CN109195361A - The processing method and golden finger circuit board of golden finger - Google Patents
The processing method and golden finger circuit board of golden finger Download PDFInfo
- Publication number
- CN109195361A CN109195361A CN201811236663.8A CN201811236663A CN109195361A CN 109195361 A CN109195361 A CN 109195361A CN 201811236663 A CN201811236663 A CN 201811236663A CN 109195361 A CN109195361 A CN 109195361A
- Authority
- CN
- China
- Prior art keywords
- golden finger
- circuit board
- copper
- plate
- golden
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Abstract
The technical issues of the invention discloses a kind of processing method of golden finger and golden finger circuit boards, and to solve existing for existing golden finger circuit board, limitation is very strong, and versatility is very poor, are easy to cause the wasting of resources and cost.Method includes: to provide golden finger copper-clad plate, and the golden finger copper-clad plate inner surface has multiple golden finger figures；Laminate is pressed in the inner surface of the golden finger copper-clad plate, obtains multi-layer board；Outer-layer circuit is made on multiple-plate surface, wherein forms multiple golden finger figures corresponding with inner surface in golden finger copper-clad plate outer surface；The part controlled depth milling that the laminate corresponds to the golden finger figure is removed, the golden finger figure is manifested；It is gold-plated to the golden finger figure；By the non-golden finger visuals controlled depth milling removal other than multiple-plate shaping area, golden finger circuit board is made, the golden finger circuit board includes circuit board body and the more golden fingers to extend out from circuit board body.
Description
Technical field
The present invention relates to circuit board technology fields, and in particular to a kind of processing method and golden finger circuit board of golden finger.
Background technique
Currently, printed circuit board (PCB) plate with golden finger, structure, which designs to generally use, is related to golden finger online
Mode within the shaping area of road plate surface layer.And the golden finger of plug function is provided, it should be matched with the size of connecting-disconnecting interface, golden finger
The thickness of circuit board should be consistent with the open height of connecting-disconnecting interface, when the open height of connecting-disconnecting interface is fixed, golden finger
The circuit plate thickness at place is also just therefore fixed.
When golden finger circuit board will realize multi-functional demand and need to increase plate thickness, then matched connecting-disconnecting interface equipment
Do whole transformation, very waste of resource and cost；Golden finger circuit board may not apply to various sizes of since thickness is fixed
Connecting-disconnecting interface causes the versatility of golden finger circuit board very poor；When same equipment has multiple connecting-disconnecting interfaces, it is necessary to design multiple
The golden finger circuit board of corresponding thickness, will affect the assembly space of product, and lead to the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, is easy to cause the wasting of resources and cost
It is promoted.
Summary of the invention
The embodiment of the present invention provides the processing method and golden finger circuit board of a kind of golden finger, to solve existing golden finger
The technical issues of existing for circuit board, limitation is very strong, and versatility is very poor, is easy to cause the wasting of resources and cost.
First aspect present invention provides a kind of processing method of golden finger, it may include:
Golden finger copper-clad plate is provided, the golden finger area of the golden finger copper-clad plate inner surface has multiple golden finger figures
Shape and the gold plated lead for being connected and being located at edges of boards with golden finger figure, other regions tool of the golden finger copper-clad plate inner surface
There is secondary outer-layer circuit figure, the outer surface of the golden finger copper-clad plate has outer layer metal layer；
Laminate is pressed in the inner surface of the golden finger copper-clad plate, multi-layer board is obtained, makes the golden finger copper-clad plate
Golden finger visuals be located at other than shaping area；
Outer-layer circuit is made on multiple-plate surface, wherein in the golden finger area of golden finger copper-clad plate outer surface
Domain forms multiple golden finger figures corresponding with inner surface and gold plated lead；
Controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden finger figure
Shape；
It is gold-plated to the golden finger figure using the gold plated lead；
By the non-golden finger visuals controlled depth milling removal other than multiple-plate shaping area, golden finger circuit is made
Plate, the golden finger circuit board include circuit board body and the more golden fingers to extend out from circuit board body.
Second aspect of the present invention provides a kind of circuit board with hanging structure golden finger, it may include:
One end of circuit board body and at least one hanging golden finger, the hanging golden finger is embedded in the circuit board body
In, the other end extends from a side wall of the circuit board body, and the golden finger is gold-plated structure for covering copper plate.
