CN211047360U - Edge-covered circuit board - Google Patents
Edge-covered circuit board Download PDFInfo
- Publication number
- CN211047360U CN211047360U CN201921540238.8U CN201921540238U CN211047360U CN 211047360 U CN211047360 U CN 211047360U CN 201921540238 U CN201921540238 U CN 201921540238U CN 211047360 U CN211047360 U CN 211047360U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- edge
- substrate
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application discloses bound line circuit board forms the circuit board through the core that has etched the figure layer and base plate pressfitting, is equipped with the drilling that runs through in the inside of circuit board, connects each figure layer circuit of circuit board through drilling, at the circuit board outside plating metal layer, the base plate and the outside metal layer of borduring form the circuit board and bordure. The structure of the circuit board is strengthened, and the function of the circuit board is improved.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a enveloping circuit board.
Background
Circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components.
Fig. 1 is a schematic structural diagram of a conventional circuit board. Conventional circuit board products are limited by processing cost, processing efficiency, machining capability of mechanical equipment, etc., and the delivered circuit board 12 needs to be spliced on a large production board. When metal edge covering is required, the whole appearance of the circuit board 12 cannot be milled through to remove electroplating, so that a plurality of rib retaining points 13 are designed to be connected with the circuit board 12. And after the metal edge covering and a series of subsequent process flows are finished, the shape is processed to form an external pattern layer 14, and then the rib retaining points 13 are milled off to form the circuit board. Therefore, at the position where the rib is left, the effect of coating gold is impossible.
For conventional digital products, the small defect that the positions of the ribs are not covered is within an acceptable range, but for the digital + microwave products, the structure has edge leakage, which causes signal leakage and causes performance defects of the digital + microwave products.
SUMMERY OF THE UTILITY MODEL
The technical problem that this application mainly solved provides a circuit board of borduring to there is the unable shortcoming of covering gold of muscle point in reaching the solution circuit board.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a binder circuit board, comprising:
the number of the core plates is at least two, and the upper surface or/and the lower surface of each core plate is/are provided with a copper foil layer;
the number of the graphic layers is at least two, and the graphic layers are connected through a line;
the substrate is arranged at the position of the middle layer of the plurality of graphic layers;
and edge-covered metal layers are arranged on the side surfaces of the core plate, the graphic layer and the substrate.
Further, the core board, the substrate and the pattern layer are connected through the prepreg.
Furthermore, the pattern layers are connected through drill holes, and conductive metal layers are arranged in the drill holes.
Furthermore, the pattern layers are symmetrically arranged relative to two sides of the substrate.
Furthermore, the substrate is made of copper material, and the edge-covered metal layer is a copper layer.
Furthermore, the number of the base plates is at least two, and the base plates and the graphic layers are arranged in a laminated mode.
Further, the substrate is matched with the edge-covering metal layer to form the edge-covering of the circuit board.
Furthermore, the outermost layer of the circuit board is provided with an outermost pattern layer, and the outermost pattern layer is connected with the edge-covering metal layer.
The beneficial effect of this application is: the circuit board is formed by laminating the core board etched with the pattern layers and the substrate, the through drill holes are arranged in the circuit board to connect the patterns of the circuit board, the metal layer is plated on the outer side of the circuit board, and the substrate and the outer side edge-covered metal layer form a circuit board edge covering, so that the structure of the circuit board is strengthened, and the function of the circuit board is improved.
Drawings
FIG. 1 is a schematic diagram of a conventional circuit board;
FIG. 2 is a schematic cross-sectional view of a first embodiment of a covered edge circuit board of the present application;
FIG. 3 is a schematic cross-sectional view of a second embodiment of a covered edge wiring board of the present application;
fig. 4 is a schematic view of the internal structure of the edge-covered circuit board of the present application.
Detailed Description
The PCB product is limited by the processing cost, the processing efficiency, the processing capability of the mechanical equipment, and the like, and the PCB circuit board needs to be assembled on a large circuit board for processing at the same time, in the prior manufacturing method of the printed circuit board, when metal edge covering is required, a through groove is milled to remove electroplating on the circuit board, several rib points are reserved on the design to keep the connection and fixation among the circuit boards, so that the subsequent processing steps are convenient, when the metal edge covering and the subsequent processing steps are finished, when the appearance of the circuit board is processed, the rib-remaining points are milled off to form a small plate finished product, so that no edge-covering effect exists at the rib-remaining points, when the printed circuit board of digit + microwave product that uses prior art to produce, the problem that the signal was revealed can be aroused because of not borduring to the microwave product part of putting the muscle point aside, and the technical scheme of this application can solve above-mentioned current problem.
