CN109143644A - Flip chip substrate, display panel and preparation method thereof, display device - Google Patents
Flip chip substrate, display panel and preparation method thereof, display device Download PDFInfo
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- CN109143644A CN109143644A CN201811025753.2A CN201811025753A CN109143644A CN 109143644 A CN109143644 A CN 109143644A CN 201811025753 A CN201811025753 A CN 201811025753A CN 109143644 A CN109143644 A CN 109143644A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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Abstract
The invention discloses flip chip substrates, display panel and preparation method thereof, display device.According to an embodiment of the invention, the edge of the flip chip substrate has cut mark, the cut mark limits trenching area in the flip chip substrate edges.As a result, when forming display panel using the flip chip substrate, it is only necessary to which flip chip substrate can be fixed on the substrate of display module by primary contraposition, simple process, high production efficiency；And aligning accuracy is high, avoids the problem of misalignment of warped generation in trenching area corner during contraposition, improves product yield, reduce the bad risk of product.
Description
Technical field
The present invention relates to field of display technology, and in particular, to flip chip substrate, display panel and preparation method thereof,
Display device.
Background technique
With the arrival in " screen comprehensively " epoch, favor of the height screen accounting display device by consumer, thus to display surface
The structure design of plate proposes new challenge.At present due to the limitation of grid array (Gate on Array, GOA) driving unit, entirely
The left and right side frame design of face display panel has had reached technological limits, but there are also very big for the upper and lower side frame design of display panel
Development space, in order to realize the narrow frame design up and down of display panel, COF (Chip on flexible printed
Circuit) technique gradually replaces traditional COG (Chip on glass) technique, becomes the direction of the following display panel development.
Specifically, traditional COG technique is that chip is directly placed on glass, screen panel and chip are however right in a plane
For the display panel for being applied to mobile terminal, integrated level is high, does not require nothing more than to screen frivolous, and chip part is not yet
Too many space can be occupied, therefore COG technique has not met at present screen trend comprehensively.And COF technique is by integrated chip
On flexible printed circuit board (Printed Circuit Board, PCB), this connection type can be such that chip bending is shielding
Curtain lower section, saves space, and mobile terminal is made to possess narrower upper and lower side frame, realizes higher screen accounting, to meet to comprehensive screen
Design requirement.Also, either LCD screen or OLED screen curtain can be packaged by COF technique.
However, current flip chip substrate, display panel and preparation method thereof, display device, still have much room for improvement.
Summary of the invention
The present invention be based on inventor couple on the fact that and problem discovery and understanding make:
Inventors have found that at present during preparation has the display panel of flip chip substrate, in the prevalence of right
Position low precision, the problems such as production efficiency is low, product yield is low.Inventor is by further investigation and many experiments discovery, at present
The design of display panel general choice front end shaped openings (such as U-shaped, Y type) for mobile terminal, it is possible thereby to ensureing
Front camera and earpiece make the screen accounting of display panel reach maximization using under the premise of the most convenient.In order to cope with this
One changes, and with reference to Fig. 5, the flip chip substrate (" COF " in such as Fig. 5) provided in display panel preparation process is also needed
Corresponding channel design will cause the substrate of flip chip substrate and display module (in such as Fig. 5 due to this special designing
" Panel ") need to be carried out in two steps during pressure welding (Bonding).Complex process is caused as a result, and production efficiency is low.
Specifically, flip chip substrate (with grooving) aligns simultaneously with shaped openings left end progress first in the substrate of display module first
Pressure welding (" once aligning Bonding " in such as Fig. 5) then carries out the second contraposition and pressure welding (in such as Fig. 5 with shaped openings right end
" secondary contraposition Bonding "), since flip chip substrate is flexible web, the grooving corner in flip chip substrate is easy
Warped occurs, the first contraposition deviation can be made, and then directly affect the precision of the second contraposition, i.e. aligning accuracy is poor, ultimately causes mistake
Position, largely reduces the yield of product.Therefore, if a kind of flip chip substrate and corresponding display panel can be proposed
Preparation method can not influence to avoid flip chip substrate warped and aligning accuracy when being used to prepare display panel, will be very
It solves the above problems in big degree.
