JP2007281012A - Flexible board and mounting device with the same mounted thereon - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible board which makes reliable and durable electric connection between the flexible board and a part when the flexible board is bent or warped while it is being bent or warped, and also to provide a mounting device. <P>SOLUTION: A flexible board 1 and a first connection 12 are electrically connected by the electric connection of the flexible board and the terminal 14 of the first connection 12. The fixed part of the flexible board 1 and a part 16 to be fixed of the first connection 12 are fixed by soldering or the like, between the electrically connected part of the flexible board 1 and the first connection 12 and the bent part or the warped part 8 of the flexible board 1. Thus, the flexible board 1 and the first connection 12 reduces stress to be applied to the electrically connected part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flexible substrate and a mounting device in which a flexible substrate is mounted on a component, and more particularly, to a mounting device in which a flexible substrate and a component are connected in the vicinity of a bent portion or a bent portion of the flexible substrate.

  Electronic devices that have been developed in recent years have become more complex and smaller in size, and the components arranged therein are not only limited in position and orientation, but also require mounting accuracy. In such an electronic device, in order to ensure a desired electrical characteristic and to realize a desired layout, as a means for electrically connecting parts, a metal that becomes a conductor layer inside or outside a resin film that becomes an insulating layer A flexible substrate having flexibility with a foil disposed thereon is used. For example, a flexible substrate is used in an optical transceiver module for connection between a coaxial optical transceiver having a light receiving element and a light emitting element and a mounting board on which a drive circuit is mounted (for example, Patent Document 1 and Patent Document 2). reference).

  A plan view of a conventional flexible substrate is shown in FIG. The flexible substrate 31 includes a flexible insulating layer 32, a conductor layer 33 serving as a wiring, and an electrical connection portion 34 for electrically connecting to an end part such as an optical transceiver.

  FIG. 12 shows a schematic plan view of an electronic device in which components are connected using a flexible substrate 31. In the optical transceiver module 41, the optical transceiver 42 and the mounting board 43 are connected via the flexible substrate 31. The flexible substrate 31 and the optical transceiver 42 are electrically connected by inserting the terminal 44 of the optical transceiver 42 into the electrical connection portion 34 of the flexible substrate 31. The flexible substrate 31 and the mounting board 43 are electrically connected by joining the other end of the flexible substrate 31 and the electrode of the mounting board 43. As shown in FIG. 12, the mounting surface of the optical transceiver 42 and the mounting surface of the mounting board 43 are in a positional relationship such that they are orthogonal to each other. Therefore, in the optical transceiver module 41, the flexible substrate 31 is bent or bent.

  A schematic process diagram showing an example of the mounting process of the flexible substrate 31 in the optical transceiver module 41 is shown in FIG. First, the terminal 44 of the optical transceiver 42 is electrically connected to the electrical connection portion of the flexible substrate 31, and the flexible substrate 31 is mounted on the optical transceiver 42 (FIG. 13A). Next, the other end of the flexible substrate 31 is electrically connected to the electrode 45 of the mounting board 43 (FIG. 13B). Next, from the viewpoint of FIG. 13, the optical transceiver 42 is rotated 90 ° counterclockwise to sink downward (in the direction of the arrow), and the optical transceiver 42 and the mounting board 43 are set to desired positions. (FIG. 13C).

Japanese Patent Laid-Open No. 2004-241915 JP 2005-340401 A

  As shown in FIGS. 12 and 13C, in the device on which the flexible substrate 31 is mounted, the flexible substrate 31 is bent. At this time, stress is applied to the electrical connection portions 34d and 34e of the flexible substrate 31 with the bending fulcrum 35 shown in FIG. 11 as a fulcrum. In particular, in the process illustrated in FIG. 13C, stress is applied in the direction in which the flexible substrate 31 is peeled off from the optical transceiver 42. Therefore, there is a problem that the electrical connection between the flexible substrate 31 and the optical transceiver 42 is disconnected (disconnected). The same problem occurs when the flexible board is bent using a jig or the like after mounting. Therefore, when the flexible substrate is bent or bent, or when the flexible substrate is bent or bent, a flexible substrate and a mounting device that realize a reliable and durable electrical connection between the flexible substrate and a component are provided. is needed.

  According to a first aspect of the present invention, there is provided a flexible board that electrically connects a plurality of components, the flexible insulating layer, the conductor layer disposed on the insulating layer, and the conductor layer electrically An electrical connection portion that is connected and electrically connected to the component, a bending portion or bending portion that is bent or bent at a predetermined position, and a bending portion or bending portion at the time of bending or bending. There is provided a flexible substrate including a stress reduction unit that reduces a stress applied to an electrical connection unit.

  According to a second aspect of the present invention, there is provided a mounting device including a flexible substrate and a component electrically connected to the flexible substrate, wherein the flexible substrate includes a flexible substrate from a predetermined bent portion or a bent portion of the flexible substrate. Provided is a mounting device in which a flexible substrate and a component are fixed at a portion other than the electrically connected portion so that no stress is applied to the portion where the component is electrically connected.

  In the present invention, “folding” means a state in which the flexible substrate is folded or folded so that a folding line is formed. In addition, the “flexion” refers to a state where the flexible substrate is bent or bent while being bent, that is, a state where the flexible substrate is bent or bent so that a bending line cannot be formed.

  According to the flexible substrate of the first aspect of the present invention and the mounting device of the second aspect of the present invention, when the flexible substrate is bent or bent, or when the flexible substrate is bent or bent, the flexible substrate and the component It is possible to reduce the stress applied to the electrical connection portion. This improves the reliability and durability of the electrical connection between the flexible substrate and the component.

  A flexible substrate according to a first embodiment of the present invention will be described. FIG. 1 shows a schematic plan view of a flexible substrate according to the first embodiment of the present invention. The flexible substrate 1 is for electrically connecting two components, for example, an optical transceiver and a mounting board. Here, the two components connected to the flexible substrate 1 are referred to as “first connection component” and “second connection component”. The flexible substrate 1 includes an insulating layer 2 having flexibility, a conductor layer 3 formed inside and / or outside of the insulating layer 2, and an electrical connection portion for connecting to a first connection component such as an optical transceiver. 4 and a bent portion or a bent portion 8 to be bent or bent at a predetermined position. The electrical connection portion 4 shown in FIG. 1 is a hole (through hole) into which a protruding terminal (lead) of the first connection component is inserted, and electrically connects the first connection component and the second connection component. It becomes an electrical path.

  The flexible substrate 1 of the present invention further includes a stress reduction unit that reduces the stress applied to the electrical connection portion 4 from the bent portion or the bent portion 8 at the time of bending or bending. The stress reduction unit includes, for example, a fixing unit 5 for fixing the flexible substrate 1 to the first connection component. The fixed portion 5 is formed between the predetermined bent portion or the bent portion 8 (the second connecting component side end portion 7) and the electric connecting portions 4d, 4e and the predetermined bent portion or the bent portion 8. Has been. The fixing portion 5 is not electrically connected to the conductor layer 3 and the electrical connection portion 4. That is, the fixing portion 5 does not constitute an electrical path that electrically connects the first connection component and the second connection component. Therefore, the fixing portion 5 is preferably formed at a position where the conductor layer 3 or the like is not formed, for example, between the conductor layer 3 and the conductor layer 3. The fixing part 5 may be in any form as long as the flexible substrate 1 can be fixed to the first connection component. For example, in the form shown in FIG. 1, the fixing portion 5 can be fixed by soldering by inserting a protrusion for fixing the first connecting component as a hole similar to the electric connecting portion 4.

  The usage pattern of the flexible substrate 1 according to the present invention and the operation and effect thereof will be described using a mounting device according to a second embodiment of the present invention as an example.

  Next, a mounting device according to the second embodiment of the present invention will be described. Here, the “mounting device” in the present invention refers to a device in which the flexible substrate of the present invention and components such as an optical transceiver are mounted (connected). FIG. 2 is a schematic plan view of a mounting device according to the second embodiment of the present invention. The mounting device 11 includes the flexible substrate 1 according to the first embodiment of the present invention shown in FIG. 1, and a first connection component 12 and a second connection component 13 that are electrically connected to the flexible substrate 1. In the form shown in FIG. 2, an optical transceiver of the optical transceiver module is shown as the first connection component 12, and a mounting boat is shown as the second connection component 13.

  The first connection component 12 includes a terminal portion 14 that is inserted into the electrical connection portion 4 of the flexible substrate 1 and a fixed portion 16 that is connected to the fixing portion of the flexible substrate 1. The fixed portion 16 prevents the stress from being applied to the connecting portion between the electrical connecting portion 4 and the terminal portion 14 by being fixed to the flexible substrate 1. The fixed portion 16 is formed between the terminal portion 14 and the bent portion or the bent portion 8 of the flexible substrate 1. In the form shown in FIG. 2, the fixed portion 16 is a protrusion that is inserted into the fixing portion 5 of the flexible substrate 1 because the fixing portion 5 of the flexible substrate 1 is a hole. The electrical connection portion 4 of the flexible substrate 1 and the terminal portion 14 of the first connection component 12, and the fixing portion 5 of the flexible substrate 1 and the protrusion 16 of the first connection component 12 are connected by solder or the like.

  The contact surface between the flexible substrate 1 and the first connection component 12 and the contact surface between the flexible substrate 1 and the second connection component 13 are in a positional relationship such that they are orthogonal to each other. Therefore, the flexible substrate 1 is bent at the bending portion 8. As a result, stress is applied to the connecting portion between the flexible substrate 1 and the first connecting component 12 with the bending fulcrum 9 as a fulcrum. In the present invention, since the fixing portion 5 (projection portion 16) is formed between the electrical connection portions 4d and 4e (terminal portion 14) and the bending portion 8, the stress is applied to the electrical connection portion 4 and the stress. It is not on the connection part with the terminal part 14 but on the connection part between the fixing part 5 and the projection part 16. Thereby, it is possible to prevent the electrical path between the flexible substrate 1 and the first connection component 12 from being disconnected. In addition, the deterioration of the connection strength between the electrical connection portion 4 and the terminal portion 14 is also suppressed. Furthermore, according to the embodiment shown in FIGS. 1 and 2, even if the solder connection between the fixing portion 5 and the protruding portion 16 is released due to the stress, the hole of the fixing portion 5 is caught by the protruding portion 16 and the electric connecting portion It can also be expected that no stress is applied to the connecting portion between 4 and the terminal portion 14. Therefore, according to the flexible substrate according to the first embodiment of the present invention and the mounting device according to the second embodiment, the reliability of electrical connection between the flexible substrate 1 and the first connection component 12 is improved.

  In the mounting apparatus 11 shown in FIG. 2, the flexible substrate 1 is bent. However, in the mounting device 11 according to the second embodiment, the flexible substrate 1 can be bent at the bent portion (folded portion) 8 or the bent fulcrum (folded fulcrum) 9.

  Next, a flexible substrate according to a third embodiment of the present invention will be described. FIG. 3 shows a schematic plan view of a flexible substrate according to the third embodiment of the present invention. The flexible substrate 1 according to the first embodiment shown in FIG. 1 has one fixing portion 5. On the other hand, the flexible substrate 1 according to the third embodiment shown in FIG. 3 has a plurality of fixing portions 5. In the form shown in FIG. 3, the flexible substrate 1 includes three fixing portions 5 a to 5 b between the electrical connection portions 4 d and 4 e closest to the second connection component side end portion 7 and the bent portions or the bent portions 8. 5c.

  Next, a mounting device according to a fourth embodiment of the present invention will be described. The mounting device (not shown) according to the fourth embodiment is obtained by connecting the flexible substrate 1 according to the third embodiment and the first connection component in the same manner as the mounting device according to the second embodiment shown in FIG. It is. The mounting device according to the third embodiment is different from the mounting device according to the second embodiment in that there are a plurality of first connection parts (the same number as the number of fixing portions 5), for example, three fixed portions, for example, protrusions. It is to have. The plurality of fixed parts of the first connection component are formed at positions corresponding to the plurality of fixing parts 5 of the flexible substrate 1 according to the third embodiment.

  According to the flexible substrate according to the third embodiment and the mounting device according to the fourth embodiment, stress when the flexible substrate 1 is bent or bent can be distributed to the plurality of fixing portions 5. Thereby, while improving the connection reliability of the flexible substrate 1 and a 1st connection component, deterioration of the fixation (connection) intensity | strength of the fixing | fixed part 5 can be suppressed.

  Next, a flexible substrate according to a fifth embodiment of the invention will be described. 4 to 6 are schematic views of a flexible substrate according to the fifth embodiment of the present invention. The flexible substrate 1 according to the fifth embodiment includes, in addition to the fixed portion 5, a load acting portion 10 that concentrates a bending load (makes it easy to bend) to the bent portion 8 when the flexible substrate 1 is bent. For example, the load application portion 10a in the form shown in FIG. 4 is a fold mark or a crease formed by bending in advance at the fold portion 8 adjacent to the fixed portion 5 before mounting on the first connection component. FIG. 5 is a side view of the flexible substrate 1. 5 is a thin portion in which the thickness of the bent portion 8 of the flexible substrate 1 is reduced. And the load action part 10c in the form shown in FIG. 6 is the concave corner | angular part (cut | notch part) formed in the both ends of the bending part 8 of the flexible substrate 1 so that it might mutually oppose.

  Next, a mounting device according to a sixth embodiment of the present invention will be described. In FIG. 7, the schematic plan view of the mounting apparatus which concerns on 6th Embodiment of this invention is shown. The mounting device according to the sixth embodiment is obtained by connecting the flexible substrate 1 according to the fifth embodiment and the first connection component 12. The flexible substrate 1 is bent and mounted near the fixed portion 5 (fixed portion 16).

  According to the flexible substrate according to the fifth embodiment and the mounting device according to the sixth embodiment, the flexible substrate 1 is bent even before or after being mounted on the first connection component 12 by the load acting unit 10. It is easily bent at the part 8. Moreover, the stress which acts on the connection part of the fixing | fixed part 5 and the to-be-fixed part 16 can be reduced. Thereby, while improving the connection reliability of the flexible substrate 1 and the 1st connection component 12, deterioration of the fixation (connection) intensity | strength of the fixing | fixed part 5 can be suppressed.

  Next, a flexible substrate according to a seventh embodiment of the present invention will be described. In the flexible substrate according to the first and third embodiments, the fixing portion 5 is formed on the contact surface between the flexible substrate 1 and the first connection component 12, but in the flexible substrate according to the seventh embodiment, The fixing portion is formed in a portion in contact with the side surface of the first connection component that intersects the contact surface of the flexible substrate and the first connection component, and / or in the vicinity thereof. The fixing portion may be a point-like fixing portion as in the flexible substrate according to the first embodiment, or a linear fixing portion along the edge of the side surface in the vicinity of the side surface and / or in the vicinity thereof. . For example, the fixing portion may be a through-hole into which the protruding portion is inserted as in the flexible substrate according to the first embodiment, or may be a metal layer for soldering. In the case of a spot-like fixing portion, a plurality of fixing portions can be provided in the same manner as the flexible substrate according to the third embodiment.

  Next, a mounting device according to an eighth embodiment of the present invention will be described. 8 and 9 are schematic plan views of the mounting equipment according to the eighth embodiment of the present invention. The mounting device according to the eighth embodiment is obtained by connecting the flexible substrate according to the seventh embodiment and the first connection component. In the mounting apparatus according to the second, fourth, and sixth embodiments, the fixed portion between the flexible substrate 1 and the first connection component 12 is formed on the contact surface between the flexible substrate 1 surface and the first connection component 12 surface. Has been. In the mounting device according to the eighth embodiment, the fixing portion 5 of the flexible substrate 1 and the fixed portion 16 of the first connection component 12 are not formed on the contact surface, and are flexible on the surface intersecting the contact surface. The substrate 1 and the first connection component 12 are joined with a fixing agent 17. For example, in the form shown in FIGS. 8 and 9, the side surface of the first connection component 12 that intersects the contact surface between the flexible substrate 1 and the first connection component 12 and the flexible substrate 1 are joined by the fixing agent 17. . That is, the fixing portion 5 of the flexible substrate 1 is formed at a portion in contact with the side surface, and the fixed portion 16 of the first connection component 12 is formed on the side surface in contact with the flexible substrate 1. This portion is a portion where the flexible substrate 1 is most separated (stripped) from the first connection component 12 on the contact surface when the flexible substrate 1 is bent or bent. Therefore, by fixing this portion, the stress applied to the electrical connection portion 4 and the terminal portion 14 can be reduced.

