CN103337490A - Chip on film tape and chip on film structure - Google Patents
Chip on film tape and chip on film structure Download PDFInfo
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- CN103337490A CN103337490A CN2013102323845A CN201310232384A CN103337490A CN 103337490 A CN103337490 A CN 103337490A CN 2013102323845 A CN2013102323845 A CN 2013102323845A CN 201310232384 A CN201310232384 A CN 201310232384A CN 103337490 A CN103337490 A CN 103337490A
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Abstract
The invention discloses a chip on film tape and a chip on film structure. The chip on film tape comprises a base material and a plurality of chip on circuit structures, wherein the base material comprises a plurality of unit areas, and all the unit areas are provided with circuit areas and cutting areas surrounding the circuit areas. Each chip on circuit structure is arranged on one of the unit areas, and comprises a drive circuit and a plurality of first bonding pads, wherein the drive circuits are arranged on the circuit areas of the base material, the first bonding pads pass through and extend out of the cutting areas from the interiors of the circuit areas, the first bonding pads are arranged at intervals approximately in one arrangement direction, and are electrically connected with the drive circuits, and each bonding pad is provided with at least one first opening arranged in the corresponding cutting area.
Description
Technical field
The invention relates to a kind of membrane of flip chip structure of covering brilliant film webs and being applicable to display.
Background technology
LCD has become the main flow of monitor market at present.Display panels wherein is to transmit signal by external driving chip, and then the arrangement of liquid crystal on the control panel, to reach the purpose that image shows.
Type of drive with display floater, tradition is two flexible circuit boards that individual packages had data-driven (data driver) chip and turntable driving (scan driver) chip, with the automatic juncture of coil type (Tape Automated Bonding; TAB) be connected with data wire and the scan line of display floater respectively, to drive the pel array of display floater.But along with the characteristic demand of display floater improves, and considering on the cost, developed at present directly will drive chip and be attached to (chip on glass on the face glass; COG) or be attached at flexible film (Chip On Film; COF) first-class technology.
Cover brilliant film (COF) technology and have and simplify encapsulation procedure, reduce cost and dwindle advantage such as encapsulation volume, thereby become present considerable development trend.Punching press will cut (punch) when taking off on the brilliant film webs from covering yet will be packaged with the membrane of flip chip structure that drives chip, can cut incoming line and the outlet line of metal material, cut incomplete problem and circuit takes place easily.When circuit cuts when incomplete, the phenomenon that circuit detaches (or claiming tearing) easily takes place, the part that circuit is detached is exposed to outside the flexible film.If this part bends in the follow-up applying stage, then may cause two adjacent lines roads to touch and the phenomenon that is short-circuited mutually, and then cause the signal entanglement and make the display floater picture unusual.In view of this, need the brilliant film webs of covering of a kind of improvement at present badly, circuit takes place when avoiding punching press to cut cut incomplete problem.
Summary of the invention
An aspect of of the present present invention provides a kind of brilliant film webs that covers, and cuts incomplete problem can effectively solve circuit.This covers brilliant film webs and comprises a base material and a plurality of cover crystal circuit structure.Base material comprises a plurality of cellular zones, and each cellular zone has a circuit region and and cuts the district around this circuit region.Each cover crystal circuit structure is arranged on one of them of cellular zone.Each cover crystal circuit structure comprises one drive circuit and a plurality of first connection pad.Drive circuit is arranged on the circuit region of base material.Each first connection pad extends to and cuts outside the district by cutting the district in circuit region, and first connection pad roughly is spaced along an orientation, and each first connection pad electrically connects drive circuit, and wherein each first connection pad has at least one first opening and is arranged at and cuts in the district.
According to an embodiment of the present invention, each cover crystal circuit structure also comprises many first leads and is arranged on the circuit region of base material, and each bar first lead connects one of them of drive circuit and first connection pad.
