KR101730847B1 - chip on film and liquid crystal display device module including the same - Google Patents
chip on film and liquid crystal display device module including the same Download PDFInfo
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- KR101730847B1 KR101730847B1 KR1020100114069A KR20100114069A KR101730847B1 KR 101730847 B1 KR101730847 B1 KR 101730847B1 KR 1020100114069 A KR1020100114069 A KR 1020100114069A KR 20100114069 A KR20100114069 A KR 20100114069A KR 101730847 B1 KR101730847 B1 KR 101730847B1
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- cof
- liquid crystal
- source driver
- circuit board
- long sides
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a liquid crystal display device, comprising: a liquid crystal panel; A COF connected to the liquid crystal panel, on which a source driver IC having a long side and a short side is mounted; And a printed circuit board connected to the COF and having a connector and a resistor and a capacitor mounted thereon, wherein the source driver IC is mounted on the COF perpendicularly to the longitudinal direction of the long side.
Description
The present invention relates to a COF for a liquid crystal display and a liquid crystal display using the same.
2. Description of the Related Art [0002] With the development of an information society, demands for a display device for displaying images have been increasing in various forms. Recently, a liquid crystal display (LCD), a plasma display panel (PDP) Various flat display devices such as an organic light emitting diode (OLED) have been utilized.
Of these flat panel display devices, liquid crystal display devices are widely used today because they have advantages of miniaturization, weight reduction, thinness, and low power driving.
In recent years, various products using the concept of an e-skin in which a display part covers the entire or a part of the entire surface of an electronic product are being released. For this purpose, studies have been actively made on a curved display with ductility so that the liquid crystal panel can be bent in various forms. Accordingly, in the semiconductor package field used for the flexible display, a new mounting method Semiconductor packages are emerging.
Conventionally, a micro-ball grid array (μ-BGA) type semiconductor package has been mainly used for a liquid crystal display device. At this time, the microvision AG is not ductile and can only be formed in a flat shape.
There are the following problems when using this in a soft display device (hereinafter, the problem will be described with reference to Fig. 1).
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic view of a general liquid
The
A timing controller, a power supply, a gamma voltage generator, and the like are mounted on the printed
A gate driver IC (not shown) and a source driver IC 31 are mounted on the
At this time, as shown in FIG. 1, the
However, as shown in Fig. 2, in the case of the flexible display, as the printed
According to the present invention, the arrangement of the components of the COF and the printed circuit board used in the soft display is positioned in the normal direction of the curvature, thereby preventing component departure.
In addition, since the printed circuit board and the COF component are stably maintained, the electrical signal can be stably supplied.
In order to achieve the above-described object, the present invention provides a liquid crystal display comprising: a liquid crystal panel; A COF connected to the liquid crystal panel, on which a source driver IC having a long side and a short side is mounted; And a printed circuit board connected to the COF and having a connector and a resistor and a capacitor mounted thereon, wherein the source driver IC is mounted on the COF perpendicularly to the longitudinal direction of the long side.
Wherein the COF includes an input / output wiring pattern including a chip input region in which a chip mounting region in which the source driver IC is mounted is defined and formed around an edge of the chip mounting region, It is turned toward the long side of the IC.
The COF uses polyimide.
The printed circuit board uses an FPC having a thickness of 0.5 t or less.
And the long side of the connector and the resistance and the capacitance are mounted on the printed circuit board perpendicularly to the longitudinal line direction.
A source driver IC comprising a long side and a short side; And an input / output wiring pattern including a chip input region in which a source driver IC is mounted, the chip input region being defined around an edge of the chip mounting region, To provide a chip-on film that tilts toward the surface.
The liquid crystal display device according to the present invention provides a liquid crystal display device suitable for a soft display, and accordingly, an electric signal can be stably supplied through prevention of departure of a source driver IC or the like.
FIG. 1 schematically shows a conventional liquid crystal display. FIG.
FIG. 2 is a photograph showing deviation and warpage of a component of a COF and a printed circuit board in a conventional liquid crystal display device. FIG.
3 is a view schematically showing a liquid crystal display device according to an embodiment of the present invention.
4 is a partial perspective view of a liquid crystal panel according to an embodiment of the present invention.
5 is a photograph showing a printed circuit board used in an embodiment of the present invention.
6 illustrates an arrangement of source driver ICs in a COF according to an embodiment of the present invention.
7 is a view showing the arrangement of a source driver IC in a conventional COF.
8 is a view showing a wiring pattern of a COF according to an embodiment of the present invention.
9 is a view showing a wiring pattern of a conventional COF.
Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.
4 is a partially exploded perspective view of a liquid crystal panel according to an embodiment of the present invention, and FIG. 5 is a cross-sectional view illustrating a liquid crystal display according to an embodiment of the present invention. Referring to FIG. 3, A photograph of a circuit board.
As shown in the drawing, the
Here, these will be specifically described.
4, a plurality of
The
Green, and
Although not clearly shown in the drawings, the upper and lower alignment films for determining the initial alignment direction of the liquid crystal are interposed at the boundaries between the first and
The
The plurality of
Here, the printed
To this end, although not shown in the printed
As the printed
This is because the degree of miniaturization of the copper wiring pattern connected to the
Accordingly, even if the thermal expansion coefficient and durability of the printed
In addition, when a flexible FPC is used, as shown in Fig. 5, the printed
Here, the printed
The
The
Although not shown, a gate driver IC, which is transmitted to the
Accordingly, when the selected thin film transistor T for each
At this time, the
As the
The flexible film package is a semiconductor package having a shape that can be bent so as to drive a semiconductor chip directly mounted on a thin tape-shaped film and to reduce a mounting area.
In such a flexible film package, for example, a copper wiring formed on the film is directly attached to the
That is, by configuring the
Hereinafter, the
6 is a view showing a mounting form of the
First, as shown in FIG. 6, the
In the embodiment of the present invention, the printed
As shown, the
Here, for convenience of explanation, the center direction of the curved surface is defined as the curvature direction (CD). A part of the curved line is defined as a tangential direction TD and a direction perpendicular to both the curvature direction CD and the tangential direction TD is defined as a normal direction PD.
Further, the
At this time, the
Conventionally, as shown in Fig. 7, the long side of the source driver IC is positioned in the tangential direction (TD). That is, the long side of the source driver IC is arranged in the COF in the lateral direction. When the source driver IC thus formed is applied to the soft display, there is a problem that the source driver IC can not withstand the curvature as the COF is warped.
However, in the case of the present invention, the long side of the
Although not shown, like the
That is, the connector and a plurality of resistors and capacitances are disposed on the printed
As a result, the elements mounted on the printed
Hereinafter, the
8 is a view showing a wiring pattern of the
First, as described above, the
The
The
At this time, the chip mounting area A is preferably formed in a direction parallel to the direction in which the sprocket holes 323 are arranged.
This is because, as described above, in the embodiment of the present invention, the long side of the
Here, as the
The input /
The input /
The other end of the
More specifically, the other ends of the
One end of the one end of the input /
First, as described above, as shown in FIG. 8, the
As a result, the chip input portion B of the input /
More specifically, as the
Conventionally, as shown in Fig. 9, the input / output wiring pattern is configured parallel to the sprocket holes. In the conventional configuration, the source driver IC is formed in a horizontal direction not suitable for the soft display, so that the input / output wiring pattern can be formed parallel to the sprocket holes.
However, in the present invention, the
The input /
When such a
In the embodiment of the present invention, first, the printed
The arrangement relationship of the
Through such a configuration, the present invention can provide a liquid crystal display device suitable for a soft display, and can stably supply an electric signal through prevention of departure of the
Although the
The embodiment of the present invention described above is an example of the present invention, and variations are possible within the spirit of the present invention. Accordingly, the invention includes modifications of the invention within the scope of the appended claims and equivalents thereof.
200: liquid crystal panel 300: COF 310: source driver IC
400: printed circuit board
CD: Curvature direction PD: Normal direction TD: Tangential direction
Claims (6)
And a source driver IC connected to the liquid crystal panel and having first and second long sides facing each other and first and second short sides connecting both ends of the first and second long sides, respectively, are mounted;
A printed circuit board connected to the COF and having a connector, a resistor, and a capacitance mounted thereon;
/ RTI >
The source driver IC is characterized in that the first and second long sides are mounted on the COF perpendicularly to the longitudinal direction,
Wherein the COF includes an input wiring pattern connecting an upper end of the COF and an upper end of the first and second long sides and an output wiring pattern connecting the lower end of the COF and the lower ends of the first and second long sides
Liquid crystal display device.
The COF,
A chip mounting region in which the source driver IC is mounted is defined,
And an input / output wiring pattern including a chip input portion formed around an edge of the chip mounting region,
Wherein the chip input section is configured to be turned on the first and second long sides of the source driver IC
Liquid crystal display device.
The COF is a polyimide-
Liquid crystal display device.
Wherein the printed circuit board is made of an FPC having a thickness of 0.5 t or less
Liquid crystal display
And the long side of the connector and the resistance and the capacitance are mounted on the printed circuit board perpendicularly to the longitudinal line direction
Liquid crystal display device.
A base film on which a source region of the source driver IC is defined in which the first and second long sides are vertically mounted in the longitudinal direction;
And an input / output wiring pattern including a chip input portion formed around an edge of the chip mounting region
/ RTI >
Wherein the chip input section is bent toward the long side of the source driver IC,
Wherein the input wiring pattern connects an upper end of the base film and an upper end of the first and second long sides, and the output wiring pattern is connected to the lower end of the base film and the lower end of the first and second long sides, film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020100114069A KR101730847B1 (en) | 2010-11-16 | 2010-11-16 | chip on film and liquid crystal display device module including the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020100114069A KR101730847B1 (en) | 2010-11-16 | 2010-11-16 | chip on film and liquid crystal display device module including the same |
Publications (2)
Publication Number | Publication Date |
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KR20120052764A KR20120052764A (en) | 2012-05-24 |
KR101730847B1 true KR101730847B1 (en) | 2017-04-27 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US11526040B2 (en) | 2020-02-25 | 2022-12-13 | Samsung Display Co., Ltd. | Display device and method of fabricating the same |
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KR101983374B1 (en) | 2012-11-06 | 2019-08-29 | 삼성디스플레이 주식회사 | Chip on film, display pannel, display device including thereof |
KR102050067B1 (en) | 2013-02-25 | 2019-11-29 | 삼성디스플레이 주식회사 | Display device |
KR102090716B1 (en) | 2013-08-07 | 2020-04-16 | 삼성디스플레이 주식회사 | Foldable display apparatus and method of manufacturing foldable display apparatus |
KR101538365B1 (en) * | 2014-02-24 | 2015-07-21 | 삼성전자 주식회사 | Display apparatus |
KR102205106B1 (en) | 2014-08-19 | 2021-01-21 | 삼성디스플레이 주식회사 | Display device and method for fabricating the same |
KR102340738B1 (en) * | 2014-09-02 | 2021-12-17 | 삼성디스플레이 주식회사 | Curved display apparatus |
KR102414074B1 (en) | 2015-11-18 | 2022-06-29 | 삼성디스플레이 주식회사 | Curved display apparatus and method of manufacturing the same |
KR102026829B1 (en) | 2016-07-11 | 2019-10-01 | 보에 테크놀로지 그룹 컴퍼니 리미티드 | Chip on film, flexible display apparatus having the same, and fabricating method thereof |
KR102652758B1 (en) * | 2018-07-06 | 2024-04-02 | 삼성디스플레이 주식회사 | Display apparatus and method of manufacturing thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005338179A (en) | 2004-05-24 | 2005-12-08 | Sharp Corp | Display apparatus |
JP2009180904A (en) * | 2008-01-30 | 2009-08-13 | Sharp Corp | Display, and driver ic used therefor |
-
2010
- 2010-11-16 KR KR1020100114069A patent/KR101730847B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005338179A (en) | 2004-05-24 | 2005-12-08 | Sharp Corp | Display apparatus |
JP2009180904A (en) * | 2008-01-30 | 2009-08-13 | Sharp Corp | Display, and driver ic used therefor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11526040B2 (en) | 2020-02-25 | 2022-12-13 | Samsung Display Co., Ltd. | Display device and method of fabricating the same |
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KR20120052764A (en) | 2012-05-24 |
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