CN113163595A - Chip on film, roll and display device - Google Patents
Chip on film, roll and display device Download PDFInfo
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- CN113163595A CN113163595A CN202110342882.XA CN202110342882A CN113163595A CN 113163595 A CN113163595 A CN 113163595A CN 202110342882 A CN202110342882 A CN 202110342882A CN 113163595 A CN113163595 A CN 113163595A
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- binding
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- film
- bonding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Abstract
The embodiment of the application provides a chip on film, a coiled material and a display device, relates to the technical field of display, and reduces the risk of short circuit of a binding lead caused by metal chips in the punching process. The chip on film comprises a flexible circuit board and a driving chip positioned on the flexible circuit board; the flexible circuit board is provided with binding wires, each binding wire comprises a first binding part and a second binding part, the first binding parts are bound with the pins of the driving chip, and the second binding parts extend to the binding areas of the flexible circuit board and are used for binding with the pins of the display panel or the printed circuit board; the at least partial binding wire is a first binding wire, a first test terminal used for detecting the binding condition of the drive chip is arranged in the first binding wire in series, an interval is reserved between a second binding part and a first edge of the first binding wire, and the first edge is an edge formed after the flexible circuit board is cut in the coiled material.
Description
Technical Field
The invention relates to the technical field of display, in particular to a chip on film, a coiled material and a display device.
Background
A Chip On Film (COF) refers to a die-On-Film (COF) for fixing a driving Chip On a Flexible Circuit Board, and the structure is widely applied to various display devices and used for connecting between a display panel and a Printed Circuit Board (PCB), wherein the PCB may be a Flexible Printed Circuit (FPC) for signal transmission between the PCB and the display panel.
At present, the electrical connection between the flexible circuit board and the display panel and the printed circuit board in the flip chip Film is usually realized by using board-to-board (BTB), Zero Insertion Force (ZIF), Anisotropic Conductive Film (ACF) binding and other methods. The technology can realize precise and miniaturized connection, for example, connection with the connection size (the line width of a binding pin and the line distance between the binding pins form a connection size, which can also be called pitch) in the range of 25-200 μm, so that the technology is more suitable for electric connection between the flexible circuit board and a display panel. Particularly, with the continuous development of the narrow frame technology of the display panel, the connection size corresponding to the bonding pins in the display panel is smaller and smaller, and accordingly, the line width and the line distance of the bonding wires on the flexible circuit board bonded with the display panel are also reduced, for example, in the case that the connection size is 25 μm, the line width of the bonding wires is usually set to 12 μm, and the line distance between the bonding wires is set to 13 μm.
As is well known, the flip-chip film is usually formed in a roll form, and after the roll is manufactured, the roll needs to be cut by using a punching force, so as to form a plurality of independent flip-chip films. When the coiled material is cut, the binding wires extending out of the cutting line in the chip on film can be cut, in the process of punching, metal scraps can be generated due to the fact that a punching jig and the like are formed, the binding wires protrude out of the surface of the flexible circuit board and are in a saw-toothed shape, therefore, as shown in fig. 1, fig. 1 is a residual schematic diagram of the metal scraps in the prior art, the metal scraps 100 are likely to be left at the cutting position, so that the metal scraps are left in a gap 300 between the binding wires 200, if the wire distance between the binding wires 200 is too small, the metal scraps 100 are likely to be contacted with the adjacent binding wires 200, two insulated binding wires 200 are caused to be electrically connected, and then the short circuit is caused after the electrification, the electrical property of the whole display device is poor, and the display abnormity is caused.
Disclosure of Invention
In view of the above, the present application provides a flip chip, a roll and a display device, which are used to reduce the risk of short circuit of bonding wires caused by metal filings during the die cutting process.
In a first aspect, an embodiment of the present application provides a chip on film, including a flexible circuit board and a driving chip located on the flexible circuit board;
the flexible circuit board is provided with binding wires, the binding wires comprise a first binding part and a second binding part, the first binding part is bound with the pins of the driving chip, and the second binding part extends to the binding area of the flexible circuit board and is used for binding with the pins of the display panel or the printed circuit board;
at least part of the binding wires are first binding wires, first test terminals for detecting the binding condition of the driver chip are arranged in the first binding wires in series, a gap is formed between the second binding portion and a first edge of the first binding wires, and the first edge is an edge formed after the flexible circuit board is cut in the coiled material.
In an embodiment, a part of the bonded traces is a second bonded trace, the second bonding portion of the second bonded trace extends to the first edge, and at least one first bonded trace is spaced between two adjacent second bonded traces.
When the part of the binding wires is the second binding wires, the second binding parts of the second binding wires extend to the first edge, the second test terminals electrically connected with the part of the second binding wires are positioned outside the first cutting line of the coiled material, at least one first binding wire is arranged between every two adjacent second binding wires at intervals, the wire distance between any two adjacent second binding wires at the cutting position can be increased by utilizing the first binding wires, and the risk of short circuit of the binding wires is further reduced.
