CN113518515B - Method for manufacturing broken joint metalized edge and circuit board - Google Patents
Method for manufacturing broken joint metalized edge and circuit board Download PDFInfo
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- CN113518515B CN113518515B CN202110273819.5A CN202110273819A CN113518515B CN 113518515 B CN113518515 B CN 113518515B CN 202110273819 A CN202110273819 A CN 202110273819A CN 113518515 B CN113518515 B CN 113518515B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000003801 milling Methods 0.000 claims abstract description 93
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052802 copper Inorganic materials 0.000 claims abstract description 49
- 239000010949 copper Substances 0.000 claims abstract description 49
- 238000007747 plating Methods 0.000 claims abstract description 32
- 238000013461 design Methods 0.000 claims abstract description 29
- 238000009713 electroplating Methods 0.000 claims abstract description 24
- 239000011265 semifinished product Substances 0.000 claims abstract description 10
- 238000003475 lamination Methods 0.000 claims abstract description 5
- 238000003754 machining Methods 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 22
- 238000010586 diagram Methods 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 101100493710 Caenorhabditis elegans bath-40 gene Proteins 0.000 description 1
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000001556 precipitation Methods 0.000 description 1
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- 239000000047 product Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The application relates to a method for manufacturing a broken joint metalized edge and a circuit board, wherein the method comprises the following steps: manufacturing an inner layer graph, wherein the inner layer graph comprises an inductance circuit graph and a board edge copper graph; performing lamination treatment to form a semi-finished product of the circuit board; milling a groove on the circuit board semi-finished product to manufacture a to-be-plated groove body; the plating bath body to be processed is arranged in the through groove to be processed, and the side wall of the plating bath body to be processed completely comprises a broken-section metalized edge design area; electroplating the to-be-electroplated tank body to form a metallized tank body; performing pre-milling processing; the pre-milling opening is arranged at the edge of a design area of a metalized side of the broken section of the metalized groove body; and (3) milling through grooves, removing the parts of the metalized groove body outside the design area of the broken section metalized edge of the metalized groove body, and finishing the manufacture of the broken section metalized edge. The method for manufacturing the broken joint metalized edge has the advantage of good processing quality.
Description
Technical Field
The application relates to the technical field of printed circuit board processing, in particular to a method for manufacturing a broken joint metalized edge and a circuit board.
Background
The printed circuit board (Printed Circuit Board, PCB), short circuit board, is made by electronic printing technology. The circuit board is not only a carrier for providing the circuit, but also a carrier for providing the electrical signal. The circuit patterns comprising the inductance coils are designed on each layer of the circuit board, so that the manufacturing of the inductance circuits can be completed in the processing process of the circuit board. Along with the development of multifunctionality, intellectualization and miniaturization of electronic products, the design of the inductance circuit of the circuit board is updated along with the development, and for some inductance circuits with special requirements of inductance measurement, inductance adjustment and the like, the functions of welding, crimping, inserting and the like of additional electronic components are required to be met by adopting a mode of manufacturing broken section metalized edges on the vertical edges of the circuit board. The broken metalized edge, i.e., the adjacent position of the vertical edge of the circuit board, is provided with a plurality of metalized edge areas which are arranged at intervals.
In the traditional manufacturing mode of the broken joint metalized edge, the groove body is completely molded, then the whole groove body is electroplated, and finally the unnecessary metalized area is milled off by using a milling cutter to form the broken joint metalized edge. The inner copper layer of the circuit board is used for removing the area which needs to be electrically connected with the metallized edge, the rest part is a large-area dielectric layer, and the area of the completely formed groove body which needs to be electroplated is large, so that when electroplating, the vertical edge lacks copper attachment points and force points, the adhesion force of copper is small, the problems of curling and pulling of electroplated copper are easy to occur when copper is milled later, and even the electroplated copper falls off when serious. Even if the problems of curling, pulling, falling and the like do not occur during processing, the problems of burrs and the like also occur at the edge of the broken joint metalized edge after processing; and the difficulty of the completely formed electroplating tank body is larger, the exchange force of electroplating liquid medicine in the larger tank body is weaker, the adhesion of copper is not facilitated, the completely formed electroplating tank body needs stronger electroplating parameters and more materials to meet the electroplating requirement of the larger tank body, and the cost is increased.
Based on the above problems, a novel manufacturing method of the broken joint metalized edge of the circuit board needs to be explored, and the processing quality of the broken joint metalized edge is improved.
Disclosure of Invention
Accordingly, it is necessary to provide a method for manufacturing a broken-section metalized side and a circuit board having good processing quality, in order to solve the above-mentioned problems.
The application provides a method for manufacturing a broken joint metalized edge, which comprises the following steps:
manufacturing an inner layer pattern, wherein the inner layer pattern comprises an inductance circuit pattern and a board edge copper pattern;
performing lamination treatment to form a semi-finished product of the circuit board;
milling the groove of the circuit board semi-finished product to manufacture a to-be-plated groove body; the to-be-plated tank body is arranged in the to-be-processed through tank, and the side wall of the to-be-plated tank body completely comprises a broken-section metalized edge design area;
electroplating the to-be-electroplated tank body to form a metallized tank body;
performing pre-milling processing; the pre-milling opening is arranged at the edge of the broken section metallized edge design area in the metallized groove body;
and (3) milling through grooves, and removing the parts of the metallized groove body outside the design area of the broken section metallized edge in the metallized groove body to finish the manufacture of the broken section metallized edge.
In one embodiment, after the pre-milling, milling a through groove to remove the portion of the metalized groove outside the design area of the broken metalized edge, and before completing the manufacture of the broken metalized edge, the method further includes: and performing microetching treatment.
In one embodiment, the milling cutter used in the groove milling process is a double-edge milling cutter, and the diameter of the double-edge milling cutter is 1/3-1/2 of the width of the electroplating tank body to be electroplated.
In one embodiment, the sidewall metallization of the metallization channel is 20 microns to 40 microns.
In one embodiment, the tool for pre-milling is a milling cutter, and the diameter of the milling cutter is 1/3-1/2 of the width of the metallized groove body.
In one embodiment, the milling cutter used for milling the through groove is a double-edge milling cutter, and the diameter of the double-edge milling cutter is 1/3-1/2 of the width of the through groove to be processed.
In one embodiment, the milling through groove processing removes the portion of the metalized groove outside the design area of the broken metalized edge in the metalized groove, and completes the manufacture of the broken metalized edge, including:
machining a through groove by using a double-edge milling cutter with the diameter being 1/2 of the width of the through groove to be machined, and removing the part of the metallized groove body outside the design area of the broken-section metallized edge;
and trimming the edge of the through groove by using a double-edge milling cutter with the diameter being 1/3 of the width of the through groove to be machined, so as to finish the manufacture of the broken joint metalized edge.
The second aspect of the application provides a circuit board, which comprises the broken joint metalized edge manufactured by the method for manufacturing the broken joint metalized edge.
According to the manufacturing method of the broken joint metalized edge, the copper graph of the plate edge is arranged on the inner layer, and the attachment points and the force points are built for the electroplated copper, so that the binding force between the electroplated copper and the plate edge can be enhanced. The body to be plated is processed before plating, and a good environment of the body to be plated is provided for plating. Before milling the through groove, pre-milling is performed, electroplated copper on the edge of a design area of the broken joint metalized edge to be reserved in the groove is milled, the problems of poor position of the broken joint metalized edge and the like caused by pulling and curling of copper sheets generated during subsequent groove milling can be avoided, and the processing quality of the broken joint metalized edge is improved.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a break metallization edge according to one embodiment;
FIG. 2 is a flow chart of another embodiment of a method for fabricating a break metallization edge;
FIG. 3 is a schematic diagram of an embodiment after an inner layer pattern is formed;
FIG. 4 is a schematic diagram of a structure after the charged plating tank is processed according to one embodiment;
FIG. 5 is a schematic illustration of the structure after electroplating to form a metallized tank in one embodiment;
FIG. 6 is a schematic diagram of a structure after pre-milling in one embodiment;
FIG. 7 is a schematic diagram of a structure after the broken metalized edge is formed in one embodiment.
Reference numerals illustrate: 100-of a circuit board body, 10-of an inductance circuit pattern, 20-of a plate edge copper pattern, 30-of a dielectric layer, 40-of a plating bath body to be plated, 41-of a copper plating layer, 50-of a through groove, 51-of an inner contour of the through groove, 52-of an outer contour of the through groove, 60-of a pre-milling opening and 70-of a broken metal edge.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. Embodiments of the application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
In a first aspect of the present application, referring to fig. 1, a method for manufacturing a broken metalized edge is provided, and in one embodiment, the method includes steps S10 to S70.