  Although the flexible substrate 1 shown in FIG. 8 is bent, the flexible substrate 1 may be bent before or after connection to the first connection component 12. On the other hand, the flexible substrate 1 shown in FIG. 9 is bent, and the contact surface is joined with the fixing agent 17 after the step of FIG. 13 (a) or FIG. 13 (b). Then, it is preferable to bend the flexible substrate 1 as shown in FIG.

  Any fixing agent 17 can be used as long as it can join the fixing portion 5 of the flexible substrate 1 and the fixed portion 16 of the first connection component 12. For example, as the fixing agent 17, solder, an adhesive, a resin, or the like can be used. Moreover, when the fixing | fixed part 5 of the flexible substrate 1 is a through-hole, the to-be-fixed part 16 may be a projection part inserted in a through-hole like the mounting apparatus which concerns on 2nd Embodiment.

  The fixing portion 5 and the fixed portion 16 according to the eighth embodiment are further provided on the contact surface between the flexible substrate 1 and the first connection component 12 as shown in the second, fourth, and sixth embodiments. 5 and the fixed portion 16 may be combined. Thereby, the flexible substrate 1 and the 1st connection component 12 can be fixed in several places.

  Moreover, in the form shown in FIG. 8, the load action part shown in 6th Embodiment can also be combined. This not only reduces the stress applied to the connection surface, but also facilitates the bonding with the fixing agent 17.

  According to the mounting device according to the eighth embodiment, the contact surface between the flexible substrate 1 and the first connection component 12 can be prevented from being separated (peeled), and therefore, between the flexible substrate 1 and the first connection component 12. The reliability of electrical connection is improved.

  Next, a flexible substrate according to a ninth embodiment of the present invention and a mounting device according to the tenth embodiment will be described. FIG. 10 is a schematic plan view of a mounting device according to the tenth embodiment of the present invention. In the form shown in FIG. 10, the flexible substrate 1 and the first connection component 12 are fixed via a fixing agent 17 on the contact surface. That is, the fixing portion 5 of the flexible substrate 1 is formed on the contact surface with the first connection component 12, and the fixed portion 16 of the first connection component 12 is formed on the contact surface with the flexible substrate 1. The fixed portion 5 and the fixed portion 16 are preferably formed on the entire contact surface between the flexible substrate 1 and the first connection component 12 (excluding the connection portion between the electrical connection portion 4 and the terminal portion 14). It is preferable to form it between the connection part of the electrical connection part 4 and the terminal part 14, and the bending part thru | or bending part 8 (or bending fulcrum thru | or bending fulcrum 9). As the fixing agent 17, for example, an adhesive, a resin, or the like can be used. In the form shown in FIG. 10, the flexible substrate 1 is bent at the bending portion 8, but it is also possible to form the bending portion 8 at the bending fulcrum or the bending fulcrum 9.

  According to the mounting device according to the tenth embodiment, the contact surface between the flexible substrate 1 and the first connection component 12 can be prevented from being separated (peeled), and therefore, between the flexible substrate 1 and the first connection component 12. The reliability of electrical connection is improved.

  The flexible substrate according to the first, third, fifth, seventh and ninth embodiments may have a single layer structure having one insulating layer and one conductive layer, or a multilayer structure in which a plurality of insulating layers or conductive layers are stacked. It may be. Further, the flexible substrate of the present invention may have a form having a plurality of features of each embodiment.

  The mounting device according to the present invention may have a plurality of features of the second, fourth, sixth, eighth, and tenth embodiments.

  Needless to say, the flexible substrate and the mounting device of the present invention are not limited to the above-described embodiments, and various changes, modifications, improvements and the like can be included within the scope of the present invention.

  In the said embodiment, the optical transceiver which has a light receiving element and a light emitting element as a 1st connection component connected with a flexible substrate, and the mounting board which has a circuit as a 2nd connection component was illustrated. However, the components connected to the flexible substrate are not limited to the optical transceiver and the mounting board, and any components that can be connected to the flexible substrate can be applied.

1 is a schematic plan view of a flexible substrate according to a first embodiment of the present invention. The schematic plan view of the mounting apparatus which concerns on 2nd Embodiment of this invention. The schematic plan view of the flexible substrate which concerns on 3rd Embodiment of this invention. The schematic plan view of the flexible substrate which concerns on 5th Embodiment of this invention. The schematic side view of the flexible substrate which concerns on 5th Embodiment of this invention. The schematic plan view of the flexible substrate which concerns on 5th Embodiment of this invention. The schematic plan view of the mounting apparatus which concerns on 6th Embodiment of this invention. The schematic plan view of the mounting apparatus which concerns on 8th Embodiment of this invention. The schematic plan view of the mounting apparatus which concerns on 8th Embodiment of this invention. The schematic plan view of the mounting apparatus which concerns on 10th Embodiment of this invention. The schematic plan view of the conventional flexible substrate. The schematic plan view of the electronic device which connected between components using the flexible substrate shown in FIG. The schematic process drawing which shows an example of the mounting process of the flexible substrate in an optical transmission / reception module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flexible substrate 2 Insulating layer 3 Conductor layer 4 Electrical connection part 5 Fixed part 6 1st connection component side edge part 7 2nd connection component side edge part 8 Bending part thru | or bending part 9 Bending fulcrum thru | or bending fulcrum 10 Load Action unit 11 Mounting device 12 First connection component (optical transceiver)
13 Second connection component (mounting board)
14 Terminal portion 15 Electrode portion 16 Fixed portion 17 Fixing agent 31 Flexible substrate 32 Insulating layer 33 Conductor layer 34 Electrical connection portion 35 Bending fulcrum 41 Optical transceiver module 42 Optical transceiver 43 Mounting board 44 Terminal 45 Electrode

Claims (14)

A flexible board that electrically connects a plurality of components,
A flexible insulating layer;
A conductor layer disposed on the insulating layer;
An electrical connection electrically connected to the conductor layer and electrically connected to the component;
A bent portion or a bent portion to be bent or bent at a predetermined position; and
A flexible substrate comprising: a stress reduction unit that reduces stress applied from the bent part or the bent part to the electrical connection part during bending or bending.   The flexible substrate according to claim 1, wherein the stress reduction part includes a fixing part that is formed between the bent part or the bending part and the electrical connection part, and is fixed to the component. .   The said stress reduction part is formed in the part which contact | connects the side surface of the said part which cross | intersects the contact surface with the said part, and / or its vicinity, The fixing | fixed part for fixing to the said part is provided. The flexible substrate as described in 1.   The flexible substrate according to claim 2, wherein the fixing portion is a through hole.   The flexible substrate according to any one of claims 2 to 4, wherein the fixing portion is not electrically connected to the conductor layer and the electrical connection portion.   The flexible substrate according to claim 1, further comprising a load acting portion that concentrates a bending load on the bent portion. A mounting device comprising a flexible substrate and a component electrically connected to the flexible substrate,
The flexible substrate other than the electrically connected portion so that no stress is applied to a portion where the flexible substrate and the component are electrically connected from a predetermined bent portion or bent portion of the flexible substrate. And the component are fixed.   The flexible substrate and the component are fixed between a portion where the flexible substrate and the component are electrically connected and the predetermined bent portion or the bent portion of the flexible substrate. The mounting device according to claim 7.   The mounting apparatus according to claim 7, wherein the flexible substrate and the component are fixed on a side surface of the component that intersects a contact surface between the flexible substrate and the component. In the portion where the flexible substrate and the component are fixed,
The mounting apparatus according to claim 7, wherein the flexible substrate is soldered to the component. In the portion where the flexible substrate and the component are fixed,
The mounting device according to any one of claims 7 to 9, wherein a protruding portion of the component is inserted into a through hole of the flexible substrate.   The mounting device according to any one of claims 7 to 11, wherein a portion where the flexible substrate and the component are fixed is fixed with an adhesive, resin, or solder.   The mounting portion according to any one of claims 7 to 12, wherein a portion where the flexible substrate and the component are fixed does not form an electrical path between the flexible substrate and the component. machine. The mounting device according to any one of claims 7 to 13, wherein the flexible substrate has a load acting portion that concentrates a bending load on the predetermined bent portion.

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