Further, the second routing wires and the first routing wires are alternately arranged.
In one embodiment, the ratio of the number of the first bonding wires to the number of the bonding wires is a, and a is greater than or equal to 0.25 and less than or equal to 1.
Further, a is 0.5.
In one embodiment, a distance between the second binding portion of the first binding trace and the first edge is greater than or equal to 100 μm.
In one embodiment, the flexible wiring board further comprises a copper exposure area and a covering area, wherein the copper exposure area is positioned between the binding area and the covering area;
the part of the binding wire, which is positioned in the copper exposure area, is a first lead, and the first test terminal is connected in series with the first lead of the first binding wire.
The first test terminal is connected in series with the first lead of the first binding wire, so that on one hand, the first test terminal can be ensured to be exposed and not covered by a protective material, and further, a detection signal can be normally received, and the detection of the binding condition of the driving chip is realized; on the other hand, generally, the size of terminal is far greater than the linewidth of walking the line, if establish ties first test terminal in the portion of binding up of second, when display panel's pin binds the portion with the second, the condition that a plurality of pins of display panel bound to same first test terminal can appear, and then lead to signal transmission mistake, consequently, establish ties first test terminal on first lead, can also avoid first test terminal to produce harmful effects to binding of display panel, improve the reliability that the panel bound.
Further, a distance between the first test terminal and the bonding region is greater than or equal to 100 μm.
In one embodiment, the first test terminals constitute a plurality of terminal groups arranged in a first direction, each of the terminal groups includes a plurality of the first test terminals arranged in a second direction, and the plurality of the first test terminals are arranged in a non-aligned manner in the second direction in each of the terminal groups;
the second direction is a direction in which the bonding area points to the coverage area, and the first direction intersects with the second direction.
In one embodiment, the copper exposure area includes a first copper exposure area and a second copper exposure area arranged in a second direction, the second direction is a direction in which the bonding area points to the covering area, and the first test terminal is located in the first copper exposure area; the first lead comprises a first sub-lead positioned in the first copper exposing area and a second sub-lead positioned in the second copper exposing area, and the line width of the first sub-lead is smaller than that of the second binding portion.
The line width of the first sub-lead is set to be smaller, so that the line distance between the first sub-leads can be increased to a certain extent, the arrangement density of the first sub-leads is avoided, and the risk of short circuit between the first sub-leads caused by factors such as etching precision is avoided.
Further, a part of the bonding wires is a second bonding wire, and the second bonding portion of the second bonding wire extends to the first edge; the line width of the second sub-lead in the first binding wire and the second binding wire is larger than the line width of the first sub-lead, and the line width of the second sub-lead in the second binding wire is larger than the line width of the second sub-lead in the first binding wire, so that the second sub-lead in the second binding wire performs greater load compensation on the first sub-lead connected with the second sub-lead, equivalent loads of the first lead in the first binding wire and the second binding wire tend to be consistent, the equivalent loads of the first lead in the first binding wire and the second binding wire tend to be consistent, and the attenuation degree difference of signals transmitted in different binding wires is reduced.
Based on the same inventive concept, the embodiment of the present application further provides a roll, including:
the flexible circuit board substrate comprises a plurality of cutting lines, and the plurality of cutting lines are intersected to define a plurality of flip chip films.
Furthermore, in the chip on film, part of the bonding wires are second bonding wires, a second bonding portion of each second bonding wire extends beyond the cutting line and is electrically connected with a second test terminal, and at least one first bonding wire is arranged between every two adjacent second bonding wires at intervals.
Based on the same inventive concept, an embodiment of the present application further provides a display device, including:
a display panel;
a printed circuit board;
the chip on film is electrically connected with the display panel and the printed circuit board respectively.
The application provides a chip on film, coiled material and display device has following beneficial effect:
in the embodiment of the invention, the test terminal electrically connected with at least part of the binding wires is arranged in the cutting line, so that the test terminal is kept on the chip on film and is not cut, and the condition that the part of the binding wires are cut because of being connected with the test terminal is avoided.
Specifically, when a part of the binding wires is the first binding wires, the other part of the binding wires is the second binding wires, the second binding wires extend out of the first cutting wires and are electrically connected with the second test terminals, and the first cutting wires are cutting wires for cutting to form the first edges. On one hand, as the certain interval is formed between the second binding part of the first binding wire and the second test terminal, the line distance between the second binding wires at the cutting position can be increased by utilizing the interval, namely, the proportion of the line width and the line distance of the binding wires at the cutting position is reduced, even if metal scraps are left at the cutting position in the cutting process, the possibility that the metal scraps fill gaps between the second binding wires can be reduced, and further, the risk that the metal scraps are contacted with the second binding wires at the cutting position is reduced; on the other hand, part of the first binding wires are located within the first cutting line, so that the part of the first binding wires cannot be cut during cutting, metal scraps generated by cutting the metal wires are reduced, and the risk of short circuit of the binding wires caused by the metal scraps is reduced to a certain extent.
