CN100414419C - Method and apparatus for adhering driving component - Google Patents
Method and apparatus for adhering driving component Download PDFInfo
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- CN100414419C CN100414419C CNB200510120677XA CN200510120677A CN100414419C CN 100414419 C CN100414419 C CN 100414419C CN B200510120677X A CNB200510120677X A CN B200510120677XA CN 200510120677 A CN200510120677 A CN 200510120677A CN 100414419 C CN100414419 C CN 100414419C
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- driving element
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Abstract
A method for sticking the driving elements includes providing liquid crystal display face plate with base plate having two ends both being set with sticking region (SR) including connection region, cleaning said SR, sticking heteroscedasticity conduction film at the first end SR and the second end SR of said base plate separately, setting a driving element at the first end connection region and the second end connection region separately then pre-pressing these driving elements, carrying out master pressing on said driving elements at two said ends for making them be connected with said base plate.
Description
[technical field]
The invention relates to a kind of driving element attaching method and attaching device, particularly about a kind of liquid crystal indicator (Liquid Crystal Display, LCD) driving element attaching method and attaching device.
[background technology]
Liquid crystal indicator is because have characteristics such as low diathermaneity, compact and power consumption are low, and is day by day extensive in the use, and along with the ripe and innovation of correlation technique, its kind is also various day by day.
Adopt the liquid crystal indicator of active matrix array to generally comprise a plurality of gate lines that are arranged on same substrate and the pixel region that source electrode line intersects to form mutually and a plurality of thin film transistor (TFT) (Thin Film Transistor that is arranged on gate line and source electrode line infall, TFT), wherein, each pixel region has a pixel electrode, and this thin film transistor (TFT) is used to control the switch of this pixel electrode.
This gate line and source electrode line are connected with driving element respectively, are loaded on thin film transistor (TFT) so that drive signal to be provided, and activate pixel region.This driving element comprises grid drive chip and source driving chip.This driving element is connected with printed circuit board (PCB) by flexible circuit board.The circuit unit syndeton is used the anisotropy conductive film usually (Anisotropic Conductive Film ACF) is realized mechanical connection and electric connection between this driving element and the substrate, between this flexible circuit board and the substrate, between this flexible circuit board and the printed circuit board (PCB) etc.
Please consult Fig. 1,2,3 together, Fig. 1 is a kind of structural representation of prior art display panels, and Fig. 2 is the cross-sectional view of II-II along the line among Fig. 1, and Fig. 3 is the cross-sectional view of III-III along the line among Fig. 1.This display panels 10 comprise first substrate 11, second substrate 12 and be sandwiched in this first substrate 11 and second substrate 12 between liquid crystal layer 13.Adjacent two ends at first substrate 11 are equipped with attach area (not indicating), and this attach area is covered by anisotropy conductive film 15 usually.In the attach area, the zone of carrying driving element 14 is join domain (a not mark).This driving element 14 comprises grid drive chip and source driving chip.In the join domain, driving element 14 is realized mechanical connection and electric connection by the anisotropy conductive film 15 and first substrate 11.Zone between the driving element 14 is interval region (a not mark).
This anisotropy conductive film 15 is to make by scatter conducting particles in macromolecule resin (as epoxy resin or acryl resin), and on a surface of this anisotropy conductive film 15 barrier film is set.When attaching driving element 14, low temperature is pressed in attach area with anisotropy conductive film 15 earlier down in advance, peels off the barrier film of anisotropy conductive film 15, driving element 14 is put at join domain again, stresses under the high temperature and realizes on the driving element 14 connecting.
Please consulting Fig. 4 together, is the process flow diagram of the driving element attaching method of this display panels among Fig. 1.This driving element attaching method 100 may further comprise the steps:
This anisotropy conductive film 15 is the higher consumptive materials of cost, and industry all wishes to reduce the use amount of anisotropy conductive film 15.But in this display panels 10, the anisotropy conductive film 15 that covers interval region has increased the use amount of anisotropy conductive film 15, increases cost.