The present invention is directed to alleviate or solve the problems, such as at least one in above-mentioned refer at least to some extent.
In one aspect of the invention, the invention proposes a kind of flip chip substrates.According to an embodiment of the invention, institute
The edge for stating flip chip substrate has cut mark, and the cut mark limits grooving in the flip chip substrate edges
Area.As a result, when forming display panel using the flip chip substrate, it is only necessary to which primary contraposition can fix flip chip substrate
Onto the substrate of display module, simple process, high production efficiency；And aligning accuracy is high, avoids trenching area during contraposition
The problem of misalignment that corner warped generates, improves product yield, reduces the bad risk of product.
According to an embodiment of the invention, the cut mark includes at least one of precut and precutting.As a result, may be used
To further increase the performance of the flip chip substrate.
According to an embodiment of the invention, the cut mark is precut, the precut is arranged in the flip chip
On substrate, and it is distributed along the continuous edge of the trenching area.Thus, it is possible to further increase the property of the flip chip substrate
Energy.
According to an embodiment of the invention, the cut mark is made of multiple spaced precuttings, the precutting
Through the flip chip substrate, and multiple precuttings are along the edge distribution of the trenching area.Thus, it is possible to further
Improve the performance of the flip chip substrate.
According to an embodiment of the invention, the side in the trenching area far from the flip chip substrate edges has hollow out
Region, the edge of the hollowed out area are Chong Die with the marginal portion of the trenching area；The edge of the trenching area of non-hollow out
It is provided with the cut mark.Thus, it is possible to further increase the performance of the flip chip substrate.
In one aspect of the invention, the invention proposes a kind of preparation methods of display panel.Reality according to the present invention
Example is applied, this method comprises: providing display module, there are shaped openings on the substrate edges of the display module, the substrate exists
The first telltale mark is provided at the shaped openings；Mentioned-above flip chip substrate is provided；Based on described first
Telltale mark is fixed on the substrate by the flip chip substrate, the trenching area of the flip chip substrate with it is described
Shaped openings are corresponding；To the trenching area carry out grooving processing, so as on the flip chip substrate formed with it is described different
The corresponding grooving of shape opening.This method, which only needs once to align, as a result, to be fixed to display module for flip chip substrate
On substrate, simple process, high production efficiency；And aligning accuracy is high, avoids what grooving corner warped during aligning generated
Problem of misalignment improves product yield, reduces the bad risk of product.
According to an embodiment of the invention, by flip chip substrate fixation being handled by pressure welding on the substrate
It realizes, the temperature of the pressure welding processing is 80~150 degrees Celsius.Thus, it is possible to which easy is fixed on flip chip substrate
On substrate, simple process, product yield height.
According to an embodiment of the invention, this method further comprises: having the one of the shaped openings along the substrate
The flip chip substrate for being formed with the grooving is bent to the back side of the substrate, so that the grooving exists by side edge
The projection of plane where the substrate is Chong Die in the projection of plane where the substrate with the shaped openings.Thus, it is possible into
One step promotes the performance of the display panel of this method preparation.
In another aspect of the invention, the invention proposes a kind of display panels.According to an embodiment of the invention, described
Display panel is prepared using mentioned-above method.The display panel can have previously described method and be had as a result,
The whole features and advantage having, details are not described herein.Generally speaking, which only needs primary align can be thin by flip
Ilm substrate is fixed on the substrate of display module, and preparation process is simple, high production efficiency；Also, without grooving side during aligning
The problem of misalignment that angle warped generates, product yield height, good quality.
