CN108401385B - Manufacturing method of stepped groove with non-metalized side wall - Google Patents
Manufacturing method of stepped groove with non-metalized side wall Download PDFInfo
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- CN108401385B CN108401385B CN201810218711.4A CN201810218711A CN108401385B CN 108401385 B CN108401385 B CN 108401385B CN 201810218711 A CN201810218711 A CN 201810218711A CN 108401385 B CN108401385 B CN 108401385B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
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- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to the technical field of PCBs and discloses a manufacturing method of a stepped groove with a non-metalized side wall. The manufacturing method comprises the following steps: pressing to obtain a multilayer board with an initial step groove; the multilayer board comprises a first outer layer surface and a second outer layer surface, and the notch of the initial stepped groove is formed in the first outer layer surface; carrying out integral copper-precipitation electroplating on the multilayer board and then carrying out integral tin plating; removing the tin layers on the surfaces of the first junction position and the second junction position to expose the copper layers of the first junction position and the second junction position; the first junction position is located at the junction position of the side wall and the first outer layer surface, and the second junction position is located at the junction position of the side wall and the bottom surface; removing the copper layers at the two junction positions, and then removing the residual tin layer; and manufacturing a preset pattern at the bottom of the initial step groove, and removing the copper layer on the side wall. The invention adopts the mode of firstly manufacturing the stepped groove and then manufacturing the groove bottom pattern, compared with the prior art, the invention can greatly simplify the manufacturing process, reduce the operation difficulty and improve the working efficiency.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a manufacturing method of a stepped groove with non-metalized side walls.
Background
With the advancement of science and technology, electronic products have become indispensable daily necessities in human life, and PCBs are important components of electronic products, so that in recent years, people have more and more functional requirements on electronic products, and thus higher requirements are made on PCBs. Generally, in order to facilitate the installation of a device with a special function or a device needing sinking on a PCB, a stepped groove is often required to be arranged on the PCB, and the stepped groove is also an important part for realizing high-power heat dissipation of a product, and is widely applied in the industry.
The side wall of the stepped groove can be metalized or non-metalized; and to the PCB of ladder groove lateral wall non-metallization, at present general preparation mode mainly has two kinds:
one is a depth controlled milling mode. The manufacturing method has the defects that the depth control difficulty is high, and the depth control milling to the specified line layer is difficult, so that the design requirement cannot be met; and no patterning can be done at the bottom of the trench.
And the other method is to pre-manufacture a via hole and a pattern at the bottom of the groove, fill or embed the gasket, and sequentially press a plate, open a cover and take out the gasket. In the manufacturing mode, the groove bottom graph is manufactured in advance and then the stepped groove is manufactured, so that on one hand, the groove bottom graph needs to be protected in the step groove manufacturing process, the process is complex and the operation is difficult; on the other hand, the method has no universality under the production requirement that different patterns need to be manufactured, and the popularization and application of the stepped groove PCB are restricted.
Disclosure of Invention
The invention aims to provide a method for manufacturing a stepped groove with a non-metalized side wall, which overcomes the defects of complex manufacturing process, difficult operation and poor universality in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a manufacturing method of a stepped groove with a non-metalized side wall comprises the following steps:
pressing to obtain a multilayer board with an initial step groove; the multilayer board comprises a first outer layer surface and a second outer layer surface which are distributed along the stacking direction, and the notch of the initial stepped groove is formed on the first outer layer surface;
carrying out integral copper deposition electroplating on the multilayer board;
carrying out integral tinning on the multilayer board;
removing the tin layers on the surfaces of the first boundary position and the second boundary position to expose the copper layers of the first boundary position and the second boundary position; the first junction position is located at the junction position of the side wall and the surface of the first outer layer, and the second junction position is located at the junction position of the side wall and the bottom surface;
removing the copper layers at the first boundary position and the second boundary position, and then removing the residual tin layer;
and manufacturing a preset pattern at the bottom of the initial stepped groove, and removing the copper layer on the side wall.
Optionally, the method for manufacturing a predetermined pattern on the bottom of the initial stepped trench and removing the copper layer on the sidewall includes:
carrying out integral tinning on the multilayer board;
removing the tin layer in the non-predetermined pattern area of the bottom surface to expose the copper layer in the non-predetermined pattern area;
removing the copper layer of the non-predetermined pattern region of the bottom surface and the copper layer of the side wall;
and removing the tin layer in the preset pattern area of the bottom surface to expose and form the copper layer in the preset pattern area into a preset pattern.
Optionally, the manufacturing method further includes:
after a multilayer board with an initial step groove is manufactured through pressing and before the multilayer board is subjected to integral copper deposition electroplating, a via hole is formed at the bottom of the initial step groove.
Optionally, the manufacturing method further includes: and manufacturing a preset pattern at the bottom of the initial step groove, removing the copper layer on the side wall, and manufacturing a hole ring.
Optionally, the method for manufacturing the annular ring while manufacturing the predetermined pattern at the bottom of the initial stepped trench and removing the copper layer on the sidewall includes:
carrying out integral tinning on the multilayer board;
removing the tin layer of the non-predetermined pattern and the non-hole ring region on the bottom surface to expose the copper layer of the non-predetermined pattern and the non-hole ring region;
removing the copper layer of the non-predetermined pattern and non-annular ring region on the bottom surface and the copper layer of the side wall;
and removing the tin layer in the preset pattern of the bottom surface and the hole ring area, so that the copper layer in the preset pattern and the hole ring area is exposed to form the preset pattern and the preset hole ring.
Optionally, the manufacturing method further includes: and manufacturing an outer layer pattern while manufacturing a preset pattern at the bottom of the initial stepped groove and removing the copper layer on the side wall.
Optionally, the widths of the first junction position and the second junction position are both 2mil to 3 mil.
Optionally, in the step of press-fitting the multilayer board having the initial stepped groove, the initial stepped groove is manufactured by filling or embedding a gasket.
Optionally, the predetermined pattern includes a line and/or a pad.
A PCB comprising a stepped trench with non-metallized sidewalls, the stepped trench being made according to the method of making as set forth in any one of the preceding claims.
Compared with the prior art, the invention has the beneficial effects that:
by applying the embodiment of the invention, the PCB with the stepped groove can be manufactured, the side wall of the stepped groove is not metalized, and a preset pattern is formed at the bottom of the groove; in the manufacturing process, the mode of firstly manufacturing the stepped groove and then manufacturing the groove bottom graph is adopted, compared with the prior art, the manufacturing process can be greatly simplified, the operation difficulty is reduced, and the working efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a flowchart of a method for manufacturing a sidewall-non-metalized stepped trench according to an embodiment of the present invention;
FIG. 2 is a structural view of a multi-layer board formed with initial stepped slots according to one embodiment of the present invention;
FIG. 3 is a view of the structure of the multi-layer board shown in FIG. 2 after the copper plating;
FIG. 4 is a view of the structure of the multi-layer board of FIG. 3 after being integrally tinned;
FIG. 5 is a view of the structure of the multi-layer board of FIG. 4 after removing the tin layer at the interface between the sidewall of the stepped trench and the outer layer and the bottom of the stepped trench;
FIG. 6 is a view of the structure of the multi-layer board of FIG. 5 after the copper layers at the two interface locations have been removed;
FIG. 7 is a view of the structure of the multi-layer board of FIG. 6 after stripping the tin;
FIG. 8 is a view of the structure of the multi-layer board of FIG. 7 after being integrally tinned;
FIG. 9 is a view of the structure of the multi-layer board of FIG. 8 after the removal of the tin layer in the non-predetermined pattern area of the bottom of the trench;
FIG. 10 is a view of the structure of the multi-layer board of FIG. 9 after removal of the non-predetermined patterned areas of the bottom of the trench and the copper layer on the sidewalls;
FIG. 11 is a view of the structure of the multi-layer board of FIG. 10 after removal of the remaining tin layer;
fig. 12 is a flowchart of a method for manufacturing a sidewall non-metalized stepped trench according to a second embodiment of the present invention;
FIG. 13 is a structural view of a multi-layer board formed with an initial stepped groove, drilled in the groove and plated integrally according to a second embodiment of the present invention;
FIG. 14 is a view of the structure of the multi-layer board of FIG. 13 after being integrally tinned;
FIG. 15 is a view of the structure of the multi-layer board of FIG. 14 after the removal of the tin layer at the interface between the sidewall of the stepped trench and the outer layer surface and the bottom surface of the stepped trench;
FIG. 16 is a view of the structure of the multi-layer board of FIG. 15 after the copper layers at the two interface locations have been removed;
FIG. 17 is a view of the structure of the multi-layer board of FIG. 16 after stripping the tin;
FIG. 18 is a view of the structure of the multi-layer board of FIG. 17 after being integrally tinned;
FIG. 19 is a view of the structure of the multi-layer board of FIG. 18 after removal of the tin layer in the non-predetermined pattern of the bottom of the trench and the non-annular ring area;
FIG. 20 is a view of the structure of the multi-layer board of FIG. 19 after removal of the copper layer in the non-predetermined pattern at the bottom of the trench and in the non-annular ring region;
fig. 21 is a view of the structure of the multi-layer board of fig. 20 after removal of the tin layer at the predetermined pattern of the bottom of the trench and in the ring area.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, a method for manufacturing a sidewall-non-metalized stepped trench is provided in the present embodiment, including the steps of:
after completing the inner layer pattern fabrication, step 101, a multi-layer board with an initial step groove is formed by pressing, as shown in fig. 2.
The multilayer board comprises a first outer layer surface and a second outer layer surface which are distributed along the stacking direction, and the bottom surface and the side wall of the initial stepped groove are not metalized; the initial stepped groove can be manufactured and molded by adopting a conventional filling or embedding manner, and the notch of the initial stepped groove is formed on the surface of the first outer layer.
The method for manufacturing the initial step groove by adopting the gasket embedding mode comprises the following steps: respectively finishing the manufacture of the inner layer graph of each core board; windowing at preset positions on a specified inner core board and a specified prepreg; stacking each core board and prepreg according to a preset sequence, and filling a gasket in a groove formed by a specified inner core board and a specified prepreg; lamination, followed by uncapping (i.e., milling away the portion of the core located in the area above the shim) and removing the shim, thereby forming an initial stepped groove.
The method for manufacturing the initial step groove by adopting the gasket filling mode comprises the following steps: respectively finishing the manufacture of the inner layer graph of each core board; windowing at preset positions on the designated outer-layer core board, the designated inner-layer core board and the designated prepreg; stacking each core board and prepreg according to a preset sequence, and embedding a gasket in a groove formed by the specified outer core board, the specified inner core board and the specified prepreg; laminating after a buffer plate is arranged on the outer layer of the outer core plate; after lamination, the buffer plate is removed and the gasket is removed, thereby forming an initial stepped channel.
Step 102, performing integral copper deposition electroplating on the multilayer board, so that the outer layer surface (including the first outer layer surface and the second outer layer surface distributed along the stacking direction) and the inner surface (including the side wall and the bottom surface of the stepped groove) of the multilayer board are plated with copper layers, as shown in fig. 3.
Step 103, performing integral tin plating on the multilayer board, so that the outer surface (including the first outer layer surface and the second outer layer surface distributed along the stacking direction) of the multilayer board and the inner surface (including the side wall and the bottom surface of the initial stepped groove) of the initial stepped groove are plated with tin layers, as shown in fig. 4.
Step 104, performing laser ablation on a first boundary position between the first outer layer surface of the multilayer board and the initial step groove side wall and a second boundary position between the initial step groove side wall and the initial step groove bottom surface by using a laser cutting machine respectively to remove the tin layers at the first boundary position and the second boundary position and expose the copper layer at the bottom of the tin layers, as shown in fig. 5.
The size of the first boundary position and the second boundary position can be flexibly set according to the design requirement, and the width of the first boundary position and the second boundary position can be 2-3 mil.
Step 105, removing the exposed copper layer at the first interface position and the second interface position by using a chemical etching method, as shown in fig. 6.
And 106, removing the residual tin layer on the outer layer surface of the multilayer board and the inner surface of the initial step groove by adopting a conventional tin stripping process, as shown in fig. 7.
So far, the copper layer of initial ladder groove lateral wall and the copper layer on first outer surface and the copper layer of initial ladder groove bottom surface have all realized the isolation, have made things convenient for the non-metallization of initial ladder groove lateral wall greatly to handle.
And 107, manufacturing a preset pattern at the bottom of the initial stepped groove, and removing the copper layer on the side wall of the initial stepped groove to enable the side wall of the initial stepped groove to be non-metallized.
Specifically, this step 107 further includes:
(1) and carrying out integral tinning on the multilayer board.
Since the initial step bath side wall and the first outer layer surface and the copper layer of the initial step bath bottom surface are disconnected, the first outer layer surface and the initial step bath bottom surface will be plated with the tin layer after the whole tin plating operation of this step, and the initial step bath side wall will not be plated with the tin layer, as shown in fig. 8.
(2) The tin layer is removed by laser ablation in the non-predetermined pattern area of the bottom surface of the initial step groove to expose the copper layer in this area, as shown in fig. 9.
Wherein the initial step groove bottom surface is divided into a predetermined pattern area and a non-predetermined pattern area.
(3) Removing the copper layer in the non-predetermined pattern area on the bottom surface of the initial step groove by adopting a chemical etching mode; meanwhile, a chemical etching mode is adopted to remove the copper layer on the side wall of the initial stepped groove, so that the side wall of the initial stepped groove is not metallized to meet the design requirement, as shown in fig. 10.
(4) The tin layer is removed by laser ablation in a predetermined pattern area on the bottom surface of the initial step groove to expose the copper layer in the area, and the part of the copper layer is formed into a predetermined pattern, as shown in fig. 11.
In step 107, the outer layer pattern can be made by a normal manufacturing process to improve the working efficiency.
Thus, a PCB with a step groove is manufactured, the side wall of the step groove is not metalized, and a preset pattern is formed at the bottom of the groove. In the manufacturing process, a mode of firstly manufacturing the stepped groove and then manufacturing the groove bottom graph is adopted, compared with the prior art, the manufacturing process can be greatly simplified, the operation difficulty is reduced, and the working efficiency is improved.
Example two
In another embodiment, a second method for manufacturing a stepped trench with non-metalized sidewalls is provided, where the bottom of the stepped trench is not only formed with a predetermined pattern but also formed with a via hole.
Referring to fig. 12, the method for manufacturing the stepped trench of the present embodiment includes the steps of:
And step 206, removing the residual tin layer on the outer layer surface of the multilayer board, the inner surface of the initial step groove and the inner wall of the via hole by adopting a conventional tin stripping process, as shown in fig. 17.
And step 207, manufacturing a preset pattern and a preset hole ring at the bottom of the initial stepped groove, and removing the copper layer on the side wall of the initial stepped groove to enable the side wall of the initial stepped groove to be non-metallized.
Specifically, this step 207 further includes:
(1) the multilayer board was bulk tinned as shown in fig. 18.
(2) Removing the tin layer of the non-predetermined pattern and non-hole ring region on the bottom surface of the initial step groove to expose the copper layer in the region, as shown in fig. 19, wherein the bottom surface of the initial step groove is divided into a predetermined pattern and hole ring region, a non-predetermined pattern and a non-hole ring region;
(3) removing the copper layer of the non-predetermined pattern and the non-hole ring region on the bottom surface of the initial stepped groove, and simultaneously removing the copper layer on the side wall of the initial stepped groove, so that the side wall of the initial stepped groove is not metalized, as shown in fig. 20;
(4) the tin layer is removed in the predetermined pattern and the collar region at the bottom of the initial step groove to expose the copper layer in that region, and this portion of the copper layer is formed in the predetermined pattern and the predetermined collar, as shown in fig. 21.
Thus, the bottom of the stepped trench manufactured in this embodiment may not only form various types of predetermined patterns, which may include lines and/or pads, but also form vias and rings.
In the existing manufacturing mode of firstly manufacturing a groove bottom pattern and a groove bottom via hole and then manufacturing a stepped groove, the groove bottom via hole needs to be protected in advance through a resin hole plugging mode or by using special materials, so that the via hole is prevented from being adversely affected in subsequent processes such as electroplating and etching, and the problems of complex process, high cost and difficult operation are caused. Compared with the prior art, the manufacturing method of the embodiment does not need to protect the via hole, greatly simplifies the manufacturing process, reduces the operation difficulty, improves the production efficiency and reduces the manufacturing cost.
EXAMPLE III
The third embodiment provides a PCB, which includes a step groove with a non-metalized side wall, and the step groove is manufactured according to the manufacturing method provided in the first embodiment or the second embodiment.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A manufacturing method of a stepped groove with a non-metalized side wall is characterized by comprising the following steps:
pressing to obtain a multilayer board with an initial step groove; the multilayer board comprises a first outer layer surface and a second outer layer surface which are distributed along the stacking direction, and the notch of the initial stepped groove is formed on the first outer layer surface;
carrying out integral copper deposition electroplating on the multilayer board;
carrying out integral tinning on the multilayer board;
removing the tin layers on the surfaces of the first boundary position and the second boundary position to expose the copper layers of the first boundary position and the second boundary position; the first junction position is located at the junction position of the side wall of the initial stepped groove and the surface of the first outer layer, and the second junction position is located at the junction position of the side wall and the bottom surface of the initial stepped groove;
removing the copper layers at the first boundary position and the second boundary position, and then removing the residual tin layer;
and manufacturing a preset pattern at the bottom of the initial stepped groove, and removing the copper layer on the side wall.
2. The method for forming a sidewall-non-metallized stepped trench as claimed in claim 1, wherein said step of forming a predetermined pattern on the bottom of the initial stepped trench and removing the copper layer from said sidewall comprises:
carrying out integral tinning on the multilayer board;
removing the tin layer in the non-predetermined pattern area of the bottom surface to expose the copper layer in the non-predetermined pattern area;
removing the copper layer of the non-predetermined pattern region of the bottom surface and the copper layer of the side wall;
and removing the tin layer in the preset pattern area of the bottom surface to expose and form the copper layer in the preset pattern area into a preset pattern.
3. The method of making a sidewall non-metallized stepped recess of claim 1, further comprising:
after a multilayer board with an initial step groove is manufactured through pressing and before the multilayer board is subjected to integral copper deposition electroplating, a via hole is formed at the bottom of the initial step groove.
4. The method of making a sidewall non-metallized stepped recess of claim 3, further comprising: and manufacturing a preset pattern at the bottom of the initial step groove, removing the copper layer on the side wall, and manufacturing a hole ring.
5. The method for forming a sidewall-non-metallized stepped trench as claimed in claim 4, wherein said method for forming an annular ring while forming a predetermined pattern on the bottom of said initial stepped trench and removing the copper layer from said sidewall comprises:
carrying out integral tinning on the multilayer board;
removing the tin layer of the non-predetermined pattern and the non-hole ring region on the bottom surface to expose the copper layer of the non-predetermined pattern and the non-hole ring region;
removing the copper layer of the non-predetermined pattern and non-annular ring region on the bottom surface and the copper layer of the side wall;
and removing the tin layer in the preset pattern of the bottom surface and the hole ring area, so that the copper layer in the preset pattern and the hole ring area is exposed to form the preset pattern and the preset hole ring.
6. The method of making a sidewall non-metallized stepped recess of claim 1, further comprising: and manufacturing an outer layer pattern while manufacturing a preset pattern at the bottom of the initial stepped groove and removing the copper layer on the side wall.
7. The method for manufacturing the sidewall-non-metallized stepped slot according to claim 1, wherein the widths of the first boundary position and the second boundary position are both 2mil to 3 mil.
8. The method for forming a multilayer board having non-metallized side walls according to claim 1, wherein said step of press-fitting a multilayer board having an initial stepped groove is performed by filling or embedding a gasket.
9. The method of claim 1, wherein the predetermined pattern comprises traces and/or pads.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810218711.4A CN108401385B (en) | 2018-03-16 | 2018-03-16 | Manufacturing method of stepped groove with non-metalized side wall |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810218711.4A CN108401385B (en) | 2018-03-16 | 2018-03-16 | Manufacturing method of stepped groove with non-metalized side wall |
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| CN108401385B true CN108401385B (en) | 2020-01-17 |
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| CN109219250B (en) * | 2018-08-17 | 2021-05-07 | 昆山沪利微电有限公司 | PCB heat dissipation T-shaped hole machining method |
| CN112543560A (en) * | 2019-09-20 | 2021-03-23 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129895A (en) * | 1989-10-16 | 1991-06-03 | Matsushita Electric Ind Co Ltd | High frequency multilayer board |
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103687313A (en) * | 2013-11-26 | 2014-03-26 | 广州杰赛科技股份有限公司 | Method for graphically machining bottoms of blind grooves |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
-
2018
- 2018-03-16 CN CN201810218711.4A patent/CN108401385B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129895A (en) * | 1989-10-16 | 1991-06-03 | Matsushita Electric Ind Co Ltd | High frequency multilayer board |
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103687313A (en) * | 2013-11-26 | 2014-03-26 | 广州杰赛科技股份有限公司 | Method for graphically machining bottoms of blind grooves |
| CN106793589A (en) * | 2016-12-29 | 2017-05-31 | 生益电子股份有限公司 | A kind of preparation method of wiring board bottom land figure |
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