Simultaneously, in attach area,, so there is difference in height between join domain and the interval region because join domain has the splicing ear of gate line or source electrode line.Attach in the anisotropy conductive film, the temperature of attaching device and pressure are not sent on the anisotropy conductive film 15 of interval region correspondence fully, so the bond strength of the anisotropy conductive film 15 of interval region correspondence and first substrate 11 is low.When peeling off barrier film, can cause anisotropy conductive film 15 in interval region, to float even rupture and roll, thereby influence the anisotropy conductive film 15 of join domain correspondence and the bond strength of substrate 11, reduce the reliability that attaches.
And in this driving element attaching method, this step 102 anisotropy conductive film attaches and the pre-pressing of step 103 driving element is long step consuming time, and second section main pressing weak point consuming time of first section main pressing of step 104 and step 105.Therefore in this driving element attaching process, waiting status appears in first section main pressing meeting of step 104, makes the attaching inefficiency of this driving element attaching method.
[summary of the invention]
For the high problem of cost that solves driving element attaching method in the prior art, be necessary to provide a kind of driving element attaching method that reduces cost.
A kind of driving element attaching device that reduces cost also is provided.
A kind of driving element attaching method, it may further comprise the steps:
Panel cleans, one display panels that comprises a substrate is provided, adjacent first end and second end of this substrate are equipped with attach area, in the attach area, the zone of carrying driving element is a join domain, zone between the driving element is an interval region, cleans the attach area of this display panels;
First section anisotropy conductive film attaches, and at the attach area attaching anisotropy conductive film at interval of this substrate first end, the anisotropy conductive film only is attached to join domain, and peels off the barrier film of this anisotropy conductive film upper surface;
First section pre-pressing of driving element is placed on the join domain of this first end with driving element, and this driving element of precompressed makes it pass through the anisotropy conductive film and this substrate is realized pre-connection;
Second section anisotropy conductive film attaches, and at the attach area attaching anisotropy conductive film at interval of this substrate second end, the anisotropy conductive film only is attached to join domain, and peels off the barrier film of this anisotropy conductive film upper surface;
Second section pre-pressing of driving element is placed on the join domain of this second end with driving element, and this driving element of precompressed makes it pass through the anisotropy conductive film and this substrate is realized pre-connection;
First section main pressing adds the driving element that is pressed in first end, makes it pass through anisotropy conductive film and the electrical and mechanical connection of this substrate realization; And
Second section main pressing adds the driving element that is pressed in second end, makes it pass through anisotropy conductive film and the electrical and mechanical connection of this substrate realization, is sent to subsequent handling then.
A kind of driving element attaching device, it comprises a purge chamber that is order and arranges, one first section attaching chamber, one first section pre-pressing chamber, one second section attaching chamber, one second section pre-pressing chamber, one first section main pressing chamber and one second section main pressing chamber, in this purge chamber, one display panels that comprises a substrate is provided, adjacent first end and second end of this substrate are equipped with attach area, in the attach area, the zone of carrying driving element is a join domain, zone between the driving element is an interval region, cleans the attach area of this display panels; This first section attaches in the chamber, and at the attach area attaching anisotropy conductive film at interval of this substrate first end, the anisotropy conductive film only is attached to join domain, and peels off the barrier film of this anisotropy conductive film upper surface; In this first section pre-pressing chamber, driving element is placed on the join domain of this first end, this driving element of precompressed makes it pass through the anisotropy conductive film and this substrate is realized pre-connection; This second section attaches in the chamber, and at the attach area attaching anisotropy conductive film at interval of this substrate second end, the anisotropy conductive film only is attached to join domain, and peels off the barrier film of this anisotropy conductive film upper surface; In this second section pre-pressing chamber, driving element is placed on the join domain of this second end, this driving element of precompressed makes it pass through the anisotropy conductive film and this substrate is realized pre-connection; In this first section main pressing chamber, add the driving element that is pressed in first end, make it pass through anisotropy conductive film and the electrical and mechanical connection of this substrate realization; In this second section main pressing chamber, add the driving element that is pressed in second end, make it pass through anisotropy conductive film and the electrical and mechanical connection of this substrate realization, be sent to subsequent handling then.
Compared with prior art, attach area attaching anisotropy conductive film at interval among the present invention, so the anisotropy conductive film is not set in the part interval region, and can effectively reduce the use amount of anisotropy conductive film, reduce cost greatly.Behind the join domain of the anisotropy of precompressed simultaneously conductive film, do not influence the bond strength of the anisotropy conductive film and first substrate when peeling off barrier film, so the connection reliability height.
And in this driving element attaching process, each step about equally consuming time, but make continuous working between each step, improve and attach efficient.
In like manner this driving element attaching device also has the effect that reduces cost.This driving element attaching device also can improve connection reliability, improve attaching efficient simultaneously.
[description of drawings]
Fig. 1 is a kind of structural representation of prior art display panels.
Fig. 2 is the cross-sectional view of II-II along the line among Fig. 1.
Fig. 3 is the cross-sectional view of III-III along the line among Fig. 1.
Fig. 4 is the process flow diagram of the driving element attaching method of this display panels among Fig. 1.
Fig. 5 is the structural representation of the display panels of a driving element to be attached.
Fig. 6 is the structural representation of driving element attaching device first embodiment of the present invention.
Fig. 7 is the process flow diagram of the driving element attaching method that this driving element attaching device is adopted among Fig. 6.
Fig. 8 is the structural representation of driving element attaching device second embodiment of the present invention.
Fig. 9 is the process flow diagram of the driving element attaching method that this driving element attaching device is adopted among Fig. 8.
[embodiment]
Seeing also Fig. 5, is the structural representation of the display panels of a driving element to be attached.This display panels 20 comprise first substrate 21, second substrate 22 and be sandwiched in this first substrate 21 and second substrate 22 between liquid crystal layer (figure do not show).This first substrate 21 comprises the first adjacent end 23 and second end 24, and this two end 23,24 is equipped with attach area (not mark).In the attach area, the zone of carrying driving element is a join domain 25, and the zone between this join domain 25 is an interval region 26.
Seeing also Fig. 6, is the structural representation of driving element attaching device first embodiment of the present invention.30 effects of this driving element attaching device are to attach driving element on this display panels 20, it comprise purge chamber that order arranges 31, first section attach chamber 32, first section pre-pressing chamber 33, second section attach chamber 34, second section pre-pressing chamber 35, first section main pressing chamber 36 and second section main pressing chamber 37.This display panels 20 disposes through the leading portion operation, can be transferred into this driving element attaching device 30, this display panels 20 at first enters purge chamber 31, then first section attach chamber 32, first section pre-pressing chamber 33, second section attach chamber 34, second section pre-pressing chamber 35, first section main pressing chamber 36 and second section main pressing chamber 37 and be transmitted successively and carry out corresponding operating.
In this purge chamber 31, use ultraviolet light and electricity slurry to clean this display panels 20 remains in attach area in the leading portion operation residue.
Attach in the chamber 32 at first section, at the attach area attaching anisotropy conductive film at interval of first end 23 of this first substrate 21, and peel off the barrier film of this anisotropy conductive film upper surface, wherein part interval region 26 is not provided with the anisotropy conductive film.In first section pre-pressing chamber 33, driving element is placed on the join domain 25 of this first end 23, low temperature (below 100 ℃) low pressure (about 40 newton) is this driving element of precompressed down, make it pass through anisotropy conductive film and this first substrate 21 and realize pre-connections, the conducting particles in this moment this anisotropy conductive film is not out of shape or distortion is arranged slightly.
Attach in the chamber 34 at second section,, and peel off the barrier film of this anisotropy conductive film upper surface at the attach area attaching anisotropy conductive film at interval of second end 24 of this first substrate 21.In second section pre-pressing chamber 35, driving element is placed on the join domain 25 of this second end 24, this driving element of precompressed under the low-temp low-pressure, make it pass through anisotropy conductive film and this first substrate 21 and realize pre-connections, the conducting particles in this moment this anisotropy conductive film is not out of shape or distortion is arranged slightly.
