CN105430877B - The preparation method of flexible PCB, terminal and flexible PCB - Google Patents
The preparation method of flexible PCB, terminal and flexible PCB Download PDFInfo
- Publication number
- CN105430877B CN105430877B CN201511025174.4A CN201511025174A CN105430877B CN 105430877 B CN105430877 B CN 105430877B CN 201511025174 A CN201511025174 A CN 201511025174A CN 105430877 B CN105430877 B CN 105430877B
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- CN
- China
- Prior art keywords
- telltale mark
- flexible pcb
- solder mask
- auxiliary material
- plate body
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention discloses a kind of flexible PCB, the flexible PCB includes flexible plate body and the solder mask being set in the flexible plate body, the flexible PCB further includes telltale mark and auxiliary material conformable region, the auxiliary material conformable region is set to the flexible plate body with the telltale mark has the side of the solder mask, the telltale mark is set to the side of the auxiliary material conformable region, the telltale mark is in same lamination, and the material of the telltale mark is identical with the material of the solder mask with the solder mask.The flexible PCB can improve the precision of auxiliary material fitting, and manufacture craft is simple, can reduce the production cost of product.Invention additionally discloses a kind of terminal including the flexible PCB and a kind of preparation methods of flexible PCB.
Description
Technical field
The present invention relates to printed circuit board field more particularly to it is a kind of for be bonded with auxiliary material flexible PCB, including
The terminal of flexible PCB and the preparation method of flexible PCB.
Background technology
Flexible PCB (Flexible Printed Circuit, FPC) is printed by prepared by base material of flexible material
Circuit board processed has many advantages, such as that wiring density height, light weight, thickness are thin and material is soft, flexible, winding and folding, because
This, is widely used in the conducting system of modern various electronic products.Flexible PCB generally includes base material, cabling and insulation
Layer, and insulating layer is usually cover film and/or solder mask.During flexible PCB is applied to various electronic products, no
Various auxiliary materials are fitted with it with can avoiding, for example, often by the auxiliary materials such as high tempreture tape, conducting resinl, foam and flexibility
Circuit board is bonded by contraposition.In the prior art, be mostly by flexible PCB printing white printing label come pair
Position, i.e.,：Between flexible PCB is positioned over two openable and closable printing plates up and down, printing plate above is on flexible PCB
It needing to open up corresponding trepanning on the position of printing white printing label, be applied on printing plate above when merging two printing plate lids
When covering white oil, white oil drains to following flexible PCB from the trepanning and (is clipped in the flexible electrical between upper and lower two printing plates
Road plate) on, so as to stamping white marking on the corresponding position of the flexible PCB, to be used for when be bonded auxiliary material pair
Position.
However, the precision of such printing process in itself is very low, alignment tolerance is usually ± 0.2mm, therefore, is being bonded
It during auxiliary material, marks to align using the white oil, aligning accuracy is relatively low, easily makes auxiliary material patch inclined, so as to cause yield declines.This
Outside, printing white printing marks on flexible PCB, and a procedure has been had more on the basis of flexible PCB is prepared, excessively numerous
It is trivial, it is unfavorable for the reduction of cost.
Invention content
The technical problems to be solved by the invention are, provide a kind of flexible PCB, and the flexible PCB can carry
The precision of high adjunct fitting, and manufacture craft is simple, can reduce the production cost of product.
The present invention also provides a kind of preparation methods of flexible PCB.
In order to solve the above-mentioned technical problem, the present invention uses following technical scheme：
On the one hand, the embodiment provides flexible PCB, the flexible PCB include flexible plate body and
The solder mask being set in the flexible plate body, the flexible PCB further includes telltale mark and auxiliary material conformable region, described
Auxiliary material conformable region is set to the flexible plate body with the telltale mark has the side of the solder mask, the telltale mark
The side of the auxiliary material conformable region is set to, the telltale mark is in same lamination, and the positioning mark with the solder mask
The material of note is identical with the material of the solder mask.
Wherein, the inward flange of the telltale mark and the boundary alignment of the auxiliary material conformable region, the telltale mark and institute
It states solder mask to be made of photosensitive-ink, and the telltale mark is made with the solder mask in same procedure.
