CN105578767B - A kind of production method of PCB stepped grooves - Google Patents
A kind of production method of PCB stepped grooves Download PDFInfo
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- CN105578767B CN105578767B CN201510930241.0A CN201510930241A CN105578767B CN 105578767 B CN105578767 B CN 105578767B CN 201510930241 A CN201510930241 A CN 201510930241A CN 105578767 B CN105578767 B CN 105578767B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention discloses a kind of production method of PCB stepped grooves, includes the following steps：S10, stepped groove is opened up on PCB, boss is reserved at the non-copper facing position of the side wall of the stepped groove；S20, whole plate electro-coppering is carried out to PCB, makes the side wall and bottom covering layers of copper of the stepped groove；Boss in S30, the removal stepped groove, enables the layers of copper that boss surface covers be synchronized removal, the sidewall surfaces no copper layer of boss corresponding position is made to cover.The present invention provides a kind of production method of PCB stepped grooves, realizes the copper electroplating layer on the regional area of the side wall of stepped groove.
Description
Technical field
The present invention relates to PCB manufacture technology fields more particularly to a kind of production methods of PCB stepped grooves.
Background technology
Common stepped groove in PCB can be roughly divided into heavy copper stepped groove and non-heavy two class of copper stepped groove, in practical applications,
Sometimes there can be a variety of different stepped grooves on one piece of PCB, and there is influencing each other functionally between stepped groove, such as
Heavy copper stepped groove is nearby designed with non-heavy copper stepped groove, which is waveguide mouth, and the another side of stepped groove has radio frequency
Line designs, then the copper of the side wall of the heavy copper stepped groove adjacent with the non-heavy copper stepped groove can influence signal, it is therefore desirable in heavy copper
Ladder groove sidewall locally scrapes off copper, forms the special-shaped stepped groove of the discontinuous plating of side wall.Based on the above situation, it is necessary to set for we
A kind of production method of special stepped groove is counted to realize above-mentioned special-shaped ladder slot structure.
Invention content
It is an object of the present invention to：A kind of production method of PCB stepped grooves is provided, realizes the side wall in stepped groove
Copper electroplating layer on regional area.
It is an object of the present invention to：A kind of production method of PCB stepped grooves is provided, by reserved boss and is being electroplated
Boss realization is removed afterwards and forms discrete electroplated layer on the side wall of stepped groove, and this method is simple, reliable, is easy to apply and carry
High efficiency.
For this purpose, the present invention uses following technical scheme：
A kind of production method of PCB stepped grooves, includes the following steps：
S10, stepped groove is opened up on PCB, boss is reserved at the non-copper facing position of the side wall of the stepped groove；
S20, whole plate electro-coppering is carried out to PCB, makes the side wall and bottom covering layers of copper of the stepped groove；
Boss in S30, the removal stepped groove, enables the layers of copper that boss surface covers be synchronized removal, boss is made to correspond to
The sidewall surfaces no copper layer of position covers.
Preferably, in step slo, the processing method for opening up the stepped groove is Milling Machining.
Preferably, the horizontal cross-section of the boss is trapezoidal either rectangle or semicircle.
Preferably, in step s 30, the processing method for removing the boss is Milling Machining.
Preferably, if the stepped groove opened up be from L1 layers of milling to Ln layers (i.e. since L1 layers of side Milling Machining, until
The medium between Ln layers and Ln-1 layers is worn in milling, and Ln layers of circuit layer retain), then the internal layer film of Ln layers of ladder groove location needs to spread
Copper.Wherein, n is natural number.If the stepped groove opened up is from the metal derby inside L1 layers of milling to PCB (i.e. from L1 layers of side
Start Milling Machining makes the bottom of the stepped groove be located in the metal derby until milling to the metal derby), ladder described in side
The inner figure of groove location is without particular/special requirement.
Specifically, boss is arranged in the sidewall areas that the present invention is required in no copper facing, is then removed after whole copper facing convex
Platform makes sidewall areas corresponding to boss without copper facing, to realize stepped groove side wall local copper facing, this method process letter
List is easily achieved, being capable of effectively save production cost and raising production efficiency.
As a kind of perferred technical scheme, further comprising the steps of between step S20 and step S30：
S21, outer layer dry film is made on PCB；
S22, graphic plating tin is carried out to PCB, makes the side wall and bottom covering tin layers of the stepped groove.
Preferably, the outer layer dry film is using any one in solvent type dry film, water-soluble dry films and exfoliated dry film.
As a kind of perferred technical scheme, further comprising the steps of after step S30：
S40, the position spraying etching resisting ink for having removed boss is corresponded to the bottom of the stepped groove, with to the stepped groove
The dew copper of bottom protected.
As a kind of perferred technical scheme, after the step s 40, further comprising the steps of：
S50, outer graphics are etched on PCB；
S60, the tin layers and the etching resisting ink are removed.
As a kind of perferred technical scheme, further comprising the steps of before step S10：
S01, inner figure is made on daughter board；
S02, several daughter boards are pressed to form PCB.
As a kind of perferred technical scheme, the height of the boss is equal to the depth of the stepped groove.
As a kind of perferred technical scheme, the width of one end that the boss is connect with the side wall is not less than non-copper facing
The requirement width at position.
Specifically, if the horizontal cross-section of the boss is trapezoidal or semicircle, the boss is connect with the side wall
One end width be more than non-copper facing position requirement width；If the horizontal cross-section of the boss is rectangle, the boss with
The width of one end of the side wall connection is equal to the requirement width at non-copper facing position.
As a kind of perferred technical scheme, the width of one end that the boss is connect with the side wall is than non-copper facing position
Big 1mil or more the 2mil or less of requirement width.
Preferably, the width of one end that the boss is connect with the side wall is bigger than the requirement width at non-copper facing position
1.1mil or 1.2mil or 1.3mil or 1.4mil or 1.5mil or 1.6mil or 1.7mil or 1.8mil or 1.9mil.
Preferably, the boss between the one end of one end of the side wall and the boss far from the side wall away from
From in 1.0mm or more 1.9mm or less.
Further, the boss is between the one end of one end of the side wall and the boss far from the side wall
Distance is 1.1mm or 1.2mm or 1.3mm or 1.4mm or 1.5mm or 1.6mm or 1.7mm or 1.8mm.
As a kind of perferred technical scheme, in step slo, stepped groove described in the practical side ratio of the stepped groove
Design unilateral big 1mil or more the 2mil or less of the length of side.
Preferably, the unilateral big 1.1mil or 1.2mil of the design length of side of stepped groove described in the practical side ratio of the stepped groove
Or 1.3mil or 1.4mil or 1.5mil or 1.6mil or 1.7mil or 1.8mil or 1.9mil.
As a kind of perferred technical scheme, in step s 30, working depth when removing the boss is than step S10
Small 1.5mil or more the 2.5mil or less of working depth when opening up the stepped groove.
Preferably, working depth when working depth when removing the boss opens up the stepped groove than step S10 is small
1.6mil or 1.7mil or 1.8mil or 1.9mil or 2.0mil or 2.1mil or 2.2mil or 2.3mil or 2.4mil.
Beneficial effects of the present invention are：A kind of production method of PCB stepped grooves is provided, realizes the office in the side wall of stepped groove
Copper electroplating layer on portion region.It is formed on the side wall of stepped groove in addition, being realized by reserved boss and after plating removal boss
Discrete electroplated layer, this method is simple, reliable, is easy to apply and improve production efficiency.
Description of the drawings
Below according to drawings and examples, invention is further described in detail.