In an additional aspect of the present invention, the invention proposes a kind of display devices.According to an embodiment of the invention, this is aobvious
Showing device includes mentioned-above display panel.The display device can have previously described display panel and be had as a result,
Whole features and advantage, details are not described herein.Generally speaking, which only needs primary align can be by flip chip
Substrate is fixed on the substrate of display module, and preparation process is simple, high production efficiency；And without grooving corner song during aligning
Stick up the problem of misalignment of generation, product yield height, good quality.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 shows the structural schematic diagram of flip chip substrate according to an embodiment of the invention；
Fig. 2 shows the structural schematic diagram of flip chip substrate in accordance with another embodiment of the present invention；
Fig. 3 shows the structural schematic diagram of the flip chip substrate of another embodiment according to the present invention；
Fig. 4 shows the structural schematic diagram of the flip chip substrate of another embodiment according to the present invention；
Fig. 5 shows the process schematic that current flip chip substrate and display module are assembled；
Fig. 6 shows the flow diagram of display panel preparation method according to an embodiment of the present invention；
Fig. 7 shows the partial structure diagram of display panel according to an embodiment of the present invention；
Fig. 8 shows the partial structure diagram of display panel according to a further embodiment of the invention；
Fig. 9 shows partial structure diagram during preparing display panel according to an embodiment of the present invention；
Figure 10 shows the partial structure diagram according to a further embodiment of the invention during preparing display panel；
Figure 11 shows the flow diagram of display panel preparation method according to an embodiment of the present invention；And
Figure 12 shows the structural schematic diagram of display device according to an embodiment of the invention.
Description of symbols:
100: substrate；110: shaped openings；120: the first telltale marks；200: flip chip substrate；210: cut mark；
220: trenching area；230: the first telltale marks；10: precut；20: precutting；240: hollowed out area；250: the grooving of non-hollow out
Area；260: grooving；1000: display device.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In one aspect of the invention, the invention proposes a kind of flip chip substrates.According to an embodiment of the invention, ginseng
Fig. 1 is examined, the edge of flip chip substrate 200 has cut mark 210, and cut mark 210 limits at 200 edge of flip chip substrate
Make trenching area 220.The flip chip substrate is not pre-formed before being fixed to display module and forming display panel
Grooving, therefore two edges for avoiding grooving need to position fixed problem twice, are utilizing the flip chip substrate as a result,
When forming display panel, it is only necessary to flip chip substrate can be fixed on the substrate of display module by primary contraposition, simple process,
High production efficiency；And aligning accuracy is high, avoids the problem of misalignment of warped generation in trenching area corner during contraposition, improves
Product yield reduces the bad risk of product.
In order to make it easy to understand, the principle of the above-mentioned technical effect of realization is described in detail below:
As previously mentioned, being first to cover at present when there is the display panel of shaped openings using the preparation of flip chip substrate
The edge of brilliant film substrate forms grooving, then flip chip substrate and the substrate of display module are carried out contraposition fixation, thus needs
Fixation is aligned twice, and is initially formed grooving, and the grooving corner in flip chip substrate is easy to happen warped, can make
Primary contraposition generates deviation, and then directly affects the precision of second of contraposition, causes to misplace.And in the present invention, flip chip base
The edge of plate 200 has cut mark 210, and cut mark 210 is in the edge limited trenching area 220 out of flip chip substrate 200, i.e.,
Cut mark 210 only need to be carried out first once aligning as a result, fixing, will have trenching area along the edge distribution of trenching area 220
220 flip chip substrate 200 is fixed on the substrate of display module, then, then based on the removal of cut mark 210 trenching area
Flip chip substrate in 220, to form grooving on flip chip substrate 200, that is to say, that carry out above-mentioned primary contraposition
Not formed grooving when fixed, warped would not also occur in the corner of grooving, and then will not generate contraposition deviation, will not cause mistake
The problem of position, the precision of contraposition is improved, that is, avoids the problem of misalignment of warped generation in trenching area corner during contraposition, improve
Product yield, reduces the bad risk of product.And, it is only necessary to flip chip substrate 200 can be fixed to aobvious by primary contraposition
On the substrate for showing mould group, with contraposition stationary phase ratio twice, primary contraposition, which is fixed to save considerably to align, fixes required time, work
Skill is simple, and product production capacity and yield greatly improved.
According to an embodiment of the invention, the concrete type of cut mark 210 is not particularly limited, those skilled in the art can
To be selected according to actual needs.For example, according to an embodiment of the invention, with reference to Fig. 2 and Fig. 3, cut mark 210 includes
At least one of precut 10 and precutting 20.Thus, it is possible to further increase the performance of the flip chip substrate.
In some embodiments of the invention, with reference to Fig. 2, cut mark 210 can be precut 10, and precut 10 is arranged
It is distributed on flip chip substrate 200, and along the continuous edge of trenching area 220.It is as a result, in subsequent operation, flip is thin
After ilm substrate is fixed in display module, can cut along precut 10 to flip chip substrate 200 can form institute
The grooving needed, further increases the performance of the flip chip substrate.
In other embodiments of the invention, with reference to Fig. 3, cut mark 210 can be by multiple spaced pre-cut
Mouth 20 is constituted, and precutting 20 runs through flip chip substrate 200, and multiple precuttings 20 are along the edge distribution of trenching area 220.By
Run through flip chip substrate 200 in precutting 20, therefore the flip chip substrate 200 at precutting 20 is that part disconnects,
In the next steps, after flip chip substrate being fixed in display module, multiple precuttings 20 can be needed only be along and be distributed
Direction remove the flip chip substrate 200 of trenching area 220 and can form required grooving.
According to an embodiment of the invention, the side in trenching area 220 far from 200 edge of flip chip substrate can with reference to Fig. 4
With with hollowed out area 240, the edge of hollowed out area 240 can partly overlap with the edge of trenching area 220.It is according to the present invention
Embodiment, the partial region of trenching area 220 can be hollow out, that is, have hollowed out area 240.The side of 240 periphery of hollowed out area
Edge is overlapped with the part edge of trenching area 220.As shown in Figure 4 250 be the trenching area of non-hollow out, the digging of the non-hollow out
250 edge of slot area is provided with cut mark.As a result, in subsequent step, it is fixed in display module by flip chip substrate
Afterwards, the flip chip substrate in the trenching area 250 of non-hollow out can be removed based on the cut mark 210, it is required to be formed
Grooving further increases the performance of the flip chip substrate.According to an embodiment of the invention, the side of the trenching area 250 of non-hollow out
At edge be arranged cut mark can be previously described cut mark 210, it can including previously described precut 10 with
And at least one of precutting 20, before detailed narration has been carried out, details are not described herein.Those skilled in the art can
Understand, hollowed out area 240 is also a part for the grooving being subsequently formed, therefore 240 one side of hollowed out area can be preparatory
A part of flip chip substrate in trenching area 220 is removed, on the other hand, the part of hollow out can also be by flip chip substrate
When being positioned with display module, the effect of telltale mark is served as: hollowed out area 240 can be with the shaped openings in display module
It is oppositely arranged.
According to an embodiment of the invention, flip chip substrate 200 further comprises the second telltale mark with reference to Fig. 2~Fig. 4
230, the second telltale mark 230 can be set at trenching area 220.According to an embodiment of the invention, the second telltale mark
230 setting position, quantity are not particularly limited, need to only meet can be used in subsequent step with the substrate of display module into
Row contraposition.For example, it may be in flip chip substrate 200 there are the both ends of 220 one side edge of trenching area to be respectively set the
Two telltale marks 230, second telltale mark 230 can be aligned with the substrate of display module, to incite somebody to action in subsequent step
Flip chip substrate 200 and the substrate of display module carry out contraposition setting, and finally obtain required display panel.It needs to illustrate
, also can have the first telltale mark in the substrate of display module, which can be with flip chip substrate
200 the second telltale mark is corresponding, is thus conducive to align the substrate of display module and the flip chip substrate 200
Setting.
According to an embodiment of the invention, the concrete type of flip chip substrate 200 is not particularly limited, those skilled in the art
Member can be selected in detail according to actual needs.For example, can also include chip (IC) and soft on flip chip substrate 200
Property circuit board (FPC).Thus, it is possible to further promote the performance of the display panel based on flip chip substrate preparation.
In one aspect of the invention, the invention proposes a kind of preparation methods of display panel.This method only needs once
Flip chip substrate can be fixed on the substrate of display module by contraposition, simple process, high production efficiency；And aligning accuracy
Height avoids the problem of misalignment of warped generation in grooving corner during contraposition, improves product yield, reduce the bad wind of product
Danger.