According to an embodiment of the present invention, base material comprises a plurality of driving holes and is positioned at outside the cellular zone, and adjoins the edge of base material, and arranges along a bearing of trend at the edge of base material.
According to an embodiment of the present invention, the orientation approximate vertical of the bearing of trend at edge and first connection pad.
According to an embodiment of the present invention, each first connection pad has a plurality of first openings, and first opening is roughly arranged along a bearing of trend of each first connection pad.
According to an embodiment of the present invention, each cover crystal circuit structure also comprises a plurality of second connection pads and is arranged on the base material, and cutting the district comprises one first and cuts the district and one second cut the district, lay respectively at the relative both sides of circuit region, wherein each first connection pad cuts the district by first and extends to first and cut outside the district in circuit region, each first opening is arranged at first and cuts in the district, and each second connection pad cuts the district by second and extends to second and cut outside the district in circuit region.
According to an embodiment of the present invention, each cover crystal circuit structure also comprises many second leads and is arranged on the circuit region of base material, and each bar second lead connects one of them of drive circuit and second connection pad.
According to an embodiment of the present invention, each second connection pad has at least one second opening and is arranged at second and cuts in the district.
According to an embodiment of the present invention, first opening of each first connection pad runs through first connection pad.
According to an embodiment of the present invention, each first opening is blind hole.
According to an embodiment of the present invention, first opening of each first connection pad runs through first connection pad, and base material has a through hole and aims at first opening.
According to an embodiment of the present invention, the last end out line of first opening of each first connection pad is circle, ellipse, polygon or X-shaped.
Another aspect of the present invention provides a kind of membrane of flip chip structure, and it is applicable to a display.This membrane of flip chip structure comprises a base material, one drive circuit and a plurality of first connection pad.Base material has one and covers crystalline region and a bonding land, and the bonding land is in abutting connection with the edge of base material.Drive circuit is arranged at covering on the crystalline region of base material.First connection pad electrically connects drive circuit, and is arranged on the bonding land of base material, and first connection pad roughly is spaced along an orientation, and wherein each first connection pad extends to the edge of base material, and each first connection pad has the edge that one first breach adjoins base material.
According to an embodiment of the present invention, the membrane of flip chip structure also comprises many first leads, and base material also comprises one first cabling district and is positioned at and covers between crystalline region and the bonding land, first lead extends to the bonding land by covering the crystalline region by the first cabling district, and each bar first lead connects one of them of drive circuit and first connection pad.
According to an embodiment of the present invention, the membrane of flip chip structure also comprises a plurality of second connection pads and is arranged on the base material, and the bonding land comprises one first bonding land and one second bonding land, lay respectively at the relative both sides of covering the crystalline region, wherein first connection pad is arranged on first bonding land, and second connection pad is arranged on second bonding land.
According to an embodiment of the present invention, the membrane of flip chip structure also comprises many second leads, and base material also comprises one second cabling district and is positioned at and covers between crystalline region and second bonding land, second lead extends to second bonding land by covering the crystalline region by the second cabling district, and each bar second lead connects one of them of drive circuit and second connection pad.
According to an embodiment of the present invention, first connection pad is engaged to a display floater, and second connection pad is engaged to a circuit board.
According to an embodiment of the present invention, second connection pad extends to another edge of base material, and each second connection pad has another edge that one second breach adjoins base material.
According to an embodiment of the present invention, first breach of each first connection pad runs through first connection pad.
According to an embodiment of the present invention, each first breach is blind hole.
According to an embodiment of the present invention, first breach of each first connection pad runs through first connection pad, and base material has a through hole and aims at first breach.
According to an embodiment of the present invention, each first connection pad has at least one first opening, and first breach and first opening are roughly arranged along a bearing of trend of each first connection pad.
According to an embodiment of the present invention, the last end out line of each first opening is circle, ellipse, polygon or X-shaped.
Description of drawings
Fig. 1 be illustrate according to an embodiment of the present invention cover brilliant film webs on look schematic diagram;
Fig. 2 A-Fig. 2 D illustrates according to looking schematic diagram on first opening of several embodiment of the present invention;
Fig. 3 A-Fig. 3 C is the generalized section that illustrates according to first opening and first breach of several embodiment of the present invention;
Fig. 4 be illustrate according to an embodiment of the present invention cover polycrystalline structure film on look schematic diagram;
Fig. 5 be illustrate according to an embodiment of the present invention cover polycrystalline structure film gluing display floater and circuit board on look schematic diagram;
Fig. 6 be illustrate according to another execution mode of the present invention cover brilliant film webs on look schematic diagram;
Fig. 7 be illustrate according to another execution mode of the present invention cover polycrystalline structure film on look schematic diagram.
Embodiment
Below will disclose a plurality of execution mode of the present invention with accompanying drawing, as clearly stated, the details on many practices will be explained in the following description.Yet, should be appreciated that the details on these practices does not use to limit the present invention.That is to say that in part execution mode of the present invention, the details on these practices is inessential.In addition, for the purpose of simplifying accompanying drawing, some known habitual structures and element will illustrate in the mode of simple signal in the accompanying drawings.
Fig. 1 illustrates according to looking schematic diagram on the brilliant film webs 1 of covering of an embodiment of the present invention.Cover brilliant film webs 1 and comprise a base material 10 and a plurality of cover crystal circuit structure 20.Base material 10 comprises a plurality of cellular zone Ru.Each cellular zone Ru has a circuit region Rc and and cuts district Rp, cuts district Rp around this circuit region Rc.Each cover crystal circuit structure 20 is arranged on one of them of cellular zone Ru.In other words, each cover crystal circuit structure 20 is formed on the corresponding cellular zone Ru.In order to obtain cover crystal circuit structure 20, can utilize alignment mark (not illustrating) to carry out contraposition, each edges of the upper die and lower die in the die-cut mould (not illustrating) is positioned at cuts among the district Rp, carry out punching press (punch) then, to take off cover crystal circuit structure 20.The material of above-mentioned base material 10 can be has flexual macromolecular material, as polyimides (polyimide, PI).In addition, base material 10 can also comprise a plurality of driving hole 10a and be positioned at outside the cellular zone Ru, and adjoins the edge E of base material 10.Driving hole 10a arranges in line along the bearing of trend D2 of the edge E of base material 10.For example can utilize the punching mode to form driving hole 10a.
Each cover crystal circuit structure 20 comprises one drive circuit 210 and a plurality of first connection pad 220.Drive circuit 210 is arranged on the circuit region Rc of base material 10.Drive circuit 210 can be the drive integrated circult chip.Each first connection pad 220 in circuit region Rc by cut the district Rp extend to cut the district Rp outside.Be positioned at and cut first connection pad 220 of district beyond the Rp and can be used as measurement circuit, electrically connect the reliability of drive circuits 210 to test first connection pad 220.It should be noted that each first connection pad 220 have at least one first opening 220a be arranged at cut the district Rp in.When cutting, the edge of the first opening 220a bears bigger stress, first connection pad 220 is ruptured since the edge of the first opening 220a easily, and then fracture is to the edge of first connection pad 220.Thus, can avoid first connection pad 220 to cut incomplete problem.
Do not limit quantity, the arrangement mode of the first opening 220a to reach end out line at this.In the present embodiment, as shown in Figure 1, first connection pad 220 has a plurality of first opening 220a and is positioned at and cuts district Rp, and roughly arranges along the bearing of trend D2 of each first connection pad 220.In other words, in the present embodiment, the bearing of trend D2 of first connection pad 220 is identical with the bearing of trend D2 of edge E.The last end out line of the first opening 220a is circular.In other embodiments, shown in Fig. 2 A-Fig. 2 D, the last end out line of the first opening 220a for example is but is not limited to polygon, ellipse or X-shaped.The first opening 220a with Fig. 2 A rhombus is example, and two end points P at the first opening 220a edge bear relatively large stress when cutting, and therefore first connection pad 220 begins fracture from end points P easily, and then fracture is to the relative both sides of the edge of first connection pad 220.