When binding the line and walking the line for first binding, whole test terminal has all moved within the first cutting line, all bind the second binding portion of walking the line and the first cutting line between all have certain interval, and die-cut process no longer runs through the metal and walks the line, only need to the flexible substrate of flexible line board cut can, therefore can not have the metal piece again and drop, has avoided the metal to walk the line and has leaded to binding the risk of circuit short circuit.
Therefore, by adjusting the setting position of the test terminal and providing a gap between the second binding portion of the first binding wire and the first edge, the chip on film provided by the embodiment of the invention can not only increase the line distance between the second binding wires penetrating through the first cutting wire by using the first binding wire, thereby reducing the ratio of the line width and the line distance of the second binding wires at the cutting position and reducing the risk of short circuit between the second binding wires, but also can prevent the first binding wires from being cut in the punching process by using the gap between the first binding wires and the first edge, thereby reducing or even avoiding the generation of metal chips. Therefore, the embodiment of the invention can effectively reduce the risk of short circuit of the binding wires caused by metal chips, thereby avoiding the problems of poor display and the like.
In addition, the embodiment of the invention only needs to adjust the etching patterns of the binding wires and the test terminals to enable part of the test terminals to be positioned within the first cutting line, compared with an improved mode that the binding wires adopt a double-layer design, the process difficulty is greatly reduced, and the manufacturing cost is effectively reduced.
Drawings
FIG. 1 is a schematic diagram of metal filings remaining in the prior art;
fig. 2 is a schematic structural diagram of a roll for forming a flip chip film according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a chip on film according to an embodiment of the invention;
fig. 4 is another schematic structural diagram of a chip on film according to an embodiment of the invention;
fig. 5 is a schematic diagram illustrating a cut of a roll when a portion of the bonding wires provided by the embodiment of the invention are first bonding wires;
fig. 6 is a schematic structural diagram of a chip on film according to another embodiment of the present invention;
fig. 7 is a schematic diagram illustrating the cutting of a roll when all of the bonding wires provided by the embodiment of the invention are first bonding wires;
fig. 8 is a schematic structural diagram of a chip on film according to an embodiment of the invention;
fig. 9 is a schematic diagram illustrating an arrangement of a first test terminal according to an embodiment of the present invention;
fig. 10 is a schematic diagram of a line width of a bonding wire according to an embodiment of the invention;
FIG. 11 is a schematic structural view of a roll of material provided by an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a display device when the flip chip film is not bent according to an embodiment of the invention;
fig. 13 is a schematic structural diagram of a display device when the flip chip film is bent according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
In combination with the content described in the background art, the flip chip film is manufactured in a form of a coil material, as shown in fig. 2, fig. 2 is a schematic structural diagram of the coil material for forming the flip chip film according to the embodiment of the present invention, the coil material includes a flexible circuit board substrate 400, a plurality of driving chips 500 are packaged on the flexible circuit board substrate 400, and the flexible circuit board substrate 400 is cut along a cutting line 600 by using a die-cutting knife to form a plurality of independent flip chip films 700.
In order to realize signal transmission, a plurality of binding wires 800 are disposed on the flexible printed circuit board substrate 400, and one end of each binding wire 800 is electrically connected to a pin of the driver chip 500. Before the coil material is cut, the binding condition between the driving chip 500 and the flexible circuit board substrate 400 is usually detected to determine whether the driving chip 500 can work normally, so as to avoid the waste of module cost caused by binding the failed flip chip film 700 to the display panel subsequently. Therefore, the other end of the bonding trace 800 generally extends to the outside of the cutting line 600 to be electrically connected to the test terminal 900, the test terminal 900 is used for externally connecting a test signal to test the driver chip 500, after the test is completed, the test terminal 900 is used as a useless terminal and is cut along with the cutting of the coiled material, and at this time, the end of the bonding trace 800 at the cutting position is used for being subsequently bonded with the pins of the display panel or the printed circuit board.
In order to better bind with a narrow-frame display panel or a printed circuit board with a smaller size, the wire distance between the binding wires 800 is small, and the arrangement is dense, so that a short circuit between the binding wires 800 is easily caused if metal chips remain at a cutting position in a cutting process.
