CN113179579A

CN113179579A - Circuit board and electronic equipment

Info

Publication number: CN113179579A
Application number: CN202110457861.2A
Authority: CN
Inventors: 黄赛娟
Original assignee: Kunshan Govisionox Optoelectronics Co Ltd
Current assignee: Kunshan Govisionox Optoelectronics Co Ltd
Priority date: 2021-04-27
Filing date: 2021-04-27
Publication date: 2021-07-27

Abstract

The application provides a circuit board and electronic equipment relates to circuit board technical field. In the present application, a circuit board includes a substrate, a first conductive line, a first conductive pad, a second conductive pad, and a second conductive line. The first conductive pad is electrically connected with the first conductive line, and the second conductive line is electrically connected with the second conductive pad and the first conductive line respectively. The first conductive circuit board is at least provided with a first transmission path and a second transmission path for transmitting the same electric signal, the first transmission path comprises a first conductive circuit and a first conductive bonding pad, and the second transmission path comprises a first conductive circuit, a second conductive circuit and a second conductive bonding pad. Through the arrangement, the problem that the reliability of the conducting circuit on the circuit board is low in the prior art can be improved.

Description

Circuit board and electronic equipment

Technical Field

The application relates to the technical field of circuit boards, in particular to a circuit board and electronic equipment.

Background

In electronic equipment, a circuit board is an important component. In order to electrically connect the circuit board to other devices in the electronic device, a conductive pad is generally disposed on the circuit board and electrically connected to a conductive trace on the circuit board.

However, the inventor researches and finds that in the production process, the circuit board is subjected to large bending stress, so that conductive circuits on the circuit board are easily disconnected, the problems of signal transmission abnormity and the like are caused, and the reliability of the circuit board is affected.

Disclosure of Invention

In view of the above, an object of the present invention is to provide a circuit board and an electronic device, so as to solve the problem of low reliability caused by the disconnection of the conductive traces on the circuit board in the prior art.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

a circuit board, comprising:

a substrate;

the first conducting circuit is positioned on one side of the substrate;

the first conductive bonding pad is electrically connected with the first conductive circuit and is positioned on the same side of the substrate;

the second conductive pad is positioned on one side, far away from the first conductive pad, of the base material;

the second conductive circuit and the second conductive bonding pad are positioned on the same side of the substrate, and the second conductive circuit is electrically connected with the second conductive bonding pad and the first conductive circuit respectively;

the circuit board is at least provided with a first transmission path and a second transmission path for transmitting the same electric signal, the first transmission path comprises the first conductive circuit line and the first conductive bonding pad, and the second transmission path comprises the first conductive circuit line, the second conductive circuit line and the second conductive bonding pad.

In a preferred option of the embodiment of the present application, in the above circuit board, the substrate has a first through hole, the first through hole has a third conductive trace therein, and the third conductive trace electrically connects the first conductive trace and the second conductive trace.

In a preferred option of the embodiment of the present application, in the circuit board, a portion of the second conductive trace away from the second conductive pad is electrically connected to the third conductive trace.

In a preferred option of the embodiment of the present application, in the above circuit board, the first conductive trace includes a first trace portion and a second trace portion;

wherein one end of the first circuit portion is electrically connected to the first conductive pad, the other end of the first circuit portion is electrically connected to the second circuit portion, and the third conductive trace is electrically connected to the second circuit portion.

In a preferred option of the embodiment of the present application, in the circuit board, a width of the first circuit portion is greater than a width of the second circuit portion, and a width of the second conductive trace is greater than a width of the second circuit portion.

In a preferred option of the embodiment of the present application, in the circuit board, an orthogonal projection of the first conductive trace on the substrate and an orthogonal projection of the first conductive pad on the substrate at least partially overlap each other;

the orthographic projection of the second conductive circuit on the base material is at least partially overlapped with the orthographic projection of the second conductive pad on the base material.

In a preferred option of the embodiment of the present application, in the circuit board, a portion of the first conductive trace electrically connected to the first conductive pad is located between the substrate and the first conductive pad;

and the part of the second conductive circuit electrically connected with the second conductive pad is positioned between the substrate and the second conductive pad.

