CN204291571U - A kind of printed circuit board - Google Patents
A kind of printed circuit board Download PDFInfo
- Publication number
- CN204291571U CN204291571U CN201420838096.4U CN201420838096U CN204291571U CN 204291571 U CN204291571 U CN 204291571U CN 201420838096 U CN201420838096 U CN 201420838096U CN 204291571 U CN204291571 U CN 204291571U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- conductive layer
- identified areas
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of printed circuit board, described printed circuit board comprises a conductive layer, also comprise: a solder mask, be covered in the upper surface of described conductive layer, and described solder mask is provided with the identified areas of hollow out, in order to described conductive layer to be exposed to described printed circuit board surface, described identified areas is positioned over the position of components and parts on described printed circuit board in order to mark.The utility model adopts the identified areas of hollow out that conductive layer is exposed to printed circuit board surface, by identified areas mark components and parts placement position on a printed circuit board, the gap between components and parts can be decreased, and the area of printed circuit board, can reach and meet densification, miniaturized object.
Description
Technical field
The utility model relates to printed circuit board (Printed Circuit Board, PCB) technical field, particularly relates to a kind of printed circuit board replacing silk-screen circuit board.
Background technology
Due to constantly reducing of mobile terminal product size, the size of corresponding pcb board is also constantly diminishing.More and more higher to the integration level necessitates of pcb board, the components and parts of surface patch also get more and more, the circuit on pcb board and device also more and more intensive, the gap between device and device is also continuous to be reduced.Traditional pcb board surface adopts white silk-screen announcer part profile or symbol usually, this representation needs there is larger gap between device, and pcb board needs leave more white space, the area taken is comparatively large, is difficult to meet densification, miniaturized requirement.
Utility model content
For the problems referred to above that existing pcb board exists, now provide a kind of and be intended to realize that integrated level is high, the printed circuit board of densification and miniaturization.
Concrete technical scheme is as follows:
A kind of printed circuit board, comprises a conductive layer, also comprises:
One solder mask, be covered in the upper surface of described conductive layer, and described solder mask is provided with the identified areas of hollow out, in order to described conductive layer to be exposed to described printed circuit board surface, described identified areas is positioned over the position of components and parts on described printed circuit board in order to mark.
Preferably, the material that described conductive layer adopts is copper.
Preferably, described identified areas is rectangular.
Preferably, be provided with on described printed circuit board surface the described identified areas adopting corner structure relative to a pair diagonal zones of described components and parts.
Preferably, described printed circuit board is provided with via hole.
Preferably, described printed circuit board is provided with blind hole.
The beneficial effect of technique scheme:
The technical program adopts the identified areas of hollow out that conductive layer is exposed to printed circuit board surface, by identified areas mark components and parts placement position on a printed circuit board, the gap between components and parts can be decreased, and the area of printed circuit board, can reach and meet densification, miniaturized object.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of embodiment of printed circuit board described in the utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of the utility model protection.
It should be noted that, when not conflicting, the embodiment in the utility model and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, but not as restriction of the present utility model.
The Making programme of existing pcb board is followed successively by: blanking, boring, heavy copper, copper facing, Graphic transitions, graphic plating, candle are carved, moved back tin, dry film solder mask, change gold, spray tin, character, punching press and electrical measurement.
In the technical program, as shown in Figure 1, printed circuit board can comprise a conductive layer, also comprise: solder mask, be covered in the upper surface of conductive layer, and solder mask is provided with the identified areas of hollow out, in order to conductive layer is exposed to printed circuit board surface, identified areas is positioned over the position of components and parts on printed circuit board in order to mark.
The flow process of character in the Making programme of above-mentioned pcb board can be dispensed in the manufacturing process of printed circuit board in the present embodiment, save Production Time, reduce costs.Adopt the identified areas of hollow out that conductive layer is exposed to printed circuit board surface, by identified areas mark components and parts placement position on a printed circuit board, the gap between components and parts can be decreased, and the area of printed circuit board, can reach and meet densification, miniaturized object.
In a preferred embodiment, the material that conductive layer adopts is copper.Copper has good ductility, conductivity and thermal conductivity.The color of the metallic copper of identified areas and the different of solder mask, not only have conducting function, also have identification function in the present embodiment.
As shown in Figure 1, in a preferred embodiment, the rectangular A of identified areas.
In a preferred embodiment, be provided with on printed circuit board surface the identified areas adopting corner structure B relative to any pair diagonal zones of components and parts.
Further, also relative to the integral edge region of components and parts, identified areas can be set, with the position of representation element device on printed circuit board surface.
In a preferred embodiment, printed circuit board is provided with via hole.Via hole gets through from the top layer of printed circuit board to bottom, can facilitate printed circuit board location when mounted and fixing.
In a preferred embodiment, printed circuit board is provided with blind hole, and blind hole only sees at the top layer of printed circuit board or bottom one deck wherein.
The foregoing is only the utility model preferred embodiment; not thereby execution mode of the present utility model and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilization the utility model specifications and diagramatic content and apparent change obtain in protection range of the present utility model.
Claims (6)
1. a printed circuit board, comprises a conductive layer, it is characterized in that, also comprise:
One solder mask, be covered in the upper surface of described conductive layer, and described solder mask is provided with the identified areas of hollow out, in order to described conductive layer to be exposed to described printed circuit board surface, described identified areas is positioned over the position of components and parts on described printed circuit board in order to mark.
2. printed circuit board as claimed in claim 1, is characterized in that, the material that described conductive layer adopts is copper.
3. printed circuit board as claimed in claim 1, it is characterized in that, described identified areas is rectangular.
4. printed circuit board as claimed in claim 1, is characterized in that, is provided with on described printed circuit board surface the described identified areas adopting corner structure relative to a pair diagonal zones of described components and parts.
5. printed circuit board as claimed in claim 1, it is characterized in that, described printed circuit board is provided with via hole.
6. printed circuit board as claimed in claim 1, it is characterized in that, described printed circuit board is provided with blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420838096.4U CN204291571U (en) | 2014-12-19 | 2014-12-19 | A kind of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420838096.4U CN204291571U (en) | 2014-12-19 | 2014-12-19 | A kind of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204291571U true CN204291571U (en) | 2015-04-22 |
Family
ID=52874695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420838096.4U Expired - Fee Related CN204291571U (en) | 2014-12-19 | 2014-12-19 | A kind of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204291571U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105263258A (en) * | 2015-11-06 | 2016-01-20 | 广东欧珀移动通信有限公司 | Flexible circuit board and method for setting positioning logo for the flexible circuit board |
| CN105430879A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board and terminal |
| CN105430877A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board, terminal and preparation method of flexible circuit board |
| CN105578717A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board and terminal |
| CN106304608A (en) * | 2015-05-26 | 2017-01-04 | 展讯通信（上海）有限公司 | Printed circuit board (PCB) and preparation method thereof |
| CN106413243A (en) * | 2016-10-31 | 2017-02-15 | 努比亚技术有限公司 | Substrate and circuit board |
-
2014
- 2014-12-19 CN CN201420838096.4U patent/CN204291571U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304608A (en) * | 2015-05-26 | 2017-01-04 | 展讯通信（上海）有限公司 | Printed circuit board (PCB) and preparation method thereof |
| CN105263258A (en) * | 2015-11-06 | 2016-01-20 | 广东欧珀移动通信有限公司 | Flexible circuit board and method for setting positioning logo for the flexible circuit board |
| CN105430879A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board and terminal |
| CN105430877A (en) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | Flexible circuit board, terminal and preparation method of flexible circuit board |
| CN105578717A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board and terminal |
| CN105430877B (en) * | 2015-12-29 | 2018-06-29 | 广东欧珀移动通信有限公司 | The preparation method of flexible PCB, terminal and flexible PCB |
| CN105578717B (en) * | 2015-12-29 | 2018-07-06 | 广东欧珀移动通信有限公司 | Flexible PCB and terminal |
| CN106413243A (en) * | 2016-10-31 | 2017-02-15 | 努比亚技术有限公司 | Substrate and circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20181219 |