In order to solve the above problem, an embodiment of the present invention provides an implementation manner, as shown in fig. 3, fig. 3 is a schematic structural diagram of a chip on film provided in the embodiment of the present invention, a bonding trace 1100 on a flexible circuit board substrate 1000 adopts a double-layer design, the bonding trace 1100 includes a first bonding trace 1200 and a second bonding trace 1300, the first bonding trace 1200 is disposed on a first surface 1400 of the flexible circuit board substrate 1000, an upper trace 1500 in the second bonding trace 1300 is disposed on the first surface 1400 of the flexible circuit board substrate 1000, a lower trace 1600 in the second bonding trace 1300 is disposed on a second surface 1700 of the flexible circuit board substrate 1000, and an end of the upper trace 1500 is located within a cutting line 1800. By adopting the design mode that the double-layer binding wires are alternately arranged, the risk of short circuit of the binding wires caused by metal chips can be reduced, but the manufacturing process of the double-layer binding wire design is very complicated, and the manufacturing cost of the chip on film can be increased.
Therefore, the embodiment of the present invention provides another implementation manner, in which the flip chip film in the implementation manner is applied to a display module, such as a liquid crystal display panel or an organic light emitting diode display module, a touch module, a camera module, and the like, which need to be packaged and interconnected, and is particularly suitable for being bound with a module connected with a narrow frame with a small size.
As shown in fig. 4, fig. 4 is another schematic structural diagram of a chip on film according to an embodiment of the present invention, the chip on film includes a flexible circuit board 101 and a driver chip 102 located on the flexible circuit board 101, a bonding trace 103 is disposed on the flexible circuit board 101, the bonding trace 103 includes a first bonding portion 104 and a second bonding portion 105, the first bonding portion 104 is bonded to a pin of the driver chip 102, and the second bonding portion 105 extends to a bonding area 106 of the flexible circuit board 101 for bonding to a pin of a display panel or a printed circuit board.
The embodiment of the present invention will be described by taking the second binding unit 105 and the display panel as an example. When the flip chip is bonded to the printed circuit board and the display panel, the driving chip 102 processes the image data signal provided by the printed circuit board, and transmits the processed signal to the pins of the display panel through the bonding wires 103, so as to provide a driving signal for each circuit element in the display panel and drive the display panel to normally display an image.
At least part of the bonding wires 103 are first bonding wires 1031, first test terminals 107 for detecting the bonding condition of the driver chip 102 are arranged in series in the first bonding wires 1031, a gap is formed between a second bonding portion 105 and a first edge 108 of the first bonding wires 1031, and the first edge 108 is an edge formed by cutting the flexible circuit board 101 in the roll material.
It should be noted that, in combination with the analysis of the dicing process of the flip chip, the independent flip chip is formed by the coil material being diced along the dicing line, and therefore, each edge of the flexible printed circuit board 101 is an edge generated by dicing along the dicing line, that is, an interval is provided between the second binding portion 5 of the first binding trace 1031 and the first edge 9, and when the independent flip chip is corresponding to the coil material, an interval is provided between the second binding portion 5 of the first binding trace 1031 and the dicing line of the coil material.
Referring to fig. 2 again, the test terminals 900 electrically connected to the bonding wires 800 are all disposed outside the cutting line 600 of the coiled material, and therefore, all the bonding wires 800 need to penetrate through the cutting line 600, which results in the dense arrangement of the bonding wires 800 at the cutting position and is easy to generate short circuit under the influence of metal filings. In the embodiment of the invention, the test terminal electrically connected with at least part of the binding wires is arranged in the cutting line and is kept on the chip on film without being cut, so that the part of the binding wires can be electrically connected with the test terminal without penetrating through the cutting line, and the condition that the part of the binding wires is cut due to the connection of the test terminal is avoided.
The following description will be made with reference to two cases, namely, a case where a part of the bound traces are the first bound traces and a case where all the bound traces are the first bound traces:
in the first case: referring to fig. 4, as shown in fig. 5, fig. 5 is a schematic diagram illustrating a cutting of a roll material when a part of the bonded trace 103 is a first bonded trace 1031, when the part of the bonded trace 103 is the first bonded trace 1031, the remaining part of the bonded trace 103 is a second bonded trace 1032, a second test terminal 110 corresponding to the second bonded trace 1032 is located outside a first cutting line 111, and the second bonded trace 1032 needs to extend to the outside of the first cutting line 111 to be electrically connected to the second test terminal 110, where the first cutting line 111 is a cutting line for forming a first edge 108 by cutting. On one hand, since the second binding portion 105 of the first binding wire 1031 has a certain interval with the second test terminal 110, the interval between the second binding wires 1032 at the cutting position can be increased by using the interval, that is, the ratio of the line width and the line distance of the binding wires 103 at the cutting position is reduced, even if metal filings are left at the cutting position in the cutting process, the possibility that the gaps between the binding wires 103 are filled with the metal filings can be reduced, and the risk that the metal filings are contacted with the binding wires 103 at the cutting position is reduced; on the other hand, a part of the first bonding wire 1031 is located within the first cutting line 111, so that the part of the first bonding wire 1031 is not cut during cutting, metal chips generated by cutting the metal wire are reduced, and the risk of short circuit of the bonding wire 103 caused by the metal chips is further reduced to a certain extent.
In the second case: as shown in fig. 6 and 7, fig. 6 is a schematic structural diagram of a chip on film according to an embodiment of the present invention, fig. 7 is a schematic diagram of a coil material cutting process when all the bonding wires 203 are the first bonding wires 2031 according to an embodiment of the present invention, and when all the bonding wires 203 are the first bonding wires 2031, the first test terminals 207 electrically connected to all the bonding wires 203 are all moved within the first cutting wires 211, so that a certain interval is formed between the second bonding portions 205 of all the bonding wires 203 and the first cutting wires 211, and the flexible substrate of the flexible circuit board 201 is only cut during the die cutting process without penetrating through the metal wires, so that no metal debris falls off, and the risk of short circuit caused by the metal wires is avoided.
It should be noted that fig. 6 and fig. 7 illustrate that the first test terminals 207 connected in series on the adjacent first bonding wires 2031 are arranged in a staggered manner, and this arrangement manner can reduce the overall width occupied by all the first test terminals 207 in the extending direction of the first edge 208 (the first cut line 211).
Therefore, by adjusting the position of the test terminal and providing a gap between the second binding portion of the first binding wire and the first edge, the chip on film provided by the embodiment of the invention can not only increase the line distance between the second binding wires at the cutting position by using the first binding wire and reduce the risk of short circuit of the second binding wires, but also prevent the first binding wire from being cut in the punching process by using the gap between the first binding wire and the first edge, thereby reducing or even avoiding the generation of metal chips. Therefore, the embodiment of the invention can effectively reduce the risk of short circuit of the binding wires caused by metal chips, thereby avoiding the problems of poor display and the like.
In addition, the embodiment of the invention only needs to adjust the etching patterns of the binding wires and the test terminals to enable part of the test terminals to be positioned within the first cutting line, compared with an improved mode of double-layer design of the binding wires, the process difficulty is greatly reduced, and the manufacturing cost is effectively reduced.
In an embodiment, please refer to fig. 4 again, when only a part of the bonding wires 103 is the first bonding wires 1031, the part of the bonding wires 103 is the second bonding wires 1032, the second bonding portions 105 of the second bonding wires 1032 extend to the first edges 108, corresponding to the structure of the roll material shown in fig. 5, the second test terminals 110 electrically connected to the part of the second bonding wires 1032 are located outside the first cutting lines 111 of the roll material, and are cut off together with the cutting of the roll material and are not retained on the chip on film, at least one first bonding wire 1031 is spaced between two adjacent second bonding wires 1032, so that the line distance between any two adjacent second bonding wires 1032 at the cutting position can be increased by using the first bonding wires 1031, and the risk of short circuit of the bonding wires 103 is further reduced.
Further, as shown in fig. 8, fig. 8 is a schematic structural diagram of a chip on film according to an embodiment of the present invention, in which the second bonding wires 3032 and the first bonding wires 3031 are alternately arranged. On one hand, in the embodiment of the present invention, the second binding wires 3032 and the first binding wires 3031 are alternately arranged, so that the ratio of the line width to the line distance of the binding wires 303 at the position of the cutting line can be adjusted to approximately 1:3, the line distance between the binding wires 303 is effectively increased, and even if metal chips remain at the cutting position, the metal chips are difficult to contact with the binding wires 303; on the other hand, this arrangement only needs to move half of the test terminals to the inside of the cutting lines, thereby avoiding the excessive space occupied by the test terminals on the flexible wiring board 301.
In one embodiment, referring to fig. 8 again, the ratio of the number of the first bonding wires 3031 to the number of the bonding wires 303 is a, where a satisfies: a is more than or equal to 0.25 and less than or equal to 1. As can be seen from the above analysis, the first binding wire 3031 not only can increase the wire distance between the second binding wires 3032 at the cutting position, but also can reduce the generation of metal chips based on the interval between itself and the first edge 308, so that the minimum value of a is set to 0.25, and it can be ensured that at least one fourth of the binding wires 303 are used to improve the short circuit problem of the binding wires, thereby avoiding the occurrence of short circuit between the binding wires 303 to a greater extent.
Further, while the short circuit of the bonding wires 303 is effectively avoided, in order to further avoid the first test terminals 307 arranged on the flexible circuit board 301 being too many, a may be set to 0.5, that is, only half of the bonding wires 303 are the first bonding wires 3031. It should be noted that when a is equal to 0.5, in order to ensure that the line distance between every two adjacent second routing binding lines 3032 at the cutting position can be increased, the second routing binding lines 3032 and the first routing binding lines 3031 may be arranged alternately as shown in fig. 8.