The present application will be described in detail with reference to the accompanying drawings and examples.
Referring to fig. 2, a cross-sectional view of a first embodiment of a covered edge circuit board of the present application is shown. Please refer to fig. 4, which is a schematic diagram of an internal structure of the edge-covered circuit board of the present application. The wiring board 1 includes: the first core plate 3 is arranged above the substrate 5, the second core plate 7 is arranged below the substrate, and copper foil layers are arranged on the upper surface and the lower surface of the first core plate 3 and the second core plate 7; an outermost pattern layer 11 is etched on the copper foil layer above the first core plate 3, a second pattern layer 4 is etched on the copper foil layer below the first core plate 3, a third pattern layer 6 is etched on the copper foil layer above the second core plate 7, and a fourth pattern layer 8 is etched on the copper foil layer below the second core plate 7. The substrate 5 made of copper is arranged at the middle layer position of the outermost pattern layer 11, the second pattern layer 4, the third pattern layer 6 and the fourth pattern layer 8. The first core board 3, the substrate 5 and the second core board 7 are laminated by a prepreg (not shown) to form the circuit board 1. The circuit board 1 is drilled with a through drilling hole 10, and the inner wall of the hole 10 is plated with copper, so that the pattern layer 11 on the outermost layer, the second pattern layer 4, the third pattern layer 6 and the fourth pattern layer 8 are connected through circuits. In this embodiment the inner wall of the hole 10 is plated with copper, in other embodiments tin plating, nickel plating and other conductive materials may be used. The side of the circuit board 1 is electroplated with a metal layer 9, in this embodiment the metal layer 9 is copper, and in other embodiments, the metal layer may be other conductive metal materials. The outermost graphics layer 11 is etched on the outermost layer of the circuit board to meet different requirements of different customers on the circuit board.
The edge-covered circuit board is formed by laminating a first core board 3, a second core board 7 and a substrate 5 which are etched with graphic layers to form a circuit board 1, a through drilling hole 10 is drilled in the circuit board 1, and a metal layer 9 is plated on the outer side of the circuit board 1. The substrate 5 is matched with the metal layer 9 arranged on the outer side of the circuit board 1 to realize metal full-wrapping of the circuit board, so that the structure of the circuit board is strengthened, and the function of the circuit board is improved.
Referring to fig. 3, a cross-sectional view of a second embodiment of a covered edge circuit board of the present application is shown. Please refer to fig. 4, which is a schematic diagram of an internal structure of the edge-covered circuit board of the present application. The wiring board 1 includes: the first core plate 3, the second core plate 7 and the third core plate 15 are arranged from top to bottom. The upper surface of the first core plate 3 is provided with a copper foil layer, the upper surface and the lower surface of the second core plate 7 are provided with copper foil layers, and the lower surface of the third core plate 15 is provided with a copper foil layer. Wherein the first substrate 51 is disposed between the first core plate 3 and the second core plate 7, and the second substrate 52 is disposed between the second core plate 7 and the third core plate 15.
An outermost pattern layer 11 is etched on the copper foil layer above the first core plate 3, a second pattern layer 4 is etched on the copper foil layer above the second core plate 7, a third pattern layer 6 is etched on the copper foil layer below the second core plate 7, and a fourth pattern layer 8 is etched on the copper foil layer below the third core plate 15. A first substrate 51 of copper is arranged between the first core plate 3 and the second core plate 7. A second substrate 52 made of copper is disposed between the second core plate 7 and the third core plate 15. The first core board 3, the first substrate 51, the second core board 7, the second substrate 52 and the third core board 15 are laminated by a prepreg (not shown) to form the circuit board 1. The circuit board 1 is drilled with a through drilling hole 10, and the inner wall of the hole 10 is plated with copper, so that the pattern layer 11 on the outermost layer, the second pattern layer 4, the third pattern layer 6 and the fourth pattern layer 8 are connected through circuits. In this embodiment the inner wall of the hole 10 is plated with copper, in other embodiments tin plating, nickel plating and other conductive materials may be used. The side surface of the circuit board 1 is electroplated with a covered edge metal layer 9, in this embodiment, the metal layer 9 is copper, and in other embodiments, the metal layer may be other conductive metal materials. The outermost graphics layer 11 is etched on the outermost layer of the circuit board to meet different requirements of different customers on the circuit board.