According to an embodiment of the invention, with reference to Fig. 6, this method comprises:
S100: display module is provided
In this step, display module is provided.According to an embodiment of the invention, with reference to Fig. 7, the substrate 100 of display module
There are shaped openings 110, substrate 100 is being provided with the first telltale mark 120 at shaped openings 110 on edge.According to this
The embodiment of invention, the setting position of the first telltale mark 120, quantity are not particularly limited, and need to only be met and are positioned close to
At shaped openings 110.For example, it may be in substrate 100 there are the both ends of 110 one side edge of shaped openings to be respectively set the
One telltale mark 120.First telltale mark 120 can be used in subsequent step being aligned with flip chip substrate.First
Telltale mark 120 is arranged close to shaped openings 110, is conducive to the screen accounting for further increasing the display panel: as previously mentioned, the
Telltale mark when one telltale mark 120 is for flip chip substrate to be fixed in display module, i.e. the first telltale mark
120 position is the position that flip chip substrate is fixed in display module.Due to being provided with connection site herein to realize
The electrical connection of circuit (such as IC) in circuit and flip chip substrate in display module, therefore display module herein can not
It is enough in display.And similarly, due to needing to be arranged the moulds group such as camera at shaped openings 110, can not be used to show.It will
First telltale mark 120 is arranged close to shaped openings 110, can will not be able to carry out concentrated setting for the region of display, thus
Be conducive to improve the screen accounting of the display panel.
According to an embodiment of the invention, the shape of shaped openings 110 is not particularly limited, those skilled in the art can root
It is selected according to actual demand.For example, the shape of shaped openings 110 may include Y shape or U-shaped.Specifically, with reference to Fig. 7, abnormity
The shape of opening 110 can be U-shaped.Specifically, the shape of shaped openings 110 can be Y shape with reference to Fig. 8.This method as a result,
Suitable for preparing the display panel with shaped openings of different shapes, the performance of display panel can be further promoted.
According to an embodiment of the invention, the concrete type of display module is not particularly limited, those skilled in the art can be with
It is selected according to actual needs.For example, display module can be and show for realizing LCD or OLED is shown.According to the present invention
Embodiment, form the specific material and shape of substrate, thickness is not particularly limited, those skilled in the art can be according to reality
Border demand is selected.
S200: flip chip substrate is provided
In this step, flip chip substrate is provided.According to an embodiment of the invention, the flip chip provided in the step
Substrate can be previously described flip chip substrate, thus, it is possible to have possessed by previously described flip chip substrate
Whole features and advantage, details are not described herein.It should be noted that cut mark 210 in flip chip substrate 200 can be with
It is designed accordingly according to the concrete shape of shaped openings 110 in the substrate 100 of display module, to make cut mark 210
Shape in the edge limited trenching area 220 out of flip chip substrate 200 is corresponding with the shape of shaped openings 110, then base
It is also corresponding in the shape and the shape of shaped openings 110 of the grooving that the trenching area 220 is formed, it will be ultimately formed covering for grooving
When brilliant film substrate 200 is fixed on the substrate 100 and is bent to the back side of substrate 100, throwing of the grooving in 100 place plane of substrate
Shadow is Chong Die in the projection of 100 place plane of substrate with shaped openings 110.
According to an embodiment of the invention, cut mark, trenching area, the second telltale mark in the flip chip substrate provided
Front has been carried out detailed narration, and details are not described herein.
S300: flip chip substrate is fixed on substrate
In this step, with reference to Fig. 9, flip chip substrate 200 is fixed on by substrate 100 based on the first telltale mark 120
On, the trenching area 220 of flip chip substrate 200 is corresponding with shaped openings 110.According to an embodiment of the invention, flip is thin
The fixed concrete mode on the substrate 100 of ilm substrate 200 is not particularly limited.For example, according to an embodiment of the invention, by flip
The fixation of film substrate 200 is to handle to realize by pressure welding on the substrate 100.It according to a particular embodiment of the invention, can be with
It is first to align the second telltale mark 240 and the first telltale mark 120, it is possible thereby to flip chip substrate 200 and base
Plate 100 carries out contraposition setting, and there is flip chip substrate 200 one side edge of trenching area 220 and substrate 100 to have after contraposition setting
There is 110 one side edge of shaped openings to be in contact, and there is overlapping region (not shown), it is then thin to the flip of overlapping region
Ilm substrate 200 and substrate 100 carry out die casting processing, so that flip chip substrate 200 is fixed on the substrate 100.According to this
The embodiment of invention, the temperature for carrying out pressure welding processing can be 80~150 degrees Celsius.According to an embodiment of the invention, being pressed
The temperature for welding processing can be 100 degrees Celsius.Thus, it is possible to easy is fixed on flip chip substrate on substrate, technique letter
Single, product yield is high.
Inventors have found that above-mentioned by the fixed method on the substrate 100 of flip chip substrate 200, it is only necessary to fixed based on second
Position label 230 and the first telltale mark 120 are once aligned, and compared with aligning twice at present, save the fixed institute of contraposition
Product production capacity and yield greatly improved in the time needed, simple process；An and aligning accuracy height.In addition, carrying out once
When aligning fixed flip chip substrate 200, flip chip substrate 200 is not provided with grooving and (can be based on cut mark 210 later period to go
Except the flip chip substrate in trenching area 220 is formed), the grooving corner warped problem generated during contraposition is thus avoided,
Dislocation is further avoided, product yield is improved, reduces the bad risk of product.
S400: grooving processing is carried out
In this step, with reference to Figure 10, grooving processing is carried out to trenching area 220, so as to the shape on flip chip substrate 200
At grooving 260 corresponding with shaped openings 110.That is, opposite with shaped openings 110 to flip chip substrate 200
Trenching area 220 carries out grooving processing.Formation grooving 260 that as a result, not only can be easy, moreover, flip chip substrate 200 is first right
Position is fixed on the substrate 100, then handles to obtain required grooving 260 by grooving, thus avoids what contraposition generated in the process
Grooving corner warped problem, further avoids dislocation, improves product yield, reduces the bad risk of product.
In some embodiments of the invention, with reference to Fig. 2, when above-mentioned cut mark 210 includes precut 10, grooving is carried out
Processing includes: along precut 10 and by the flip chip substrate of break bar cutting removal trenching area 220, to form grooving
260.Thus, it is possible to easy formation grooving 260.According to an embodiment of the invention, the line width of precut 10 is greater than the width of break bar
Degree.As a result, when forming grooving 260, without especially improving the precision of cutting or carrying out stringent monitoring to the contraposition of break bar,
Break bar will not damage other components on flip chip substrate 200, further promote product yield.
In other embodiments of the invention, with reference to Fig. 3, when above-mentioned cut mark 210 includes multiple precuttings 20, into
Row grooving processing includes: the flip chip substrate that trenching area 220 is removed along precutting 20, to form grooving 260.As a result,
Can be easy by removing to form required grooving 260, other components on flip chip substrate will not be damaged, are further mentioned
Rise product yield.According to an embodiment of the invention, removing the specific side of the flip chip substrate of trenching area 220 based on precutting 20
Formula is not particularly limited, for example, it may be removing or being removed using machine manually.
Other embodiment according to the present invention, with reference to Fig. 4, far from 200 edge of flip chip substrate in trenching area 220
Side when being provided with hollowed out area 240, cut mark 210 include previously described preset lines 10 and predetermined mouth 20 at least
One of.Carrying out grooving processing includes: the flip chip substrate that the trenching area 250 of non-hollow out is removed along cut mark 210, so as to
Form grooving 260.Specifically, cut mark 210 is preset lines 10, the trenching area for removing non-hollow out can be cut by break bar
250 flip chip substrate, to form grooving 260.Wherein, carrying out break bar cutting can be previously described break bar cutting,
Details are not described herein.Alternatively, cut mark 210 includes multiple precuttings 20, non-hollow out can be removed along multiple precuttings 20
Trenching area 250 flip chip substrate, to form grooving 260.Wherein, the mode removed can be previously described remove
Mode, details are not described herein.Thus, it is possible to which grooving needed for easy formation, will not damage other on flip chip substrate
Component further promotes product yield.
In order to further enhance the performance of the display panel of this method preparation, with reference to Figure 11, this method further comprises:
S500: the flip chip substrate for being formed with grooving is bent to the back side of substrate
In this step, there is the one side edge of shaped openings 110 along substrate 100, the flip of grooving 260 will be formed with
Film substrate 200 is bent to the back side of substrate 100, projection and shaped openings so as to grooving 260 in 100 place plane of substrate
110 100 place plane of substrate projection be overlapped.After bending as a result, due to the presence of grooving 260, flip chip substrate 200
The use that will not influence such as front camera and earpiece of subsequent step formation can further promote the aobvious of this method preparation
Show the performance of panel.It should be noted that the back side of substrate 100 is the side that display panel deviates from user when in use.
In conclusion this method, which only needs once to align, to be fixed to flip chip substrate on the substrate of display module,
Simple process, high production efficiency；And aligning accuracy is high, avoids the dislocation that grooving corner warped generates during aligning and asks
Topic, improves product yield, reduces the bad risk of product.
In another aspect of the invention, the invention proposes a kind of display panels.According to an embodiment of the invention, display
Panel is prepared using mentioned-above method.The display panel can have possessed by previously described method as a result,
Whole features and advantage, details are not described herein.Generally speaking, which only needs primary align can be by flip chip base
Plate is fixed on the substrate of display module, and preparation process is simple, high production efficiency；Also, without grooving corner song during aligning
Stick up the problem of misalignment of generation, product yield height, good quality.
In an additional aspect of the present invention, with reference to Figure 12, the invention proposes a kind of display devices 1000.According to the present invention
Embodiment, the display device 1000 include mentioned-above display panel.The display device 1000 can have front as a result,
Whole feature and advantage possessed by the display panel of description, details are not described herein.Generally speaking, the display device 1000 is only
Need to once align can be fixed to flip chip substrate on the substrate of display module, and preparation process is simple, high production efficiency；And
And the problem of misalignment generated during aligning without grooving corner warped, product yield height, good quality.
In the description of the present invention, the orientation or positional relationship of the instructions such as term " on ", "lower" is based on the figure
Orientation or positional relationship is merely for convenience of the description present invention rather than requires the present invention that must be constructed and be grasped with specific orientation
Make, therefore is not considered as limiting the invention.
In the description of this specification, the description of reference term " one embodiment ", " another embodiment " etc. means to tie
The embodiment particular features, structures, materials, or characteristics described are closed to be included at least one embodiment of the present invention.At this
In specification, the schematic representation of the above terms does not necessarily have to refer to the same embodiment or example.Moreover, the tool of description
Body characteristics, structure, material or feature may be combined in any suitable manner in any one or more of the embodiments or examples.This
Outside, without conflicting with each other, those skilled in the art by different embodiments described in this specification or can show
The feature of example and different embodiments or examples is combined.In addition, it is necessary to illustrate, in this specification, term
" first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicate meaning
The quantity of the technical characteristic shown.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (10)
1. a kind of flip chip substrate, which is characterized in that the edge of the flip chip substrate has cut mark, the cutting
Label limits trenching area in the flip chip substrate edges.
2. flip chip substrate according to claim 1, which is characterized in that the cut mark includes precut and pre-
At least one of notch.
3. flip chip substrate according to claim 1, which is characterized in that the cut mark is precut, described pre-
Tangent line is arranged on the flip chip substrate, and is distributed along the continuous edge of the trenching area.
4. flip chip substrate according to claim 1, which is characterized in that the cut mark is by multiple spaced
Precutting is constituted, and the precutting runs through the flip chip substrate, and multiple precuttings are along the side of the trenching area
Fate cloth.
5. flip chip substrate according to claim 1, which is characterized in that far from the flip chip in the trenching area
The side of substrate edges has hollowed out area, and the edge of the hollowed out area is Chong Die with the part edge of the trenching area；
The edge of the trenching area of non-hollow out is provided with the cut mark.
6. a kind of preparation method of display panel characterized by comprising
Display module is provided, there are shaped openings, the substrate is close to the abnormity on the substrate edges of the display module
Opening is provided with the first telltale mark；
The described in any item flip chip substrates of Claims 1 to 5 are provided；
It is based on first telltale mark that the flip chip substrate is fixed on the substrate, the flip chip substrate
The trenching area is corresponding with the shaped openings；
Grooving processing is carried out to the trenching area, it is corresponding with the shaped openings to be formed on the flip chip substrate
Grooving.
7. preparation method according to claim 6, which is characterized in that the flip chip substrate is fixed on the substrate
On be to handle to realize by pressure welding, the temperature of pressure welding processing is 80~150 degrees Celsius.
8. preparation method according to claim 6, which is characterized in that further comprise:
There is the one side edge of the shaped openings along the substrate, the flip chip substrate of the grooving will be formed with
Be bent to the back side of the substrate, so as to the grooving in the projection of plane where the substrate with the shaped openings described
The projection overlapping of plane where substrate.
9. a kind of display panel, which is characterized in that the display panel is to utilize the described in any item methods of claim 6~8
Preparation.
10. a kind of display device, which is characterized in that including display panel as claimed in claim 9.
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| CN201811025753.2A CN109143644B (en) | 2018-09-04 | 2018-09-04 | Chip on film substrate, display panel, preparation method of display panel and display device |
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| CN201811025753.2A CN109143644B (en) | 2018-09-04 | 2018-09-04 | Chip on film substrate, display panel, preparation method of display panel and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110262108A (en) * | 2019-06-28 | 2019-09-20 | 厦门天马微电子有限公司 | Display panel and display device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050186702A1 (en) * | 2003-11-14 | 2005-08-25 | Munehide Saimen | Semiconductor device manufacturing method and manufacturing apparatus |
| CN102890348A (en) * | 2012-10-18 | 2013-01-23 | 深圳市华星光电技术有限公司 | COF (chip on film) base band, manufacturing method of COF base band, liquid crystal display module |
| CN103337490A (en) * | 2013-06-13 | 2013-10-02 | 友达光电股份有限公司 | Chip on film tape and chip on film structure |
| CN104008714A (en) * | 2013-02-27 | 2014-08-27 | 乐金显示有限公司 | Display apparatus |
| JP2014215464A (en) * | 2013-04-25 | 2014-11-17 | 三菱電機株式会社 | Display device |
| CN105575275A (en) * | 2016-03-07 | 2016-05-11 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof and display device |
| CN106773213A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN106783664A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of display module, binding detection method and binding system |
| CN107195642A (en) * | 2017-07-05 | 2017-09-22 | 京东方科技集团股份有限公司 | Flexible display panels and preparation method thereof, display device |
-
2018
- 2018-09-04 CN CN201811025753.2A patent/CN109143644B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050186702A1 (en) * | 2003-11-14 | 2005-08-25 | Munehide Saimen | Semiconductor device manufacturing method and manufacturing apparatus |
| CN102890348A (en) * | 2012-10-18 | 2013-01-23 | 深圳市华星光电技术有限公司 | COF (chip on film) base band, manufacturing method of COF base band, liquid crystal display module |
| CN104008714A (en) * | 2013-02-27 | 2014-08-27 | 乐金显示有限公司 | Display apparatus |
| JP2014215464A (en) * | 2013-04-25 | 2014-11-17 | 三菱電機株式会社 | Display device |
| CN103337490A (en) * | 2013-06-13 | 2013-10-02 | 友达光电股份有限公司 | Chip on film tape and chip on film structure |
| CN105575275A (en) * | 2016-03-07 | 2016-05-11 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof and display device |
| CN106773213A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN106783664A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of display module, binding detection method and binding system |
| CN107195642A (en) * | 2017-07-05 | 2017-09-22 | 京东方科技集团股份有限公司 | Flexible display panels and preparation method thereof, display device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110262108A (en) * | 2019-06-28 | 2019-09-20 | 厦门天马微电子有限公司 | Display panel and display device |
| CN110262108B (en) * | 2019-06-28 | 2022-07-01 | 厦门天马微电子有限公司 | Display panel and display device |
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| Publication number | Publication date |
|---|---|
| CN109143644B (en) | 2021-09-03 |
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