In addition, due to the influence of the cutting precision, a cutting position may be shifted, if the distance between the second binding portion 305 of the first binding trace 3031 and the first edge 308, that is, the first cutting line 311 is too close, the first binding trace 3031 may be cut during the die cutting process, which results in a dense arrangement of the metal traces at the cutting position, or, even if the first binding trace 3031 is not cut, if the distance between the second binding portion 305 of the first binding trace 3031 and the first cutting line 311 is too close, metal chips left during the cutting process may contact the first binding trace 3031. For this reason, referring to fig. 8 again, the distance d1 between the second binding portion 305 and the first edge 308 of the first wire 3031 can be greater than or equal to 100 μm, so that the second binding portion 305 of the first wire 3031 is spaced from the first cutting line 311 by more than 100 μm, thereby preventing the first wire 3031 from being too close to the cutting position.
In an implementation manner, as shown in fig. 9, fig. 9 is a schematic diagram of an arrangement of the first test terminal 407 provided in the embodiment of the present invention, the flexible printed circuit board further includes a copper exposed area 414 and a coverage area 415, and the copper exposed area 414 is located between the bonding area 406 and the coverage area 415; the portion of the bonding trace located in the copper exposed area 414 is the first lead 416, and the first test terminal 407 is connected in series to the first lead 416 of the first bonding trace 4031.
It should be noted that, in the process of manufacturing the chip on film, after the bonding wires are formed on the flexible circuit board, the wires extending in the coverage area 415 need to be covered with a protective material such as resin, so as to prevent the corrosion of the wires by water vapor, the second bonding portion 405 located in the bonding area 406 and the first lead 416 located in the copper exposure area 414 in the bonding wires are exposed, the exposed second bonding portion 405 is used for subsequent bonding with the pins of the display panel, and the exposed first lead 416 is used for implementing transition, so as to prevent the pins of the display panel from being bonded to the coverage area 415. After the subsequent display panel and the flip chip film are bonded, a layer of insulating glue is coated on the bonding area 406 and the copper exposure area 414, so as to protect the wires in the partial area.
The sizes of the bonding area 406 and the copper exposure area 414 can be set according to actual situations, for example, the length of the bonding area 406 in the direction in which the bonding area 406 points to the coverage area 415 can be set to 400 μm to 500 μm, and the length of the copper exposure area 414 in the direction in which the bonding area 406 points to the coverage area 415 can be set to be within 400 μm.
By connecting the first test terminal 407 in series to the first lead 416 of the first binding trace 4031, on one hand, it can be ensured that the first test terminal 407 is exposed and not covered by a protective material, and thus a detection signal can be normally received, and detection of the binding condition of the driver chip is achieved; on the other hand, generally, the size of the terminal is much larger than the line width of the wire, if the first testing terminal 407 is connected in series to the second binding portion 405, when the pins of the display panel are bound to the second binding portion 405, a situation that a plurality of pins of the display panel are bound to the same first testing terminal 407 may occur, and then a signal transmission error is caused, therefore, the first testing terminal 407 is connected in series to the first lead 416, and a bad influence on the binding of the first testing terminal 407 to the display panel can be avoided, thereby improving the reliability of the panel binding.
Further, referring to fig. 9 again, the distance d2 between the first test terminal 407 and the bonding region 406 may be greater than or equal to 100 μm, so as to avoid the first test terminal 407 being too close to the bonding region 406, and thus avoid the situation that the pin of the display panel is bonded to the first test terminal 407 due to a bonding error.
In one embodiment, referring to fig. 9 again, the first test terminals 407 form a plurality of terminal groups 417 arranged along a first direction, each terminal group 417 includes a plurality of first test terminals 407 arranged along a second direction, and in each terminal group 417, the plurality of first test terminals 407 are arranged in a non-aligned manner in the second direction, wherein the second direction is a direction in which the bonding region 406 points to the covering region 415, and the first direction intersects with the second direction.
Because the size of the first test terminal 407 is large, the first test terminal 407 is arranged in the above-mentioned staggered arrangement manner, and the first test terminal 407 does not occupy an excessive space in the first direction or the second direction, and the influence on the extension of the binding wire is small.
In one implementation, as shown in fig. 10, fig. 10 is a schematic line width diagram of a bonding wire according to an embodiment of the present invention, where the copper exposing region 514 includes a first copper exposing region 518 and a second copper exposing region 519 arranged in a second direction, the second direction is a direction in which the bonding region 506 points to the covering region 515, and the first test terminal 507 is located in the first copper exposing region 518; the first lead 516 includes a first sub-lead 520 located in the first copper exposing region 518 and a second sub-lead 521 located in the second copper exposing region 519, and a line width L1 of the first sub-lead 520 is smaller than a line width L2 of the second binding portion 505.
Because the first test terminal 507 occupies a part of space in the first copper exposing area 518, the line width of the first sub-lead 520 is set to be smaller, so that the line distance between the first sub-leads 520 can be increased to a certain extent, the arrangement of the first sub-leads is avoided to be too dense, and the risk of short circuit between the first sub-leads 520 caused by factors such as etching precision is avoided. Illustratively, the line width of the second binding portions 505 is 12 μm, the line pitch between the second binding portions 505 is 16 μm, and when the sizes of the first test terminals 507 in the first and second directions are 60 μm, respectively, the line width of the first sub-lead 520 may be reduced to 8 μm, and accordingly the minimum line pitch between the first sub-leads 520 is adjusted to 10 μm.
In addition, the load of the first sub-lead 520 may be increased by reducing the line width of the first sub-lead 520, and for this reason, the line width of the second sub-lead 521 may be set to be larger than that of the first sub-lead 520 to compensate for the increased load of the first sub-lead 520. However, for the first bonding wire 5031 and the second bonding wire 5032, the first sub-lead 520 in the first bonding wire 5031 is connected in series with the first test terminal 507 with a larger size, so that the increase degree of the equivalent load of the first sub-lead 520 in the first bonding wire 5031 is smaller than the increase degree of the load of the first sub-lead 520 in the second bonding wire 5032, and therefore, the line widths of the second sub-leads 521 in the first bonding wire 5031 and the second bonding wire 5032 can be designed differently, so as to compensate the first sub-lead 520 to different degrees.
Therefore, when the partially bonded trace is the second bonded trace 5032, and the second bonding portion 205 of the second bonded trace 5032 extends to the first edge 508, the line widths of the second sub-leads 521 in the first bonded trace 5031 and the second bonded trace 5032 are both greater than the line width of the first sub-lead 520, and the line width L3 of the second sub-lead 521 in the second bonded trace 5032 is greater than the line width L4 of the second sub-lead 521 in the first bonded trace 5031, so that the second sub-lead 521 in the second bonded trace 5032 performs greater load compensation on the first sub-lead 520 connected to the second sub-lead, and the equivalent loads of the first lead 516 in the first bonded trace 5031 and the second bonded trace 5032 tend to be consistent, and further the equivalent loads of the first bonded trace 5031 and the second bonded trace 5032 tend to be consistent, thereby reducing the difference in attenuation degrees of signals transmitted in different bonded traces.
Based on the same inventive concept, the embodiment of the present invention further provides a roll material, as shown in fig. 11, fig. 11 is a schematic structural diagram of the roll material provided by the embodiment of the present invention, the roll material includes a flexible circuit board substrate 1001, the flexible circuit board substrate 1001 includes a plurality of cutting lines 1002, and the cutting lines 1002 intersect to define a plurality of flip chips 1003 as described above.
Further, referring to fig. 11 again, in the chip on film 1003, a part of the bonding wires is a second bonding wire 1004, a second bonding portion 1005 of the second bonding wire 1004 extends to the outside of the cutting line 1002 to be electrically connected to the second test terminal 1006, and at least one first bonding wire 1007 is spaced between two adjacent second bonding wires 1004.
When a part of the bonding wires is the second bonding wires 1004, the second bonding portions 1005 of the second bonding wires 1004 extend beyond the cutting lines 1002, and the second test terminals 1006 electrically connected to the part of the second bonding wires 1004 are cut off along with the cutting of the flexible printed circuit board substrate 1001 and are no longer retained on the flip chip 1003. By arranging at least one first binding wire 1007 at intervals between two adjacent second binding wires 1004, the wire distance between any two adjacent second binding wires 1004 at the cutting position can be increased by using the first binding wires 1007, and the risk of short circuit of the binding wires is further reduced.
Based on the same inventive concept, an embodiment of the present invention further provides a display device, as shown in fig. 12 and fig. 13, fig. 12 is a schematic structural diagram of the display device when the flip chip is not bent, and fig. 13 is a schematic structural diagram of the display device when the flip chip is bent, the display device includes a display panel 2001, a printed circuit board 2002 and the flip chip 2003, and the flip chip 2003 is electrically connected to the display panel 2001 and the printed circuit board 2002, respectively. After the display panel 2001 and the printed circuit board 2002 are respectively bonded together with the flip-chip film 2003, the flip-chip film 2003 is bent toward the backlight side of the display panel 2001, thereby bending the printed circuit board 2002 to the backlight side of the display panel 2001. The printed circuit board 2002 may be a flexible circuit board, and the specific structure of the flip chip cover 2003 has been described in detail in the above embodiments, which is not described herein again.
