CN111836470A - In-hole copper plating method before hole plugging of circuit board with buried through hole - Google Patents
In-hole copper plating method before hole plugging of circuit board with buried through hole Download PDFInfo
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- CN111836470A CN111836470A CN202010629125.6A CN202010629125A CN111836470A CN 111836470 A CN111836470 A CN 111836470A CN 202010629125 A CN202010629125 A CN 202010629125A CN 111836470 A CN111836470 A CN 111836470A
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- hole
- circuit board
- copper
- buried
- later use
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a hole copper plating method before plugging a circuit board with a buried through hole, which comprises the steps of cutting, heating and pressing, drilling a circuit board, depositing copper aiming at the buried through hole, carrying out first pattern transfer and pattern electroplating on the buried through hole, then carrying out hole plugging and polishing, carrying out secondary through hole drilling, secondary copper deposition electroplating and secondary pattern transfer, finally carrying out etching, solder mask and surface treatment, forming the circuit board, packaging in inspection, adding pattern transfer flow, namely, the first pattern transfer exposes the buried through hole to be electroplated for electroplating independently, and other positions which do not need to be electroplated are covered by dry films, so that the problems of uneven copper plating caused by whole-plate electroplating and uneven copper reduction after whole-plate electroplating are avoided, thereby avoiding the product rejection caused by incomplete etching or etching lines due to the problem of uneven copper thickness.
Description
Technical Field
The invention particularly relates to a hole copper plating method before plugging of a circuit board with a buried through hole.
Background
The pressing procedure in the circuit board manufacturing process is that all inner layer boards of the manufactured circuit are laminated with a substrate and an outer layer copper foil matched with a PP resin sheet, and then the inner layer boards and the substrate are pressed to form the multilayer circuit board. Before lamination, the substrate and the inner layer circuit board need to be filled with flowing resin slurry, and then a PP sheet is used for lamination.
The common process needs to carry out the steps of copper plating on the whole plate firstly and then copper reduction, the defect of uneven copper thickness of the whole plate copper plating exists, the hidden trouble of uneven copper reduction also exists in the subsequent copper reduction process, the problem of uneven copper thickness is further increased by overlapping the copper plating and the copper reduction process, and for products with high line distribution density, uneven copper thickness affects the subsequent etching process, so that incomplete etching or lines etched are easily caused, and the products are scrapped.
Disclosure of Invention
In view of the above, the present invention provides a method for copper plating in a hole before plugging a via hole of a via-embedded circuit board, which improves the production process, thereby avoiding the problem of uneven copper thickness caused by the conventional process, reducing the production difficulty of the via-embedded circuit board for high-density circuits, and improving the production capacity of precise circuits.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a hole copper plating method before plugging of a circuit board with a buried through hole comprises the following steps:
step 4, depositing copper for the first time: depositing a layer of chemical copper layer on the inner wall of the buried through hole for later use by inducing chemical copper deposition autocatalytic reaction at the position of the buried through hole of the circuit board blank corresponding to the step 3;
step 5, first pattern transfer: when the circuit board blank subjected to the copper deposition treatment in the step 4 is subjected to pattern transfer, a positive film is required to be manufactured, a blocking point is designed at the position of the buried through hole, the blocking point is 0.2mm larger than the diameter of the buried through hole, and the film is subjected to alignment, exposure and development to expose the buried through hole to be plated with copper for later use;
step 6, first pattern electroplating: in the step 5, the 'buried through hole' to be plated with copper is exposed independently through the film, and at the moment, a dry film is used for covering other positions which do not need to be plated before plating, then plating is completed, so that the inner wall of the 'buried through hole' is plated with copper uniformly, and finally the dry film is torn off for later use;
step 7, resin hole plugging: step 6, after the first copper plating is finished, resin is injected into the 'buried through hole' after the copper plating, so that the resin is solidified in the hole, and the resin at the two ends is protruded, thereby facilitating the subsequent processing for later use;
step 8, surface polishing: polishing the circuit board blank subjected to resin hole plugging in the step 7 by using polishing equipment to enable the copper plating layer protruding from the part of the circuit board blank corresponding to the buried through hole to be subtracted by resin, and obtaining a flat and smooth buried through hole surface for later use;
step 9, drilling for the second time; secondary drilling of a through hole is carried out on the position, parallel to the buried through hole, of the circuit board blank with the polished surface in the step 8 for later use;
step 10, secondary copper deposition: after the drilling of the circuit board blank is finished in the step 9, a layer of chemical copper layer is deposited on the surface of the circuit board blank and the inner wall of the through hole for standby by inducing chemical copper deposition autocatalytic reaction;
and step 12, second pattern transfer: after the secondary electroplating is finished in the step 11, a circuit etching pattern transfer layer is manufactured on the surface of the circuit board blank for standby;
step 13, etching: etching the circuit board blank after the pattern transfer in the step 12 by adopting an acid etching method, and etching and removing the unnecessary copper layers on the upper surface and the lower surface of the circuit board blank to form a circuit which is finally needed for later use;
step 14, solder mask and surface treatment: performing screen printing of solder mask ink on the surface of the circuit board blank processed in the step 13, then completely curing the solder mask ink by baking to finish solder mask treatment, and finally performing plate grinding and burr removing on the multilayer circuit board blank to finish surface treatment;
step 15, detection: performing electrical detection on the circuit board blank manufactured in the step 14 through a circuit board detector, and removing a failed product to obtain a qualified circuit board;
step 16: and (6) packaging and delivering out of the warehouse.
Furthermore, copper sheets are arranged on two surfaces of the core board in the step 1.
The technical effects of the invention are mainly reflected in the following aspects: through cutting the material, the heating pressfitting, circuit board drilling processing, carry out copper deposition to burying the through-hole, carry out first time figure transfer and figure electroplating to burying the through-hole, then carry out the consent, polish, carry out the secondary and bore out the through-hole, the secondary is heavy copper electroplating and second time figure transfer, etch at last, solder mask and surface treatment, make the circuit board shaping, pack in the inspection, through increasing the figure transfer flow, figure transfer for the first time promptly, it electroplates alone to expose "the through-hole" that will electroplate, "it hides alone to bury the through-hole", other positions that do not need electroplate use the dry film to hide, the copper facing that has removed whole board from and has electroplated the inhomogeneous problem of copper reduction after the whole board is electroplated, thereby avoid leading to the incomplete etching or the etching line to cause the product to scrap because of.
Drawings
FIG. 1 is a schematic diagram of a circuit board in step 1 of the present invention;
FIG. 2 is a schematic diagram of the circuit board after being pressed in step 2 according to the present invention;
FIG. 3 is a schematic view of a first drilling of a circuit board in step 3 according to the present invention;
FIG. 4 is a schematic view of the circuit board after the first copper deposition in step 4 of the present invention;
FIG. 5 is a schematic diagram of a first pattern transfer of the circuit board in step 5 according to the present invention;
FIG. 6 is a schematic diagram of a first pattern plating of a circuit board in step 6 of the present invention;
FIG. 7 is a schematic diagram of the circuit board after the first pattern plating stripping in step 6 of the present invention;
FIG. 8 is a schematic view of resin plugging of circuit board holes in step 7 according to the present invention;
FIG. 9 is a schematic view of the circuit board after polishing in step 8 according to the present invention;
FIG. 10 is a schematic view of the circuit board after a second drilling step 9 according to the present invention;
FIG. 11 is a schematic view of the circuit board after the second copper deposition in step 10 of the present invention;
FIG. 12 is a schematic view of the circuit board after the second electroplating in step 11 according to the present invention;
FIG. 13 is a diagram illustrating the circuit board after the second pattern transfer in step 12 according to the present invention;
fig. 14 is a schematic diagram of the circuit board after etching in step 13 according to the present invention.
Detailed Description
The embodiments of the present invention are described in further detail to make the technical solutions of the present invention easier to understand and master.
Examples
A hole copper plating method before plugging of a circuit board with a buried through hole comprises the following steps:
step 4, depositing copper for the first time: depositing a layer of chemical copper layer on the inner wall of the buried through hole by inducing chemical copper deposition autocatalytic reaction at the position of the buried through hole of the circuit board blank corresponding to the step 3, as shown in figure 4 for standby;
step 5, first pattern transfer: when the circuit board blank subjected to the copper deposition treatment in the step 4 is subjected to pattern transfer, a positive film is required to be manufactured, a blocking point is designed at the position of the buried through hole, the blocking point is 0.2mm larger than the diameter of the buried through hole, and the film is subjected to alignment, exposure and development to expose the buried through hole to be plated with copper, and is specifically shown in fig. 5 for standby application;
step 6, first pattern electroplating: in the step 5, the 'buried through hole' to be plated with copper is exposed independently through the film, the other positions which do not need to be plated with copper are covered by the dry film before plating, then plating is completed, so that the inner wall of the 'buried through hole' is plated with copper uniformly, and finally the dry film is torn off, as shown in fig. 6-7 for later use;
step 7, resin hole plugging: step 6, after the first copper plating is finished, injecting resin into the copper plated 'buried through hole' to enable the resin to be solidified in the hole, and enabling the resin at two ends to be protruded, so that the subsequent processing is facilitated, and the copper plated 'buried through hole' is particularly shown in fig. 8 for standby;
step 8, surface polishing: polishing the circuit board blank subjected to resin hole plugging in the step 7 by using polishing equipment to enable the copper plating layer protruding from the part of the circuit board blank corresponding to the buried through hole to be subtracted by resin, and obtaining a 'buried through hole' with a smooth and flat surface, as shown in fig. 9 for later use;
step 9, drilling for the second time; secondary drilling of a through hole is carried out on the position, parallel to the buried through hole, of the circuit board blank with the polished surface in the step 8, and the through hole is specifically shown in figure 10 for standby;
step 10, secondary copper deposition: after the drilling of the circuit board blank is completed in the step 9, a layer of chemical copper layer is deposited on the surface of the circuit board blank and the inner wall of the through hole by inducing a chemical copper deposition autocatalytic reaction, as shown in fig. 11 for standby;
and step 12, second pattern transfer: after the secondary electroplating is completed in step 11, a pattern transfer layer for circuit etching is manufactured on the surface of the circuit board blank, as shown in fig. 13 for standby;
step 13, etching: etching the circuit board blank after the pattern transfer in the step 12 by using an acid etching method, and etching and removing the unnecessary copper layers on the upper and lower surfaces of the circuit board blank to form a finally required circuit, which is specifically shown in fig. 14 for standby;
step 14, solder mask and surface treatment: performing screen printing of solder mask ink on the surface of the circuit board blank processed in the step 13, then completely curing the solder mask ink by baking to finish solder mask treatment, and finally performing plate grinding and burr removing on the multilayer circuit board blank to finish surface treatment;
step 15, detection: performing electrical detection on the circuit board blank manufactured in the step 14 through a circuit board detector, and removing a failed product to obtain a qualified circuit board;
step 16: and (6) packaging and delivering out of the warehouse.
In this embodiment, referring to fig. 1, in step 1, copper sheets 11 are disposed on both surfaces of the core board 1.
The technical effects of the invention are mainly reflected in the following aspects: through cutting the material, the heating pressfitting, circuit board drilling processing, carry out copper deposition to burying the through-hole, carry out first time figure transfer and figure electroplating to burying the through-hole, then carry out the consent, polish, carry out the secondary and bore out the through-hole, the secondary is heavy copper electroplating and second time figure transfer, etch at last, solder mask and surface treatment, make the circuit board shaping, pack in the inspection, through increasing the figure transfer flow, figure transfer for the first time promptly, it electroplates alone to expose "the through-hole" that will electroplate, "it hides alone to bury the through-hole", other positions that do not need electroplate use the dry film to hide, the copper facing that has removed whole board from and has electroplated the inhomogeneous problem of copper reduction after the whole board is electroplated, thereby avoid leading to the incomplete etching or the etching line to cause the product to scrap because of.
The above are only typical examples of the present invention, and besides, the present invention may have other embodiments, and all the technical solutions formed by equivalent substitutions or equivalent changes are within the scope of the present invention as claimed.
Claims (2)
1. A hole copper plating method before plugging of a circuit board with a buried through hole is characterized by comprising the following steps:
step 1, cutting: selecting a core board, a PP layer and copper foils according to the specific requirements of the circuit board, then performing electrical inspection on the core board through a circuit board detector, selecting a qualified core board for edge milling, and finally respectively attaching the PP layer and the copper foils to the two sides of the core board according to the design of a pressing structure to complete the setting of the structure of the circuit board to be pressed for standby;
step 2, laminating: step 1, after the press-fit structure is arranged, pressurizing the press-fit structure to 0.2-0.3MPA, heating to 150-180 ℃, and continuing for 20-30 seconds, so that the PP layers 2 on the two sides of the core plate 1 are filled into the hole grooves in the core plate 1 due to extrusion, and then press-fit processing is completed to obtain a circuit board blank for later use;
step 3, drilling for the first time: drilling a round hole at a preset position of a to-be-formed hole on the board surface or board edge of the circuit board blank to prepare a buried through hole for later use;
step 4, depositing copper for the first time: depositing a layer of chemical copper layer on the inner wall of the buried through hole for later use by inducing chemical copper deposition autocatalytic reaction at the position of the buried through hole of the circuit board blank corresponding to the step 3;
step 5, first pattern transfer: when the circuit board blank subjected to the copper deposition treatment in the step 4 is subjected to pattern transfer, a positive film is required to be manufactured, a blocking point is designed at the position of the buried through hole, the blocking point is 0.2mm larger than the diameter of the buried through hole, and the film is subjected to alignment, exposure and development to expose the buried through hole to be plated with copper for later use;
step 6, first pattern electroplating: in the step 5, the 'buried through hole' to be plated with copper is exposed independently through the film, and at the moment, a dry film is used for covering other positions which do not need to be plated before plating, then plating is completed, so that the inner wall of the 'buried through hole' is plated with copper uniformly, and finally the dry film is torn off for later use;
step 7, resin hole plugging: step 6, after the first copper plating is finished, resin is injected into the 'buried through hole' after the copper plating, so that the resin is solidified in the hole, and the resin at the two ends is protruded, thereby facilitating the subsequent processing for later use;
step 8, surface polishing: polishing the circuit board blank subjected to resin hole plugging in the step 7 by using polishing equipment to enable the copper plating layer protruding from the part of the circuit board blank corresponding to the buried through hole to be subtracted by resin, and obtaining a flat and smooth buried through hole surface for later use;
step 9, drilling for the second time; secondary drilling of a through hole is carried out on the position, parallel to the buried through hole, of the circuit board blank with the polished surface in the step 8 for later use;
step 10, secondary copper deposition: after the drilling of the circuit board blank is finished in the step 9, a layer of chemical copper layer is deposited on the surface of the circuit board blank and the inner wall of the through hole for standby by inducing chemical copper deposition autocatalytic reaction;
step 11, second electroplating: step 10, after copper deposition is finished, electroplating is carried out again, so that the copper layer of the circuit board blank is further thickened after copper deposition for later use;
and step 12, second pattern transfer: after the secondary electroplating is finished in the step 11, a circuit etching pattern transfer layer is manufactured on the surface of the circuit board blank for standby;
step 13, etching: etching the circuit board blank after the pattern transfer in the step 12 by adopting an acid etching method, and etching and removing the unnecessary copper layers on the upper surface and the lower surface of the circuit board blank to form a circuit which is finally needed for later use;
step 14, solder mask and surface treatment: performing screen printing of solder mask ink on the surface of the circuit board blank processed in the step 13, then completely curing the solder mask ink by baking to finish solder mask treatment, and finally performing plate grinding and burr removing on the multilayer circuit board blank to finish surface treatment;
step 15, detection: performing electrical detection on the circuit board blank manufactured in the step 14 through a circuit board detector, and removing a failed product to obtain a qualified circuit board;
step 16: and (6) packaging and delivering out of the warehouse.
2. The method for plating copper in the hole before the plug hole of the circuit board with the embedded through hole as claimed in claim 1, wherein: copper sheets are arranged on two surfaces of the core board in the step 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010629125.6A CN111836470A (en) | 2020-07-02 | 2020-07-02 | In-hole copper plating method before hole plugging of circuit board with buried through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010629125.6A CN111836470A (en) | 2020-07-02 | 2020-07-02 | In-hole copper plating method before hole plugging of circuit board with buried through hole |
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| Publication Number | Publication Date |
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| CN111836470A true CN111836470A (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010629125.6A Pending CN111836470A (en) | 2020-07-02 | 2020-07-02 | In-hole copper plating method before hole plugging of circuit board with buried through hole |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739031A (en) * | 2021-03-30 | 2021-04-30 | 四川英创力电子科技股份有限公司 | Printed circuit board with side-face metalized groove and processing technology thereof |
| CN113133224A (en) * | 2021-04-07 | 2021-07-16 | 威海世一电子有限公司 | FPCB plate via hole selective plating process |
| CN113660780A (en) * | 2021-08-04 | 2021-11-16 | 深圳崇达多层线路板有限公司 | Copper-buried circuit board and manufacturing method thereof |
| CN114096080A (en) * | 2021-11-11 | 2022-02-25 | 江苏普诺威电子股份有限公司 | Manufacturing process of thick-hole copper in printed circuit board |
| CN114137383A (en) * | 2022-02-08 | 2022-03-04 | 广东科翔电子科技股份有限公司 | High-precision Mini-LED board electric measurement method |
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| CN107613671A (en) * | 2017-08-02 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of circuit board plated hole |
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| CN104717845A (en) * | 2013-12-13 | 2015-06-17 | 深圳崇达多层线路板有限公司 | Technological method for outer layer circuit board resin hole plugging of multi-layer circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112739031A (en) * | 2021-03-30 | 2021-04-30 | 四川英创力电子科技股份有限公司 | Printed circuit board with side-face metalized groove and processing technology thereof |
| CN112739031B (en) * | 2021-03-30 | 2021-06-08 | 四川英创力电子科技股份有限公司 | Printed circuit board with side-face metalized groove and processing technology thereof |
| CN113133224A (en) * | 2021-04-07 | 2021-07-16 | 威海世一电子有限公司 | FPCB plate via hole selective plating process |
| CN113133224B (en) * | 2021-04-07 | 2022-07-08 | 威海世一电子有限公司 | FPCB plate via hole selective plating process |
| CN113660780A (en) * | 2021-08-04 | 2021-11-16 | 深圳崇达多层线路板有限公司 | Copper-buried circuit board and manufacturing method thereof |
| CN114096080A (en) * | 2021-11-11 | 2022-02-25 | 江苏普诺威电子股份有限公司 | Manufacturing process of thick-hole copper in printed circuit board |
| CN114137383A (en) * | 2022-02-08 | 2022-03-04 | 广东科翔电子科技股份有限公司 | High-precision Mini-LED board electric measurement method |
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Application publication date: 20201027 |
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