The edge-covered circuit board is formed by laminating a first core board 3, a second core board 7, a third core board 15, a first substrate 51 and a second substrate 52 which are etched with graphic layers to form a circuit board 1, a through drilling hole 10 is drilled in the circuit board 1, and a metal layer 9 is plated on the outer side of the circuit board 1. The substrate 5 is matched with the metal layer 9 arranged on the outer side of the circuit board 1 to realize metal full-wrapping of the circuit board, so that the structure of the circuit board is strengthened, and the function of the circuit board is improved.
The method for manufacturing the fully-covered circuit board of the first embodiment specifically comprises the following steps:
the raw materials of the first core plate 3 and the second core plate 7 are obtained and cut, and the cutting is carried out according to the preset size. And cleaning burrs of the cut first core plate 3 and the second core plate 7, and grinding round corners to obtain a plurality of first core plates 3 and second core plates 7.
Performing film exposure on the copper foil layers at the lower layers of the plurality of cut first core plates 3, and etching to form a second graph layer 4; and performing film exposure on the copper foil layers on the upper layers of the cut second core plates 7, and etching to form a third graphic layer 6.
A substrate 5 is provided on the intermediate layer of a plurality of pairs of the first core board 3 and the second core board 7 on which the pattern layer has been formed by etching, and the first core board 3, the substrate 5, and the second core board 7 are laminated using a prepreg (not shown) to form the wiring board 1. In the present embodiment, the material of the substrate 5 is copper, and in other embodiments, the material of the substrate 5 may be other conductive metal materials.
And drilling the manufactured circuit board. A through hole 10 is drilled in the circuit board and copper is plated on the inner wall of the through hole 10 to connect the circuit between the second graphic layer 4 and the third graphic layer 6.
The wiring board is processed to conform to the shape of the wiring board 1. In this processing, the processing of the substrate is not involved, and the state that one substrate layer is connected with a plurality of circuit boards 1 is maintained.
The method comprises the following steps of performing edge covering treatment on a plurality of circuit boards 1 processed into a specified shape, wherein the edge covering treatment is to plate a metal layer 9 on the outer sides of the plurality of circuit boards 1, the metal layer 9 is copper in the embodiment, and the metal layer 9 can be other conductive metal layers 9 such as a tin layer and a nickel layer in other embodiments;
the upper surface layer of the wiring board 1 is exposed and etched to form an outermost pattern layer 11.
And processing the substrate 5 connected among the circuit boards 1, and milling the substrate 5 to form the circuit boards 1 arranged at intervals. The circuit boards 1 arranged at intervals are made into metal full-edge-covered circuit boards 1.
The circuit board processed by the method realizes a metal full-edge-covering structure, and in the embodiment, the substrate 5 and the edge-covering metal layer 9 are both made of copper materials. In the edge covering process, although copper is plated on the outer sides of the circuit boards 1, the circuit boards 1 are connected through the substrate, and copper is not plated at the connection positions of the circuit boards 1, the substrate 5 and the metal layer 9 on the outer layer form a metal full-edge covering structure of the circuit board because the substrate 5 is made of copper.
The circuit board is formed by laminating the core board etched with the graphic layers and the substrate, the through drill holes are formed in the circuit board, the circuit of each graphic layer of the circuit board is connected, the metal layer is plated on the outer side of the circuit board, and the substrate and the metal layer on the outer side of the edge cover form a circuit board edge cover, so that the structure of the circuit board is strengthened, and the function of the circuit board is improved.
The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.
Claims (8)
1. A contained circuit board, comprising:
the number of the core plates is at least two, and the upper surface or/and the lower surface of each core plate is/are provided with a copper foil layer;
the number of the graphic layers is at least two, and the graphic layers are connected through a line;
the substrate is arranged at the position of the middle layer of the plurality of graphic layers;
and edge-covering metal layers are arranged on the side surfaces of the core board, the graphic layer and the substrate.