In first section main pressing chamber 36, (more than 140 ℃) add high pressure (more than 60 newton) on the driving element of this first end 23 under the high temperature, make it pass through anisotropy conductive film and the electrical and mechanical connection of this first substrate 21 realizations, the conducting particles generation moderate finite deformation in the anisotropy conductive film at this moment.
In second section main pressing chamber 37, add high pressure under the high temperature on the driving element of this second end 24, make it pass through anisotropy conductive film and the electrical and mechanical connection of this first substrate 21 realizations, the conducting particles generation moderate finite deformation in the anisotropy conductive film at this moment.
Please consulting Fig. 7 together, is the process flow diagram of the driving element attaching method that this driving element attaching device 30 is adopted among Fig. 6.This driving element attaching method 300 may further comprise the steps:
Step 201, panel cleans, the attach area of using ultraviolet light and electricity slurry to clean this display panels 20;
Step 202, first section anisotropy conductive film attaches, and at the attach area attaching anisotropy conductive film at interval of first end 23 of this first substrate 21, and peels off the barrier film of this anisotropy conductive film upper surface;
Step 203, first section pre-pressing of driving element, driving element is placed on the join domain 25 of this first end 23, this driving element of precompressed under the low-temp low-pressure, make it pass through anisotropy conductive film and this first substrate 21 and realize pre-connections, the conducting particles in this moment this anisotropy conductive film is not out of shape or distortion is arranged slightly;
Step 204, second section anisotropy conductive film attaches, and at the attach area attaching anisotropy conductive film at interval of second end 24 of this first substrate 21, and peels off the barrier film of this anisotropy conductive film upper surface;
Step 205, second section pre-pressing of driving element, driving element is placed on the join domain 25 of this second end 24, this driving element of precompressed under the low-temp low-pressure, make it pass through anisotropy conductive film and this first substrate 21 and realize pre-connections, the conducting particles in this moment this anisotropy conductive film is not out of shape or distortion is arranged slightly;
Step 206, first section main pressing adds high pressure under the high temperature on the driving element of this first end 23, makes it pass through anisotropy conductive film and the electrical and mechanical connection of this first substrate 21 realizations, the conducting particles generation moderate finite deformation in the anisotropy conductive film at this moment;
Step 207, second section main pressing adds high pressure under the high temperature on the driving element of this second end 24, makes it pass through anisotropy conductive film and the electrical and mechanical connection of this first substrate 21 realizations, conducting particles generation moderate finite deformation in the anisotropy conductive film is sent to subsequent handling then at this moment.
In driving element attaching method 300, attach area attaching anisotropy conductive film at interval, so the anisotropy conductive film is not set in the part interval region 26, and can effectively reduce the use amount of anisotropy conductive film, reduce cost greatly.Behind the join domain 25 of the anisotropy of precompressed simultaneously conductive film, do not influence the bond strength of the anisotropy conductive film and first substrate 21 when peeling off barrier film, so the connection reliability height.
And in this driving element attaching process, each step about equally consuming time, but make continuous working between each step, improve and attach efficient.
In like manner this driving element attaching device 30 also has the effect that reduces cost.This driving element attaching device 30 also can improve connection reliability, improve attaching efficient simultaneously.
In driving element attaching device 30 and attaching method 300, first end 23 of this first substrate 21 is a source terminal, and second end 24 is a gate terminal; Simultaneously, the driving element that is placed on the join domain 25 of first end 23 is a source driving chip, and the driving element that is placed on the join domain 25 of second end 24 is a grid drive chip.Certainly, first end 23 of this first substrate 21 also can be gate terminal, and second end 24 is a source terminal; Simultaneously, the driving element that is placed on the join domain 25 of first end 23 is a grid drive chip, and the driving element that is placed on the join domain 25 of second end 24 is a source driving chip.
Seeing also Fig. 8, is the structural representation of driving element attaching device second embodiment of the present invention.40 effects of this driving element attaching device are to attach driving element on this display panels 20, it comprise purge chamber 41 that order arranges, in advance attach chamber 48, first section attach chamber 42, first section pre-pressing chamber 43, second section attach chamber 44, second section pre-pressing chamber 45, first section main pressing chamber 46 and second section main pressing chamber 47.This display panels 20 disposes through the leading portion operation, can be transferred into this driving element attaching device 40, this display panels 20 at first enters purge chamber 41, then pre-attach chamber 48, first section attach chamber 42, first section pre-pressing chamber 43, second section attach chamber 44, second section pre-pressing chamber 45, first section main pressing chamber 46 and second section main pressing chamber 47 and be transmitted successively and carry out corresponding operating.