Wherein, the telltale mark is in continuous narrow line shape.
Wherein, the telltale mark is in discontinuous narrow line shape.
Wherein, the line width of the telltale mark is more than or equal to 0.1mm and less than or equal to 0.12mm.
Wherein, the flexible plate body includes base material and the routing layer being set on the base material, the solder mask and institute
Telltale mark is stated to be set on the routing layer.
Wherein, the flexible plate body includes base material, routing layer and cover film, and the routing layer and the cover film are successively
It is stacked on the base material, the solder mask and the telltale mark are set on the cover film.
On the other hand, the present invention also provides a kind of terminal, including the flexible PCB described in any of the above item.
In another aspect, the present invention also provides a kind of preparation method of flexible PCB, include the following steps：
The one flexible plate body for carrying auxiliary material conformable region is provided；
A photosensitive printing ink layer is coated in the flexible plate body；And
The photosensitive printing ink layer is exposed and developed, to form solder mask and telltale mark, makes the telltale mark
Inward flange be aligned with the outer edge of the auxiliary material conformable region.
Wherein, the telltale mark is in narrow line shape.
Wherein, the line width of the telltale mark is more than or equal to 0.1mm and less than or equal to 0.12mm.
Compared with prior art, technical scheme of the present invention has the advantages that：The flexible PCB of the present invention exists
Auxiliary material conformable region is provided with telltale mark, and the material of telltale mark and the material of solder mask are all photosensitive-ink so that fixed
Position label can simultaneously make in the process for making solder mask, without increasing other process, so as to make the flexibility
The preparation process of circuit board is simplified；Simultaneously as the techniques such as exposure, development may be used in telltale mark as solder mask
It makes, makes the white oil label that telltale mark prints than in the prior art finer, contraposition is more accurate, so as to improve auxiliary material fitting
Precision.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the schematic top plan view of the flexible PCB of first embodiment of the invention；
Fig. 2 is schematic cross-section of the flexible PCB shown in FIG. 1 along cutting line A-A；
Fig. 3 is the schematic top plan view of the flexible PCB of second embodiment of the invention；
Fig. 4 is the schematic cross-section of the flexible PCB of third embodiment of the invention；
Fig. 5 is the flow chart of the preparation method of the flexible PCB of the present invention；And
Fig. 6 to Fig. 8 is the process schematic of the preparation method of the flexible PCB of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention.
If some vocabulary is used to censure specific components in specification and claim.Those skilled in the art
, it is to be appreciated that hardware manufacturer may call same component without different nouns.This specification and claims are not
In a manner that the difference of title is used as and distinguishes component, but it is used as the criterion of differentiation with the difference of component functionally.Such as
Fruit is an open language in the "comprising" of specification in the whole text and claim mentioned in, therefore should be interpreted that and " include but not
It limits "." substantially " refer in acceptable error range, those skilled in the art can solve institute within a certain error range
Technical problem is stated, basically reaches the technique effect.
For ease of description, may be used herein such as " ... under ", " ... below ", " under ", " ... on ",
" on " etc. spaces relative terms elements or features as illustrated in the drawing and another (a little) elements or features are described
Relationship.It is appreciated that when an element or layer be referred to as another element or layer " on ", " being connected to " or " being couple to " another member
When part or layer, it can directly on another element or layer, be directly connected to or be couple to another element or layer or can deposit
In intervening elements or layer.In addition, " coupling " word is herein comprising any direct and indirect electric property coupling means.Therefore, it is if literary
Described in a first device be coupled to a second device, then represent the first device can be directly electrically coupled to it is described second dress
It puts or the second device indirectly electrically coupled through other devices or coupling means.
It is appreciated that terminology used here is merely to description specific embodiment, is not intended to limit the present invention.Herein
In use, clearly stating unless the context otherwise, otherwise singulative " one " and "the" are also intended to including plural form.Further
Ground, when used in this manual, term " comprising " and/or "comprising" show the feature, entirety, step, element and/or
The presence of component, but be not excluded for other one or more features, entirety, step, element, component and/or a combination thereof presence or
Increase.Specification subsequent descriptions are to implement the better embodiment of the present invention, and so description is to illustrate that the present invention's is general
For the purpose of principle, it is not limited to the scope of the present invention.Protection scope of the present invention is when regarding appended claims institute defender
Subject to.
Please refer to Fig.1 and Fig. 2, Fig. 1 be first embodiment of the invention flexible PCB schematic top plan view；Fig. 2 is Fig. 1
Schematic cross-section of the shown flexible PCB along cutting line A-A.In the present embodiment, flexible PCB includes flexible plate body
10 and the solder mask 20 that is set in the flexibility plate body 10.The flexibility plate body 10 includes base material 11 and routing layer 12, institute
It states routing layer 12 to be set on the base material 11, which can be etched by copper foil, specifically may include conducting wire and big copper
Face (not shown).The solder mask 20 is then set on the routing layer 12 of the flexible plate body 10, to the routing layer 12
Play welding resistance, insulation and protection.
Auxiliary material conformable region 30 is provided in the flexibility plate body 10, which corresponds to a part of routing layer
12, i.e., auxiliary material conformable region 30 is the subregion on 12 surface of routing layer, specifically, the auxiliary material conformable region 30 can be set
On the conducting wire and/or the big copper face of the routing layer 12.The shape of the auxiliary material conformable region 30 and the auxiliary material to be bonded (figure
In be not shown) shape it is consistent, can be but be not limited to circle, rectangle, polygon or irregular figure etc., the present embodiment
It is illustrated so that auxiliary material conformable region 30 is rectangle as an example.
In an embodiment of the present invention, the boundary of the auxiliary material conformable region 30 is provided with telltale mark 40, i.e., described auxiliary material
Conformable region 30 is surrounded in the region of routing layer 12 by the telltale mark 40, and the telltale mark 40 is in same with the solder mask 20
One lamination, the i.e. telltale mark 40 are made with the solder mask 20 in same procedure, the telltale mark 40 and institute
It states solder mask 20 to be all located on the routing layer 12, and the material of the telltale mark 40 is identical with the material of solder mask 20.Preferably
The material of ground, the telltale mark 40 and the solder mask 20 is all photosensitive-ink.
In an embodiment of the present invention, the telltale mark 40 can be continuous filament, along the auxiliary material conformable region
30 boundary setting forms a such as rectangular area in 30 1 weeks around the auxiliary material conformable region.For example, vertical view as shown in Figure 1, institute
The shape for stating auxiliary material conformable region 30 is rectangle, then the telltale mark 40 is the rectangle frame surrounded by continuous filament.Into
During row fitting auxiliary material, the periphery of auxiliary material is aligned with the filament (i.e. telltale mark 40), with the periphery exposed portion of auxiliary material or
All the filament is meets the requirements.Both since the material of telltale mark 40 is identical with the material of the solder mask 20, i.e.,
Material is photosensitive-ink, therefore, in the solder mask 20 for making the flexible PCB, can make the positioning mark simultaneously
Note 40, without increasing additional process, so as to simplify preparation process relative to the prior art.Further, since the positioning mark
Note 40 and the material of the solder mask 20 are all photosensitive-ink, therefore can be made by the techniques such as exposing, developing, this technique
Fine filament can be made, the line width that can specifically make the telltale mark 40 is more than or equal to 0.1mm and is less than or equal to
0.12mm.Therefore, when being bonded auxiliary material, error is small, and aligning accuracy is high.
In the present embodiment, the size of the auxiliary material conformable region 30 can be set as and the auxiliary material to be bonded
Size is consistent, and the inward flange of the telltale mark 40 is aligned with the periphery of the auxiliary material conformable region 30.Therefore, in fitting auxiliary material
When, the outer edge of auxiliary material with the inward flange of telltale mark 40 is aligned, so can not only improve the precision of auxiliary material fitting,
And manufacture craft is simple.
Referring to Fig. 3, Fig. 3 is the schematic top plan view of the flexible PCB of second embodiment of the invention.In the present embodiment
The structure of flexible PCB and the structure of the flexible PCB in the first embodiment and its respective figure are essentially identical, different
Part is：Telltale mark 40 is formed by discontinuous filament.
Specifically, in embodiments of the present invention, the telltale mark 40 is set as discontinuous filament, as shown in Figure 3
Vertical view, the shape of the auxiliary material conformable region 30 can be rectangle, then the telltale mark 40 is surrounded by discontinuous filament
Rectangle frame.The telltale mark 40 includes multiple breaking parts 41 and multiple continuous parts 42, multiple breaking part 41
The as part without photosensitive-ink, multiple continuous part 42 are to have photosensitive-ink part.In the conducting wire of the routing layer 12
In the case that 31 are located in the auxiliary material conformable region 30, which passes through corresponding disconnecting unit in the plane of the base material 11
Dividing 41, in a preferred embodiment as shown in Figure 3, a plurality of conducting wire 31 passes through corresponding breaking part 41 in the horizontal direction, so as to
It is alternatively arranged in the telltale mark 40.It is appreciated that being required according to specific cabling, a plurality of conducting wire 31 can be in the positioning mark
It vertically or oblique is alternatively arranged in note 40.Further, since the height of telltale mark 40 is equal to the height of the conducting wire 31,
And conducting wire 31 is set in corresponding breaking part 41, that is, the conducting wire 31 and the continuous part 42 of 41 both sides of breaking part are whole
It flushes, so as to make the edge of the auxiliary material conformable region 30 there is provided telltale mark 40 smooth, is conducive to improve pair during patch auxiliary material
Position precision, and enhance the adhesive force after auxiliary material fitting.
Referring to Fig. 4, Fig. 4 is the schematic cross-section of the flexible PCB of third embodiment of the invention.In the present embodiment
The structure of flexible PCB and the structure of the flexible PCB in above-mentioned first embodiment and its respective figure are essentially identical, different
Part is：Flexible plate body 10 includes base material 11, routing layer 12 and cover film 13, the routing layer 12 and the cover film 13
It being cascadingly set on the base material 11, the solder mask 20 and the telltale mark 40 are set on the cover film 13,
30 exposed portion cover film 13 of auxiliary material conformable region.
Flexible PCB not only include cover film but also including solder mask in the case of, existing technology is typically to pass through printing
White oil aligns, but the error of the two is all larger in cover film uplifting window.The present embodiment is in the auxiliary material fitting for exposing cover film
Alignment mark is provided on the boundary in area, and the material of alignment mark and the material of solder mask are all photosensitive-ink so that
The telltale mark can be made when manufacturing the process of the solder mask simultaneously, without increasing other manufacturing process, and then
It is simplified the preparation process of the flexible PCB.Further, since alignment mark may be used as solder mask exposure,
The techniques such as development make, and make the white oil label that the alignment mark prints than in the prior art finer, and contraposition is more accurate, so as to
Improve the precision of auxiliary material fitting.
The embodiment of the present invention also provides a kind of terminal, and the terminal includes flexible circuit described in any of the above embodiment
Plate.The products such as the terminal refers to but is not limited to mobile phone, laptop computer, tablet computer, POS machine and vehicle-mounted computer.
Referring to Fig. 5, Fig. 5 is the flow chart of the preparation method of the flexible PCB of the present invention, the embodiment of the present invention is also
A kind of preparation method for preparing above-mentioned flexible PCB is provided, the preparation method includes at least step S1, S2 and S3.It please one
And refering to Fig. 6 to Fig. 8, Fig. 6 to Fig. 8 is the process schematic of the preparation method of the flexible PCB of the present invention.
S1：The one flexible plate body for carrying auxiliary material conformable region is provided.
Specifically, as shown in fig. 6, flexible plate body 10 in the production process, can first be provided including base material and routing layer
Single sided board with copper foil, the single sided board include the base material and copper foil, by the copper foil of the single sided board through overexposure,
After the processes such as development, etching, the routing layer is obtained on the substrate；In the actual process of the manufacturing, according to specific
Auxiliary material fitting position, auxiliary material conformable region is marked off on the routing layer.
The flexibility plate body 10 can also include cover film, and the cover film is fitted on the routing layer, to described
Routing layer shields, at this point, the auxiliary material conformable region can be delimited on the cover film.
S2：A photosensitive printing ink layer is coated in the flexible plate body.
Specifically, as shown in fig. 7, coat photosensitive-ink by the method printing or be coated in flexible plate body 10, and
Cured, so as to form a photosensitive printing ink layer 20 '.
S3：The photosensitive printing ink layer is exposed and development treatment is to form solder mask and telltale mark, and is made described
The inward flange of telltale mark is aligned with the outer edge of the auxiliary material conformable region.
Specifically, as shown in figure 8, when being exposed to the photosensitive printing ink layer 20 ', in the photosensitive printing ink layer 20 '
A light shield is placed between a ultraviolet lamp, the ultraviolet lighting that the light shield sends out ultraviolet lamp is mapped in photosensitive printing ink layer 20 '
The position that form solder mask 20 and telltale mark 40, remaining position by way of masking then not by ultraviolet light,
So as to which the photosensitive printing ink layer 20 ' on the position of solder mask 20 and telltale mark 40 to be formed be made to crosslink reaction；During development,
The photosensitive-ink that the crosslinking reaction may not occur is washed off into (the sense on position not being mapped to i.e. by way of masking by ultraviolet lighting then
Light ink is washed off), so as to form solder mask 20 as shown in Figure 8 and telltale mark 40.Wherein, the telltale mark 40 is in company
Continuous or discontinuous narrow line shape, it is preferable that the width of the filament is more than or equal to 0.10mm and less than or equal to 0.12mm.
In conclusion in the preparation method of the flexible PCB of the embodiment of the present invention, the flexible PCB is in auxiliary material
Conformable region is provided with telltale mark, and the material of alignment mark and the material of solder mask are all photosensitive-ink so that is manufacturing
The telltale mark can be made during the process of the solder mask simultaneously, without increasing other manufacturing process, and then makes institute
The preparation process for stating flexible PCB is simplified.Further, since exposure, development etc. may be used in contraposition part as solder mask
Technique makes, and makes the white oil label that the telltale mark prints than in the prior art finer, contraposition is more accurate, auxiliary so as to improve
Expect the precision of fitting.
In the description of this specification, reference term " one embodiment ", " example ", " is specifically shown " some embodiments "
The description of example " or " some examples " etc. means to combine the embodiment or example particular features, structures, materials, or characteristics described
It is contained at least one embodiment of the present invention or example.In the present specification, schematic expression of the above terms differ
Surely identical embodiment or example are referred to.Moreover, the particular features, structures, materials, or characteristics of description can be any one
It is combined in an appropriate manner in a or multiple embodiments or example.
Embodiments described above does not form the restriction to the technical solution protection domain.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical solution
Within enclosing.
Claims (7)
1. a kind of flexible PCB, including flexible plate body and the solder mask being set in the flexible plate body, feature exists
In the flexible PCB further includes telltale mark and auxiliary material conformable region, and the auxiliary material conformable region is set with the telltale mark
There is the side of the solder mask in the flexible plate body, the telltale mark is set to the side of the auxiliary material conformable region,
The telltale mark is in same lamination, and the material of the telltale mark and the material phase of the solder mask with the solder mask
Together, the flexible plate body includes base material and the routing layer being set on the base material, the solder mask and the telltale mark
It is set on the routing layer, the telltale mark is discontinuous narrow line shape, and the telltale mark includes multiple disconnecting units
Point and multiple continuous parts, between the adjacent continuous part, the multiple breaking part is each breaking part
Part without photosensitive-ink, the multiple continuous part is has photosensitive-ink part, and the conducting wire of the routing layer is in the base material
Plane in pass through the corresponding breaking part.
2. flexible PCB as described in claim 1, which is characterized in that the inward flange of the telltale mark is pasted with the auxiliary material
The boundary alignment in area is closed, the telltale mark is made with the solder mask of photosensitive-ink, and the telltale mark and the resistance
Layer is made in same procedure.
3. flexible PCB as claimed in claim 2, which is characterized in that the line width of the telltale mark be more than or equal to
0.1mm and less than or equal to 0.12mm.
4. flexible PCB as described in any one of claims 1 to 3, which is characterized in that it is described flexibility plate body include base material,
Routing layer and cover film, the routing layer and the cover film are cascadingly set on the base material, the solder mask and institute
Telltale mark is stated to be set on the cover film.
5. a kind of terminal, which is characterized in that including Claims 1-4 any one of them flexible PCB.
6. a kind of preparation method of flexible PCB, which is characterized in that include the following steps：
A flexible plate body for carrying auxiliary material conformable region is provided, the flexibility plate body includes base material and is set on the base material
Routing layer,；
A photosensitive printing ink layer is coated in the flexible plate body；And
The photosensitive printing ink layer is exposed and developed, to form solder mask and telltale mark, makes the interior of the telltale mark
Edge is aligned with the outer edge of the auxiliary material conformable region, and the solder mask and the telltale mark are set on the routing layer,
The telltale mark is discontinuous narrow line shape, and the telltale mark includes multiple breaking parts and multiple continuous parts, respectively
The breaking part is between the adjacent continuous part, part of the multiple breaking part for no photosensitive-ink, institute
Multiple continuous parts are stated to there is photosensitive-ink part, the conducting wire of the routing layer passes through corresponding institute in the plane of the base material
State breaking part.
7. preparation method as claimed in claim 6, which is characterized in that the line width of the telltale mark is more than or equal to 0.1mm
And less than or equal to 0.12mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201511025174.4A CN105430877B (en) | 2015-12-29 | 2015-12-29 | The preparation method of flexible PCB, terminal and flexible PCB |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201511025174.4A CN105430877B (en) | 2015-12-29 | 2015-12-29 | The preparation method of flexible PCB, terminal and flexible PCB |
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| CN105430877A CN105430877A (en) | 2016-03-23 |
| CN105430877B true CN105430877B (en) | 2018-06-29 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304618A (en) * | 2016-08-30 | 2017-01-04 | 张家港康得新光电材料有限公司 | Circuit board fit area and the alignment method of conductive adhesive layer |
| CN106358363A (en) * | 2016-11-18 | 2017-01-25 | 广东小天才科技有限公司 | Printed circuit board designing method, printed circuit board and terminal equipment |
| CN107846779A (en) * | 2017-10-24 | 2018-03-27 | 广东欧珀移动通信有限公司 | Preparation method, flexible PCB and the mobile terminal of flexible PCB |
| CN107623988A (en) * | 2017-10-24 | 2018-01-23 | 广东欧珀移动通信有限公司 | Preparation method, flexible PCB and the mobile terminal of flexible PCB |
| CN108565359A (en) * | 2018-02-07 | 2018-09-21 | 上海瀚莅电子科技有限公司 | The alignment device and manufacturing system of silicon substrate OLED micro-displays |
| CN108322999B (en) * | 2018-03-30 | 2020-09-04 | 成都奕斯伟芯片设计有限公司 | Circuit board, method for forming solder mask layer of circuit board and chip |
| CN111652248B (en) * | 2020-06-02 | 2023-08-08 | 上海岭先机器人科技股份有限公司 | Positioning method and device for flexible cloth |
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| JP3042641B2 (en) * | 1991-11-07 | 2000-05-15 | イビデン株式会社 | Printed wiring board |
| JP3575523B2 (en) * | 1998-07-10 | 2004-10-13 | ローム株式会社 | Method of manufacturing circuit board for electronic device |
| JP2007019280A (en) * | 2005-07-08 | 2007-01-25 | Fuji Electric Fa Components & Systems Co Ltd | Position recognition mark and printed board therewith |
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| CN103796417A (en) * | 2012-10-31 | 2014-05-14 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacture method thereof |
| CN204291571U (en) * | 2014-12-19 | 2015-04-22 | 上海斐讯数据通信技术有限公司 | A kind of printed circuit board |
| CN204669710U (en) * | 2015-03-16 | 2015-09-23 | 建业科技电子（惠州）有限公司 | A kind of printed substrate with novel aligning structure |
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