Therefore the golden finger copper-clad plate that the embodiment of the present invention has golden finger figure using one end is provided, in golden hand
Refer to and press laminate in copper-clad plate, the part controlled depth milling corresponding to golden finger figure of laminate is removed, to golden finger figure
It is gold-plated, then, by the milling of golden finger figure at the technical solution of golden finger, achieve following technical effect:
Golden finger thickness design can be carried out according to the open height of connecting-disconnecting interface, and then meet different connecting-disconnecting interface plugs
Demand；Since golden finger is the hanging structure extended, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation quilt
Reduce, versatility is stronger, it is not easy to lead to the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase plate thickness, since golden finger is the standalone module of hanging structure,
It will not therefore change, it is not necessary to change original connecting-disconnecting interface equipment, save resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
When same equipment there are multiple interfaces, do not have to provide multiple corresponding circuit boards, it only need to be at of the invention one
The golden finger of multiple hanging structures is designed on circuit board, thus can save the assembly space of product, reduces cost and resource
Waste.
Detailed description of the invention
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of flow chart of the processing method of hanging structure golden finger provided in an embodiment of the present invention；
Fig. 2 a to 2h is the schematic diagram using each stage of present invention method processing circuit board.
Specific embodiment
The embodiment of the present invention provides the processing method and golden finger circuit board of a kind of circuit edge connector, existing to solve
Existing for golden finger circuit board, limitation is very strong, and versatility is very poor, and the technology of the wasting of resources and cost is easy to cause to ask
Topic.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The model that the present invention protects all should belong in member's every other embodiment obtained without making creative work
It encloses.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Referring to FIG. 1, the embodiment of the present invention provides a kind of processing method of golden finger, it may include:
110, golden finger copper-clad plate is provided, the golden finger area of the golden finger copper-clad plate inner surface has multiple golden hands
Refer to figure and is connected and is located at the gold plated lead of edges of boards, other areas of the golden finger copper-clad plate inner surface with golden finger figure
Domain has time outer-layer circuit figure, and the outer surface of the golden finger copper-clad plate has outer layer metal layer.
It, as shown in figures 2 a and 2b, can be according to the opening of equipment connecting-disconnecting interface in a kind of embodiment of the embodiment of the present invention
Highly, prepare the golden finger copper-clad plate 20 of respective thickness, which specifically can be double face copper；Figure can be used
Shape forwarding function makes time outer-layer circuit figure 201 in the non-golden finger area of 20 inner surface of golden finger copper-clad plate, at one end
Golden finger area produce multiple golden finger figures 202, and connect with golden finger figure 202 edges of boards auxiliary gold plated lead
203.The outer surface of golden finger copper-clad plate 20 is outer layer metal layer 204.
120, dielectric layer and laminate are pressed in the inner surface of the golden finger copper-clad plate, obtains multi-layer board, made described
The golden finger visuals of golden finger copper-clad plate is located at other than shaping area.
This step is pressing step, as shown in Figure 2 c, by pressing golden finger copper-clad plate 20, dielectric layer and laminate 40
It is integrated, multi-layer board 30 is made.Described dielectric layer may include at least one layer of prepreg (PP piece).Described laminate 40 can
To be double face copper or multi-layer board, the metal layer of the one side to be laminated of the laminate has been processed as line layer, another side
It is then outer layer metal layer 404.After pressing, multi-layer board 30 as shown in Figure 2 d is obtained.
In order to protect the golden finger figure in golden finger copper-clad plate 20, before pressing, can be pasted on golden finger figure 202
Simultaneously gasket 304 is arranged in adhesive tape 305.Described gasket can be the false core plate copper-clad plate of copper foil layer (be etched removal) or
Duroplasts or Teflon etc..Described adhesive tape can be double-sided adhesive.
Gasket 304 exceeds 202 length 5-10mm of golden finger figure, facilitates subsequent plating along 202 direction of golden finger figure, size
The production of gold wire.The fixed bonding of gasket, a part are bonded by adhesive tape, and a part leans on the prepreg (i.e. PP piece) of dielectric layer
Bonding.One end of the adhesive tape pasted on golden finger figure 202 extends slightly into pressing area, the adhesive tape other end and golden finger figure 202
Concordantly.
130, outer-layer circuit is made on multiple-plate surface, wherein in the golden hand of golden finger copper-clad plate outer surface
Refer to region, forms multiple golden finger figures corresponding with inner surface and connected edges of boards gold plated lead.
As shown in figure 2 e and 2f, this step uses outer graphics technology, by pattern transfer and etching, by multilayer
Outside the outer layer metal layer of plate surface, the i.e. outer layer metal layer 204 of golden finger copper-clad plate outer surface and laminate outer surface
Layer metal layer 404, is processed as outer-layer circuit, wherein in the golden finger area of 20 outer surface of golden finger copper-clad plate, formed with it is interior
The corresponding multiple golden finger figures 302 in side surface and connected edges of boards gold plated lead 303 are formed normal outer in other regions
Sandwich circuit figure 301.In concrete application, after making outer-layer circuit, solder mask can be also set in outer-layer circuit.Solder mask is used
In the part covering protection for not needing to appear to outer-layer circuit.