Fig. 1 is the flow diagram of the production method of the PCB stepped grooves described in embodiment；
Figure 1A is that the step described in embodiment presses the structural schematic diagram to form PCB；
Fig. 2A is that the step described in embodiment opens up stepped groove and reserves the structural schematic diagram of boss；
Fig. 3 A are that the step described in embodiment opens up stepped groove and reserves the vertical view of boss；
Fig. 4 A are the structural schematic diagram of the step electro-coppering described in embodiment；
Fig. 5 A are the structural schematic diagram of the step electrotinning described in embodiment；
Fig. 6 A are the structural schematic diagram of the step removal boss described in embodiment；
Fig. 7 A are the vertical view of the step removal boss described in embodiment；
Fig. 8 A are the structural schematic diagram of the step spraying etching resisting ink described in embodiment；
Figure 1B is that the step described in embodiment presses another structural schematic diagram to form PCB；
Fig. 2 B are that the step described in embodiment opens up stepped groove and reserves another structural schematic diagram of boss；
Fig. 3 B are that the step described in embodiment opens up stepped groove and reserves another vertical view of boss；
Fig. 4 B are another structural schematic diagram of the step electro-coppering described in embodiment；
Fig. 5 B are another structural schematic diagram of the step electrotinning described in embodiment；
Fig. 6 B are another structural schematic diagram of the step removal boss described in embodiment；
Fig. 7 B are another vertical view of the step removal boss described in embodiment；
Fig. 8 B are another structural schematic diagram of the step spraying etching resisting ink described in embodiment.
In figure：
1, daughter board；11, L1 layers；12, L2 layers；2, stepped groove；21, boss；3, layers of copper；4, tin layers；5, etching resisting ink；6, golden
Belong to block.
Specific implementation mode
Technical solution to further illustrate the present invention below with reference to the accompanying drawings and specific embodiments.
Embodiment one：
As shown in Figure 1, a kind of production method of PCB stepped grooves, includes the following steps：
S01, inner figure is made on daughter board 1；
S02, the pressing of several daughter boards 1 is formed into PCB, as shown in Figure 1A；
S10, stepped groove 2 is opened up on PCB, reserve boss 21 at the non-copper facing position of the side wall of the stepped groove 2, such as scheme
Shown in 2A and 3A；
S20, whole plate electro-coppering is carried out to PCB, makes the side wall and bottom covering layers of copper 3 of the stepped groove 2, such as Fig. 4 A institutes
Show；
S21, outer layer dry film is made on PCB；
S22, graphic plating tin is carried out to PCB, makes the side wall and bottom covering tin layers 4 of the stepped groove 2, such as Fig. 5 A institutes
Show；
S30, boss 21 in the stepped groove 2 is removed, enables the layers of copper 3 that 21 surface of boss covers be removed by synchronous, makes convex
The sidewall surfaces no copper layer 3 of 21 corresponding position of platform covers, as illustrated in figs. 6 a and 7；
S40, the position spraying etching resisting ink 5 for having removed boss 21 is corresponded to the bottom of the stepped groove 2, with to the rank
The dew copper of the bottom of terraced slot 2 is protected, as shown in Figure 8 A；
S50, outer graphics are etched on PCB；
S60, the tin layers 4 and the etching resisting ink 5 are removed.
Specifically, boss 21 is arranged in the sidewall areas that the present invention is required in no copper facing, is then removed after whole copper facing
Boss 21 makes sidewall areas corresponding to boss 21 without copper facing, to realize stepped groove 2 side wall local copper facing, this method
Process is simple, is easily achieved, being capable of effectively save production cost and raising production efficiency.
In this present embodiment, the stepped groove 2 opened up be from 11 milling of L1 layers to L2 layers 12 (i.e. since 11 side of L1 layers
Milling Machining, until the medium between L1 layers 11 and L2 layers 12 is worn in milling, and 12 circuit layer of L2 layers retains), 12 stepped groove of L2 layers, 2 position
The internal layer film be equipped with copper.
In this present embodiment, in step slo, the processing method for opening up the stepped groove 2 is Milling Machining.In step S30
In, the processing method for removing the boss 21 is Milling Machining.
The horizontal cross-section of the boss 21 is trapezoidal either rectangle or semicircle.In this present embodiment, the boss 21
Horizontal cross-section be trapezoidal.
The outer layer dry film uses any one in solvent type dry film, water-soluble dry films and exfoliated dry film.Yu Benshi
It applies in example, the outer layer dry film uses solvent type dry film.
In this present embodiment, the height of the boss 21 is equal to the depth of the stepped groove 2.The boss 21 and the side
The width of one end of wall connection is bigger 1mil than the requirement width at non-copper facing position.The boss 21 close to one end of the side wall with
The distance between the one end of the boss 21 far from the side wall is 1.0mm.In step slo, the practical side of the stepped groove 2
Length is more unilateral big 1mil than the design length of side of the stepped groove 2.In step s 30, the working depth ratio when boss 21 is removed
Step S10 opens up the small 1.5mil of working depth when the stepped groove 2.
Embodiment two：
As shown in Figure 1, a kind of production method of PCB stepped grooves, includes the following steps：
S01, inner figure is made on daughter board 1；
S02, the pressing of several daughter boards 1 is formed into PCB, as shown in Figure 1B；
S10, stepped groove 2 is opened up on PCB, reserve boss 21 at the non-copper facing position of the side wall of the stepped groove 2, such as scheme
Shown in 2B and 3B；
S20, whole plate electro-coppering is carried out to PCB, makes the side wall and bottom covering layers of copper 3 of the stepped groove 2, such as Fig. 4 B institutes
Show；
S21, outer layer dry film is made on PCB；
S22, graphic plating tin is carried out to PCB, makes the side wall and bottom covering tin layers 4 of the stepped groove 2, such as Fig. 5 B institutes
Show；
S30, boss 21 in the stepped groove 2 is removed, enables the layers of copper 3 that 21 surface of boss covers be removed by synchronous, makes convex
The sidewall surfaces no copper layer 3 of 21 corresponding position of platform covers, as shown in figs. 6 b and 7b；
S40, the position spraying etching resisting ink 5 for having removed boss 21 is corresponded to the bottom of the stepped groove 2, with to the rank
The dew copper of the bottom of terraced slot 2 is protected, as shown in Figure 8 B；
S50, outer graphics are etched on PCB；
S60, the tin layers 4 and the etching resisting ink 5 are removed.
Specifically, boss 21 is arranged in the sidewall areas that the present invention is required in no copper facing, is then removed after whole copper facing
Boss 21 makes sidewall areas corresponding to boss 21 without copper facing, to realize stepped groove 2 side wall local copper facing, this method
Process is simple, is easily achieved, being capable of effectively save production cost and raising production efficiency.
In this present embodiment, the stepped groove 2 opened up is from the metal derby 6 inside 11 milling to PCB of L1 layers, i.e., from L1 layers
11 sides start Milling Machining, until milling to the metal derby 6, the bottom of the stepped groove 2 are made to be located in the metal derby 6.
In this present embodiment, in step slo, the processing method for opening up the stepped groove 2 is Milling Machining.In step S30
In, the processing method for removing the boss 21 is Milling Machining.
The horizontal cross-section of the boss 21 is trapezoidal either rectangle or semicircle.In this present embodiment, the boss 21
Horizontal cross-section be rectangle.
The outer layer dry film uses any one in solvent type dry film, water-soluble dry films and exfoliated dry film.Yu Benshi
It applies in example, the outer layer dry film uses water-soluble dry films.
In this present embodiment, the height of the boss 21 is equal to the depth of the stepped groove 2.The boss 21 and the side
The width of one end of wall connection is equal to the requirement width at non-copper facing position.The boss 21 close to one end of the side wall with it is described
The distance between the one end of boss 21 far from the side wall is 1.9mm.In step slo, the practical side ratio of the stepped groove 2
The unilateral big 2mil of the design length of side of the stepped groove 2.In step s 30, working depth when removing the boss 21 compares step
S10 opens up the small 2.5mil of working depth when the stepped groove 2.
Embodiment three：
As shown in Figure 1, a kind of production method of PCB stepped grooves, includes the following steps：
S01, inner figure is made on daughter board 1；
S02, the pressing of several daughter boards 1 is formed into PCB, as shown in Figure 1A；
S10, stepped groove 2 is opened up on PCB, reserve boss 21 at the non-copper facing position of the side wall of the stepped groove 2, such as scheme
Shown in 2A and 3A；
S20, whole plate electro-coppering is carried out to PCB, makes the side wall and bottom covering layers of copper 3 of the stepped groove 2, such as Fig. 4 A institutes
Show；
S21, outer layer dry film is made on PCB；
S22, graphic plating tin is carried out to PCB, makes the side wall and bottom covering tin layers 4 of the stepped groove 2, such as Fig. 5 A institutes
Show；
S30, boss 21 in the stepped groove 2 is removed, enables the layers of copper 3 that 21 surface of boss covers be removed by synchronous, makes convex
The sidewall surfaces no copper layer 3 of 21 corresponding position of platform covers, as illustrated in figs. 6 a and 7；
S40, the position spraying etching resisting ink 5 for having removed boss 21 is corresponded to the bottom of the stepped groove 2, with to the rank
The dew copper of the bottom of terraced slot 2 is protected, as shown in Figure 8 A；
S50, outer graphics are etched on PCB；
S60, the tin layers 4 and the etching resisting ink 5 are removed.
Specifically, boss 21 is arranged in the sidewall areas that the present invention is required in no copper facing, is then removed after whole copper facing
Boss 21 makes sidewall areas corresponding to boss 21 without copper facing, to realize stepped groove 2 side wall local copper facing, this method
Process is simple, is easily achieved, being capable of effectively save production cost and raising production efficiency.
In this present embodiment, the stepped groove 2 opened up be from 11 milling of L1 layers to L2 layers 12 (i.e. since 11 side of L1 layers
Milling Machining, until the medium between L1 layers 11 and L2 layers 12 is worn in milling, and 12 circuit layer of L2 layers retains), 12 stepped groove of L2 layers, 2 position
The internal layer film be equipped with copper.
In this present embodiment, in step slo, the processing method for opening up the stepped groove 2 is Milling Machining.In step S30
In, the processing method for removing the boss 21 is Milling Machining.
The horizontal cross-section of the boss 21 is trapezoidal either rectangle or semicircle.In this present embodiment, the boss 21
Horizontal cross-section be semicircle.
The outer layer dry film uses any one in solvent type dry film, water-soluble dry films and exfoliated dry film.Yu Benshi
It applies in example, the outer layer dry film uses exfoliated dry film.
In this present embodiment, the height of the boss 21 is equal to the depth of the stepped groove 2.The boss 21 and the side
The width of one end of wall connection is bigger 2mil than the requirement width at non-copper facing position.The boss 21 close to one end of the side wall with
The distance between the one end of the boss 21 far from the side wall is 1.5mm.In step slo, the practical side of the stepped groove 2
Length is more unilateral big 1.5mil than the design length of side of the stepped groove 2.In step s 30, the working depth when boss 21 is removed
The small 2.0mil of working depth when opening up the stepped groove 2 than step S10.
It is to be understood that above-mentioned specific implementation mode is only that presently preferred embodiments of the present invention and institute's application technology are former
Reason, in technical scope disclosed in this invention, variation that any one skilled in the art is readily apparent that or
It replaces, should all cover within the scope of the present invention.
Claims (10)
1. a kind of production method of PCB stepped grooves, which is characterized in that include the following steps：
S10, stepped groove is opened up on PCB, boss, the water of the boss are reserved at the non-copper facing position of the side wall of the stepped groove
Plane section is trapezoidal either rectangle or semicircle；
S20, whole plate electro-coppering is carried out to PCB, makes the side wall and bottom covering layers of copper of the stepped groove；
Boss in S30, the removal stepped groove, enables the layers of copper that boss surface covers be synchronized removal, makes boss corresponding position
Sidewall surfaces no copper layer covering.
2. a kind of production method of PCB stepped grooves according to claim 1, which is characterized in that in step S20 and step
It is further comprising the steps of between S30：
S21, outer layer dry film is made on PCB；
S22, graphic plating tin is carried out to PCB, makes the side wall and bottom covering tin layers of the stepped groove.
3. a kind of production method of PCB stepped grooves according to claim 2, which is characterized in that after step S30, also
Include the following steps：
S40, the position spraying etching resisting ink for having removed boss is corresponded to the bottom of the stepped groove, with the bottom to the stepped groove
The dew copper in portion is protected.
4. a kind of production method of PCB stepped grooves according to claim 3, which is characterized in that after the step s 40, also
Include the following steps：
S50, outer graphics are etched on PCB；
S60, the tin layers and the etching resisting ink are removed.
5. a kind of production method of PCB stepped grooves according to claim 1, which is characterized in that before step S10, also
Include the following steps：
S01, inner figure is made on daughter board；
S02, several daughter boards are pressed to form PCB.
6. a kind of production method of PCB stepped grooves according to any one of claims 1 to 5, which is characterized in that the boss
Height be equal to the stepped groove depth.
7. a kind of production method of PCB stepped grooves according to any one of claims 1 to 5, which is characterized in that the boss
The width of the one end being connect with the side wall is not less than the requirement width at non-copper facing position.
8. a kind of production method of PCB stepped grooves according to claim 7, which is characterized in that the boss and the side
The width of one end of wall connection is bigger 1mil or more 2mil or less than the requirement width at non-copper facing position.
9. a kind of production method of PCB stepped grooves according to any one of claims 1 to 5, which is characterized in that in step
In S10, unilateral big 1mil or more the 2mil or less of the design length of side of stepped groove described in the practical side ratio of the stepped groove.
10. a kind of production method of PCB stepped grooves according to any one of claims 1 to 5, which is characterized in that in step
In S30, working depth when removing the boss opens up the small 1.5mil or more of working depth when the stepped groove than step S10
2.5mil following.
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| CN201510930241.0A CN105578767B (en) | 2015-12-14 | 2015-12-14 | A kind of production method of PCB stepped grooves |
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| CN201510930241.0A CN105578767B (en) | 2015-12-14 | 2015-12-14 | A kind of production method of PCB stepped grooves |
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| CN105578767B true CN105578767B (en) | 2018-09-25 |
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| CN110691476B (en) * | 2019-08-27 | 2021-05-04 | 东莞康源电子有限公司 | Cavity opening processing method for protecting PCB inner layer circuit by adopting wet film |
| CN113411977B (en) * | 2021-06-30 | 2022-07-12 | 生益电子股份有限公司 | Manufacturing method of stepped groove and circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102497737A (en) * | 2011-12-23 | 2012-06-13 | 东莞生益电子有限公司 | Method for manufacturing printed circuit board (PCB) with step-shaped grooves |
| CN104582272A (en) * | 2013-10-09 | 2015-04-29 | 珠海方正科技高密电子有限公司 | Method and device for manufacturing metalized step trough on side wall |
| CN104582271A (en) * | 2013-10-09 | 2015-04-29 | 北大方正集团有限公司 | Manufacturing method of power amplification tank, printed circuit board with power amplification tank and manufacturing method of printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6848912B2 (en) * | 2002-12-12 | 2005-02-01 | Broadcom Corporation | Via providing multiple electrically conductive paths through a circuit board |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102497737A (en) * | 2011-12-23 | 2012-06-13 | 东莞生益电子有限公司 | Method for manufacturing printed circuit board (PCB) with step-shaped grooves |
| CN104582272A (en) * | 2013-10-09 | 2015-04-29 | 珠海方正科技高密电子有限公司 | Method and device for manufacturing metalized step trough on side wall |
| CN104582271A (en) * | 2013-10-09 | 2015-04-29 | 北大方正集团有限公司 | Manufacturing method of power amplification tank, printed circuit board with power amplification tank and manufacturing method of printed circuit board |
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