Step S10: manufacturing an inner layer graph, wherein the inner layer graph comprises an inductance circuit graph and a board edge copper graph;
step S20: performing lamination treatment to form a semi-finished product of the circuit board;
step S30: milling a groove on the circuit board semi-finished product to manufacture a to-be-plated groove body; the plating bath body to be processed is arranged in the through groove to be processed, and the side wall of the plating bath body to be processed completely comprises a broken-section metalized edge design area;
step S40: electroplating the to-be-electroplated tank body to form a metallized tank body;
step S50: performing pre-milling processing; the pre-milling opening is arranged at the edge of a design area of a metalized side of the broken section of the metalized groove body;
step S70: and (3) milling through grooves, removing the parts of the metalized groove body outside the design area of the broken section metalized edge of the metalized groove body, and finishing the manufacture of the broken section metalized edge.
According to the manufacturing method of the broken joint metalized edge, the copper graph of the plate edge is arranged on the inner layer, and the attachment points and the force points are built for the electroplated copper, so that the binding force between the electroplated copper and the plate edge can be enhanced. The body to be plated is processed before plating, and a good environment of the body to be plated is provided for plating. Before milling the through groove, pre-milling is performed, electroplated copper on the edge of a design area of the broken joint metalized edge to be reserved in the groove is milled, the problems of poor position of the broken joint metalized edge and the like caused by pulling and curling of copper sheets generated during subsequent groove milling can be avoided, and the processing quality of the broken joint metalized edge is improved.
In one embodiment, referring to fig. 2, after step S50, before step S70, step S60 is further included: and performing microetching treatment.
In the above embodiment, the groove body after milling the pre-milling opening is trimmed by adopting a microetching treatment mode, so that burrs and impurities generated during milling the pre-milling opening can be removed, and the processing quality is further improved.
The following detailed description refers to the accompanying drawings.
As shown in fig. 3, an inner core board is taken, and an inner pattern including an inductance circuit pattern 10 and a board side copper pattern 20 is formed on the inner core board. The inductance circuit patterns 10 and the board edge copper patterns 20 are correspondingly arranged, namely, the board edge corresponding to each inductance circuit pattern 10 is provided with the board edge copper patterns 20. It will be appreciated that the number of inductive elements in the inductive circuit pattern 10 may be one or more. Furthermore, each inductance element is correspondingly provided with two plate edge copper patterns, and the two plate edge copper patterns are oppositely arranged, so that good attachment points and good adhesion points are provided for electroplated copper in subsequent electroplating. In addition, the inductance circuit pattern 10 and the board edge copper pattern 20 can be manufactured synchronously with other circuit patterns on the inner core board, so that the board edge copper pattern 20 can be manufactured on the basis of not increasing the process flow, and the cost is reduced. Other areas of the layer expose dielectric layer 30 when there are no other circuit patterns on the inner core.
And after the inner layer pattern is manufactured, laminating and typesetting the inner layer core board with the pattern and the medium layers and the copper foils with the corresponding numbers, and then performing lamination treatment to form a semi-finished product of the circuit board. As shown in fig. 4, the circuit board semi-finished product is further processed by milling a groove to manufacture a plating tank body 40. The plating tank 40 is disposed in the through tank 50, and the sidewall of the plating tank 40 completely includes a design area of the broken metalized side. The broken-section metalized edge design area comprises a plurality of areas to be metalized which are arranged at intervals, and the areas are perpendicular to the plane where the inductance circuit pattern is located. Preferably, the number of plating baths 40 is the same as the number of regions to be metallized, and the sidewall of each plating bath 40 completely contains one region to be metallized. Preferably, the side wall of the plating bath body 40 completely includes a design area of the broken metal edge, and the plating bath body 40 corresponding to each area to be metallized is prevented from being milled through and broken as much as possible, and meanwhile, enough connection positions between the inductance circuit pattern 10 and the circuit board body 100 are ensured to be reserved. Preferably, the radial width of the plating tank 40 is the same as the width of the through tank to be processed, that is, two sides of the plating tank 40 in the width direction are tangent to the inner contour 51 of the through tank to be processed and the outer contour 52 of the through tank to be processed. Preferably, the milling cutter used in the above-mentioned groove milling process is a double-edged milling cutter, and the diameter of the double-edged milling cutter is 1/3-1/2 of the width of the plating tank 40 to be cut. The milling groove treatment is fine milling grooves, and has the advantage of good processing quality.
As shown in fig. 5, the plating process is performed on the plating tank 40, so that a copper plating layer 41 is formed on the side wall of the plating tank 40, and the manufacture of the metallized tank is completed. Preferably, the sidewall copper thickness of the metallized bath after the electroplating process is 20 microns to 40 microns. Optionally, the electroplating treatment process comprises the following steps: firstly, carrying out copper precipitation treatment to enable copper on the side wall of the plating bath body 40 to be plated so as to realize a conductive function; then carrying out full-plate electroplating to thicken the copper thickness of the side wall; then making an outer layer pattern, and covering the area without pattern electroplating by pasting a dry film, exposing and developing to expose the to-be-electroplated tank body 40 needing electroplating; then carrying out pattern electroplating to further thicken the copper thickness of the side wall of the groove body; finally, outer layer etching and film stripping treatment are carried out. Preferably, the above-mentioned technological processes of copper deposition, full-plate electroplating, outer layer pattern, pattern electroplating, outer layer etching and film removal in the electroplating process are all the technological processes of the circuit board to be processed, and the electroplating to-be-plated tank 40 and other holes to be plated or other electroplating to-be-plated tank on the circuit board to be processed are synchronously electroplated, so as to avoid the newly added process and reduce the cost.
After the metallized groove body is formed, as shown in fig. 6, a pre-milling opening 60 is formed, and the pre-milling opening 60 is arranged at the edge of the design area of the metallized edge of the broken section of the metallized groove body. That is, the pre-milling opening 60 breaks the broken joint metalized edge area from other areas in the metalized groove body, so that poor forming of the broken joint metalized edge position caused by pulling or curling of the copper sheet generated in the subsequent groove milling process can be avoided. The size of the pre-milling opening 60 is smaller than that of the metallized groove body, so that a smaller cutter can be used for machining when the pre-milling opening 60 is machined, and the machining quality is convenient to ensure. When the pre-milling opening 60 is processed, the milling through of the adjacent metallized groove bodies should be avoided as much as possible, and the milling into the connection position of the inductance circuit pattern 10 and the circuit board body 100 should be avoided. Alternatively, the tool for the pre-milling of the mouth 60 is a milling cutter having a diameter of 1/3-1/2 of the width of the metallized groove body. It will be appreciated that when the diameter of the mill is greater than the diameter of the pre-milling opening 60, then the size of the pre-milling opening 60 may be controlled by controlling the depth of feed of the mill, for example, a half-milling operation may be performed. Preferably, after the pre-milling opening 60 is processed, microetching treatment is performed to trim the processing area, thereby removing burrs and impurities generated during the pre-milling opening processing, and further improving the processing quality.
And finally, milling through grooves, removing the parts of the metallized groove body outside the design area of the broken section metallized edge of the metallized groove body, and finishing the manufacture of the broken section metallized edge. Optionally, the milling cutter used for milling the through groove is a double-edge milling cutter, and the diameter of the double-edge milling cutter is 1/3-1/2 of the width of the through groove to be processed, so that fine milling is performed. Optionally, milling the through groove comprises the following steps: firstly, machining a through groove by using a double-edge milling cutter with the diameter being 1/2 of the width of the through groove to be machined, and removing a part of the metallized groove outside a design area of a metallized edge of a broken section of the metallized groove; and trimming the edge of the through groove by using a double-edge milling cutter with the diameter being 1/3 of the width of the through groove to be machined, so as to finish the manufacture of the broken joint metalized edge.
One side of the through slot 50, as shown in fig. 7, includes a break metallized edge 70. The shape of the through slot 50 and the broken metallized edge 70 are determined by the shape of the pins of the external electronic component. In this embodiment, the through slot 50 is formed by two incomplete rings, and the broken metalized edge 70 is on the inner side wall of the through slot 50. It will be appreciated that different shapes of the through slots 50 may be designed for different pin shapes, and that the break metallized edges 70 may be provided at different locations of the through slots 50.
According to the manufacturing method of the broken joint metalized edge, the copper graph of the plate edge is arranged on the inner layer, and the attachment points and the force points are built for the electroplated copper, so that the binding force between the electroplated copper and the plate edge can be enhanced. The body to be plated is processed before plating, and a good environment of the body to be plated is provided for plating. Before milling the through groove, pre-milling is performed, electroplated copper on the edge of a design area of the broken joint metalized edge to be reserved in the groove is milled, the problems of poor position of the broken joint metalized edge and the like caused by pulling and curling of copper sheets generated during subsequent groove milling can be avoided, and the processing quality of the broken joint metalized edge is improved. Further, the size of the pre-milling opening is smaller than that of the through groove, so that the small milling cutter can be used for manufacturing, the finish milling effect can be achieved, the effective matching of all links of the whole flow is achieved, the reliability of the broken joint metalized edge is effectively improved, and the quality and manufacturing attractiveness of the broken joint metalized edge are improved. In addition, in the processing process, the manufacturing process is made simultaneously with the original manufacturing process of the circuit board as much as possible, so that a new flow is avoided, and the cost is reduced.
In a second aspect of the present application, a circuit board is provided, which includes the broken-section metallized edge in the above embodiment. Specifically, the number of layers of the circuit board can be four layers, six layers or other layers; can be a hard board or a soft and hard combined board. The design number of the broken section metalized edges in the circuit board can be one group or a plurality of groups. In summary, the number of layers, types and design numbers of the circuit board interrupt node metalized sides are not limited in this embodiment. It will be appreciated that other structures of the circuit board may be fabricated using other process steps to complete the overall circuit fabrication of the circuit board, depending on the actual circuit design, before and/or after the fabrication of the broken metallized edges.
According to the circuit board, when the broken joint metalized edge is manufactured, the copper graph on the board edge is arranged on the inner layer, so that the attachment points and the adhesive force points are built for the electroplated copper, and the bonding force between the electroplated copper and the board edge can be enhanced. The body to be plated is processed before plating, and a good environment of the body to be plated is provided for plating. Before milling the through groove, pre-milling is performed, electroplated copper on the edge of a design area of the broken joint metalized edge to be reserved in the groove is milled, the problems of poor position of the broken joint metalized edge and the like caused by pulling and curling of copper sheets generated during subsequent groove milling can be avoided, and the processing quality of the broken joint metalized edge is improved. Further, the size of the pre-milling opening is smaller than that of the through groove, so that the small milling cutter can be used for manufacturing, the finish milling effect can be achieved, the effective matching of all links of the whole flow is achieved, the reliability of the broken joint metalized edge is effectively improved, and the quality and manufacturing attractiveness of the broken joint metalized edge are improved. In addition, in the processing process, the manufacturing process is made simultaneously with the original manufacturing process of the circuit board as much as possible, so that a new flow is avoided, and the cost is reduced.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (3)
1. The manufacturing method of the broken joint metalized edge is characterized by comprising the following steps of:
manufacturing an inner layer pattern, wherein the inner layer pattern comprises an inductance circuit pattern and a board edge copper pattern;
performing lamination treatment to form a semi-finished product of the circuit board;
using a first double-edge milling cutter to mill grooves on the circuit board semi-finished product;
manufacturing a plating bath body to be plated; the to-be-plated tank body is arranged in the to-be-processed through tank, and the side wall of the to-be-plated tank body completely comprises a broken-section metalized edge design area;
the diameter of the first double-edge milling cutter is 1/3-1/2 of the width of the plating bath body to be plated;
electroplating the to-be-electroplated tank body to form a metallized tank body;
the milling cutter is used for pre-milling, and the diameter of the milling cutter is 1/3-1/2 of the width of the metallized groove body; the pre-milling opening is arranged at the edge of the broken section metallized edge design area in the metallized groove body;
carrying out microetching treatment;
machining a through groove by using a double-edge milling cutter with the diameter being 1/2 of the width of the through groove to be machined, and removing the part of the metallized groove body outside the design area of the broken-section metallized edge;
and trimming the edge of the through groove by using a double-edge milling cutter with the diameter being 1/3 of the width of the through groove to be machined, so as to finish the manufacture of the broken joint metalized edge.
2. The method for manufacturing the broken joint metalized side according to claim 1, wherein the thickness of the sidewall metalized layer of the metalized groove body is 20-40 microns.
3. A circuit board comprising a broken metallized edge manufactured by the method of manufacturing a broken metallized edge according to any one of claims 1 to 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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