In a preferred option of the embodiment of the present application, in the circuit board, the substrate has a second through hole, the second through hole has a fourth conductive trace therein, and the fourth conductive trace electrically connects the first conductive pad and the second conductive pad;

the first conductive circuit is electrically connected with the first conductive pad and the fourth conductive circuit respectively, and the second conductive circuit is electrically connected with the second conductive pad and the fourth conductive circuit respectively.

In a preferred option of the embodiment of the present invention, in the above circuit board, the substrate is a flexible substrate structure, so as to form a flexible circuit board.

The embodiment of the application also provides electronic equipment which comprises the circuit board.

In a preferred option of the embodiment of the present application, in the electronic device, the electronic device further includes a solder circuit board, and the solder circuit board includes a third conductive pad;

wherein the third conductive pad is electrically connected to the first conductive pad and the second conductive pad to transmit electrical signals between the circuit board and the soldered circuit board.

The application provides a circuit board and electronic equipment sets up first conducting wire and first electrically conductive pad through one side at the substrate, sets up second conducting wire and second electrically conductive pad at the opposite side of substrate to electrically connect first conducting wire and second conducting wire, thereby form double-conductor circuit structure, like first transmission path and second transmission path. Therefore, after the first transmission path is disconnected due to the reasons of stress and the like of the first conductive circuit, the circuit board is at least provided with the second transmission path for transmitting the electric signals, so that the reliability of the conductive path of each electric signal can be guaranteed, and the reliability of the conductive circuit on the circuit board is improved.

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

Fig. 2 is a schematic diagram illustrating an electrical connection between a first conductive trace and a second conductive trace according to an embodiment of the disclosure.

Fig. 3 is a schematic diagram illustrating an electrical connection between a first conductive trace and a second conductive trace according to another embodiment of the present disclosure.

Fig. 4 is a schematic diagram of an electrical connection between a first conductive trace and a second conductive trace according to yet another embodiment of the present disclosure.

Fig. 5 is an equivalent circuit diagram of the conductive structure of the circuit board shown in fig. 1.

Fig. 6 is a schematic diagram illustrating a comparison between widths of a first line portion and a second line portion according to an embodiment of the present application.

Fig. 7 is a schematic diagram illustrating a relative position relationship between a first conductive trace and a first conductive pad according to an embodiment of the present disclosure.

Fig. 8 is a schematic diagram illustrating a relative position relationship between a second conductive trace and a second conductive pad according to an embodiment of the present disclosure.

Fig. 9 is a schematic diagram of an electrical connection between a first conductive pad and a second conductive pad according to an embodiment of the present application.

Fig. 10 is a schematic diagram of an electrical connection between a first conductive pad and a second conductive pad according to another embodiment of the present application.

Fig. 11 is a schematic diagram illustrating a relative position relationship between a first conductive trace, a second conductive trace and a fourth conductive trace according to an embodiment of the present disclosure.

Fig. 12 is a schematic diagram illustrating a relative position relationship between a plurality of first conductive traces and a plurality of first conductive pads according to an embodiment of the present application.

Fig. 13 is a schematic diagram illustrating a relative position relationship between a plurality of second conductive traces and a plurality of second conductive pads according to an embodiment of the present application.

Fig. 14 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Icon: 100-a circuit board; 110-a substrate; 111-a first via; 113-a second via; 120-a first conductive trace; 121-a first line portion; 122-a second line portion; 130-a first conductive pad; 140-a second conductive pad; 150-a second conductive line; 160-a third conductive line; 170-fourth conductive traces.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1, the present embodiment provides a circuit board 100. The circuit board 100 may include a substrate 110, a first conductive trace 120, a first conductive pad 130, a second conductive pad 140, and a second conductive trace 150.

In detail, the first conductive traces 120 are located on one side of the substrate 110, the first conductive pads 130 are electrically connected to the first conductive traces 120, and the first conductive pads 130 and the first conductive traces 120 are located on the same side of the substrate 110. The second conductive pad 140 is located on a side of the substrate 110 away from the first conductive pad 130. The second conductive traces 150 and the second conductive pads 140 are located on the same side of the substrate 110, and the second conductive traces 150 are electrically connected to the second conductive pads 140 and the first conductive traces 120, respectively.

Based on the above arrangement, the first conductive trace on the circuit board 100 at least has a first transmission path and a second transmission path for transmitting the same electrical signal, the first transmission path includes the first conductive trace 120 and the first conductive pad 130, and the second transmission path includes the first conductive trace 120, the second conductive trace 150 and the second conductive pad 140. The first conductive trace, the first conductive pad, the second conductive trace, the second conductive pad, the first conductive trace and the second conductive trace are based on this, and since the first transmission path is disconnected due to disconnection of the first conductive trace 120 caused by stress and the like, the circuit board 100 at least has a second transmission path for transmitting an electrical signal, which can ensure the reliability of the conductive path, thereby improving the reliability of the conductive trace on the circuit board 100.

In the first aspect, it is noted that the material of the substrate 110 is not limited, and may be selected according to the actual application requirement.

For example, in an alternative example, the material of the substrate 110 may be a Flexible material to form a Flexible substrate structure, so that the Circuit board 100 may be a Flexible Printed Circuit (FPC) 100. For another example, in another alternative example, the material of the substrate 110 may also be a non-flexible material, so that the circuit Board 100 may be a Rigid Board (PCB), such as a PCB Board.

Alternatively, in the above examples, the flexible material may include, but is not limited to, polyimide, mylar, or the like. The non-flexible material may include, but is not limited to, Polypropylene (PP) and the like.

In the second aspect, it should be noted that, for the first conductive traces 120 and the second conductive traces 150, an electrical connection manner between the first conductive traces 120 and the second conductive traces 150 is not limited, and may be selected according to actual application requirements.

For example, in an alternative example, referring to fig. 2, the first conductive traces 120 and the second conductive traces 150 may be electrically connected by conductive traces on the surface of the substrate 110. As shown at XL in fig. 2, it is understood that, in fig. 2, the conductive trace is only illustrated in part, and the conductive trace may further include a portion extending in a direction from the first conductive trace 120 to the first conductive pad 130, and the portion may be located at a rear side of the first conductive trace 120 and the first conductive pad 130 and at a rear side of the second conductive trace 150 and the second conductive pad 140 in the view of fig. 2 to extend to a position where the first conductive trace 120 and the second conductive trace 150 are located, respectively, so as to achieve electrical connection with the first conductive trace 120 and the second conductive trace 150.

For another example, in another alternative example, with reference to fig. 1 and 3, the substrate 110 has a first via 111 thereon, and the first via 111 has a third conductive trace 160 therein.

The third conductive trace 160 electrically connects the first conductive trace 120 and the second conductive trace 150, so that the first conductive trace 120 and the second conductive trace 150 can be electrically connected through the third conductive trace 160.

Therefore, the electrical connection relationship between the first conductive traces 120 and the second conductive traces 150 is relatively concise, and the problems of high manufacturing cost and complex manufacturing process caused by forming more traces on the surface of the substrate 110 are avoided.

Optionally, on the basis of the above example, considering that the first conductive traces 120 are the main circuit structure on the circuit board 100, the second conductive traces 150 are the auxiliary circuit structure of the first conductive traces 120, and the length of the first conductive traces 120 is greater than that of the second conductive traces 150, based on this, in order to achieve the electrical connection between the second conductive traces 150 and the third conductive traces 160, and to avoid that the second conductive traces 150 can replace the disconnected first conductive traces 120 to transmit signals to a greater extent and reduce the waste of materials, the third conductive traces 160 may be electrically connected to the portion of the second conductive traces 150 far from the second conductive pads 140. This allows more of the second conductive trace 150 to be used to transmit signals.

It is understood that, in the above example, a portion of the second conductive trace 150 away from the second conductive pad 140 may refer to an area on the second conductive trace 150. This region may include an end of the second conductive trace 150 remote from the second conductive pad 140 and extending a distance therefrom in a direction closer to the second conductive pad 140. The distance may be less than the length of the second conductive trace 150, or less than half the length of the second conductive trace 150.

In an alternative example, in order to enable each part of the second conductive trace 150 to fully perform the function of transmitting signals, the third conductive trace 160 may be electrically connected to an end (end a shown in fig. 1) of the second conductive trace 150 away from the second conductive pad 140.

Based on this, if the length of the second conductive trace 150 is L1, a portion of the first conductive trace 120 with a length of L1 may be replaced. That is, a signal can be transmitted through the second conductive trace 150 by breaking at any position in a portion of the second conductive trace 150 having a length L1, thereby ensuring the reliability of the conductive trace.

Alternatively, on the basis of the above example, in order to enable the second conductive trace 150 to transmit a signal to a large extent also when the first conductive trace 120 is disconnected, considering that the portion of the first conductive trace 120 close to the first conductive pad 130 is easily disconnected, in a possible example, in conjunction with fig. 4, the first conductive trace 120 includes a first trace portion 121 and a second trace portion 122.

One end (end B shown in fig. 4) of the first circuit portion 121 is electrically connected to the first conductive pad 130, the other end (end C shown in fig. 4) of the first circuit portion 121 is electrically connected to the second circuit portion 122, and the third conductive trace 160 is electrically connected to the second circuit portion 122.

Based on this, after any one position in the first line part 121 is disconnected, that is, after the part of the first conductive line 120 close to the first conductive pad 130 is disconnected, a signal can be transmitted through the second conductive line 150.

Alternatively, on the basis of the above example, in order to avoid the problems of material waste and complicated wiring caused by the excessively long length of the second conductive trace 150 and/or the third conductive trace 160, in a possible example, the third conductive trace 160 may be electrically connected to a region on the second line portion 122 close to the first line portion 121.

For example, in an alternative example, the third conductive trace 160 may be electrically connected to an end portion of the second line portion 122 near the first line portion 121.

Based on this, an equivalent circuit as shown in fig. 5 can be formed, when the first circuit portion 121 is not disconnected, a signal enters the circuit board 100, and the signal can be divided into two parts, one part enters the second circuit portion 122 (the first transmission path as described above) after passing through the first conductive pad 130 and the first circuit portion 121 in sequence, and the other part enters the second circuit portion 122 after passing through the second conductive pad 140, the second conductive trace 150 and the third conductive trace 160 in sequence. When the first circuit portion 121 is disconnected, a signal may enter the second circuit portion 122 after passing through the second conductive pad 140, the second conductive trace 150 and the third conductive trace 160 in sequence (the second transmission path as described above), so that the signal can be effectively transmitted.

Alternatively, on the basis of the above example, considering that the first line portion 121 is a portion of the first conductive trace 120 close to the first conductive pad 130 and is thus easily subjected to a large stress, based on which, considering factors such as wiring requirements and resource waste, the width of the first line portion 121 may be larger than the width of the second line portion 122 in conjunction with fig. 6.

Similarly, since the distances from the second conductive pad 140 to the respective portions of the second conductive trace 150 are small, the second conductive trace 150 is also easily subjected to large stress, and therefore, the width of the second conductive trace 150 may be larger than the width of the second trace portion 122.

In the third aspect, it should be noted that, for the first conductive traces 120 and the first conductive pads 130, a relative position relationship between the first conductive traces 120 and the first conductive pads 130 is not limited, and may be selected according to actual application requirements.

For example, in an alternative example, the boundary of the first conductive trace 120 and the boundary of the first conductive pad 130 contact each other.

For another example, in another alternative example, with reference to fig. 7, an orthographic projection of the first conductive trace 120 on the substrate 110 and an orthographic projection of the first conductive pad 130 on the substrate 110 at least partially coincide. As such, the stability of the electrical connection between the first conductive trace 120 and the first conductive pad 130 may be improved.

Optionally, on the basis of the above example, in order to facilitate electrical connection between the first conductive pad 130 and other devices and avoid the first conductive trace 120 from being damaged by other devices, in a possible example, a portion of the first conductive trace 120 electrically connected to the first conductive pad 130 is located between the substrate 110 and the first conductive pad 130, as the first conductive pad 130 at least partially covers the portion of the first conductive trace 120.

Based on this, a portion on the first conductive trace 120 may be covered and protected by the first conductive pad 130. In addition, when a protective film or an insulating film is disposed on the first conductive traces 120, the first conductive pads 130 may be exposed through windows, thereby ensuring that the first conductive pads 130 can be effectively electrically connected to other devices.

In the fourth aspect, it should be noted that, for the second conductive traces 150 and the second conductive pads 140, a relative position relationship between the second conductive traces 150 and the second conductive pads 140 is not limited, and may be selected according to actual application requirements.

For example, in an alternative example, the boundary of the second conductive trace 150 and the boundary of the second conductive pad 140 contact each other.

For another example, in another alternative example, with reference to fig. 8, an orthographic projection of the second conductive traces 150 on the substrate 110 and an orthographic projection of the second conductive pad 140 on the substrate 110 at least partially coincide. In this manner, the stability of the electrical connection between the second conductive trace 150 and the second conductive pad 140 may be improved.

Optionally, on the basis of the above example, in order to facilitate electrical connection between the second conductive pad 140 and other devices and avoid the second conductive trace 150 from being damaged by other devices, in a possible example, a portion of the second conductive trace 150 electrically connected to the second conductive pad 140 is located between the substrate 110 and the second conductive pad 140, as the second conductive pad 140 at least partially covers the portion of the second conductive trace 150.

Based on this, a portion of the second conductive trace 150 may be covered and protected by the second conductive pad 140. In addition, when a protective film or an insulating film is disposed on the second conductive traces 150, the second conductive pads 140 can be exposed through windows, thereby ensuring that the second conductive pads 140 can be effectively electrically connected to other devices.

In the fifth aspect, it is to be noted that, for the first conductive pad 130 and the second conductive pad 140, a connection relationship between the first conductive pad 130 and the second conductive pad 140 is not limited, and may be selected according to a practical application requirement.

For example, in an alternative example, the first conductive pad 130 and the second conductive pad 140 may not have an electrical connection relationship therebetween. As such, when the first conductive traces 120 are not disconnected, other devices may be in contact with the first conductive pads 130 to achieve electrical connection. While the first conductive traces 120 are disconnected, other devices may be in contact with the second conductive pads 140 to make electrical connection. Alternatively, other devices may be in contact with the first conductive pad 130 and the second conductive pad 140 respectively when the first conductive trace 120 is not disconnected and when the first conductive trace 120 is disconnected, so as to achieve electrical connection respectively.

For another example, in another alternative example, in order to improve the convenience of connecting the circuit board 100 to other devices, the first conductive pad 130 and the second conductive pad 140 may be electrically connected, such that any one of the first conductive pad 130 and the second conductive pad 140 may be electrically connected to the first conductive pad 130 and the second conductive pad 140 after being in contact with other devices.

Alternatively, on the basis of the above example, in order to enable electrical connection between the first conductive pad 130 and the second conductive pad 140, in a possible example, with reference to fig. 9 and 10, the substrate 110 has a second through hole 113 thereon, and the second through hole 113 has a fourth conductive line 170 therein. One end (e.g., end D shown in fig. 10) of the fourth conductive trace 170 is electrically connected to the first conductive pad 130, and the other end (E shown in fig. 10) of the fourth conductive trace 170 is electrically connected to the second conductive pad 140.

Based on this, by providing the fourth conductive line 170 in the second via 113, the wiring on the circuit board 100 can be simplified while ensuring the electrical connection between the first conductive pad 130 and the second conductive pad 140.

It is understood that, in other possible examples, the first conductive pad 130 and the second conductive pad 140 may be electrically connected based on other methods, for example, electrically connected through a conductive line on the side of the substrate 110.

Optionally, on the basis of the above example, in order to enable the first conductive trace 120 and the second conductive trace 150 to transmit signals more reliably, in a possible example, referring to fig. 11, the first conductive trace 120 is electrically connected to the first conductive pad 130 and the fourth conductive trace 170, respectively, and the second conductive trace 150 is electrically connected to the second conductive pad 140 and the fourth conductive trace 170, respectively.

Based on this, signals can be directly transmitted between the first conductive pad 130 and the second conductive trace 150 through the fourth conductive trace 170, and signals can also be directly transmitted between the second conductive pad 140 and the first conductive trace 120 through the fourth conductive trace 170.

It is to be understood that, in the above example, in conjunction with fig. 12 and 13, the first conductive trace 120, the first conductive pad 130, the second conductive pad 140, and the second conductive trace 150 may be respectively plural. A one-to-one correspondence relationship may be formed among the plurality of first conductive traces 120, the plurality of first conductive pads 130, the plurality of second conductive pads 140, and the plurality of second conductive traces 150, so that a gold finger structure is formed on the substrate 110 through the plurality of first conductive pads 130, and a gold finger structure is formed on the substrate 110 through the plurality of second conductive pads 140.

It is understood that, in the above example, a plurality of the first conductive traces 120 may be electrically connected to a connector or a display driving chip on the circuit board 100. The connector is used for being electrically connected with the welding circuit board, and the display driving chip is used for providing a display driving signal.

The embodiment of the present application further provides an electronic device, which may include the circuit board 100 described above. The structure of the circuit board 100 can refer to the foregoing description, and is not repeated herein.

It will be appreciated that the electronic device may also include other structures or devices, etc., based on different needs. For example, when the electronic device is a display device or has a display function, the electronic device may further include a display module. The circuit board 100 may be electrically connected to the display module.

It will be appreciated that in an alternative example, in connection with fig. 14, the electronic device may further include a solder circuit board 200.

Wherein the welding circuit board 200 includes a third conductive pad 210, and the third conductive pad 210 is electrically connected to the first conductive pad 130 and the second conductive pad 140 for transmitting an electrical signal between the circuit board 100 and the welding circuit board 200. As such, the first transmission path and the second transmission path on the circuit board 100 may be used to transmit the same electrical signal input by the soldering circuit board 200 through the third conductive pad 210.

For example, in an alternative example, the third conductive pad 210 may be electrically connected to the second conductive pad 140 (e.g., by soldering, etc.). The first conductive pad 130 is electrically connected to the second conductive pad 140 (e.g., via the fourth conductive trace 170, as described above), so that the third conductive pad 210 is electrically connected to the first conductive pad 130.

It is understood that the solder circuit board 200 may further include a substrate structure 220, a copper sheet 230, a first cover film 240, a second cover film 250, a trace line 260, and the like.

In detail, the copper sheet 230 is located on one side of the substrate structure 220, and the first capping film 240 is located on one side of the copper sheet 230 away from the substrate structure 220, as the first capping film 240 covers the copper sheet 230. The trace line 260 is electrically connected to the third conductive pad 210, and the trace line 260 and the third conductive pad 210 are located on a side of the substrate structure 220 away from the copper sheet 230. The second cover film 250 is located on a side of the trace line 260 away from the substrate structure 220, for example, the second cover film 250 covers the trace line 260.

It is understood that in an alternative example, the circuit board 100 may further include a third cover film 180 and a fourth cover film 190, such as the insulating film or the protective film described above.

In summary, the circuit board 100 and the electronic device provided in the present application form a dual conductive circuit structure, such as a first transmission path and a second transmission path, by disposing the first conductive trace 120 and the first conductive pad 130 on one side of the substrate 110, disposing the second conductive trace 150 and the second conductive pad 140 on the other side of the substrate 110, and electrically connecting the first conductive trace 120 and the second conductive pad 150. Thus, after the first conductive traces 120 are disconnected due to stress and other reasons, so that the first transmission path is disconnected, the circuit board 100 at least has a second transmission path for transmitting electrical signals, which can ensure the reliability of the conductive paths, thereby improving the reliability of the conductive traces on the circuit board 100.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board, comprising:

a substrate;

the first conducting circuit is positioned on one side of the substrate;

2. The circuit board of claim 1, wherein the substrate has a first via therein, and a third conductive trace therein, the third conductive trace electrically connecting the first conductive trace and the second conductive trace.

3. The circuit board of claim 2, wherein a portion of the second conductive trace remote from the second conductive pad is electrically connected to the third conductive trace.

4. The circuit board of claim 2, wherein the first conductive trace includes a first trace portion and a second trace portion;

5. The circuit board of claim 4, wherein the first circuit portion has a width greater than a width of the second circuit portion, and the second conductive trace has a width greater than a width of the second circuit portion.

6. The circuit board of claim 1, wherein an orthographic projection of the first conductive trace on the substrate and an orthographic projection of the first conductive pad on the substrate at least partially coincide;

7. The circuit board of claim 6, wherein the portion of the first conductive trace electrically connected to the first conductive pad is located between the substrate and the first conductive pad;

8. The circuit board of claim 1, wherein the substrate has a second via therein, the second via having a fourth conductive trace therein, the fourth conductive trace electrically connecting the first conductive pad to the second conductive pad;

9. An electronic device, characterized in that the electronic device comprises a circuit board according to any one of claims 1-8.

10. The electronic device of claim 9, further comprising a solder circuit board, the solder circuit board including a third conductive pad;