In this purge chamber 41, use ultraviolet light and electricity slurry to clean this display panels 20 remains in attach area in the leading portion operation residue.
This pre-attaching in chamber 48, on first end, 23 a part of join domains 25 of first substrate 21 of this display panels 20, attach the anisotropy conductive film, and peel off the barrier film of this anisotropy conductive film upper surface.Attach in the chamber 42 at first section, first end, the 23 another part join domains 25 on this first substrate 21 attach the anisotropy conductive film, and peel off the barrier film of this anisotropy conductive film upper surface, so the anisotropy conductive film is not set on the interval region 26.In first section pre-pressing chamber 43, driving element is placed on the join domain 25 of this first end 23, low temperature (below 100 ℃) low pressure (about 40 newton) is this driving element of precompressed down, make it pass through the anisotropy conductive film and first substrate 21 is realized pre-connections, the conducting particles in this moment this anisotropy conductive film is not out of shape or distortion is arranged slightly.
Attach in the chamber 44 at second section, the join domain 25 of second end 24 on first substrate 21 of this display panels 20 attaches the anisotropy conductive film, and peels off the barrier film of this anisotropy conductive film upper surface.In second section pre-pressing chamber 45, driving element is placed on the join domain 25 of this second end 24, this driving element of precompressed under the low-temp low-pressure makes it pass through the anisotropy conductive film and first substrate 21 is realized pre-connections.
In first section main pressing chamber 46, (more than 140 ℃) add high pressure (more than 60 newton) on the driving element of this first end 23 under the high temperature, make it pass through anisotropy conductive film and the electrical and mechanical connection of first substrate, 21 realizations.
In second section main pressing chamber 47, add high pressure under the high temperature on the driving element of this second end 24, make it pass through anisotropy conductive film and the electrical and mechanical connection of first substrate, 21 realizations.
Please consulting Fig. 9 together, is the process flow diagram of the driving element attaching method that this driving element attaching device 40 is adopted among Fig. 8.This driving element attaching method 400 may further comprise the steps:
Step 401, panel cleans, and uses the attach area of ultraviolet light and electricity slurry cleaning fluid LCD panel 20;
Step 402, the anisotropy conductive film attaches in advance, attaches the anisotropy conductive film on first end, 23 a part of join domains 25 of first substrate 21, and peels off the barrier film of this anisotropy conductive film upper surface;
Step 403, first section anisotropy conductive film attaches, and first end, the 23 another part join domains 25 on this first substrate 21 attach the anisotropy conductive film, and peel off the barrier film of this anisotropy conductive film upper surface;
Step 404, first section pre-pressing of driving element is placed on the join domain 25 of this first end 23 with driving element, and this driving element of precompressed under the low-temp low-pressure makes it pass through the anisotropy conductive film and first substrate 21 is realized pre-connections;
Step 405, second section anisotropy conductive film attaches, and attaches the anisotropy conductive films at the join domain 25 of second end 24 of first substrate 21, and peels off the barrier film of this anisotropy conductive film upper surface;
Step 406, second section pre-pressing of driving element is placed on the join domain 25 of this second end 24 with driving element, and this driving element of precompressed under the low-temp low-pressure makes it pass through the anisotropy conductive film and first substrate 21 is realized pre-connections;
Step 407, first section main pressing adds high pressure under the high temperature on the driving element of this first end 23, makes it pass through anisotropy conductive film and the electrical and mechanical connection of first substrate, 21 realizations;
Step 408, second section main pressing adds high pressure under the high temperature on the driving element of this second end 24, makes it pass through anisotropy conductive film and the electrical and mechanical connection of first substrate, 21 realizations, is sent to subsequent handling then.
In driving element attaching device 40 and attaching method 400, first end 23 of this first substrate 21 is a source terminal, and second end 24 is a gate terminal; Simultaneously, the driving element that is placed on the join domain 25 of first end 23 is a source driving chip, and the driving element that is placed on the join domain 25 of second end 24 is a grid drive chip.
In driving element attaching method 400, attach the anisotropy conductive film at join domain, so the anisotropy conductive film is not set in the interval region 26, can effectively reduce the use amount of anisotropy conductive film, reduce cost greatly.Behind the join domain 25 of the anisotropy of precompressed simultaneously conductive film, do not influence the bond strength of the anisotropy conductive film and first substrate 21 when peeling off barrier film, so the connection reliability height.
And in this driving element attaching process, each step about equally consuming time, but make each step between continuous working, improve and attach efficient.
In like manner this driving element attaching device 40 also has the effect that reduces cost.This driving element attaching device 40 also can improve connection reliability, improve attaching efficient simultaneously.
Claims (14)
1. driving element attaching method, it comprises the steps:
Panel cleans, one display panels that comprises a substrate is provided, adjacent first end and second end of this substrate are equipped with attach area, in the attach area, the zone of carrying driving element is a join domain, zone between the driving element is an interval region, cleans the attach area of this display panels;
First section anisotropy conductive film attaches, and at the attach area attaching anisotropy conductive film at interval of this substrate first end, the anisotropy conductive film only is attached to join domain, and peels off the barrier film of this anisotropy conductive film upper surface;
First section pre-pressing of driving element is placed on the join domain of this first end with driving element, and this driving element of precompressed makes it pass through the anisotropy conductive film and this substrate is realized pre-connection;
Second section anisotropy conductive film attaches, and at the attach area attaching anisotropy conductive film at interval of this substrate second end, the anisotropy conductive film only is attached to join domain, and peels off the barrier film of this anisotropy conductive film upper surface;
Second section pre-pressing of driving element is placed on the join domain of this second end with driving element, and this driving element of precompressed makes it pass through the anisotropy conductive film and this substrate is realized pre-connection;
First section main pressing adds the driving element that is pressed in first end, makes it pass through anisotropy conductive film and the electrical and mechanical connection of this substrate realization; And
Second section main pressing adds the driving element that is pressed in second end, makes it pass through anisotropy conductive film and the electrical and mechanical connection of this substrate realization, is sent to subsequent handling then.
2. driving element attaching method as claimed in claim 1 is characterized in that: first end of this substrate is a source terminal, and second end is a gate terminal.
3. driving element attaching method as claimed in claim 2 is characterized in that: this driving element that is placed on the join domain of first end is a source driving chip, and the driving element that is placed on the join domain of second end is a grid drive chip.
4. driving element attaching method as claimed in claim 1 is characterized in that: first end of this substrate is a gate terminal, and second end is a source terminal.
5. driving element attaching method as claimed in claim 4 is characterized in that: this driving element that is placed on the join domain of first end is a grid drive chip, and the driving element that is placed on the join domain of second end is a source driving chip.
6. driving element attaching method as claimed in claim 1, it is characterized in that: in the step of this first section pre-pressing of driving element and second section pre-pressing of driving element, the precompressed driving element carries out under this driving element applying 40 newton's pressure below 100 ℃.
7. driving element attaching method as claimed in claim 1 is characterized in that: in the step of this first section main pressing and second section main pressing, add and be pressed in driving element and carry out under this driving element with upward pressure applying 60 newton more than 140 ℃.