In order to confirm astomous connection pad and the stress distribution of connection pad when cutting with difformity opening, utilize computer-aided engineering (Computer Aided Engineering, CAE) carry out sunykatuib analysis, and the result of maximum stress value and mean stress value is put in order in table one.Above-mentioned opening refers to run through the opening of connection pad.
Table one
| ? | Imperforation | Diamond opening | Square aperture | Circular open |
| Maximum stress (MPa) | 33600 | 42950 | 36720 | 49680 |
| Mean stress (MPa) | 12800 | 24330 | 16500 | 15700 |
By table one result displayed as can be known, no matter the shape of opening why, and it is all higher than the connection pad that does not have opening to have maximum stress and mean stress that the connection pad of opening bears when cutting.Therefore under the identical situation that cuts condition, the connection pad ratio with opening is easier to fracture, and the phenomenon that can avoid circuit to be detached takes place.
Fig. 3 A-Fig. 3 C is the generalized section that illustrates according to first opening of several embodiment of the present invention.As shown in Figure 3A, the first opening 220a of first connection pad 220 runs through first connection pad 220 and exposes a part of base material 10.For example can utilize the lithography mode to form the first opening 220a.Shown in Fig. 3 B, the first opening 220a is blind hole, and it can utilize the halftoning light shield to carry out micro image etching procedure and form.Shown in Fig. 3 C, the first opening 220a of first connection pad 220 runs through first connection pad 220, and base material 10 has a through hole 10b and aims at the first opening 220a.For example can utilize the punching mode to form the first opening 220a and through hole 10b.
Please get back to Fig. 1, first connection pad 220 roughly is spaced along an orientation D1.The orientation D1 approximate vertical of the bearing of trend D2 of the edge E of base material 10 and first connection pad 220.Each first connection pad 220 electrically connects drive circuit 210.In the present embodiment, each cover crystal circuit structure 20 also comprises many first leads 230 and is arranged on the circuit region Rc of base material 10, and each bar first lead 230 connects wherein one of drive circuits 210 and first connection pad 220.Specifically, an end of first lead 230 connects drive circuit 210, and the other end connects first connection pad 220.
In addition, each cover crystal circuit structure 20 also comprises a plurality of second connection pads 240 and is arranged on the base material 10, and cuts district Rp and comprise one first and cut district Rp1 and one second and cut district Rp2, lays respectively at the relative both sides of circuit region Rc.Each first connection pad 220 cuts district Rp1 by first and extends to first and cut outside the district Rp1 in circuit region Rc.Each first opening 220a is arranged at first and cuts in the district Rp1.Each second connection pad 240 cuts district Rp2 by second and extends to second and cut outside the district Rp2 in circuit region Rc.Be positioned at second and cut second connection pad 240 of district beyond the Rp2 and can be used as measurement circuit equally, electrically connect the reliability of drive circuits 210 in order to test second connection pad 240.Each second connection pad 240 has at least one second opening 240a and is arranged at second and cuts in the district Rp2.Certainly, each cover crystal circuit structure 20 can also comprise many second leads 250 and be arranged on the circuit region Rc of base material 10, and each bar second lead 250 connects wherein one of drive circuits 210 and second connection pad 240.
