CN112165782A - Resin hole plugging process for printed circuit board with high aspect ratio - Google Patents
Resin hole plugging process for printed circuit board with high aspect ratio Download PDFInfo
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- CN112165782A CN112165782A CN202011200040.2A CN202011200040A CN112165782A CN 112165782 A CN112165782 A CN 112165782A CN 202011200040 A CN202011200040 A CN 202011200040A CN 112165782 A CN112165782 A CN 112165782A
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- 239000011347 resin Substances 0.000 title claims abstract description 122
- 229920005989 resin Polymers 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims abstract description 89
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 140
- 229910052802 copper Inorganic materials 0.000 claims abstract description 140
- 239000010949 copper Substances 0.000 claims abstract description 140
- 238000011282 treatment Methods 0.000 claims abstract description 112
- 238000005530 etching Methods 0.000 claims abstract description 35
- 238000007747 plating Methods 0.000 claims abstract description 34
- 238000005553 drilling Methods 0.000 claims abstract description 33
- 238000009713 electroplating Methods 0.000 claims abstract description 21
- 238000003825 pressing Methods 0.000 claims abstract description 19
- 238000000227 grinding Methods 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000001514 detection method Methods 0.000 claims abstract description 4
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 238000013461 design Methods 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 8
- 238000005429 filling process Methods 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims description 5
- 238000011946 reduction process Methods 0.000 claims description 5
- 238000012797 qualification Methods 0.000 abstract description 9
- 238000005498 polishing Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a resin hole plugging process for a printed circuit board with a high aspect ratio, which comprises the following steps of S1: pre-procedure treatment, including cutting, inner layer circuit, pressing and drilling treatment, wherein copper reduction treatment is arranged between the pressing treatment and the drilling treatment; s2: the circuit manufacturing comprises the steps of primary copper plate plating, primary circuit manufacturing and primary pattern electroplating treatment; s3: resin hole plugging, including resin hole plugging and ceramic grinding plate treatment; s4: the circuit manufacturing comprises secondary drilling treatment, secondary copper plate plating, secondary circuit manufacturing, secondary pattern electroplating and etching treatment; s5: and post-procedure treatment, including resistance welding, character treatment, surface treatment, molding, detection, packaging and warehousing treatment. The resin hole plugging process for the printed circuit board with the high aspect ratio has the advantages of good uniformity of copper thickness, high product qualification rate and the like.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a resin hole plugging process for a printed circuit board with a high aspect ratio.
Background
As the reliability of PCBA to PCB is higher and higher at present, especially for products of power supply, 5G, medical equipment and the like, cracks, shrinkage and cavities generated by ink plugging in VAI hole holes cannot be received, and the traditional ink plugging hole cannot meet the existing high-quality requirement, the resin plugging hole with higher reliability and extremely low shrinkage is selected to replace the ink plugging hole. In addition, the VAI test holes need to be filled and leveled, and the holes need to be communicated, resin hole plugging and electroplating copper plating are needed, so that the VAI holes are communicated and are completely leveled with surface copper, and the resin hole plugging process is also needed.
The existing resin hole plugging process generally adopts the steps of plating after a first copper plate is plated, so as to ensure that enough hole copper is plated, then resin hole plugging is carried out, high tree fingers are ground flat through a ceramic grinding plate after hole plugging, then copper reduction treatment is carried out, and then the ceramic grinding plate is carried out again after the copper reduction treatment. According to the process, due to the fact that copper is plated in holes, the copper thickness is not uniform, the etching lines are young, etching is not clean, and the like.
Disclosure of Invention
Therefore, the applicant provides a resin hole plugging process for the printed circuit board with high aspect ratio, which has the advantages of good surface copper uniformity, convenient etching and high product qualification rate.
In order to achieve the above purpose, the following technical solutions are provided.
A printed circuit board resin hole plugging process with a high aspect ratio is provided, wherein a copper reduction treatment process is arranged after a former process pressing treatment and before a resin hole plugging drilling hole. The invention provides a resin hole plugging process for a printed circuit board with a high aspect ratio, which carries out copper reduction treatment after lamination and before drilling, namely the copper reduction process is carried out after the lamination, because the copper is reduced before the hole plugging, the copper reduction is not needed after the resin hole plugging is polished, the surface copper has thin thickness and good uniformity, the subsequent etching is convenient, the situations of young etching lines, incomplete etching and the like caused by uneven copper thickness in the prior art are effectively avoided, and the qualification rate of products is greatly improved.
Further, the resin plug hole process of the high aspect ratio printed circuit board comprises the following steps,
s1: pre-procedure treatment, including cutting, inner layer circuit, pressing and drilling treatment, wherein copper reduction treatment is arranged between the pressing treatment and the drilling treatment;
s2: plating hole treatment, including one-time copper plate plating, plating hole film design and one-time pattern plating treatment;
s3: the hole plugging treatment comprises resin hole plugging and ceramic grinding plate treatment;
s4: the circuit manufacturing comprises secondary drilling treatment, secondary copper plate plating, circuit manufacturing, secondary pattern electroplating and etching treatment;
s5: and post-procedure treatment, including resistance welding, character treatment, surface treatment, molding, detection, packaging and warehousing treatment.
According to the resin hole plugging process for the printed circuit board with the high aspect ratio, the copper reducing treatment process is arranged after the pressing treatment in the previous process treatment and before the drilling treatment, copper reduction is not needed after resin hole plugging polishing, the surface copper is thin in thickness and good in uniformity, subsequent etching is facilitated, the situations of young etching lines, incomplete etching and the like caused by uneven copper thickness in the prior art are effectively avoided, and the qualification rate of products is greatly improved; on the other hand, the copper reduction treatment process is advanced, and copper reduction is not needed after resin hole plugging polishing, so that the secondary polishing process is reduced, namely, the primary ceramic plate grinding treatment is reduced, and the primary process flow is reduced; the plating hole is handled earlier through a heavy copper plate electricity and is handled, plates the table copper on the board surface layer, then carries out the plating hole copper through the design of plating hole film, adopts a figure electroplating treatment to do the electroplating to the hole of resin consent again at last, effectively ensures board table copper thickness, has avoided increasing of board table copper and the inhomogeneous problem of copper thickness because of adding the plating and causing among the prior art, need not to subtract the copper processing again after the resin is polished, ensures that table copper thickness is thin, the homogeneity is good.
Further, the copper reducing treatment reduces the copper of the base copper after the pressing treatment to 9 um-11 um. The general line width circuit of the board with the resin plug holes is 4.0mil/4.0mil, and the line width is too small, so that compensation is not provided with space, and only 0.8-1.2mil can be compensated, therefore, the surface copper, namely the etching copper, is strictly controlled, the thickness of the base copper after being pressed in the previous process is 15um, the copper is reduced to 9 um-11 um after being subjected to the copper reduction treatment, and a foundation is laid for not reducing the copper subsequently.
Further, the drilling process is used for drilling the resin plug hole, and after the drilling process, the two sides are ground and flash twice respectively. The aperture of the resin plug hole is generally a small hole of 0.20-0.30 mm, the aperture is reduced by 0.05mm after electroplating, the final aperture is only 0.15-0.25 mm, and the hole is too small, so that the resin is easy to plug into the hole, and the hole is not formed, therefore, after drilling is finished, the plate surface is ensured to be free of burrs, after drilling is finished, the burrs are ground on two sides twice respectively so as to ensure that the plate surface is free of burrs, the problem that the resin is difficult to plug into the hole due to the fact that the burrs highly push against an aluminum sheet of the resin plug hole when the burrs exist is effectively avoided, and the smooth operation of the whole process is ensured.
Furthermore, the copper deposition plate is very critical to the hole plugging process, the problem that final etching is not clean or etching lines are young is easily caused due to the fact that copper is too thick, the problem that the final etching is poor can be caused due to the fact that the copper is thin, the grinding plate is exposed out of a base material and scrapped after resin hole plugging is achieved, the copper deposition plate is electroplated once by adopting the current parameter of 18ASF 20min, the thickness of hole copper after electroplating is 3-6 um, the thickness of surface copper is 15-20 um, the requirement for meeting the thickness of the surface copper is guaranteed, follow-up etching lines are guaranteed, and the product qualification rate is further guaranteed.
Furthermore, the single side of the design hole-opening window of the plated hole film is 4.0mil larger than the resin hole-plugging window, so that a foundation is provided for subsequent ceramic grinding plates, and meanwhile, better guarantee is provided for subsequent electroplating; if the single side of the window is too large compared with the resin plug hole, the grinding plate after the resin plug hole is difficult to grind and level due to the too large window, and if the single side of the window is a little larger than the resin plug hole, the window is too small, so that the alignment is easy to cause inconvenience, and the dry film is difficult to cover the hole and electroplate copper, so that the process manufacturing difficulty is increased, meanwhile, the manufacturing time is prolonged, and the operation efficiency is low.
Furthermore, the primary pattern electroplating treatment is to electroplate the resin plug holes, the current parameter of the primary pattern electroplating is 15ASF 60min, the thickness of the plated hole copper is 25 um-30 um, the primary pattern electroplating is to electroplate the holes of the resin plug holes, and the current parameter of the 15ASF 60min is selected to ensure that the current is proper, so that the phenomenon that the plate is burnt due to overlarge current is avoided, the scrapping of the plate is avoided, and the product percent of pass is ensured.
Further, the resin plug hole process includes the steps of,
s1: the method comprises the following steps of (1) pre-processing, namely, firstly passing a hole inspection machine on a resin hole plugging front plate, processing holes with holes, inspecting a resin hole plugging tool, and then passing the hole inspection machine on the resin hole plugging front plate, inspecting the hole plugging tool and preparing for hole plugging;
s2: the hole plugging treatment is carried out, a true hole plugging machine is adopted for resin hole plugging, a cutter plug is used during hole plugging, the hole plugging efficiency is ensured, the hole plugging quality is ensured, if the cutter plug fails, the hole plugging efficiency is greatly reduced, and resin raw materials are wasted;
s3: performing exhaust treatment, namely standing for 1-2 h after plugging the hole to enable bubbles in the hole to flow out to prepare for subsequent curing treatment, and preventing the phenomenon of black spots or uneven curing caused by bubbles in the plug hole;
s4: the resin is cured in a segmented mode, the resin is cured for 15min in a curing and baking chamber at 100 ℃ and then cured for 20min in a 150 ℃ environment, the problem that the resin is baked to death due to overhigh temperature and overlong time of single curing and the follow-up polishing is difficult to polish can be effectively solved, the curing quality and effect of the resin are effectively ensured, and the follow-up polishing process is guaranteed.
Furthermore, according to the resin hole plugging tool, the aperture of the aluminum sheet is 0.1-0.15 mm larger than that of the resin hole plugging tool, a hole with the diameter of 2.0-2.5 mm is drilled in the air guide base plate by using a plate with the thickness of 3.0mm, before the air guide base plate is used, an aluminum sheet is polished to form a burr, no aluminum wire is remained in the hole, the aperture of the aluminum sheet is 0.1-0.15 mm larger than that of the resin hole plugging tool, and resin hole plugging is facilitated; and the air guide backing plate is drilled with a plate with the thickness of 3.0mm and the diameter of 2.0 mm-2.5 mm, and the hole is far larger than the resin plug hole, so that air guide is ensured during plug hole, and the condition that air cannot be guided due to the fact that the air guide backing plate is too small is prevented.
Furthermore, the secondary copper deposition plate is electroplated by adopting a current parameter of 18-20ASF 20min, the thickness of the electroplated hole copper is 5-8 um, and the thickness of the surface copper is 15-25 um, so that the subsequent etching is facilitated.
Compared with the prior art, the resin hole plugging process for the printed circuit board with the high aspect ratio has the following beneficial effects:
the resin plug hole process for the printed circuit board with the high aspect ratio has the advantages that the copper reduction treatment process is advanced, copper reduction is not needed after resin plug hole polishing, and then the secondary polishing process is reduced, namely, the primary ceramic board grinding treatment is reduced, and the primary process flow is reduced;
secondly, the surface copper has good uniformity, the copper reducing treatment procedure is set after the pressing treatment in the previous procedure treatment and before the drilling treatment in the resin plug hole process of the printed circuit board with high aspect ratio, the copper reducing is not needed after the resin plug hole is polished, the surface copper has thin thickness and good uniformity; on the other hand, the surface copper is plated on the surface layer of the plate through the first copper-deposition plate electroplating treatment, then the hole copper is plated through the hole film design, and finally the hole of the resin hole is electroplated through the first graphic electroplating treatment, so that the thickness of the surface copper of the plate is effectively ensured, the problems of the increase of the surface copper of the plate and the non-uniformity of the copper thickness caused by plating in the prior art are solved, the copper reduction treatment is not needed after the resin is polished, and the thin thickness and the good uniformity of the surface copper are ensured;
thirdly, the etching effect is good, the copper reducing treatment process is arranged after the pressing treatment in the previous process treatment and before the drilling treatment in the resin hole plugging process of the printed circuit board with the high aspect ratio, copper reduction is not needed after the resin hole plugging is polished, the surface copper is thin in thickness and good in uniformity, subsequent etching is facilitated, and the situations of young etching lines, incomplete etching and the like caused by uneven copper thickness in the prior art are effectively avoided;
fourthly, the product has less scratch, the copper reducing treatment procedure is arranged after the pressing treatment in the previous procedure treatment and before the drilling treatment in the resin hole plugging process of the printed circuit board with high aspect ratio, and the copper reducing treatment is not needed after the resin hole plugging is polished, so that the problem of increasing scratch due to the addition of chemical copper reducing and plate grinding after the resin hole plugging is polished in the prior art is effectively avoided, and the scratch is greatly reduced;
fifthly, the qualification rate of the product is high, and the high aspect ratio printed circuit board resin hole plugging process has the advantages that the copper reduction treatment process is arranged after the pressing treatment in the previous process treatment and before the drilling treatment, the copper reduction is not needed after the resin hole plugging is polished, the surface copper is thin in thickness and good in uniformity, and the problems of the young etched line, the incomplete etching, the scratch of the product and the like are effectively avoided, so that the qualification rate of the product is greatly improved.
Drawings
FIG. 1 is a schematic flow diagram of a resin via filling process for a high aspect ratio printed circuit board.
Detailed Description
The resin via filling process for a high aspect ratio printed circuit board according to the present invention will be described in further detail with reference to the following embodiments and the accompanying drawings.
Referring to fig. 1, in a non-limiting embodiment of the present invention, a process for resin plugging a printed circuit board with a high aspect ratio includes a copper reduction process after a pre-process lamination process and before a resin plug hole is drilled. The invention provides a resin hole plugging process for a printed circuit board with a high aspect ratio, which carries out copper reduction treatment after lamination and before drilling, namely the copper reduction process is carried out after the lamination, because the copper is reduced before the hole plugging, the copper reduction is not needed after the resin hole plugging is polished, the surface copper has thin thickness and good uniformity, the subsequent etching is convenient, the situations of young etching lines, incomplete etching and the like caused by uneven copper thickness in the prior art are effectively avoided, and the qualification rate of products is greatly improved.
Referring to fig. 1, in one non-limiting embodiment of the present invention, the process of resin plugging a high aspect ratio printed circuit board includes the steps of,
s1: pre-procedure treatment, including cutting, inner layer circuit, pressing and drilling treatment, wherein copper reduction treatment is arranged between the pressing treatment and the drilling treatment;
s2: plating hole treatment, including one-time copper plate plating, plating hole film design and one-time pattern plating treatment;
s3: the hole plugging treatment comprises resin hole plugging and ceramic grinding plate treatment;
s4: the circuit manufacturing comprises secondary drilling treatment, secondary copper plate plating, circuit manufacturing, secondary pattern electroplating and etching treatment;
s5: and post-procedure treatment, including resistance welding, character treatment, surface treatment, molding, detection, packaging and warehousing treatment.
According to the resin hole plugging process for the printed circuit board with the high aspect ratio, the copper reducing treatment process is arranged after the pressing treatment in the previous process treatment and before the drilling treatment, copper reduction is not needed after resin hole plugging polishing, the surface copper is thin in thickness and good in uniformity, subsequent etching is facilitated, the situations of young etching lines, incomplete etching and the like caused by uneven copper thickness in the prior art are effectively avoided, and the qualification rate of products is greatly improved; on the other hand, the copper reduction treatment process is advanced, and copper reduction is not needed after resin hole plugging polishing, so that the secondary polishing process is reduced, namely, the primary ceramic plate grinding treatment is reduced, and the primary process flow is reduced; the plating hole is handled earlier through a heavy copper plate electricity and is handled, plates the table copper on the board surface layer, then carries out the plating hole copper through the design of plating hole film, adopts a figure electroplating treatment to do the electroplating to the hole of resin consent again at last, effectively ensures board table copper thickness, has avoided increasing of board table copper and the inhomogeneous problem of copper thickness because of adding the plating and causing among the prior art, need not to subtract the copper processing again after the resin is polished, ensures that table copper thickness is thin, the homogeneity is good.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the copper reduction process reduces the copper content of the base copper after the pressing process to 9um to 11 um. The general line width circuit of the board with the resin plug holes is 4.0mil/4.0mil, and the line width is too small, so that compensation is not provided with space, and only 0.8-1.2mil can be compensated, therefore, the surface copper, namely the etching copper, is strictly controlled, the thickness of the base copper after being pressed in the previous process is 15um, the copper is reduced to 9 um-11 um after being subjected to the copper reduction treatment, and a foundation is laid for not reducing the copper subsequently.
Referring to FIG. 1, in one non-limiting embodiment of the present invention, the one drilling process is used to drill resin plugs, and the two sides are flash-cut twice each after the one drilling process. The aperture of the resin plug hole is generally a small hole of 0.20-0.30 mm, the aperture is reduced by 0.05mm after electroplating, the final aperture is only 0.15-0.25 mm, and the hole is too small, so that the resin is easy to plug into the hole, and the hole is not formed, therefore, after drilling is finished, the plate surface is ensured to be free of burrs, after drilling is finished, the burrs are ground on two sides twice respectively so as to ensure that the plate surface is free of burrs, the problem that the resin is difficult to plug into the hole due to the fact that the burrs highly push against an aluminum sheet of the resin plug hole when the burrs exist is effectively avoided, and the smooth operation of the whole process is ensured.
Referring to fig. 1, in a non-limiting embodiment of the present invention, a copper deposition plate is very critical to a hole plugging process, the problem of incomplete final etching or line etching is easily caused due to too thick copper, and the problem of scrap due to exposure of a base material after resin hole plugging is caused due to thin copper, the primary copper deposition plate is electroplated with a current parameter of 18ASF × 20min, the thickness of the plated hole copper is 3 to 6um, and the thickness of the surface copper is 15 to 20um, so that the thickness of the surface copper is ensured to meet requirements, a guarantee is provided for subsequent line etching, and further, the product yield is ensured.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the design of the hole-punched window of the hole-plated film has a single side 4.0mil larger than the resin hole-punched window, which provides a foundation for subsequent ceramic grinding and better guarantees for subsequent electroplating; if the single side of the window is too large compared with the resin plug hole, the grinding plate after the resin plug hole is difficult to grind and level due to the too large window, and if the single side of the window is a little larger than the resin plug hole, the window is too small, so that the alignment is easy to cause inconvenience, and the dry film is difficult to cover the hole and electroplate copper, so that the process manufacturing difficulty is increased, meanwhile, the manufacturing time is prolonged, and the operation efficiency is low.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the first pattern plating process is to plate the resin plug holes, a current parameter of the first pattern plating process is 15ASF × 60min, a thickness of the plated copper holes is 25um to 30um, the second pattern plating process is to plate the resin plug holes, and the current parameter of the first pattern plating process is 15ASF × 60min, so as to ensure a proper current, prevent the plate from being burned due to an excessive current, and further prevent the plate from being scrapped, thereby ensuring a product yield.
Referring to fig. 1, in one non-limiting embodiment of the present invention, the resin plug hole process includes the steps of,
s1: the method comprises the following steps of (1) pre-processing, namely, firstly passing a hole inspection machine on a resin hole plugging front plate, processing holes with holes, inspecting a resin hole plugging tool, and then passing the hole inspection machine on the resin hole plugging front plate, inspecting the hole plugging tool and preparing for hole plugging;
s2: the hole plugging treatment is carried out, a true hole plugging machine is adopted for resin hole plugging, a cutter plug is used during hole plugging, the hole plugging efficiency is ensured, the hole plugging quality is ensured, if the cutter plug fails, the hole plugging efficiency is greatly reduced, and resin raw materials are wasted;
s3: performing exhaust treatment, namely standing for 1-2 h after plugging the hole to enable bubbles in the hole to flow out to prepare for subsequent curing treatment, and preventing the phenomenon of black spots or uneven curing caused by bubbles in the plug hole;
s4: the resin is cured in a segmented mode, the resin is cured for 15min in a curing and baking chamber at 100 ℃ and then cured for 20min in a 150 ℃ environment, the problem that the resin is baked to death due to overhigh temperature and overlong time of single curing and the follow-up polishing is difficult to polish can be effectively solved, the curing quality and effect of the resin are effectively ensured, and the follow-up polishing process is guaranteed.
Referring to fig. 1, according to a non-limiting embodiment of the present invention, in the resin hole plugging tool, the aperture of an aluminum sheet is 0.1mm to 0.15mm larger than the aperture of the resin hole plugging tool, a hole with a diameter of 2.0mm to 2.5mm is drilled in a 3.0mm thick plate for an air guide shim plate, before use, the aluminum sheet is ground to form a burr, no aluminum wire is remained in the hole, and the aperture of the aluminum sheet is 0.1mm to 0.15mm larger than the aperture of the resin hole plugging tool, so as to facilitate the resin hole plugging; and the air guide backing plate is drilled with a plate with the thickness of 3.0mm and the diameter of 2.0 mm-2.5 mm, and the hole is far larger than the resin plug hole, so that air guide is ensured during plug hole, and the condition that air cannot be guided due to the fact that the air guide backing plate is too small is prevented.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the secondary copper deposition plate is electroplated with a current parameter of 18-20ASF × 20min, the thickness of the plated hole copper is 5 um-8 um, and the thickness of the surface copper is 15 um-25 um, which facilitates subsequent etching.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (10)
1. A high aspect ratio printed circuit board resin hole plugging process is characterized in that: and a copper reduction treatment process is arranged after the pressing treatment of the previous process and before the hole filling and drilling of the resin.
2. The high aspect ratio printed circuit board resin via filling process of claim 1, comprising the steps of,
s1: pre-procedure treatment, including cutting, inner layer circuit, pressing and drilling treatment, wherein copper reduction treatment is arranged between the pressing treatment and the drilling treatment;
s2: plating hole treatment, including one-time copper plate plating, plating hole film design and one-time pattern plating treatment;
s3: the hole plugging treatment comprises resin hole plugging and ceramic grinding plate treatment;
s4: the circuit manufacturing comprises secondary drilling treatment, secondary copper plate plating, circuit manufacturing, secondary pattern electroplating and etching treatment;
s5: and post-procedure treatment, including resistance welding, character treatment, surface treatment, molding, detection, packaging and warehousing treatment.
3. The process of claim 1 or 2, wherein the copper reduction process reduces the copper content of the base copper after the pressing process to 9-11 um.
4. The process of claim 1 or 2, wherein the one drilling process is used to drill resin plugs, and the two side burrs are each performed twice after the one drilling process.
5. The process of claim 1 or 2, wherein the first copper deposition plate is electroplated with a current parameter of 18ASF 20min, the thickness of the plated via copper is 3um to 6um, and the thickness of the surface copper is 15um to 20 um.
6. The process of claim 1 or 2, wherein the plated hole film design punch-through window has a single side 4.0 mils larger than the resin plug-through holes.
7. The process of claim 1 or 2, wherein the one-time pattern plating process is electroplating the resin plug holes, the one-time pattern plating current parameter is 15ASF 60min, and the thickness of the plated hole copper is 25-30 um.
8. The high aspect ratio printed circuit board resin via filling process of claim 2, wherein said resin via filling process comprises the steps of,
s1: the former procedure treatment, namely, the plate passes through a hole inspection machine before the resin hole is plugged, the hole with the hole is well treated, and a resin hole plugging tool is well checked;
s2: plugging, namely plugging the holes with resin by using a true hole plugging machine, wherein a plug cap is cut during plugging;
s3: performing exhaust treatment, namely standing for 1-2 h after hole plugging to enable bubbles in the holes to flow out;
s4: and (3) performing segmented curing treatment on the resin, namely curing for 15min at the temperature of 80 ℃ in a curing and baking chamber, and then curing for 20min at the temperature of 120 ℃.
9. The process of claim 8, wherein the resin hole plugging tool has an aluminum sheet with a hole diameter 0.1mm to 0.15mm larger than the hole diameter of the resin hole plugging tool, and the air guide shim plate is drilled with a plate 3.0mm thick with a hole diameter 2.0mm to 2.5 mm.
10. The process of claim 1 or 2, wherein the secondary copper deposition plate is electroplated with a current parameter of 18-20ASF 20min, the thickness of the plated via copper is 5um to 8um, and the thickness of the surface copper is 15um to 25 um.
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| CN113260163A (en) * | 2021-05-07 | 2021-08-13 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing circuit board fine line |
| CN113905521A (en) * | 2021-09-17 | 2022-01-07 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with two different hole copper thicknesses |
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