8. driving element attaching device, it comprises and is that order arranges:
One purge chamber, one display panels that comprises a substrate is provided, adjacent first end and second end of this substrate are equipped with attach area, in the attach area, the zone of carrying driving element is a join domain, zone between the driving element is an interval region, cleans the attach area of this display panels;
One first section attaches the chamber, and at the attach area attaching anisotropy conductive film at interval of this substrate first end, the anisotropy conductive film only is attached to join domain, and peels off the barrier film of this anisotropy conductive film upper surface;
One first section pre-pressing chamber is placed on the join domain of this first end with driving element, and this driving element of precompressed makes it pass through the anisotropy conductive film and this substrate is realized pre-connection;
One second section attaches the chamber, and at the attach area attaching anisotropy conductive film at interval of this substrate second end, the anisotropy conductive film only is attached to join domain, and peels off the barrier film of this anisotropy conductive film upper surface;
One second section pre-pressing chamber is placed on the join domain of this second end with driving element, and this driving element of precompressed makes it pass through the anisotropy conductive film and this substrate is realized pre-connection;
One first section main pressing chamber adds the driving element that is pressed in first end, makes it pass through anisotropy conductive film and the electrical and mechanical connection of this substrate realization; And
One second section main pressing chamber adds the driving element that is pressed in second end, makes it pass through anisotropy conductive film and the electrical and mechanical connection of this substrate realization, is sent to subsequent handling then.
9. driving element attaching device as claimed in claim 8 is characterized in that: first end of this substrate is a source terminal, and second end is a gate terminal.
10. driving element attaching device as claimed in claim 9 is characterized in that: this driving element that is placed on the join domain of first end is a source driving chip, and the driving element that is placed on the join domain of second end is a grid drive chip.
11. driving element attaching device as claimed in claim 8 is characterized in that: first end of this substrate is a gate terminal, and second end is a source terminal.
12. driving element attaching device as claimed in claim 11 is characterized in that: this driving element that is placed on the join domain of first end is a grid drive chip, and the driving element that is placed on the join domain of second end is a source driving chip.
13. driving element attaching device as claimed in claim 8 is characterized in that: in this first section pre-pressing chamber and the second section pre-pressing chamber, the precompressed driving element carries out under this driving element applying 40 newton's pressure below 100 ℃.
14. driving element attaching device as claimed in claim 8 is characterized in that: in this first section main pressing chamber and the second section main pressing chamber, add and be pressed in driving element and carry out under this driving element with upward pressure applying 60 newton more than 140 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510120677XA CN100414419C (en) | 2005-12-16 | 2005-12-16 | Method and apparatus for adhering driving component |
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|---|---|---|---|
| CNB200510120677XA CN100414419C (en) | 2005-12-16 | 2005-12-16 | Method and apparatus for adhering driving component |
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| CN1982996A CN1982996A (en) | 2007-06-20 |
| CN100414419C true CN100414419C (en) | 2008-08-27 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101842000B (en) * | 2009-03-19 | 2014-04-30 | 鸿富锦精密工业（深圳）有限公司 | Attaching device and attaching method using same |
| CN101823356B (en) * | 2010-04-29 | 2012-09-05 | 友达光电股份有限公司 | Thin-film bonding machine table, thin-film bonding method and manufacturing method of solidifying film layer |
| KR101925743B1 (en) * | 2015-12-11 | 2018-12-05 | 선전 로욜 테크놀로지스 컴퍼니 리미티드 | Method of combining flexible display module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6031590A (en) * | 1997-01-22 | 2000-02-29 | Lg Electronics Inc. | Structure and method of mounting driver IC using anisotropic conductive film in liquid crystal display device |
| JP2004063628A (en) * | 2002-07-26 | 2004-02-26 | Seiko Epson Corp | Conductive pattern formation method, conductive pattern formation substrate, electro-optical device, and electronic apparatus |
| JP2004170824A (en) * | 2002-11-22 | 2004-06-17 | Nec Saitama Ltd | Connection structure and connection method of flexible printed wiring board |
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2005
- 2005-12-16 CN CNB200510120677XA patent/CN100414419C/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6031590A (en) * | 1997-01-22 | 2000-02-29 | Lg Electronics Inc. | Structure and method of mounting driver IC using anisotropic conductive film in liquid crystal display device |
| JP2004063628A (en) * | 2002-07-26 | 2004-02-26 | Seiko Epson Corp | Conductive pattern formation method, conductive pattern formation substrate, electro-optical device, and electronic apparatus |
| JP2004170824A (en) * | 2002-11-22 | 2004-06-17 | Nec Saitama Ltd | Connection structure and connection method of flexible printed wiring board |
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| CN1982996A (en) | 2007-06-20 |
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