Fig. 4 be illustrate according to an embodiment of the present invention cover polycrystalline structure film 20 ' on look schematic diagram.Cover polycrystalline structure film 20 ' and be the structure that district Rp obtains that cuts by die-cut die stamping membrane of flip chip winding 1 shown in Figure 1.Membrane of flip chip structure 20 ' comprises base material 110, drive circuit 210 and a plurality of first connection pad 220.Base material 110 has the crystalline region of covering R
ICAnd bonding land Rb, bonding land Rb is in abutting connection with the edge E1 of base material 110.What drive circuit 210 was arranged at base material 110 covers crystalline region R
ICOn.First connection pad 220 is arranged on the bonding land Rb of base material 110, and extends to the edge E1 of base material 110.It should be noted that, when cutting line (not illustrating) passes through the first opening 220a shown in Figure 1, can form a breach and adjoin above-mentioned cutting line, so each first connection pad 220 that covers in the polycrystalline structure film 20 ' shown in Figure 4 has the edge E1 that one first breach 220b adjoins base material 110.The cross-section structure of the first breach 220b can be shown in Fig. 3 A-Fig. 3 C.As shown in Figure 3A, the first breach 220b of first connection pad 220 runs through first connection pad 220 and exposes a part of base material 10.Shown in Fig. 3 B, the first breach 220b is blind hole.Shown in Fig. 3 C, the first breach 220b of first connection pad 220 runs through first connection pad 220, and base material 10 has a through hole 10b and aims at the first breach 220b.
In the present embodiment, each first connection pad 220 also has at least one first opening 220a, as shown in Figure 4.The first breach 220b and the first opening 220a roughly arrange along the bearing of trend D2 of first connection pad 220.The last end out line of the first opening 220a can be circle, ellipse, polygon or X-shaped, shown in Fig. 1, Fig. 2 A-Fig. 2 D, but is not limited thereto.
Please get back to Fig. 4, first connection pad 220 roughly is spaced along orientation D1, and electrically connects drive circuit 210.Membrane of flip chip structure 20 ' can also comprise many first leads 230, each bar first lead 230 connect drive circuits 210 and first connection pad 220 wherein one.Base material 110 also comprises one first cabling district Rw1 and is positioned at and covers crystalline region R
ICAnd between the Rb of bonding land, above-mentioned first lead 230 is by covering crystalline region R
ICExtend to bonding land Rb by the first cabling district Rw1.
In the present embodiment, membrane of flip chip structure 20 ' also comprises a plurality of second connection pads 240 and is arranged on the base material 110, and bonding land Rb comprises one first bonding land Rb1 and one second bonding land Rb2, lays respectively at and covers crystalline region R
ICRelative both sides.First connection pad 220 is arranged on the first bonding land Rb1, and second connection pad is arranged on the second bonding land Rb2.Second connection pad 240 extends to another edge E2 of base material 110, and each second connection pad 240 has another edge E2 that one second breach 240b adjoins base material 110.This is because when cutting, and cutting line (not illustrating) is by the second opening 240a shown in Figure 1, so membrane of flip chip structure 20 ' shown in Figure 4 has the second breach 240b.Certainly, membrane of flip chip structure 20 ' can also comprise many second leads 250, and each bar second lead 250 connects one of them of drive circuit 210 and second connection pad 250.Base material 110 also comprises one second cabling district Rw2 and is positioned at and covers crystalline region R
ICAnd between the second bonding land Rb2, and second lead 250 is by covering crystalline region R
ICExtend to the second bonding land Rb2 by the second cabling district Rw2.
In one embodiment, this membrane of flip chip structure 20 ' is applicable to a display.Membrane of flip chip structure 20 ' can connect the display floater in the display, sends a signal to element in the display floater with the drive circuit 210 that utilizes membrane of flip chip structure 20 '.The kind of display can be LCD (Liquid Crystal Display), can also be organic light emitting display (Organic Light Emitting Display), but be not limited thereto.As shown in Figure 5, be engaged to display floater 30, the second connection pads 240 by first connection pad 220 and be engaged to circuit board 40, so that drive circuit 210 electrically connects display floater 30 and circuit board 40.(Anisotropic Conductive Film ACF), is engaged in first connection pad 220 on the connection pad corresponding in the display floater 30 (not illustrating) for example can to utilize the anisotropy conducting film.
Fig. 6 illustrates according to looking schematic diagram on the brilliant film webs 2 of covering of another execution mode of the present invention.Cover brilliant film webs 2 and be that with the difference of covering brilliant film webs 1 shown in Figure 1 220 of each first connection pads that cover brilliant film webs 2 have first an opening 220a, and each second connection pad 240 is neither has second opening.In one embodiment, first connection pad 220 is for the output connection pad, in order to connect display floater; Second connection pad 240 is for the input connection pad, in order to the connecting circuit plate.Because the spacing of two adjacent input connection pads is wideer usually, be not easy to take place that circuit detaches the part bending and the problem of touching mutually, so opening can be set importing on the connection pad.But the spacing of two adjacent output connection pads is shorter usually, and it is higher that circuit detaches the possibility that part touches mutually because of bending, is opened on the output connection pad so be preferably to arrange, and makes the output connection pad be easy to fracture when cutting, and takes place with the phenomenon of avoiding circuit to detach.
Fig. 7 illustrates to cover polycrystalline structure film 20 ' according to another execution mode of the present invention ' on look schematic diagram.Cover polycrystalline structure film 20 ' ' be to distinguish the structure that Rp obtains by cutting of die-cut die stamping membrane of flip chip winding 2.Cover polycrystalline structure film 20 ' ' be with the difference of covering polycrystalline structure film 20 ' shown in Figure 4, cover polycrystalline structure film 20 ' ' only have the first breach 220b, and each second connection pad 240 does not all have second opening.Cover polycrystalline structure film 20 ' ' first connection pad 220 can be in order to engage display floater and circuit board respectively with second connection pad 240.
In sum, because first connection pad has first opening, so when cutting, the edge of first opening bears bigger stress, and easy edge fracture since first opening, and then fracture is to the edge of first connection pad.Therefore can solve the incomplete problem that cuts, and then solution detaches the short circuit problem that may cause because of circuit.
Though the present invention discloses as above with execution mode; so it is not in order to limit the present invention; anyly be familiar with this skill person; without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking the scope that appending claims defines.
Claims (23)
1. one kind covers brilliant film webs, it is characterized in that, comprises:
One base material comprises a plurality of cellular zones, and respectively this cellular zone has a circuit region and and cuts the district around this circuit region; And
A plurality of cover crystal circuit structures, respectively this cover crystal circuit structure is arranged on one of them of those cellular zones, and respectively this cover crystal circuit structure comprises:
One drive circuit is arranged on this circuit region of this base material; And
A plurality of first connection pads, respectively this first connection pad cuts the district by this and extends to this and cut outside the district in this circuit region, those first connection pads are spaced along an orientation, and respectively this first connection pad electrically connects this drive circuit, and wherein respectively this first connection pad has at least one first opening and is arranged at this and cuts in the district.
2. according to claim 1ly cover brilliant film webs, it is characterized in that, respectively this cover crystal circuit structure also comprises on this circuit region that many first leads are arranged at this base material, and respectively this first lead connects one of them of this drive circuit and those first connection pads.
3. according to claim 1ly cover brilliant film webs, it is characterized in that this base material comprises a plurality of driving holes and is positioned at outside those cellular zones, and adjoin an edge of this base material, and arrange along a bearing of trend at this edge of this base material.
4. according to claim 3ly cover brilliant film webs, it is characterized in that this bearing of trend at this edge is vertical with this orientation of those first connection pads.
5. according to claim 1ly cover brilliant film webs, it is characterized in that respectively this first connection pad has a plurality of first openings, those first openings are arranged along a bearing of trend of this first connection pad respectively.
6. according to claim 1ly cover brilliant film webs, it is characterized in that, respectively this cover crystal circuit structure also comprises a plurality of second connection pads and is arranged on this base material, and this cuts the district and comprises one first and cut the district and one second cut the district, lay respectively at the relative both sides of this circuit region, wherein respectively this first connection pad first cuts the district and extends to this and first cut outside the district by this in this circuit region, respectively this first opening is arranged at this and first cuts in the district, and respectively this second connection pad second cuts the district and extends to this and second cut outside the district by this in this circuit region.
7. according to claim 6ly cover brilliant film webs, it is characterized in that, respectively this cover crystal circuit structure also comprises on this circuit region that many second leads are arranged at this base material, to connect one of them of this driving and those second connection pads.
8. according to claim 6ly cover brilliant film webs, it is characterized in that, respectively this second connection pad has at least one second opening and is arranged at this and second cuts in the district.
9. according to claim 1ly cover brilliant film webs, it is characterized in that respectively this first opening of this first connection pad runs through this first connection pad.
10. according to claim 1ly cover brilliant film webs, it is characterized in that respectively this first opening is blind hole.
11. according to claim 1ly cover brilliant film webs, it is characterized in that respectively this first opening of this first connection pad runs through this first connection pad, and this base material has a through hole and aims at this first opening.
12. according to claim 1ly cover brilliant film webs, it is characterized in that respectively the last end out line of this first opening of this first connection pad is circular, oval, polygon or X-shaped.
13. a membrane of flip chip structure is characterized in that, is applicable to a display, this membrane of flip chip structure comprises:
One base material has one and covers crystalline region and a bonding land, and this bonding land is in abutting connection with an edge of this base material;
One drives, and this that is arranged at this base material covers on the crystalline region; And
A plurality of first connection pads, electrically connect this driving, and be arranged at this bonding land of this base material, those first connection pads are spaced along an orientation, wherein respectively this first connection pad extends to this edge of this base material, and respectively this first connection pad has this edge that one first breach adjoins this base material.
14. membrane of flip chip structure according to claim 13, it is characterized in that, also comprise many first leads, and this base material also comprises one first cabling district and is positioned at this and covers between crystalline region and this bonding land, those first leads cover the crystalline region by this and extend to this bonding land by this first cabling district, to connect one of them of this drive circuit and those first connection pads.
15. membrane of flip chip structure according to claim 13, it is characterized in that, also comprising a plurality of second connection pads is arranged on this base material, and this bonding land comprises one first bonding land and one second bonding land, lay respectively at the relative both sides that this covers the crystalline region, wherein those first connection pads are arranged on this first bonding land, and those second connection pads are arranged on this second bonding land.
16. membrane of flip chip structure according to claim 15, it is characterized in that, also comprise many second leads, and this base material also comprises one second cabling district and is positioned at this and covers between crystalline region and this second bonding land, those second leads cover the crystalline region by this and extend to this second bonding land by this second cabling district, and respectively this second lead connects one of them of this drive circuit and those second connection pads.
17. the polycrystalline structure film that covers according to claim 15 is characterized in that, those first connection pads are engaged to a display floater, and those second connection pads are engaged to a circuit board.
18. membrane of flip chip structure according to claim 15 is characterized in that, those second connection pads extend to another edge of this base material, and respectively this second connection pad has this another edge that one second breach adjoins this base material.
19. membrane of flip chip structure according to claim 13 is characterized in that, respectively this first breach of this first connection pad runs through this first connection pad.
20. membrane of flip chip structure according to claim 13 is characterized in that, respectively this first breach is blind hole.
21. membrane of flip chip structure according to claim 13 is characterized in that, respectively this first breach of this first connection pad runs through this first connection pad, and this base material has a through hole and aims at this first breach.
22. membrane of flip chip structure according to claim 13 is characterized in that, respectively this first connection pad has at least one first opening, and this first breach and this first opening are along the respectively bearing of trend arrangement of this first connection pad.
