy can be increased.

[Second Embodiment]
FIG. 5 is an enlarged partial plan view of the mounting range of the second embodiment different from the above. In this embodiment, the conductive connection part A between the dummy first terminal 115t ′ and the dummy circuit side terminal 122 ′, the conductive connection part B between the dummy first terminal 116t ′ and the dummy circuit side terminal 123 ′, and the dummy second terminal 116s ′. And a conductive connection C of the dummy substrate side terminal 132s'. The inspection wiring pattern 240 extends from the dummy first terminal 115t ′ on the electro-optical panel 110 (substrate overhanging portion 111T) and reaches the inspection terminal 240g, and from the dummy first terminal 116t ′. A wiring part 240b extending on the electro-optical panel 110 (substrate overhanging part 111T) to the dummy second terminal 116s', and a wiring in the circuit device 120 for directly conductively connecting the dummy circuit side terminal 122 'and the dummy circuit side terminal 123'. Part 240c and a wiring part 240e extending on the wiring board 130 from the dummy board side terminal 132s' and reaching the inspection terminal 240h.

  In the case of this embodiment, it is possible to inspect the three conductive connection states of the conductive connection portions A, B, and C by measuring the electrical resistance between the inspection terminals 240g and 240h. Although the number of conductive connection portions serving as inspection locations is small, the measured electrical resistance value becomes smaller, so that the detection sensitivity of the conductive connection state for each inspection location can be increased.

  In the present embodiment, one inspection terminal 240g must be provided on the electro-optical panel 110, but this is provided in a non-formation region of the wirings 115 and 116 at the left and right ends of the substrate extension 111T. Therefore, miniaturization of the electro-optical panel 110 is not hindered so much. On the other hand, since only one conductive connection portion, wiring portion, and inspection terminal on the wiring substrate 130 are required, the area occupied by the inspection wiring pattern on the wiring substrate 130 can be reduced.

  In the present embodiment, the inspection wiring pattern 240 is disposed at both ends in the width direction of the first terminals 115t and 116t, the second terminal 116s, the circuit side terminals 122 and 123, and the board side terminal 132s. This is the same as in the first embodiment.

[Third Embodiment]
FIG. 6 is an enlarged partial plan view of the mounting range of the third embodiment different from the above. In this embodiment, the conductive connection part A between the dummy first terminal 115t ′ and the dummy circuit side terminal 122 ′, the conductive connection part B between the dummy first terminal 116t ′ and the dummy circuit side terminal 123 ′, and the dummy second terminal 116s ′ The conductive connection portion C of the dummy substrate side terminal 132s ′ and the conductive connection portion D of the dummy second terminal 116s ″ and the dummy substrate side terminal 132s ″ are provided.

  In addition, the inspection wiring pattern 340 extends from the dummy first terminal 115t ′ on the electro-optical panel 110 (substrate overhanging portion 111T) and reaches the inspection terminal 340g and the dummy first terminal 116t ′. In the circuit device 120 that directly connects the wiring portion 340b extending on the optical panel 110 (substrate overhanging portion 111T) to the dummy second terminal 116s ″ and the dummy circuit side terminal 122 ′ and the dummy circuit side terminal 123 ′. The wiring portion 340c, the wiring portion 340d extending from the dummy second terminal 116s 'on the electro-optical panel 110 (substrate overhanging portion 111T) to the inspection terminal 340h, the dummy substrate side terminal 132s', and the dummy substrate side terminal And a wiring portion 340e that is electrically conductively connected to 132s ″ on the wiring board 130.

  In the present embodiment, the inspection terminals 340g and 340h are formed on the panel substrate 111. However, since the wiring pattern non-formation regions at both the left and right ends of the substrate extension 111T can be used, the electro-optical panel It is possible to design so as not to hinder the miniaturization of 110.

[Fourth Embodiment]
FIG. 7 is an enlarged partial plan view of the mounting range of the fourth embodiment. In FIG. 7, wiring patterns for inspection are shown on the left and right sides, but in this case, different patterns 440 and 540 are formed on the left and right. As described above, the inspection wiring patterns at the left and right ends may not have the same configuration. However, either one of the inspection wiring patterns shown on the left and right sides in FIG. 7 may be formed on both the left and right sides.

  In the configuration shown on the left side of FIG. 7, the conductive connection part A of the dummy first terminal 116t ′ and the dummy circuit side terminal 123 ′, the conductive connection part B of the dummy first terminal 116t ″ and the dummy circuit side terminal 123 ″, A conductive connection C between the dummy second terminal 116s ′ and the dummy substrate side terminal 132s ′, and a conductive connection D between the dummy second terminal 116s ″ and the dummy substrate side terminal 132s ″ are provided.

  Further, the inspection wiring pattern 440 includes a wiring portion 440a extending from the dummy first terminal 116t ′ on the electro-optical panel 110 (substrate overhanging portion 111T) to the dummy second terminal 116s ′, and a dummy first terminal 116t. ″ Extends from the electro-optical panel (substrate overhanging portion 111T) to the dummy second terminal 116s ″ and the dummy circuit side terminal 123 ′ to the inside of the circuit device 120 to become the dummy circuit side terminal 123 ″. The wiring part 440c that extends to the wiring board 130 extends from the dummy board side terminal 132s ′, and the wiring part 440e that reaches the inspection terminal 440g and the wiring board 130 extends from the dummy board side terminal 132s ″ to the inspection terminal 440h. A wiring portion 440f extending to the wiring portion 440f.

  In this configuration, two adjacent dummy circuit side terminals 123 ′ and 123 ″ are provided at the end of the array terminal group of the plurality of circuit side terminals 123 arranged on the wiring board 130 side, so that the drive region of the electro-optical panel 110 is provided. Although different from the previous embodiments in that the end of the array terminal group of the plurality of circuit-side terminals 122 on the (display area) side is not used, circuit-side terminals that generally have more than the number of pixels of the electro-optical panel 110 Since the number of arrays 122 is much larger than the number of circuit-side terminals 123, the inspection wiring pattern can be configured by using the left and right terminal non-forming spaces of the circuit-side terminals 123, thereby preventing the circuit device 120 from being downsized. There is no advantage.

  In the configuration shown on the right side of FIG. 7, the conductive connection portion A between the dummy first terminal 115t ′ and the dummy circuit side terminal 122 ′, the conductive connection portion B between the dummy first terminal 116t ′ and the dummy circuit side terminal 123 ′, Conductive connection C of dummy first terminal 116t ″ and dummy circuit side terminal 123 ″, conductive connection D of dummy second terminal 116s ′ and dummy substrate side terminal 132s ′, dummy second terminal 116s ″ and dummy substrate side A conductive connection E of the terminal 132s ″ is provided.

  In addition, the inspection wiring pattern 540 extends from the dummy first terminal 115t ′ on the electro-optical panel 110 (substrate overhanging portion 111T) to the inspection terminal 540g and from the dummy circuit side terminal 123 ′. A wiring portion 540b extending in the circuit device 120 and reaching the inspection terminal 540h exposed on the upper surface thereof; a wiring portion 540c extending in the circuit device 120 from the dummy circuit side terminal 122 ′ and reaching the dummy circuit side terminal 123 ″; The wiring portion 540d extends from the dummy first terminal 116t ′ to the dummy second terminal 116s ′ and extends from the dummy first terminal 116t ′ to the electro-optical panel (substrate extension portion 111T). ) And the wiring portion 540e extending to the dummy second terminal 116s ″ and the wiring substrate 130 from the dummy substrate side terminal 132s ′. And a wiring portion 540f extending to the dummy substrate side terminals 132 s ".

  In this configuration, since the number of conductive connection portions increases from 5 to A to E, the electrical resistance value between the inspection terminals 540g and 540h increases, but there is a defect in any one of the 5 conductive connection states. Since this can be detected, there is an advantage that the detection accuracy can be increased. The circuit device 120 has an inspection terminal 540h exposed on the upper surface of the semiconductor substrate 121. A wiring portion 540b to the inspection terminal 540h is formed by a dummy circuit side terminal 123 ′ formed at an end in the width direction. Since it only needs to pass through the outer periphery of the substrate and connect to the inspection terminal 540h on the upper surface of the substrate, the influence on the drive circuit configured in the circuit device 120 can be minimized.

[Manufacturing process and inspection method]
FIG. 8 is a schematic process diagram showing a manufacturing process for explaining an inspection method performed using any of the configurations of the above-described embodiments. As a manufacturing process of the electro-optical device 100, the electrodes 111a and 112a are formed on the first substrate (panel substrate 111) and the second substrate (panel substrate 112) by a sputtering method, a CVD method, and the like, respectively, and then as necessary. The alignment films 111b and 112b are formed by applying a polyimide resin or the like, firing, and performing a rubbing process (illustrated steps S1 and S2). Then, after the sealing material 113 is disposed on one panel substrate, the two substrates are bonded together (illustration step S3).

  Thereafter, the electro-optical panel 110 which is a liquid crystal panel is completed through steps such as liquid crystal injection, sealing, and substrate division (illustrated step S4). At this time, the wiring 115 including the first terminal 115t and the wiring 116 including the first terminal 116t and the second terminal 116s are formed on the substrate extension portion 111T.

  Next, the circuit device 120 is mounted on the substrate extension 111T of the electro-optical panel 110 by thermocompression bonding via the ACF 124 (circuit mounting step S5). In this driver mounting process, the circuit device 120 positioned on the ACF 124 is pressed against the substrate overhanging portion 111T with a heated mounting head, whereby the thermosetting resin of the ACF is once softened and crushed. And the first terminals 115t and 116t are in conductive contact with the conductive particles 124a interposed therebetween, and then the thermosetting resin is cured by heating of the mounting head, whereby a circuit is formed on the electro-optical panel 110. The device 120 is adhesively fixed.

  Next, a wiring board (FPC) 130 is mounted on the electro-optical panel 110 (board mounting step S7). Even in this case, mounting is performed by the same thermocompression bonding method as described above via the ACF 134. Thereafter, as mounting inspection 2, the electrical resistance between the inspection terminals 140g and 140h is measured (board mounting inspection step S8). Also in this case, if the electric resistance is higher than the reference resistance value, it can be understood that any of the conductive connection portions has a defect. In this case, normally, the wiring board 130 is once removed and then mounted again, but the panel may be discarded.

  Thereafter, a predetermined display signal is applied through the wiring board 130 to perform display inspection of the panel (S9). If there is no problem, the mounting area on the board extension 111T is made of silicon resin or the like. Sealing is performed by molding (S10).

  In the above method, the mounting inspection 1 in which the circuit device 120 is mounted on the electro-optical panel 110 before the wiring board (FPC) 130 is mounted (board mounting step S7). (Circuit mounting inspection step S6) may be performed. In the mounting inspection 1, for example, the inspection may be performed by electrically measuring between the normal second terminals 116 s of the wiring 116, or in the first embodiment shown in FIGS. 3 and 4, The electrical resistance value between the dummy second terminal 116s ′ and the dummy second terminal 116 ″ may be measured. Here, if the electrical resistance value is higher than the reference resistance value, the conductive connection state may be defective. In this case, the panel is usually discarded, but the circuit device 120 can be remounted.

[Electronics]
Finally, an electronic apparatus in which the electro-optical device 100 of each of the above embodiments is mounted will be described. FIG. 9 shows a mobile phone which is an embodiment of an electronic apparatus according to the present invention. A cellular phone 200 shown here includes an operation unit 201 having a plurality of operation buttons, a mouthpiece, and the like, and a display unit 202 having a mouthpiece, and the above-described electro-optical device is provided inside the display unit 202. 100 is incorporated. The display area of the electro-optical device 100 can be viewed on the surface (inner surface) of the display unit 202. In this case, a display control circuit, which will be described later, for controlling the electro-optical device 100 is provided inside the mobile phone 200. The display control circuit sends a predetermined control signal to a known drive circuit that drives the electro-optical panel 110 to determine the display mode of the electro-optical device 100.

  FIG. 10 is a schematic configuration diagram showing an overall configuration of a control system (display control system) for the electro-optical device 100 in the electronic apparatus. The electronic device (the mobile phone 200) shown here includes a display information output source 291, a display information processing circuit 292, a power supply circuit 293, a timing generator 294, and a light source control circuit 295 that supplies power to the backlight 150. A display control circuit 290 including The electro-optical device 100 includes an electro-optical panel 110 that is a liquid crystal display having the above-described configuration, a drive circuit 150 that drives the electro-optical panel 110, and a backlight 160 that illuminates the electro-optical panel 110. Is provided. The drive circuit 150 is configured in the circuit device 120 that is directly mounted on the electro-optical panel 110.

  The display information output source 291 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. The display information is supplied to the display information processing circuit 292 in the form of an image signal or the like of a predetermined format based on various clock signals generated by the timing generator 294.

  The display information processing circuit 292 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to obtain image information. Are supplied to the drive circuit 150 together with the clock signal CLK. The drive circuit 150 includes a scanning line drive circuit, a signal line drive circuit, and an inspection circuit. The power supply circuit 293 supplies a predetermined voltage to each of the above-described components.

  The light source control circuit 295 supplies power to the light source of the backlight 160 based on the voltage supplied from the power supply circuit 293, and controls whether or not the light source is turned on and its brightness based on a predetermined control signal. ing.

  In addition to the mobile phone shown in FIG. 9, examples of the electronic apparatus according to the present invention include a liquid crystal television, a car navigation device, an electronic notebook, a calculator, a workstation, a videophone, and a POS terminal. And the liquid crystal display device which concerns on this invention can be used as a display part of these various electronic devices. However, since the present invention has a feature that does not hinder downsizing of the electro-optical device 100, it is particularly effective when used in portable electronic devices such as a mobile phone, an electronic timepiece, and a portable information terminal.

  Note that the present invention is not limited to the illustrated examples described above, and various modifications can be made without departing from the scope of the present invention. For example, in the present embodiment, a liquid crystal display device including a liquid crystal display panel has been described. However, the present invention is not limited to a liquid crystal display device, and an organic luminescence display device, a field emission display device, a plasma display display device, an electrophoresis, and the like. Other electro-optical devices including an electro-optical panel such as a display device may be used.

1 is a schematic plan view schematically showing the overall configuration of an electro-optical device according to a first embodiment. The expanded partial longitudinal cross-sectional view of the mounting range of 1st Embodiment. The expansion partial top view of the mounting range of 1st Embodiment. The expanded partial sectional view of the both ends of the mounting range of a 1st embodiment. The expansion partial top view of the both ends of the mounting range of 2nd Embodiment. The expansion partial top view of the both ends of the mounting range of 3rd Embodiment. The expansion partial top view of the both ends of the mounting range of 4th Embodiment. Process drawing of the manufacturing process containing the inspection method of embodiment. The schematic perspective view which shows the external appearance of an electronic device. The schematic block diagram of the display control system of an electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Electro-optical apparatus, 110 ... Electro-optical panel, 111, 112 ... Panel board | substrate, 111T ... Board | substrate extension part, 115, 116 ... Wiring, 115t, 116t ... 1st terminal, 115t ', 116t' ... Dummy 1st terminal 116s ... second terminal, 116s' ... dummy second terminal, 120 ... circuit device, 122,123 ... circuit side terminal, 122 ', 123' ... dummy circuit side terminal, 130 ... wiring board, 132 ... wiring, 132s ... Board side terminals, 132s', 132s "... dummy board side terminals, 140 ... inspection wiring patterns, 140a, 140b, 140c, 140e, 140f ... wiring portions, 140g, 140h ... inspection terminals