The display device shown in fig. 12 and 13 may be any electronic device having a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic book, or a television.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (14)
1. A chip on film is characterized by comprising a flexible circuit board and a driving chip positioned on the flexible circuit board;
the flexible circuit board is provided with binding wires, the binding wires comprise a first binding part and a second binding part, the first binding part is bound with the pins of the driving chip, and the second binding part extends to the binding area of the flexible circuit board and is used for binding with the pins of the display panel or the printed circuit board;
at least part of the binding wires are first binding wires, first test terminals for detecting the binding condition of the driver chip are arranged in the first binding wires in series, a gap is formed between the second binding portion and a first edge of the first binding wires, and the first edge is an edge formed after the flexible circuit board is cut in the coiled material.
2. The chip on film of claim 1,
and part of the binding wires are second binding wires, the second binding parts of the second binding wires extend to the first edge, and at least one first binding wire is arranged between every two adjacent second binding wires at intervals.
3. The chip on film of claim 2,
the second bonded wires and the first bonded wires are alternately arranged.
4. The chip on film of claim 1,
the ratio of the number of the first binding wires to the number of the binding wires is A, and A is more than or equal to 0.25 and less than or equal to 1.
5. The chip on film of claim 4,
A＝0.5。
6. the chip on film of claim 1,
a distance between the second binding portion of the first binding trace and the first edge is greater than or equal to 100 μm.
7. The chip on film of claim 1,
the flexible circuit board further comprises a copper exposure area and a covering area, and the copper exposure area is positioned between the binding area and the covering area;
the part of the binding wire, which is positioned in the copper exposure area, is a first lead, and the first test terminal is connected in series with the first lead of the first binding wire.
8. The chip on film of claim 7,
the distance between the first test terminal and the bonding region is greater than or equal to 100 μm.
9. The chip on film of claim 7,
the first test terminals form a plurality of terminal groups arranged along a first direction, each terminal group comprises a plurality of first test terminals arranged along a second direction, and in each terminal group, the plurality of first test terminals are arranged in a non-aligned mode in the second direction;
the second direction is a direction in which the bonding area points to the coverage area, and the first direction intersects with the second direction.
10. The chip on film of claim 7,
the copper exposure area comprises a first copper exposure area and a second copper exposure area which are arranged in a second direction, the second direction is a direction in which the binding area points to the covering area, and the first test terminal is located in the first copper exposure area;
the first lead comprises a first sub-lead positioned in the first copper exposing area and a second sub-lead positioned in the second copper exposing area, and the line width of the first sub-lead is smaller than that of the second binding portion.
11. The chip on film of claim 10,
part of the binding wires are second binding wires, and the second binding parts of the second binding wires extend to the first edges;
the line width of the second sub-lead in the first binding wire and the second binding wire is larger than the line width of the first sub-lead, and the line width of the second sub-lead in the second binding wire is larger than the line width of the second sub-lead in the first binding wire.
12. A web of material, comprising:
a flexible wiring board substrate comprising a plurality of dicing lines and a plurality of flip-chip films according to any one of claims 1 to 11.
13. The web of claim 12,
in the chip on film, part of the bonding wires are second bonding wires, a second bonding part of each second bonding wire extends to the outside of the cutting line and is electrically connected with a second test terminal, and at least one first bonding wire is arranged between every two adjacent second bonding wires at intervals.
14. A display device, comprising:
a display panel;
a printed circuit board;
the chip on film according to any one of claims 1 to 11, wherein the chip on film is electrically connected to the display panel and the printed circuit board, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110342882.XA CN113163595A (en) | 2021-03-30 | 2021-03-30 | Chip on film, roll and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110342882.XA CN113163595A (en) | 2021-03-30 | 2021-03-30 | Chip on film, roll and display device |
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| CN113163595A true CN113163595A (en) | 2021-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110342882.XA Pending CN113163595A (en) | 2021-03-30 | 2021-03-30 | Chip on film, roll and display device |
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| CN113593758A (en) * | 2021-07-30 | 2021-11-02 | 惠科股份有限公司 | Flexible flat cable and display device |
| CN113641019A (en) * | 2021-10-14 | 2021-11-12 | 惠科股份有限公司 | Display panel, display device and display mother board |
| CN113849085A (en) * | 2021-09-27 | 2021-12-28 | Tcl华星光电技术有限公司 | Substrate and display panel |
| CN114255683A (en) * | 2021-12-21 | 2022-03-29 | 武汉华星光电技术有限公司 | Display panel |
| TWI767817B (en) * | 2021-08-09 | 2022-06-11 | 頎邦科技股份有限公司 | Double-sided flexible printed circuit board |
| CN114994991A (en) * | 2022-06-20 | 2022-09-02 | 苏州华星光电技术有限公司 | Chip on film and display device |
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Application publication date: 20210723 |