2. The edge-wrapped circuit board according to claim 1, wherein the core board, the substrate and the graphic layer are connected by a prepreg.
3. The edge-wrapped circuit board of claim 2, wherein the pattern layers are connected by a drilled hole, and a conductive metal layer is disposed in the drilled hole.
4. A covered edge wiring board according to claim 3, wherein the pattern layers are symmetrically arranged with respect to both sides of the substrate.
5. The covered edge wire board of claim 4, wherein the substrate is made of a copper material and the metal layer of the covered edge is a copper layer.
6. A covered edge wiring board according to claim 5, wherein the number of said base plate is at least one, and said base plate and said pattern layer are arranged in a stacked manner.
7. A covered wire board according to any one of claims 1 to 6, wherein the substrate cooperates with the metal layer to form a covered wire board.
8. The edge-covered circuit board according to claim 1, wherein an outermost pattern layer is arranged on the outermost layer of the circuit board, and the outermost pattern layer is connected with the edge-covered metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921540238.8U CN211047360U (en) | 2019-09-11 | 2019-09-11 | Edge-covered circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921540238.8U CN211047360U (en) | 2019-09-11 | 2019-09-11 | Edge-covered circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211047360U true CN211047360U (en) | 2020-07-17 |
Family
ID=71534419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921540238.8U Active CN211047360U (en) | 2019-09-11 | 2019-09-11 | Edge-covered circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211047360U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113518515A (en) * | 2021-03-15 | 2021-10-19 | 江西宇睿电子科技有限公司 | Method for manufacturing broken-joint metalized edge and circuit board |
| CN114449727A (en) * | 2020-10-30 | 2022-05-06 | 碁鼎科技秦皇岛有限公司 | Circuit board and preparation method thereof |
-
2019
- 2019-09-11 CN CN201921540238.8U patent/CN211047360U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114449727A (en) * | 2020-10-30 | 2022-05-06 | 碁鼎科技秦皇岛有限公司 | Circuit board and preparation method thereof |
| CN113518515A (en) * | 2021-03-15 | 2021-10-19 | 江西宇睿电子科技有限公司 | Method for manufacturing broken-joint metalized edge and circuit board |
| CN113518515B (en) * | 2021-03-15 | 2023-09-08 | 江西宇睿电子科技有限公司 | Method for manufacturing broken joint metalized edge and circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101790289B (en) | PCB with interconnected blind holes and processing method thereof | |
| CN105722302B (en) | It is embedded in the circuit board and its processing method of boss Metal Substrate | |
| CN104244616B (en) | A kind of preparation method of centreless thin base sheet | |
| CN102523704A (en) | Production method of multi-stage HDI plate | |
| CN105704948B (en) | The production method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN104349609A (en) | Printed circuit board and manufacturing method thereof | |
| CN103871996A (en) | Package structure and manufacturing method thereof | |
| CN108882567B (en) | Manufacturing method of PCB | |
| CN104244597A (en) | Method for manufacturing coreless substrates of symmetrical structure | |
| CN102045964B (en) | Making method of circuit board | |
| CN103225094B (en) | The guard method of a kind of blind hole plate plating single-sided current | |
| CN211047360U (en) | Edge-covered circuit board | |
| CN105472909B (en) | A kind of processing method of stepped groove circuit board | |
| CN201674724U (en) | High-frequency circuit board | |
| CN102045936B (en) | Circuit board structure | |
| CN111343800B (en) | Processing technology for local electroplating of blind buried hole | |
| CN110740564B (en) | Processing method of dense network multilayer printed circuit board | |
| CN112449494B (en) | Manufacturing method of printed circuit board | |
| CN211063845U (en) | Mechanical blind hole HDI circuit board | |
| CN110461085B (en) | Circuit board capable of realizing crimping of components in stepped groove and manufacturing method thereof | |
| CN109195363B (en) | Manufacturing method of PCB (printed Circuit Board) interconnected in Z direction and PCB | |
| CN108882568B (en) | Manufacturing method of PCB | |
| CN114885524B (en) | Manufacturing method of dense copper paste hole circuit board and circuit board | |
| CN109379840A (en) | A kind of processing method and circuit board of hanging golden finger | |
| CN201717256U (en) | Passive device and circuit board embedded with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |