CN106341950A - Circuit board manufacturing method adopting resin plugging - Google Patents
Circuit board manufacturing method adopting resin plugging Download PDFInfo
- Publication number
- CN106341950A CN106341950A CN201610860735.0A CN201610860735A CN106341950A CN 106341950 A CN106341950 A CN 106341950A CN 201610860735 A CN201610860735 A CN 201610860735A CN 106341950 A CN106341950 A CN 106341950A
- Authority
- CN
- China
- Prior art keywords
- copper
- hole
- resin
- dry film
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a circuit board manufacturing method adopting resin plugging. The method includes the following steps of: step one, rough shape cutting; step two, brownification and copper reduction; step three, hole drilling; and step 4, electroless plating copper/board plating: hole walls are metallized by using chemical deposition, and hole copper and a copper layer on a copper clad layer are thickened by 2 to 3 microns through adopting a whole-board electroplating method; step five, hole plating and dry film attachment: a photosensitive dry film is attached onto a board processed in the step four; step six, hole plating: copper electroplating thickening is performed on the board which has been subjected to hole plating and dry film attachment through adopting an electroplating method; step seven, resin plugging; step eight, board baking: resin is baked optimally and cured through high temperature; and step nine, adhesive residue removing: the resin and the dry film are eroded by using chemical solutions, while, the chemical solutions do not react with the copper. According to the circuit board manufacturing method adopting resin plugging of the invention, the resin is applied to the hole plated board, and hole plugging and curing can be carried out, and then, the resin on the surface of the board can be removed through a chemical adhesive removing method, and polishing is not required, and the copper thickness of the surface of the board is only 10 microns. With the circuit board manufacturing method adopting resin plugging of the invention adopted, a fine circuit board of which the minimum line width and line spacing can be 2.5mil can be produced.
Description
Technical field
The present invention relates to circuit board manufacturing area, particularly to a kind of circuit board resin consent preparation method.
Background technology
Light, thin, miniaturization with the 3/4g product such as following mobile phone and digital camera and multifunction development trend are right
(hdi defines hdi: all pcb have on-mechanical boring, aperture≤0.15mm (6mil), orifice ring≤0.25mm (10mil), and contact
, in 130 points/inch2, wiring density is in 117inch/inch2 (live width line-spacing 4/4mil) above person, referred to as hdi class for density
Pcb) requirements at the higher level are constantly proposed.
Due to compactization of electronic product, on the packing forms of electronic component its size reduce also extremely obvious,
The high density promoting wiring board must synchronous improve.High-density development direction mainly has two kinds, and one makes for buried blind via, and two is essence
Fine rule road makes.
When making, table copper thickness can be stepped up, it is impossible to make fine-line, only plating by the way of plated hole buried blind via
Surfacing copper, although can solve the problems, such as that surface copper thickness is stepped up, but does not carry out resin polishing, multi-layer sheet central layer to hole copper after consent
Layers of copper skewness, the plate appearance after leading to press is uneven, and during polishing resin, the layers of copper of regional area is reamed dew
Go out base material to lead to scrap.
In order to overcome this phenomenon, the copper layer thickness of copper-clad plate would generally be controlled in more than 20um in industry, so root
Originally live width cannot be made, line-spacing is less than the fine-line plate of 3mil.
Content of the invention
The invention provides a kind of circuit board resin consent preparation method, with solve cannot to make in prior art live width,
Line-spacing is less than the problem of the fine-line plate of 3mil.
For solving the above problems, as one aspect of the present invention, there is provided a kind of circuit board resin consent preparation method,
Including:
Step 1. sawing sheet: the copper-clad plate that base copper thickness is 12um is cut into by preliminary dimension by cutting machine；
Step 2. brown subtracts copper: is stung by way of copper by chemistry, the layers of copper in copper-clad plate is uniformly thinned to 7-9um；
Step 3, boring: using the through hole of boring machine drill different pore size；
Step 4, the plating of heavy copper/plate: using chemical deposition mode by the via hole, by hole by the way of whole plate plating
Layers of copper on copper and copper-clad plate thickeies 2-3um；
Step 5, plated hole dry film: paste last layer photosensitive dry film on the plate after step 4 is processed, entered using the plated hole film
Row selectively exposes with the figure required for being formed, then is developed by alkalescent liquid medicine, so that needing the hole that copper facing thickeies
Exposed copper-plated copper face out, is not needed to be covered by dry film；
Step 6, plated hole: using the mode of plating, electro-coppering thickening is carried out to the plate after plated hole dry film；
Step 7, filling holes with resin: under vacuum state and predetermined pressure, by way of whole plate is coated with, resin ink is filled
Enter to need the in the hole of filling holes with resin；
Step 8, baking sheet: by high temperature, resin optimization is dried and solidify；
Step 9, de-smear: erosion resin and dry film are stung by chemical medicinal liquid, but does not react with layers of copper；
Step 10, aperture of polishing: the layers of copper that aperture is protruded polishes flat.
In technique scheme, directly coating resin on the plate after plated hole carries out consent and solidifies, so the present invention
Remove the resin of plate surface afterwards by the method for chemistry removing glue, need not carry out polishing just can removal resin ink quickly and doing
Film, the surface copper being so obtained is thick to only have 10um, can make the fine-line plate of minimum feature line-spacing 2.5mil.
Specific embodiment
Hereinafter embodiments of the invention are described in detail, but the present invention can be defined by the claims and cover
Multitude of different ways is implemented.
The invention provides a kind of circuit board resin consent preparation method, comprising:
Step 1. sawing sheet: the copper-clad plate that base copper thickness is 12um is cut into by preliminary dimension by cutting machine；
Step 2. brown subtracts copper: is stung by way of copper by chemistry, the layers of copper in copper-clad plate is uniformly thinned to 7-9um；
Step 3, boring: using the through hole of boring machine drill different pore size；
Step 4, the plating of heavy copper/plate: using chemical deposition mode by the via hole, by hole by the way of whole plate plating
Layers of copper on copper and copper-clad plate thickeies 2-3um；
Step 5, plated hole dry film: paste last layer photosensitive dry film on the plate after step 4 is processed, entered using the plated hole film
Row selectively exposes with the figure required for being formed, then is developed by alkalescent liquid medicine, so that needing the hole that copper facing thickeies
Exposed copper-plated copper face out, is not needed to be covered by dry film；
Step 6, plated hole: using the mode of plating, electro-coppering thickening is carried out to the plate after plated hole dry film；
Step 7, filling holes with resin: under vacuum state and predetermined pressure, by way of whole plate is coated with, resin ink is filled
Enter to need the in the hole of filling holes with resin；
Step 8, baking sheet: by high temperature, resin optimization is dried and solidify；
Step 9, de-smear: erosion resin and dry film are stung by chemical medicinal liquid, but does not react with layers of copper；
Step 10, aperture of polishing: the layers of copper that aperture is protruded polishes flat.
In technique scheme, plate of the present invention adopts the base copper of 12um, then subtracts copper to 7-9um by brown, adopts
Hole copper is made to meet customer requirement and the thick growth of control surface copper with the preparation method of dry film plated hole, then, directly after plated hole
On plate, coating resin carries out consent and solidifies, and then removes the resin of plate surface by the method for chemistry removing glue.
Because removing glue liquid medicine is in alkalescence, the dry film under resin is met alkali and is peeled off immediately, need not carry out polishing and just can go quickly
Except resin ink and dry film, table copper is not damaged, and in the hole resin is full.So, the copper on surface is thick only has 10um, can make
The fine-line plate of little live width line-spacing 2.5mil.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (1)
1. a kind of circuit board resin consent preparation method is it is characterised in that include:
Step 1. sawing sheet: the described copper-clad plate that base copper thickness is 12um is cut into by preliminary dimension by described cutting machine；
Step 2. brown subtracts copper: is stung by way of copper by chemistry, the layers of copper in copper-clad plate is uniformly thinned to 7-9um；
Step 3, boring: using the through hole of boring machine drill different pore size；
Step 4, the plating of heavy copper/plate: using chemical deposition mode by the via hole, by the way of whole plate plating by hole copper and
Layers of copper in copper-clad plate thickeies 2-3um；
Step 5, plated hole dry film: paste last layer photosensitive dry film on the plate after step 4 is processed, selected using the plated hole film
The exposure of selecting property is with the figure required for being formed, then is developed by alkalescent liquid medicine, so that needing the hole that copper facing thickeies exposed
Out, copper-plated copper face is not needed to be covered by dry film；
Step 6, plated hole: using the mode of plating, electro-coppering thickening is carried out to the plate after plated hole dry film；
Step 7, filling holes with resin: under vacuum state and predetermined pressure, by way of whole plate is coated with, resin ink is poured into be needed
The in the hole of filling holes with resin；
Step 8, baking sheet: by high temperature, resin optimization is dried and solidify；
Step 9, de-smear: erosion resin and dry film are stung by chemical medicinal liquid, but does not react with layers of copper；
Step 10, aperture of polishing: the layers of copper that aperture is protruded polishes flat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610860735.0A CN106341950A (en) | 2016-09-29 | 2016-09-29 | Circuit board manufacturing method adopting resin plugging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610860735.0A CN106341950A (en) | 2016-09-29 | 2016-09-29 | Circuit board manufacturing method adopting resin plugging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106341950A true CN106341950A (en) | 2017-01-18 |
Family
ID=57840390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610860735.0A Pending CN106341950A (en) | 2016-09-29 | 2016-09-29 | Circuit board manufacturing method adopting resin plugging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106341950A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289374A (en) * | 2017-12-21 | 2018-07-17 | 江门崇达电路技术有限公司 | A kind of production method of filling holes with resin wiring board |
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
| CN110167274A (en) * | 2019-04-29 | 2019-08-23 | 恩达电路(深圳)有限公司 | The production method of millimetre-wave radar plate |
| CN110536565A (en) * | 2019-08-06 | 2019-12-03 | 宁波华远电子科技有限公司 | A kind of filling perforation method of wiring board through-hole |
| CN111246670A (en) * | 2020-01-21 | 2020-06-05 | 惠州中京电子科技有限公司 | Method for manufacturing thin plate or soft plate through macroporous resin hole plugging |
| CN111818737A (en) * | 2020-07-23 | 2020-10-23 | 深圳市和美精艺科技有限公司 | Method for plugging ink front plug coating hole of packaging substrate |
| CN111836470A (en) * | 2020-07-02 | 2020-10-27 | 肇庆昌隆电子有限公司 | In-hole copper plating method before hole plugging of circuit board with buried through hole |
| CN111988920A (en) * | 2020-10-27 | 2020-11-24 | 智恩电子(大亚湾)有限公司 | Solder-resisting hole plugging method for BMU printed circuit board |
| CN112165782A (en) * | 2020-11-02 | 2021-01-01 | 胜华电子（惠阳）有限公司 | Resin hole plugging process for printed circuit board with high aspect ratio |
| CN112165778A (en) * | 2020-10-19 | 2021-01-01 | 东莞森玛仕格里菲电路有限公司 | Method for preventing substrate from being exposed by grinding plate in selective hole plugging process |
| CN112911833A (en) * | 2021-01-15 | 2021-06-04 | 扬宣电子(清远)有限公司 | Preparation method of PCB (printed circuit board) |
| CN113194616A (en) * | 2021-05-21 | 2021-07-30 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing resin plug hole without plating filling |
| CN113260163A (en) * | 2021-05-07 | 2021-08-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing circuit board fine line |
| CN113613390A (en) * | 2021-07-28 | 2021-11-05 | 深圳市普林电路有限公司 | Selective vacuum resin hole plugging process |
| CN113983970A (en) * | 2021-09-10 | 2022-01-28 | 安捷利美维电子(厦门)有限责任公司 | Method for quantitatively measuring amount of glue residue generated by laser blind hole |
| CN114807934A (en) * | 2022-05-06 | 2022-07-29 | 深圳市迅捷兴科技股份有限公司 | Processing method of class carrier plate with minimum line width spacing of 2/2mil |
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| US20040121266A1 (en) * | 2002-12-23 | 2004-06-24 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| CN101260221A (en) * | 2007-02-06 | 2008-09-10 | 太阳油墨制造株式会社 | Thermosetting resin composition and method for manufacturing printed circuit substrate using the same |
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN103813655A (en) * | 2012-11-09 | 2014-05-21 | 镇江华扬信息科技有限公司 | Manufacturing method for improving reliability of printed circuit board (PCB) including bonding pad structure |
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| US20040121266A1 (en) * | 2002-12-23 | 2004-06-24 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| CN101260221A (en) * | 2007-02-06 | 2008-09-10 | 太阳油墨制造株式会社 | Thermosetting resin composition and method for manufacturing printed circuit substrate using the same |
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
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Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108289374A (en) * | 2017-12-21 | 2018-07-17 | 江门崇达电路技术有限公司 | A kind of production method of filling holes with resin wiring board |
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
| CN110167274A (en) * | 2019-04-29 | 2019-08-23 | 恩达电路(深圳)有限公司 | The production method of millimetre-wave radar plate |
| CN110536565A (en) * | 2019-08-06 | 2019-12-03 | 宁波华远电子科技有限公司 | A kind of filling perforation method of wiring board through-hole |
| CN111246670A (en) * | 2020-01-21 | 2020-06-05 | 惠州中京电子科技有限公司 | Method for manufacturing thin plate or soft plate through macroporous resin hole plugging |
| CN111246670B (en) * | 2020-01-21 | 2023-10-13 | 惠州中京电子科技有限公司 | Manufacturing method of sheet or soft board macroporous resin plug hole |
| CN111836470A (en) * | 2020-07-02 | 2020-10-27 | 肇庆昌隆电子有限公司 | In-hole copper plating method before hole plugging of circuit board with buried through hole |
| CN111818737B (en) * | 2020-07-23 | 2022-01-07 | 深圳和美精艺半导体科技股份有限公司 | Method for plugging ink front plug coating hole of packaging substrate |
| CN111818737A (en) * | 2020-07-23 | 2020-10-23 | 深圳市和美精艺科技有限公司 | Method for plugging ink front plug coating hole of packaging substrate |
| CN112165778A (en) * | 2020-10-19 | 2021-01-01 | 东莞森玛仕格里菲电路有限公司 | Method for preventing substrate from being exposed by grinding plate in selective hole plugging process |
| CN111988920B (en) * | 2020-10-27 | 2021-01-01 | 智恩电子(大亚湾)有限公司 | Solder-resisting hole plugging method for BMU printed circuit board |
| CN111988920A (en) * | 2020-10-27 | 2020-11-24 | 智恩电子(大亚湾)有限公司 | Solder-resisting hole plugging method for BMU printed circuit board |
| CN112165782A (en) * | 2020-11-02 | 2021-01-01 | 胜华电子（惠阳）有限公司 | Resin hole plugging process for printed circuit board with high aspect ratio |
| CN112911833A (en) * | 2021-01-15 | 2021-06-04 | 扬宣电子(清远)有限公司 | Preparation method of PCB (printed circuit board) |
| CN113260163A (en) * | 2021-05-07 | 2021-08-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing circuit board fine line |
| CN113194616A (en) * | 2021-05-21 | 2021-07-30 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing resin plug hole without plating filling |
| CN113613390A (en) * | 2021-07-28 | 2021-11-05 | 深圳市普林电路有限公司 | Selective vacuum resin hole plugging process |
| CN113983970A (en) * | 2021-09-10 | 2022-01-28 | 安捷利美维电子(厦门)有限责任公司 | Method for quantitatively measuring amount of glue residue generated by laser blind hole |
| CN113983970B (en) * | 2021-09-10 | 2024-04-16 | 安捷利美维电子(厦门)有限责任公司 | Method for quantitatively measuring quantity of rubber residues generated by laser blind holes |
| CN114807934A (en) * | 2022-05-06 | 2022-07-29 | 深圳市迅捷兴科技股份有限公司 | Processing method of class carrier plate with minimum line width spacing of 2/2mil |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20170118 |