In some embodiments of the invention, before making outer-layer circuit, it can also make on multilayer boards as needed various
Through-hole or blind hole etc., and heavy copper and plating can be carried out to the hole for wherein needing to metallize as needed.
140, controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden hand
Refer to figure.
As shown in figure 2f, milling shape operation for the first time is carried out to multi-layer board 30 in this step.The laminate 40 is corresponding
It is removed in the part controlled depth milling of the golden finger figure 202, manifests the golden finger figure 202.It specifically includes: in multi-layer board
Other than 30 shaping area, to the region controlled depth milling for appearing area corresponding to the golden finger figure 202 of the laminate 40, directly
To the gasket 304 is manifested, the gasket 304 and the adhesive tape 305 are then removed, appears the golden finger figure 202
Out.
150, gold-plated to golden finger figure using gold plated lead.
It is gold-plated to golden finger figure 202 and 302 in this step, make golden hand required for being formed in golden finger copper-clad plate 20
Refer to.When gold-plated, the plating resist film such as adhesive tape can be used, multiple-plate other region overlays are protected, 202 He of golden finger figure is exposed
302；Using gold plated lead 203 and 303, electroplating gold is carried out to the golden finger figure 202 and 302 revealed, required for formation
Golden finger 37.At this point, each golden finger 37 is connected still through the insulating medium layer among golden finger copper-clad plate 20.
160, the non-golden finger visuals controlled depth milling other than multiple-plate shaping area is removed, golden finger electricity is made
Road plate, the golden finger circuit board include circuit board body and the more golden fingers to extend out from circuit board body.
As shown in Figure 2 g, second of milling shape operation is carried out in this step.Other than the shaping area of the multi-layer board 30
Non- golden finger visuals controlled depth milling removal, is made golden finger circuit board.The golden finger circuit board include circuit board body with
And the more golden fingers 37 to extend out from circuit board body, more golden fingers 37 are hanging structure.It can be used during controlled depth milling
Adhesive tape protects golden finger 37, removes adhesive tape after controlled depth milling.
It is the top view of the final circuit board obtained with hanging structure golden finger 37 as shown in fig. 2h.From Fig. 2 g and 2h
As can be seen that multiple golden fingers 37 are extended in the side of circuit board obtained, the width of multiple golden fingers 37 can be identical, can also
With difference.
More than, the embodiment of the invention provides a kind of processing method of golden finger, this method has gold using one end is provided
The golden finger copper-clad plate of finger figure, presses laminate in golden finger copper-clad plate, and laminate is corresponded to golden finger figure
Part controlled depth milling removal, it is gold-plated to golden finger figure, then, by golden finger figure milling at golden finger technical solution, obtain
Following technical effect:
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Since golden finger is the hanging structure extended, golden finger thickness is unrelated with circuit plate thickness, therefore suffered office
Limit is reduced, and versatility is stronger, it is not easy to lead to the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase plate thickness, since golden finger is the standalone module of hanging structure,
It will not therefore change, it is not necessary to change original connecting-disconnecting interface equipment, save resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
When same equipment there are multiple interfaces, do not have to provide multiple corresponding circuit boards, it only need to be at of the invention one
The golden finger of multiple hanging structures is designed on circuit board, thus can save the assembly space of product, reduces cost and resource
Waste.
Embodiment two,
Fig. 2 g and 2h are please referred to, the embodiment of the present invention provides a kind of golden finger circuit board, it may include:
One end of circuit board body 30 and at least one hanging golden finger 37, the hanging golden finger 37 is embedded in the circuit
In plate ontology 30, the other end extends from a side wall of the circuit board body 30, and the hanging golden finger 37 is gold-plated
Structure for covering copper plate.
The circuit board body may include multilayer line layer.
The hanging golden finger 37 can be connected with the outer-layer circuit 301 of the circuit board body.
Circuit board provided in an embodiment of the present invention can be used one method of embodiment and be made.More detailed description please refers to implementation
Example one.
More than, the embodiment of the invention provides a kind of golden finger circuit boards, achieve following technical effect:
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Since golden finger is the hanging structure extended, golden finger thickness is unrelated with circuit plate thickness, therefore suffered office
Limit is reduced, and versatility is stronger, it is not easy to lead to the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase plate thickness, since golden finger is the standalone module of hanging structure,
It will not therefore change, it is not necessary to change original connecting-disconnecting interface equipment, save resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
When same equipment there are multiple interfaces, do not have to provide multiple corresponding circuit boards, it only need to be at of the invention one
The golden finger of multiple hanging structures is designed on circuit board, thus can save the assembly space of product, reduces cost and resource
Waste.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for the various method embodiments described above, for simple description, therefore, it is stated as a series of
Combination of actions, but those skilled in the art should understand that, the present invention is not limited by described sequence of movement because according to
According to the present invention, certain steps can use other sequences or carry out simultaneously.Secondly, those skilled in the art should also know that,
The embodiments described in the specification are all preferred embodiments, and not necessarily the present invention must for related actions and modules
Must.
The processing method and golden finger circuit board for being provided for the embodiments of the invention circuit edge connector above carry out
It is discussed in detail, but the above description of the embodiment is only used to help understand the method for the present invention and its core ideas, should not be understood
For limitation of the present invention.Those skilled in the art, according to the thought of the present invention, the invention discloses technical scope
Interior, any changes or substitutions that can be easily thought of, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of processing method of golden finger characterized by comprising
Golden finger copper-clad plate is provided, the golden finger area of the golden finger copper-clad plate inner surface have multiple golden finger figures and
It is connected and is located at the gold plated lead of edges of boards with golden finger figure, other regions of the golden finger copper-clad plate inner surface have secondary
The outer surface of outer-layer circuit figure, the golden finger copper-clad plate has outer layer metal layer；
Dielectric layer and laminate are pressed in the inner surface of the golden finger copper-clad plate, multi-layer board is obtained, covers the golden finger
The golden finger visuals of copper sheet is located at other than shaping area；
Outer-layer circuit is made on multiple-plate surface, wherein in the golden finger area of golden finger copper-clad plate outer surface, shape
At multiple golden finger figures corresponding with inner surface and gold plated lead；
Controlled depth milling is carried out to multiple-plate part corresponding to the golden finger figure, manifests the golden finger figure；
It is gold-plated to the golden finger figure using the gold plated lead；
By the non-golden finger visuals controlled depth milling removal other than multiple-plate shaping area, golden finger circuit board, institute is made
Stating golden finger circuit board includes circuit board body and the more golden fingers to extend out from circuit board body.
2. according to the method described in claim 1, it is characterized by: being pasted on the golden finger figure before pressing laminate
Simultaneously gasket is arranged in adhesive tape.
3. the method according to claim 1, wherein before multiple-plate surface production outer-layer circuit also
It include: to drill in the multi-layer board, and carry out heavy copper and plating.
4. the method according to claim 1, wherein to described multiple-plate corresponding to the golden finger figure
Part carries out before controlled depth milling, further includes: solder mask is arranged in the outer-layer circuit.
5. according to the method described in claim 2, it is characterized in that, will be to described multiple-plate corresponding to the golden finger figure
Part carry out controlled depth milling, manifesting the golden finger figure includes: other than multiple-plate shaping area, to the laminate
Then the region controlled depth milling for appearing area corresponding to the golden finger figure removes the gasket until manifesting the gasket
With the adhesive tape, reveal the golden finger figure.
6. a kind of golden finger circuit board characterized by comprising circuit board body and at least one hanging golden finger, it is described outstanding
One end of empty golden finger is embedded in the circuit board body, and the other end extends from a side wall of the circuit board body,
The hanging golden finger is gold-plated structure for covering copper plate.
7. circuit board according to claim 6, it is characterised in that: the outer layer line of the hanging golden finger and the circuit board
Road is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811236663.8A CN109195361A (en) | 2018-10-23 | 2018-10-23 | The processing method and golden finger circuit board of golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811236663.8A CN109195361A (en) | 2018-10-23 | 2018-10-23 | The processing method and golden finger circuit board of golden finger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109195361A true CN109195361A (en) | 2019-01-11 |
Family
ID=64942844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811236663.8A Pending CN109195361A (en) | 2018-10-23 | 2018-10-23 | The processing method and golden finger circuit board of golden finger |
Country Status (1)
| Country | Link |
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| CN (1) | CN109195361A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114080118A (en) * | 2020-08-12 | 2022-02-22 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of stepped gold finger circuit board and circuit board |
-
2018
- 2018-10-23 CN CN201811236663.8A patent/CN109195361A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114080118A (en) * | 2020-08-12 | 2022-02-22 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of stepped gold finger circuit board and circuit board |
| CN114080118B (en) * | 2020-08-12 | 2024-03-12 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of stepped golden finger circuit board and circuit board |
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Application publication date: 20190111 |