KR20090053001A - Chip on film and lcd including the same - Google Patents

Chip on film and lcd including the same Download PDF

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Publication number
KR20090053001A
KR20090053001A KR1020070119601A KR20070119601A KR20090053001A KR 20090053001 A KR20090053001 A KR 20090053001A KR 1020070119601 A KR1020070119601 A KR 1020070119601A KR 20070119601 A KR20070119601 A KR 20070119601A KR 20090053001 A KR20090053001 A KR 20090053001A
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KR
South Korea
Prior art keywords
driver
liquid crystal
chip
film
heat dissipation
Prior art date
Application number
KR1020070119601A
Other languages
Korean (ko)
Inventor
강필성
Original Assignee
엘지디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지디스플레이 주식회사 filed Critical 엘지디스플레이 주식회사
Priority to KR1020070119601A priority Critical patent/KR20090053001A/en
Publication of KR20090053001A publication Critical patent/KR20090053001A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13454—Drivers integrated on the active matrix substrate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2320/00—Control of display operating conditions
    • G09G2320/04—Maintaining the quality of display appearance
    • G09G2320/041—Temperature compensation

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a COF type liquid crystal display device, and more particularly, to a liquid crystal display device in which a heat dissipation effect of a COF in which a driver IC is mounted is improved.

A feature of the present invention is to form a heat dissipation hole in the back of the COF in which the driver IC is mounted, and can quickly and effectively dissipate the high temperature heat generated from the driver IC.

As a result, not only the life of the driver IC can be extended, but also the device reliability can be greatly improved, and the image quality of the LCD can be prevented.

COF, Heat Dissipation Hole, Driver IC, Liquid Crystal Display

Description

Chip on film and liquid crystal display including same {Chip on film and LCD including the same}

The present invention relates to a liquid crystal display device, and more particularly to a COF in which a driver IC is mounted.

A liquid crystal display device displays an image using the optical anisotropy and polarization property of the liquid crystal. Since the liquid crystal has a thin and long molecular structure, the liquid crystal has directivity in the arrangement of molecules, and the direction of the molecular arrangement can be controlled by artificially applying an electric field to the liquid crystal.

Therefore, if the molecular arrangement direction of the liquid crystal is arbitrarily adjusted, the molecular arrangement of the liquid crystal is changed, and the polarization state of light is changed in the molecular arrangement direction of the liquid crystal due to optical anisotropy, thereby displaying an image.

Accordingly, a liquid crystal display device includes a liquid crystal panel formed by bonding a pair of first and second substrates having transparent field generating electrodes formed to face each other with a liquid crystal layer interposed therebetween, and a backlight for supplying light thereto. (back light), by controlling the electric field between the two field generating electrodes of the liquid crystal panel to artificially adjust the alignment direction of the liquid crystal molecules to generate a difference in transmittance and to pass through the light generated from the backlight through the liquid crystal panel Various images are displayed by allowing the difference of to be expressed to the outside.

1 is a perspective view of such a liquid crystal display device, wherein the liquid crystal panel 10 having the above-described configuration includes a first substrate 12 and a second substrate 14 having a liquid crystal layer (not shown) therebetween. It is in a state of facing together. The backlight 30, which is a dimming means, is provided on the rear surface of the liquid crystal panel 10.

At this time, since the first substrate 12 has a larger area than the second substrate 14, two adjacent edges of the first substrate 12 are exposed to the outside when they are bonded together, although they are not clearly shown in the drawings. There are a plurality of data pads and gate pads at the two edges, respectively, and data lines and gate lines are connected to each other.

Each of the plurality of data pads and gate pads is connected to an external printed circuit board 40 through a COF (chip on film) 20, and the printed circuit board 40 is provided with various inputs from an external device such as a computer. A timing controller, a power supply unit, a gamma voltage generation unit, and the like are mounted to process signal information primarily to generate a signal voltage necessary for image display. The COF 20 has a liquid crystal through a signal voltage transmitted from a printed circuit board 40, respectively. Data and gate driver ICs 22 for generating and outputting an image signal transmitted to a data line of the panel 10 and a scan signal transmitted to a gate line are mounted.

In general, the COF 20 has a semiconductor chip (= driver IC: 22) mounted on a tape wiring board (not shown) by flip chip bounding, and both ends of the COF 20 are conductive adhesive materials. It is attached to the liquid crystal panel 10 and the printed circuit board 40 via an anisotropic conductive film (not shown hereafter, ACF).

On the other hand, in the general liquid crystal display device having the above-described configuration, the high temperature heat is gradually generated from each of the driver ICs 22 when the image is displayed. As a result, the life of the driver ICs 22 is greatly shortened, and the reliability is deteriorated. It may cause distortion. This, in turn, represents a drawback that leads directly to poor image quality.

In particular, as the display area of the display device, which is rapidly progressing in recent years, has increased in size, the size of the liquid crystal display device has gradually increased, and thus the number of driver ICs 22 has also increased. However, the heat generation phenomenon of the driver IC 22 is also intensifying.

The present invention is to solve the above problems, by providing a specific way to quickly and effectively dissipate the high temperature heat generated from the driver IC mounted on the COF to significantly extend the life of the driver IC as well as device reliability It is a first object to improve.

For this reason, the second object is to prevent the deterioration of the image quality of the liquid crystal display device.

In order to achieve the object as described above, the present invention is a chip mounting region is defined, the base film having a heat dissipation hole in the chip mounting region; An input / output wiring pattern formed around an edge of the chip mounting region of the base film; A chip on film is electrically connected to the input / output wiring pattern and includes a driver IC mounted in the chip mounting area.

The heat dissipation hole is characterized in that a plurality of spaced apart at a predetermined interval formed side by side, the total area of the plurality of heat dissipation holes is characterized in that 1/2 or 1/3 of the area of the driver IC.

At this time, the heat dissipation hole is characterized in that arranged in two rows or three rows, characterized in that the insulating molding resin is formed between the driver IC and the base film.

In addition, the molding resin is exposed through the heat dissipation hole, and the molding resin is characterized in that the epoxy (epoxy) or silicone (silicon) resin.

In addition, a protective layer is formed on the input / output wiring pattern.

The present invention also provides a liquid crystal panel; A chip on film connected to the liquid crystal panel and having heat dissipation holes; And a printed circuit board connected to the liquid crystal panel through the chip on film, wherein the heat dissipation hole corresponds to a driver IC of the chip on film.

As described above, according to the present invention, by forming a heat dissipation hole on the back of the COF on which the driver IC is mounted, there is an effect that can quickly and effectively dissipate the high temperature heat generated from the driver IC.

As a result, due to the high temperature heat generated from the existing driver IC, the life of the driver IC can be greatly shortened, and the problem of the signal distortion caused by the reliability deterioration can be prevented, and the image quality of the LCD can be prevented. It can work.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

2 is a perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.

As illustrated, a plurality of COFs 120 on which a liquid crystal panel 110 composed of first and second substrates 112 and 114 bonded to each other with a liquid crystal layer (not shown) interposed therebetween and a driver IC 122 mounted thereon. A printed circuit board 140 connected to two adjacent edges of the liquid crystal panel 110 and a backlight 130 for supplying light from the rear surface of the liquid crystal panel 110.

In this case, a heat dissipation hole (not shown) is formed on the rear surface of the COF 120 in which the driver IC 122 is mounted.

Here, each of them will be described in detail.

First, the liquid crystal panel 110 will be described in more detail with reference to FIG. 3, which is an exploded perspective view thereof. A plurality of data lines 212 may be provided on one surface of the first substrate 112 called a lower substrate or an array substrate. ) And the gate line 216 cross each other to define the pixel P. Thin film transistors T are provided at the intersections of these two lines to correspond one-to-one with the transparent pixel electrodes 220 provided in the pixel regions P. FIG.

In addition, the second substrate 114 facing the liquid crystal layer 225 therebetween is called an upper substrate or a color filter substrate, and one surface thereof has a data line 212 of the first substrate 112. A grid-like black matrix 232 is formed around the pixel region P to cover only the pixel electrode 220 while covering the non-display elements such as the gate line 216 and the thin film transistor T.

In addition, in the lattice, one of the plurality of R (rea), G (green), and B (blue) color filters 234a, 234b, 234c, and all of them are sequentially arranged to correspond to each pixel area P. A transparent common electrode 236 is included.

In addition, although not clearly shown in the drawings, the upper and lower alignment layers for determining the initial molecular alignment direction of the liquid crystal are interposed between the two substrates 112 and 114 and the liquid crystal layer 225, and the liquid crystal filled therebetween. Seal patterns are formed along the edges of both substrates 112 and 114 to prevent leakage of the layer 225, and only specific light is selectively formed on the outer surfaces of the first and second substrates 112 and 114. A polarizing plate to transmit may be attached.

In addition, since the first substrate 112 has a larger size than the second substrate 114, one side edge of the first substrate 112 is exposed to the outside when the two substrates 114 are bonded to each other. A plurality of data pads 214 connected to each other and a plurality of gate pads (not shown) connected to the plurality of gate lines 216 are positioned.

The plurality of data pads 214 and the gate pads (not shown) are connected to an external printed circuit board 140 via a COF 120, respectively, and the printed circuit board 140 may be connected to an external device such as a computer. A timing controller, a power supply unit, a gamma voltage generation unit, and the like are mounted to process various input signal information to generate a signal voltage necessary for displaying an image. The COF 120 is a signal voltage transmitted from a printed circuit board 140, respectively. Data and gates, which are transmitted to the data line and the gate line 216 of the liquid crystal panel 110 and the scan signal including the on / off signal of the thin film transistor T, are generated and output. The driver IC 122 is mounted.

Therefore, when the thin film transistor T selected for each gate line 216 is turned on by the on / off signal of the thin film transistor T that is scanned and transferred to the gate line 216, the corresponding pixel is turned on. The image signal of the data line 212 is transmitted to the electrode 220, and the arrangement direction of the liquid crystal molecules is changed by the electric field between the pixel electrode 220 and the common electrode 236, thereby generating a difference in transmittance. .

In this case, each of the driver ICs 122 may include semiconductor devices packaged in a chip form.

Meanwhile, the COF 120 according to the present invention has a structure in which high temperature heat generated from the driver IC 122 can be easily discharged to the outside, which will be described in more detail with reference to FIG. 4 below.

4 is a plan view illustrating a heat dissipation type COF according to an exemplary embodiment of the present invention, and FIG. 5 is a cross-sectional view taken along the line VV ′ of FIG. 4.

As shown, the driver IC 122 is flip-chip bonded to the upper surface of the tape wiring board 123 via the electrode bumps 129, and the bonded portions are the driver IC 122 and the tape wiring board 123. Protected by an insulating molding resin 127 filled in between.

In this case, the heat dissipation hole 300 is formed in the tape wiring board 123 of the portion where the driver IC 122 is bonded, so that heat generated from the driver IC 122 can easily escape to the outside. .

Looking at each of them in more detail, the tape wiring board 123 includes a base film 125 and input / output wiring patterns 126a and 126b formed by patterning an upper metal layer thereof.

The base film 125 is provided with a chip mounting area A in which a driver IC 122 is mounted at a central portion thereof, and a sprocket hole 124 is provided at regular intervals along both edges of the base film 125. Are formed.

In this case, the chip mounting area A is preferably formed in a direction perpendicular to the direction in which the sprocket holes 124 are arranged.

Here, the base film 125 may be used an insulating synthetic resin, generally, polyimide, acrylic, polyether nitrile, polyether sulfone, polyethylene terephthalate ( Synthetic resins such as polyethylene terephthalate, polyethylene naphthalate, and polyvinyl chloride may be used.

In addition, the input / output wiring patterns 126a and 126b may be formed by attaching a copper foil to the upper surface of the base film 125 with a metal layer and then patterning the same by a photolithography process. Nickel (Ni), gold (Au), solder, or alloys of these materials having electrical conductivity, including Cu), may be used.

The input / output wiring patterns 126a and 126b are flip-chip bonded to one end via the electrode bump 129, and the other ends connected to the ends are extended out of the chip mounting area P. Referring to FIG. In this case, one end of the input / output wiring patterns 126a and 126b is formed around the edge of the chip mounting area A so that the electrode bumps 129 may be bonded, and the other end of the input wiring pattern 126a may be formed as a driver IC. 122 extends to one side of the base film 125, and the other end of the output wiring patterns 126b extends to the other side of the base film 125.

The input / output wiring patterns 126a and 126b preferably extend in a direction parallel to the direction in which the sprocket holes 124 are formed. The other end of the input wiring patterns 126a is a printed circuit board (140 in FIG. 2). The other end of the output wiring patterns 126b is bonded to the liquid crystal panel 110 of FIG. 2.

In addition, the input / output wiring patterns 126a and 126b formed on the upper surface of the base film 125 are protected by a protective layer 128 such as a solder resist.

When the COF 120 is attached to the liquid crystal panel (110 of FIG. 2) and the printed circuit board (140 of FIG. 2), the edge portion of the base film 125 on which the sprocket holes 124 are formed is removed.

The insulating molding resin 127 serves to protect the electrical junction between the driver IC 122 and the tape wiring board 123 and the surrounding and exposed electrode bumps 129 of the driver IC 122 from an external environment.

Meanwhile, the heat dissipation hole 300 is formed in the base film 125, and the heat dissipation hole 300 is formed to correspond to the portion where the driver IC 122 is bonded, so that the driver IC 122 is connected to the tape wiring board 123. ) Once the phase is mounted, it is located directly below it.

Therefore, the high temperature heat generated by the driver IC 122 is radiated to the outside through the heat dissipation hole 300.

At this time, the heat dissipation hole 300 is formed in a plurality of side by side spaced apart at a predetermined interval corresponding to the driver IC 122, each of the heat dissipation holes 300 is heat dissipation according to the area of the driver IC (122) It is preferable to form the size of the hole 300 correspondingly.

That is, the sum of the opened areas of the heat dissipation holes 300 is 1/2 or 1/3 of the area of the driver IC 122, so that high-temperature heat generated from the driver IC 122 can be easily obtained. Through the heat dissipation hole 300 to exit to the outside.

On the other hand, it is apparent that the heat dissipation holes 300 can be arranged in two rows and three rows according to the area of the driver IC 122.

At this time, the molding resin 127 filled between the tape wiring board 123 and the driver IC 122 is exposed through the heat dissipation hole 300, and the molding resin 127 is more thermally conductive than the base film 125. It is preferable to configure with this high epoxy or silicone resin.

As described above, by forming the heat dissipation hole 300 on the back surface of the COF 120, it is possible to quickly and effectively dissipate the high temperature heat generated from the driver IC 122.

As a result, the life of the driver IC 122 may be greatly shortened due to the high temperature heat generated from the existing driver IC 122 and the problem that the signal distortion may be caused due to the decrease in reliability can be prevented.

This can also prevent deterioration in image quality of the liquid crystal display device.

6 is a schematic cross-sectional view of a liquid crystal display device using a COF according to an embodiment of the present invention.

As illustrated, a liquid crystal panel 110 including first and second substrates 112 and 114 bonded to each other with a liquid crystal layer 225 in FIG. 3 interposed therebetween is provided. Since the first substrate 112 has a larger size than the second substrate 114, one edge of the first substrate 112 is exposed to the outside when the substrate 112 is bonded to each other.

The COF 120 is provided in the exposed portion of the first substrate 112 of the liquid crystal panel 110, and thus the printed circuit board 140 and the liquid crystal panel 110 are electrically connected to each other.

In this case, both ends of the COF 120 are attached to the liquid crystal panel 110 and the printed circuit board 140 through anisotropic conductive films 150a and 150b which are conductive adhesive materials.

That is, the other end of the output wiring pattern 126b of the COF 120 is bonded to the edge of the liquid crystal panel 110, and the other end of the input wiring pattern 126a is bonded to the edge of the printed circuit board 140.

At this time, by using the flexibility of the COF 120, the COF 120 is flipped so that the printed circuit board 140 is located on the rear side of the liquid crystal panel 110, thereby allowing the driver IC 122 mounted on the COF 120 and the mouth. The output wiring patterns 126a and 126b are positioned to face the rear surface of the liquid crystal panel 110.

Therefore, the heat generated from the driver IC 122 is discharged directly to the outside of the liquid crystal panel 110 through the heat dissipation hole 300, and thus has a better heat dissipation effect.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

1 is a perspective view of such a liquid crystal display device.

2 is a perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.

3 is an exploded perspective view of a part of a liquid crystal panel;

Figure 4 is a plan view showing a heat release COF according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view taken along the line VV ′ of FIG. 4. FIG.

6 is a schematic cross-sectional view of a liquid crystal display device using a COF according to an embodiment of the present invention.

Claims (9)

A base film having a chip mounting region defined therein and having heat dissipation holes formed in the chip mounting region; An input / output wiring pattern formed around an edge of the chip mounting region of the base film; A driver IC electrically connected to the input / output wiring pattern and mounted in the chip mounting area. Chip on film comprising a. The method of claim 1, The heat dissipation hole is a chip-on film, characterized in that the plurality is formed side by side spaced apart. The method of claim 1, And the total area of the plurality of heat dissipation holes is 1/2 or 1/3 of the area of the driver IC. The method of claim 1, And the heat dissipation holes are arranged in two rows or three rows. The method of claim 1, Chip-on film, characterized in that the insulating molding resin is formed between the driver IC and the base film. The method of claim 5, wherein Chip on film, characterized in that the molding resin is exposed through the heat release hole. The method of claim 6, The molding resin chip-on film, characterized in that the epoxy (epoxy) or silicone (silicon) resin. The method of claim 1, Chip on film, characterized in that the protective layer is formed on the input and output wiring pattern. A liquid crystal panel; A chip on film connected to the liquid crystal panel and having heat dissipation holes; Printed circuit board connected to the liquid crystal panel via the chip on film And a heat dissipation hole corresponding to a driver IC of the chip on film.
KR1020070119601A 2007-11-22 2007-11-22 Chip on film and lcd including the same KR20090053001A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070119601A KR20090053001A (en) 2007-11-22 2007-11-22 Chip on film and lcd including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070119601A KR20090053001A (en) 2007-11-22 2007-11-22 Chip on film and lcd including the same

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KR20090053001A true KR20090053001A (en) 2009-05-27

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KR1020070119601A KR20090053001A (en) 2007-11-22 2007-11-22 Chip on film and lcd including the same

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140125673A (en) * 2013-04-19 2014-10-29 삼성디스플레이 주식회사 Cof package and display device including the same
KR20170007655A (en) * 2015-07-10 2017-01-19 삼성디스플레이 주식회사 Display Device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140125673A (en) * 2013-04-19 2014-10-29 삼성디스플레이 주식회사 Cof package and display device including the same
KR20170007655A (en) * 2015-07-10 2017-01-19 삼성디스플레이 주식회사 Display Device

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