23. membrane of flip chip structure according to claim 22 is characterized in that, respectively the last end out line of this first opening is circle, ellipse, polygon or X-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102323845A CN103337490A (en) | 2013-06-13 | 2013-06-13 | Chip on film tape and chip on film structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102323845A CN103337490A (en) | 2013-06-13 | 2013-06-13 | Chip on film tape and chip on film structure |
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| CN103337490A true CN103337490A (en) | 2013-10-02 |
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| CN2013102323845A Pending CN103337490A (en) | 2013-06-13 | 2013-06-13 | Chip on film tape and chip on film structure |
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Cited By (10)
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| CN104678322A (en) * | 2013-12-02 | 2015-06-03 | 神讯电脑(昆山)有限公司 | Test device |
| CN105323947A (en) * | 2014-05-30 | 2016-02-10 | 南茂科技股份有限公司 | Flexible circuit carrier plate |
| CN109143644A (en) * | 2018-09-04 | 2019-01-04 | 京东方科技集团股份有限公司 | Flip chip substrate, display panel and preparation method thereof, display device |
| CN109686720A (en) * | 2018-11-08 | 2019-04-26 | 友达光电股份有限公司 | Flip chip encapsulating structure and display device |
| CN109686765A (en) * | 2018-12-24 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | Chip structure and display device |
| CN110544684A (en) * | 2018-05-28 | 2019-12-06 | 三星电子株式会社 | thin film package and package module including the same |
| CN110579915A (en) * | 2019-08-06 | 2019-12-17 | 深圳市华星光电技术有限公司 | flip Chip On Film (COF) set, display module and bonding method of COF set |
| CN111584456A (en) * | 2020-05-08 | 2020-08-25 | 武汉华星光电半导体显示技术有限公司 | Chip on film |
| CN113163595A (en) * | 2021-03-30 | 2021-07-23 | 荣耀终端有限公司 | Chip on film, roll and display device |
| US11373943B2 (en) | 2020-05-08 | 2022-06-28 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flip-chip film |
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| CN104678322A (en) * | 2013-12-02 | 2015-06-03 | 神讯电脑(昆山)有限公司 | Test device |
| CN105323947A (en) * | 2014-05-30 | 2016-02-10 | 南茂科技股份有限公司 | Flexible circuit carrier plate |
| CN105323947B (en) * | 2014-05-30 | 2018-05-22 | 南茂科技股份有限公司 | Flexible circuit carrier plate |
| CN110544684A (en) * | 2018-05-28 | 2019-12-06 | 三星电子株式会社 | thin film package and package module including the same |
| CN110544684B (en) * | 2018-05-28 | 2024-06-18 | 三星电子株式会社 | Film package and package module including the same |
| CN109143644A (en) * | 2018-09-04 | 2019-01-04 | 京东方科技集团股份有限公司 | Flip chip substrate, display panel and preparation method thereof, display device |
| CN109143644B (en) * | 2018-09-04 | 2021-09-03 | 京东方科技集团股份有限公司 | Chip on film substrate, display panel, preparation method of display panel and display device |
| CN109686720B (en) * | 2018-11-08 | 2020-04-07 | 友达光电股份有限公司 | Chip on film package structure and display device |
| CN109686720A (en) * | 2018-11-08 | 2019-04-26 | 友达光电股份有限公司 | Flip chip encapsulating structure and display device |
| CN109686765A (en) * | 2018-12-24 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | Chip structure and display device |
| CN110579915A (en) * | 2019-08-06 | 2019-12-17 | 深圳市华星光电技术有限公司 | flip Chip On Film (COF) set, display module and bonding method of COF set |
| CN111584456A (en) * | 2020-05-08 | 2020-08-25 | 武汉华星光电半导体显示技术有限公司 | Chip on film |
| WO2021223294A1 (en) * | 2020-05-08 | 2021-11-11 | 武汉华星光电半导体显示技术有限公司 | Chip on film |
| US11373943B2 (en) | 2020-05-08 | 2022-06-28 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flip-chip film |
| CN113163595A (en) * | 2021-03-30 | 2021-07-23 | 荣耀终端有限公司 | Chip on film, roll and display device |
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Application publication date: 20131002 |