Claims (4)

An electro-optical panel having a plurality of first terminals and a plurality of second terminals;
A circuit device that is mounted on the electro-optical panel and includes a plurality of circuit-side terminals that are conductively connected to each of the plurality of first terminals;
A wiring board that is mounted on the electro-optical panel and includes a plurality of board-side terminals that are conductively connected to each of the plurality of second terminals;
In an electro-optical device comprising:
The plurality of circuit side terminals include two circuit side terminals electrically connected by a wiring portion provided in the circuit device,
One circuit side terminal of the two circuit side terminals is conductively connected to a predetermined first terminal of the plurality of first terminals, and then is connected to a first wiring pattern provided in the electro-optical panel. Derived,
The other circuit side terminal of the two circuit side terminals is conductively connected to another predetermined first terminal of the plurality of first terminals, and then a second wiring provided in the electro-optical panel Connected to a predetermined second terminal of the plurality of second terminals by a pattern, and conductively connected to a predetermined substrate side terminal of the plurality of substrate side terminals,
A conductive path passing in series between the first wiring pattern and the predetermined substrate side terminal is configured, and a first inspection terminal is provided on the first wiring pattern side of the conductive path. , A second inspection terminal is provided on the side of the predetermined substrate side terminal of the conductive path ,
The first wiring pattern is connected to another predetermined second terminal arranged outside the predetermined second terminal, and is electrically connected to another predetermined substrate side terminal among the plurality of substrate side terminals. By being connected, it is connected to the first inspection terminal provided on the wiring board,
The electro-optical device , wherein the second inspection terminal on the conductive substrate side of the predetermined substrate side terminal is provided on the wiring substrate in electrical connection with the predetermined substrate side terminal. . An electro-optical panel having a plurality of first terminals and a plurality of second terminals;
A circuit device that is mounted on the electro-optical panel and includes a plurality of circuit-side terminals that are conductively connected to each of the plurality of first terminals;
A wiring board that is mounted on the electro-optical panel and includes a plurality of board-side terminals that are conductively connected to each of the plurality of second terminals;
In an electro-optical device comprising:
The plurality of circuit side terminals include two circuit side terminals electrically connected by a wiring portion provided in the circuit device,
One circuit side terminal of the two circuit side terminals is conductively connected to a predetermined first terminal of the plurality of first terminals, and then is connected to a first wiring pattern provided in the electro-optical panel. Derived,
The other circuit side terminal of the two circuit side terminals is conductively connected to another predetermined first terminal of the plurality of first terminals, and then a second wiring provided in the electro-optical panel Connected to a predetermined second terminal of the plurality of second terminals by a pattern, and conductively connected to a predetermined substrate side terminal of the plurality of substrate side terminals,
A conductive path passing in series between the first wiring pattern and the predetermined substrate side terminal is configured, and a first inspection terminal is provided on the first wiring pattern side of the conductive path. , A second inspection terminal is provided on the side of the predetermined substrate side terminal of the conductive path,
The first inspection terminal on the side of the first wiring pattern in the conductive path is provided on the electro-optical panel;
The electro-optical device, wherein the second inspection terminal on the conductive substrate side of the predetermined substrate side terminal is provided on the wiring substrate in electrical connection with the predetermined substrate side terminal. . A plurality of the first terminals, a plurality of the second terminals, a plurality of the circuit side terminals, and a plurality of the substrate side terminals are each configured as an array terminal group arranged in a predetermined direction,
The first terminal, the second terminal, the circuit side terminal, and the board side terminal constituting the conductive path are provided at at least one of both end portions of the array terminal group. The electro-optical device according to claim 1 . An electronic apparatus with the electro-optical device according to any one of claims 1 to 3, characterized in that it comprises a control means of the electro-optical device.

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