CN104981097B - The processing method and golden finger circuit board of golden finger - Google Patents
The processing method and golden finger circuit board of golden finger Download PDFInfo
- Publication number
- CN104981097B CN104981097B CN201410147966.8A CN201410147966A CN104981097B CN 104981097 B CN104981097 B CN 104981097B CN 201410147966 A CN201410147966 A CN 201410147966A CN 104981097 B CN104981097 B CN 104981097B
- Authority
- CN
- China
- Prior art keywords
- golden finger
- circuit board
- copper
- plate
- golden
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses the processing method and golden finger circuit board of a kind of golden finger, to solve existing for existing golden finger circuit board, limitation is very strong, and versatility is very poor, is easy to cause the technical problem of the wasting of resources and cost.Method includes：Golden finger copper-clad plate is provided, the golden finger copper-clad plate inner surface has multiple golden finger figures；Laminate is pressed in the inner surface of the golden finger copper-clad plate, obtains multi-layer board；Outer-layer circuit is made on multiple-plate surface, wherein, formed and the corresponding multiple golden finger figures of inner surface in golden finger copper-clad plate outer surface；The part controlled depth milling that the laminate is corresponded to the golden finger figure removes, and manifests the golden finger figure；It is gold-plated to the golden finger figure；Non- golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, golden finger circuit board is made, the golden finger circuit board includes circuit board body and the more golden fingers to extend out from circuit board body.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to the processing method and golden finger circuit board of a kind of golden finger.
Background technology
At present, the printed circuit board (PCB) with golden finger（PCB）Plate, generally using golden finger is related to online in its structure design
Mode within the shaping area of road plate top layer.And the golden finger of plug function is provided, it should be matched with the size of connecting-disconnecting interface, golden finger
The thickness of circuit board should be consistent with the open height of connecting-disconnecting interface, when the open height of connecting-disconnecting interface is fixed, golden finger
The circuit plate thickness at place is also just therefore fixed.
When golden finger circuit board will realize multi-functional demand and need to increase thickness of slab, then supporting connecting-disconnecting interface equipment
Do whole conversion, very waste of resource and cost；Golden finger circuit board is fixed due to thickness, it is impossible to applied to various sizes of
Connecting-disconnecting interface, causes the versatility of golden finger circuit board very poor；When same equipment has multiple connecting-disconnecting interfaces, it is necessary to design multiple
The golden finger circuit board of corresponding thickness, can influence the assembly space of product, and cause the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, is easy to cause the wasting of resources and cost
Lifting.
The content of the invention
The embodiment of the present invention provides a kind of processing method and golden finger circuit board of golden finger, to solve existing golden finger
Existing for circuit board, limitation is very strong, and versatility is very poor, is easy to cause the technical problem of the wasting of resources and cost.
First aspect present invention provides a kind of processing method of golden finger, it may include：
Golden finger copper-clad plate is provided, the golden finger area of the golden finger copper-clad plate inner surface has multiple golden finger figures
Shape and be connected with golden finger figure and positioned at edges of boards gold plated lead, the golden finger copper-clad plate inner surface other regions tool
There is secondary outer-layer circuit figure, the outer surface of the golden finger copper-clad plate has outer layer metal layer；
Laminate is pressed in the inner surface of the golden finger copper-clad plate, multi-layer board is obtained, makes the golden finger copper-clad plate
Golden finger visuals be located at beyond shaping area；
Outer-layer circuit is made on multiple-plate surface, wherein, in the golden finger area of golden finger copper-clad plate outer surface
Domain, forms and the corresponding multiple golden finger figures of inner surface and gold plated lead；
Controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden finger figure
Shape；
It is gold-plated to the golden finger figure using the gold plated lead；
Non- golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, golden finger circuit is made
Plate, the golden finger circuit board include circuit board body and the more golden fingers to extend out from circuit board body.
Second aspect of the present invention provides a kind of circuit board with hanging structure golden finger, it may include：
Circuit board body and at least one hanging golden finger, one end of the hanging golden finger are embedded in the circuit board body
In, the other end extends from a side wall of the circuit board body, and the golden finger is gold-plated structure for covering copper plate.
Therefore the embodiment of the present invention has the golden finger copper-clad plate of golden finger figure using one end is provided, in golden hand
Refer to and press laminate in copper-clad plate, the part controlled depth milling corresponding to golden finger figure of laminate is removed, to golden finger figure
Gold-plated, then, the technical solution by the milling of golden finger figure into golden finger, achieves following technique effect：
Golden finger thickness design can be carried out according to the open height of connecting-disconnecting interface, and then meet different connecting-disconnecting interface plugs
Demand；Since golden finger is the hanging structure that extends, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation quilt
Reduce, versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, since golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Brief description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of flow chart of the processing method of hanging structure golden finger provided in an embodiment of the present invention；
Fig. 2 a to 2h are the schematic diagrames using each stage of present invention method processing circuit board.
Embodiment
The embodiment of the present invention provides a kind of processing method and golden finger circuit board of circuit edge connector, existing to solve
Existing for golden finger circuit board, limitation is very strong, and versatility is very poor, and the technology for being easy to cause the wasting of resources and cost is asked
Topic.
In order to make those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Attached drawing, is clearly and completely described the technical solution in the embodiment of the present invention, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
Member's all other embodiments obtained without making creative work, should all belong to the model that the present invention protects
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Please refer to Fig.1, the embodiment of the present invention provides a kind of processing method of golden finger, it may include：
110th, golden finger copper-clad plate is provided, the golden finger area of the golden finger copper-clad plate inner surface has multiple golden hands
Refer to figure and be connected with golden finger figure and positioned at edges of boards gold plated lead, other areas of the golden finger copper-clad plate inner surface
Domain has time outer-layer circuit figure, and the outer surface of the golden finger copper-clad plate has outer layer metal layer.
, as shown in figures 2 a and 2b, can be according to the opening of equipment connecting-disconnecting interface in a kind of embodiment of the embodiment of the present invention
Highly, the golden finger copper-clad plate 20 of respective thickness is prepared, which can be specifically double face copper；Figure can be used
Shape forwarding function, makes time outer-layer circuit figure 201, at one end in the non-golden finger area of 20 inner surface of golden finger copper-clad plate
Golden finger area produce multiple golden finger figures 202, and be connected with golden finger figure 202 edges of boards auxiliary gold plated lead
203.The outer surface of golden finger copper-clad plate 20 is outer layer metal layer 204.
120th, dielectric layer and laminate are pressed in the inner surface of the golden finger copper-clad plate, obtains multi-layer board, made described
The golden finger visuals of golden finger copper-clad plate is located at beyond shaping area.
This step is pressing step, as shown in Figure 2 c, by the way that golden finger copper-clad plate 20, dielectric layer and laminate 40 are pressed
It is integrated, multi-layer board 30 is made.Described dielectric layer may include at least one layer of prepreg（PP pieces）.Described laminate 40 can
To be double face copper or multi-layer board, the metal layer of the one side to be laminated of the laminate has been processed as line layer, another side
It is then outer layer metal layer 404.After pressing, multi-layer board 30 as shown in Figure 2 d is obtained.
In order to protect the golden finger figure in golden finger copper-clad plate 20, before pressing, can be pasted on golden finger figure 202
Adhesive tape 305 simultaneously sets gasket 304.Described gasket can be false core plate（It has been etched the copper-clad plate for removing copper foil layer）Or
Duroplasts or Teflon etc..Described adhesive tape can be double faced adhesive tape.
For gasket 304 along 202 direction of golden finger figure, size exceeds 202 length 5-10mm of golden finger figure, convenient follow-up plating
The making of gold wire.The fixed bonding of gasket, a part are bonded by adhesive tape, and a part leans on the prepreg of dielectric layer（That is PP pieces）
Bond.One end of the adhesive tape pasted on golden finger figure 202 extends slightly into pressing area, the adhesive tape other end and golden finger figure 202
Concordantly.
130th, outer-layer circuit is made on multiple-plate surface, wherein, in the golden hand of golden finger copper-clad plate outer surface
Refer to region, form multiple golden finger figures corresponding with inner surface and the edges of boards gold plated lead being connected.
As shown in figure 2 e and 2f, this step uses outer graphics technology, by pattern transfer with etching and etc., by multilayer
The outer layer metal layer 204 of the outer layer metal layer of plate surface, i.e. golden finger copper-clad plate outer surface, and laminate outer surface are outer
Layer metal layer 404, is processed as outer-layer circuit, wherein, in the golden finger area of 20 outer surface of golden finger copper-clad plate, formed with it is interior
The corresponding multiple golden finger figures 302 in side surface and connected edges of boards gold plated lead 303, form normal outer in other regions
Sandwich circuit figure 301.In concrete application, after making outer-layer circuit, solder mask can be also set in outer-layer circuit.Solder mask is used
In the part covering protection that need not appear to outer-layer circuit.
In some embodiments of the invention, before outer-layer circuit is made, it can also make on multilayer boards as needed various
Through hole or blind hole etc., and heavy copper and plating can be carried out to the hole for wherein needing to metallize as needed.
140th, controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden hand
Refer to figure.
As shown in figure 2f, the operation of first time milling shape is carried out in this step to multi-layer board 30.The laminate 40 is corresponded to
Removed in the part controlled depth milling of the golden finger figure 202, manifest the golden finger figure 202.Specifically include：In multi-layer board
Beyond 30 shaping area, to the region controlled depth milling for appearing area corresponding to the golden finger figure 202 of the laminate 40, directly
To the gasket 304 is manifested, the gasket 304 and the adhesive tape 305 are then removed, appears the golden finger figure 202
Out.
150th, it is gold-plated to golden finger figure using gold plated lead.
It is gold-plated to golden finger figure 202 and 302 in this step, make to form required golden hand in golden finger copper-clad plate 20
Refer to.When gold-plated, the plating resist films such as adhesive tape can be used, multiple-plate other region overlays are protected, expose 202 He of golden finger figure
302；Using gold plated lead 203 and 303, plating gold is carried out to the golden finger figure 202 and 302 revealed, required for formation
Golden finger 37.At this time, each golden finger 37 is connected still through the insulating medium layer among golden finger copper-clad plate 20.
160th, the non-golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, golden finger electricity is made
Road plate, the golden finger circuit board include circuit board body and the more golden fingers to extend out from circuit board body.
As shown in Figure 2 g, second of milling shape operation is carried out in this step.Beyond the shaping area of the multi-layer board 30
Non- golden finger visuals controlled depth milling removes, and golden finger circuit board is made.The golden finger circuit board include circuit board body with
And the more golden fingers 37 to extend out from circuit board body, more golden fingers 37 are hanging structure.It can be used during controlled depth milling
Adhesive tape protects golden finger 37, removes adhesive tape after controlled depth milling.
It is the top view of the final obtained circuit board with hanging structure golden finger 37 as shown in fig. 2h.From Fig. 2 g and 2h
As can be seen that multiple golden fingers 37 are extended in the side of obtained circuit board, the width of multiple golden fingers 37 can be identical, also may be used
With difference.
More than, an embodiment of the present invention provides a kind of processing method of golden finger, this method has gold using one end is provided
The golden finger copper-clad plate of finger figure, laminate is pressed in golden finger copper-clad plate, and laminate is corresponded to golden finger figure
Part controlled depth milling remove, gold-plated to golden finger figure, then, the technical solution by the milling of golden finger figure into golden finger, obtains
Following technique effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Since golden finger is the hanging structure that extends, golden finger thickness is unrelated with circuit plate thickness, therefore suffered office
Limit is reduced, and versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, since golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Embodiment two,
G and 2h are please referred to Fig.2, the embodiment of the present invention provides a kind of golden finger circuit board, it may include：
Circuit board body 30 and at least one hanging golden finger 37, one end of the hanging golden finger 37 are embedded in the circuit
In plate body 30, the other end extends from a side wall of the circuit board body 30, and the hanging golden finger 37 is gold-plated
Structure for covering copper plate.
The circuit board body may include multilayer line layer.
The hanging golden finger 37 can be connected with the outer-layer circuit 301 of the circuit board body.
Circuit board provided in an embodiment of the present invention can be made using one method of embodiment.More detailed description refer to implementation
Example one.
More than, an embodiment of the present invention provides a kind of golden finger circuit board, achieve following technique effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Since golden finger is the hanging structure that extends, golden finger thickness is unrelated with circuit plate thickness, therefore suffered office
Limit is reduced, and versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, since golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention and from the limitation of described sequence of movement because according to
According to the present invention, some steps can use other orders or be carried out at the same time.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
The processing method and golden finger circuit board of the circuit edge connector provided above the embodiment of the present invention carry out
It is discussed in detail, but the explanation of above example is only intended to helping to understand method and its core concept of the invention, should not be understood
For limitation of the present invention.Those skilled in the art, according to the present invention thought, the invention discloses technical scope
Change or replacement that are interior, can readily occurring in, should be covered by the protection scope of the present invention.
Claims (5)
- A kind of 1. processing method of golden finger, it is characterised in that including：Golden finger copper-clad plate is provided, the golden finger area of the golden finger copper-clad plate inner surface have multiple golden finger figures and It is connected with golden finger figure and positioned at the gold plated lead of edges of boards, other regions of the golden finger copper-clad plate inner surface is with secondary Outer-layer circuit figure, the outer surface of the golden finger copper-clad plate have outer layer metal layer；Dielectric layer and laminate are pressed in the inner surface of the golden finger copper-clad plate, multi-layer board is obtained, covers the golden finger The golden finger visuals of copper coin is located at beyond shaping area；Outer-layer circuit is made on multiple-plate surface, wherein, in the golden finger area of golden finger copper-clad plate outer surface, shape Into multiple golden finger figures corresponding with inner surface and gold plated lead；Controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden finger figure；It is gold-plated to the golden finger figure using the gold plated lead；Non- golden finger visuals controlled depth milling beyond multiple-plate shaping area is removed, golden finger circuit board, institute is made Stating golden finger circuit board includes circuit board body and the more golden fingers to extend out from circuit board body.
- 2. according to the method described in claim 1, it is characterized in that：Before pressing laminate, tape on the golden finger figure and gasket is set.
- 3. according to the method described in claim 1, it is characterized in that, before multiple-plate surface makes outer-layer circuit also Including：Drill in the multi-layer board, and carry out heavy copper and plating.
- 4. according to the method described in claim 1, it is characterized in that, to described multiple-plate corresponding to the golden finger figure Before part carries out controlled depth milling, further include：Solder mask is set in the outer-layer circuit.
- 5. according to the method described in claim 2, it is characterized in that, multiple-plate it will correspond to the golden finger figure to described Part carry out controlled depth milling, manifesting the golden finger figure includes：Beyond multiple-plate shaping area, the region for appearing area for corresponding to the golden finger figure of the laminate is controlled deeply Milling, until manifesting the gasket, then removes the gasket and the adhesive tape, reveals the golden finger figure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410147966.8A CN104981097B (en) | 2014-04-14 | 2014-04-14 | The processing method and golden finger circuit board of golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410147966.8A CN104981097B (en) | 2014-04-14 | 2014-04-14 | The processing method and golden finger circuit board of golden finger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104981097A CN104981097A (en) | 2015-10-14 |
| CN104981097B true CN104981097B (en) | 2018-04-20 |
Family
ID=54277034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410147966.8A Active CN104981097B (en) | 2014-04-14 | 2014-04-14 | The processing method and golden finger circuit board of golden finger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104981097B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104981096B (en) * | 2014-04-14 | 2018-11-02 | 深南电路有限公司 | The processing method and circuit board of hanging golden finger |
| CN105960100B (en) * | 2016-06-30 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | A kind of golden finger gold plated lead adding method |
| CN107580411B (en) * | 2017-08-31 | 2019-12-24 | 广州兴森快捷电路科技有限公司 | Golden finger lead structure and manufacturing method |
| CN113056094A (en) * | 2019-12-27 | 2021-06-29 | 深南电路股份有限公司 | Prefabricated substrate and printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| CN102458056A (en) * | 2010-10-25 | 2012-05-16 | 矢崎总业株式会社 | Method for manufacturing wiring substrate |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7326857B2 (en) * | 2004-11-18 | 2008-02-05 | International Business Machines Corporation | Method and structure for creating printed circuit boards with stepped thickness |
| US7596863B2 (en) * | 2007-01-12 | 2009-10-06 | Endicott Interconnect Technologies, Inc. | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
-
2014
- 2014-04-14 CN CN201410147966.8A patent/CN104981097B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
| CN102458056A (en) * | 2010-10-25 | 2012-05-16 | 矢崎总业株式会社 | Method for manufacturing wiring substrate |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104981097A (en) | 2015-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104244612B (en) | A kind of method that plated through-hole is made on PTFE circuit boards | |
| CN105722302B (en) | It is embedded in the circuit board and its processing method of boss Metal Substrate | |
| CN102548225B (en) | Manufacturing method for printed circuit board (PCB) | |
| CN104981097B (en) | The processing method and golden finger circuit board of golden finger | |
| CN104349570A (en) | Rigid-flexible-combined circuit board and manufacturing method thereof | |
| CN104981113B (en) | The processing method and golden finger circuit board of circuit edge connector | |
| CN105611751A (en) | Processing method of multilayer flexible circuit board | |
| CN103327738B (en) | Rigid-flexible circuit board and preparation method thereof | |
| CN104981096B (en) | The processing method and circuit board of hanging golden finger | |
| CN103635005A (en) | Rigid-flex circuit substrate, rigid-flex circuit board and manufacturing methods | |
| CN104902683B (en) | Step groove circuit board and its processing method | |
| CN103796416A (en) | Circuit board combining flexible board with hard board and method for manufacturing same | |
| CN104981115B (en) | The processing method and golden finger circuit board of circuit edge connector | |
| CN104981110B (en) | The processing method of golden finger and golden finger circuit board | |
| CN109379840A (en) | A kind of processing method and circuit board of hanging golden finger | |
| CN104981114B (en) | The processing method and circuit board of hanging golden finger | |
| CN104981108B (en) | The processing method and circuit board of hanging structure golden finger | |
| CN104902698B (en) | The processing method of circuit edge connector and the circuit board with golden finger | |
| CN109195361A (en) | The processing method and golden finger circuit board of golden finger | |
| CN104981112B (en) | The processing method and golden finger circuit board of golden finger | |
| CN104902684B (en) | A kind of step groove circuit board and its processing method | |
| CN104902700B (en) | The processing method of inner-layer thick copper circuit board and inner-layer thick copper circuit board | |
| CN105228346B (en) | The processing method and step groove circuit board of step groove circuit board | |
| CN104981107B (en) | The processing method and golden finger circuit board of circuit edge connector | |
| CN104981109B (en) | The processing method and circuit board of hanging structure golden finger |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |