CN102781173A - Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material - Google Patents
Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material Download PDFInfo
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- CN102781173A CN102781173A CN2012102572167A CN201210257216A CN102781173A CN 102781173 A CN102781173 A CN 102781173A CN 2012102572167 A CN2012102572167 A CN 2012102572167A CN 201210257216 A CN201210257216 A CN 201210257216A CN 102781173 A CN102781173 A CN 102781173A
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Abstract
The invention discloses a method for machining and molding a printed circuit board (PCB) made of a polytetrafluoroethylene (PTFE) material. By stacking a phenolic resin plate, the PCB made of the PTFE material and machined by one time and an FR-4 copper-free light plate sequentially during machining and molding of the PCB made of the PTFE material, a problem of burrs in a molding process of the PCB made of the PTFE material is effectively solved, labor waste and material waste caused by repairing through knives after the burrs occur are avoided, integrated production efficiency of the PCB made of the PTFE is improved, quality is improved, scrap caused in a repairing process is avoided, and the method has good market popularization and application prospects.
Description
Technical field
The present invention relates to PCB processing and manufacturing technical field, relate in particular to a kind of processing molding method of PTFE material pcb board.
Background technology
In the manufacture craft of pcb board, need cut and hole pcb board, such as the plate of polytetrafluoroethylene (PTFE Poly tetra fluoro ethylene) material being holed or other add man-hour, because PTFE material pcb board (being called for short the PTFE plate); Material is very soft, so in machining, very difficult acquisition is plate face quality preferably; The processing cutting ability is poor, is easy to produce burr, in case produce burr; Must artificially remove with cutter, material resources are wasted in both wastes of manpower again.
In view of this, prior art awaits to improve and development.
Summary of the invention
In view of the deficiency of above-mentioned prior art, the object of the present invention is to provide a kind of processing molding method of PTFE material pcb board, be intended to solve that PTFE material pcb board because material is very soft, is easy to generate the problem of a large amount of burrs in the prior art when machining.
Technical scheme of the present invention is following:
A kind of processing molding method of PTFE material pcb board wherein, may further comprise the steps:
The PCB substrate of ST1, selection PTFE material;
ST2, said PCB substrate is carried out processed, said processed comprises successively: boring, heavy copper coin electricity, line pattern making, graphic plating, etching, resistance weldering and surface treatment obtain the PTFE material pcb board of time processing;
ST3, the phenolic resins plate, the FR-4 that provide PTFE material pcb board with time processing to have same size do not have the bronzing plate;
ST4, that the PTFE material pcb board of said phenolic resins plate, time processing and FR-4 are not had the bronzing plate is stacked successively, and as required that the PTFE material pcb board of time processing is unnecessary part removes, and obtains the PTFE material pcb board of moulding.
The processing molding method of described PTFE material pcb board wherein, when the PTFE of a plurality of time processing of moulding material pcb board, is placed blank sheet of paper between the PTFE of said time processing material pcb board.
The processing molding method of described PTFE material pcb board, wherein, said FR-4 does not have the thickness of bronzing plate between 0.5 millimeter to 1 millimeter.
The processing molding method of described PTFE material pcb board, wherein, the thickness of said phenolic resins plate is 2.5 millimeters or 2.0 millimeters.
Beneficial effect: the processing molding method of PTFE material pcb board of the present invention; Through when PTFE material pcb board is carried out processing and forming; It is stacked successively that the PTFE material pcb board of said phenolic resins plate, time processing and FR-4 are not had the bronzing plate; Solve the problem that PTFE material pcb board burr in forming process produces effectively, avoid producing the waste of the human and material resources of repairing with cutter behind the burr, can promote the production efficient of PTFE material pcb board; And the lifting quality, that avoids in repair procedures, producing scraps.
Description of drawings
Fig. 1 is the flow chart figure of the processing molding method of PTFE material pcb board of the present invention.
Fig. 2 is a lamination sketch map in the processing molding method of PTFE material pcb board of the present invention.
Embodiment
The present invention provides a kind of processing molding method of PTFE material pcb board, and is clearer, clear and definite for making the object of the invention, technical scheme and effect, below to further explain of the present invention.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
See also Fig. 1, it is the flow chart figure of the processing molding method of PTFE material pcb board of the present invention.As shown in the figure, the processing molding method of said PTFE material pcb board may further comprise the steps:
The PCB substrate of S1, selection PTFE material;
S2, said PCB substrate is carried out processed, said processed comprises successively: boring, heavy copper coin electricity, line pattern making, graphic plating, etching, resistance weldering and surface treatment obtain the PTFE material pcb board of time processing;
S3, the phenolic resins plate, the FR-4 that provide PTFE material pcb board with time processing to have same size do not have the bronzing plate;
S4, that the PTFE material pcb board of said phenolic resins plate, time processing and FR-4 are not had the bronzing plate is stacked successively, and as required that the PTFE material pcb board of time processing is unnecessary part removes, and obtains the PTFE material pcb board of moulding.
Specifically introduce to above-mentioned steps respectively below:
At first, according to customer requirement, select a kind of PCB substrate of PTFE material.Because the processability in the performance of that pcb board, quality, the manufacturing, manufacturing cost, manufacture level etc. depend on baseplate material to a great extent.
Then, said PCB substrate is carried out processed, said processed comprises successively: boring, heavy copper coin electricity, line pattern making, graphic plating, etching, resistance weldering and surface treatment obtain the PTFE material pcb board of time processing.Above-mentioned, identical in processed process and the prior art, it produces line pattern according to normal parameter and flow process on the PCB of said PTFE material substrate, obtain the PTFE material pcb board of time processing.
Be key point of the present invention below, very easily produce burr, brought great puzzlement for the production firm of PTFE material pcb board according to present forming method.Yet the present invention proposes a kind of lamination mode, and the phenolic resins plate and the FR-4 that promptly provide PTFE material pcb board with time processing to have same size earlier do not have the bronzing plate.Wherein, said phenolic resins plate is also claimed the phenolic fiber plate, has advantages such as hardness ratio general fibre plate hight, planarization be good.FR-4 does not have the bronzing plate and claims the FR-4 tabula rasa yet, and its electrical insulation capability is stable, good planeness, smooth surface, can be as cover plate.
Then, it is stacked successively the PTFE material pcb board of said phenolic resins plate, time processing and FR-4 not to be had the bronzing plate.See also Fig. 2; In the present embodiment; FR-4 does not have bronzing plate (representing with the FR-4 tabula rasa among the figure) and is arranged on the top; Placing the PTFE material pcb board (representing with PTFE high frequency plate among the figure) of time processing below, is phenolic resins plate (representing with the phenolic fiber plate among the figure) then, is the forming machine table top below the phenolic resins plate.Thus, part that just can be as required that the PTFE material pcb board of time processing is unnecessary is removed, and obtains the PTFE material pcb board of moulding.The original relatively common paper fiber board of this method+pcb board lamination mode has not only improved Burr Problem in the molding process, but also has saved human and material resources, has shortened fabrication cycle.
Further; When the PTFE of a plurality of time processing of moulding material pcb board, between the PTFE of said time processing material pcb board, place blank sheet of paper, as shown in Figure 2; The PTFE material pcb board (representing with PTFE high frequency plate among the figure) of two time processing of processing; Blank sheet of paper is placed in the middle of the PTFE material pcb board of two time processing, can once carry out the moulding processed to two PTFE material pcb boards, by that analogy.
Further, can know through test of many times, the thickness that said FR-4 does not have a bronzing plate at 0.5 millimeter between 1 millimeter and/or the thickness of said phenolic resins plate when being 2.5 millimeters or 2.0 millimeters.It is more suitable for the gong cutter and processes, and is difficult for producing burr and dust.
In sum; The processing molding method of PTFE material pcb board of the present invention; Through when PTFE material pcb board is carried out processing and forming, it is stacked successively that the PTFE material pcb board of said phenolic resins plate, time processing and FR-4 are not had the bronzing plate, solves the PTFE material pcb board problem that burr produces in forming process effectively; Avoid producing the waste of the human and material resources of repairing with cutter behind the burr; Can promote the production efficient of PTFE material pcb board, and promote quality, that avoids in repair procedures, producing scraps.
Should be understood that application of the present invention is not limited to above-mentioned giving an example, concerning those of ordinary skills, can improve or conversion that all these improvement and conversion all should belong to the protection range of accompanying claims of the present invention according to above-mentioned explanation.
Claims (4)
1. the processing molding method of a PTFE material pcb board is characterized in that, may further comprise the steps:
The PCB substrate of ST1, selection PTFE material;
ST2, said PCB substrate is carried out processed, said processed comprises successively: boring, heavy copper coin electricity, line pattern making, graphic plating, etching, resistance weldering and surface treatment obtain the PTFE material pcb board of time processing;
ST3, the phenolic resins plate, the FR-4 that provide PTFE material pcb board with time processing to have same size do not have the bronzing plate;
ST4, that the PTFE material pcb board of said phenolic resins plate, time processing and FR-4 are not had the bronzing plate is stacked successively, and as required that the PTFE material pcb board of time processing is unnecessary part removes, and obtains the PTFE material pcb board of moulding.
2. the processing molding method of PTFE material pcb board according to claim 1 is characterized in that, when the PTFE of a plurality of time processing of moulding material pcb board, between the PTFE of said time processing material pcb board, places blank sheet of paper.
3. the processing molding method of PTFE material pcb board according to claim 1 is characterized in that, said FR-4 does not have the thickness of bronzing plate between 0.5 millimeter to 1 millimeter.
4. the processing molding method of PTFE material pcb board according to claim 1 is characterized in that, the thickness of said phenolic resins plate is 2.5 millimeters or 2.0 millimeters.
Priority Applications (1)
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CN201210257216.7A CN102781173B (en) | 2012-07-24 | 2012-07-24 | Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material |
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CN201210257216.7A CN102781173B (en) | 2012-07-24 | 2012-07-24 | Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material |
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CN102781173B CN102781173B (en) | 2015-07-22 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103240452A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Polytetrafluoroethylene (PTFE) plate milling and cutting method |
CN103561538A (en) * | 2013-09-10 | 2014-02-05 | 镇江华印电路板有限公司 | Method for making soft and hard double-sided circuit board |
CN104869761A (en) * | 2015-05-08 | 2015-08-26 | 深圳崇达多层线路板有限公司 | Manufacture method of rigid-flexible printed circuit board with outer-layer flexible printed circuit board |
CN108990289A (en) * | 2018-08-16 | 2018-12-11 | 吉安市满坤科技有限公司 | A kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr |
CN111263526A (en) * | 2020-03-23 | 2020-06-09 | 西安微电子技术研究所 | Dry-type milling method for aluminum-based printed circuit board |
WO2020135204A1 (en) * | 2018-12-28 | 2020-07-02 | 深圳市景旺电子股份有限公司 | High-frequency circuit board and manufacturing method therefor |
CN111601465A (en) * | 2020-04-28 | 2020-08-28 | 胜宏科技(惠州)股份有限公司 | White oil board forming and stacking method |
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US20050176328A1 (en) * | 2004-02-05 | 2005-08-11 | Matsushita Electric Works, Ltd. | Backup board for machining process |
CN201491399U (en) * | 2009-09-16 | 2010-05-26 | 深圳市深联电路有限公司 | Bottom backing board of printed circuit board (PCB) |
CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
JP2010540260A (en) * | 2007-09-28 | 2010-12-24 | トライ−スター ラミネーツ、 インク. | Improved system and method for drilling holes in a printed circuit board |
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Patent Citations (4)
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US20050176328A1 (en) * | 2004-02-05 | 2005-08-11 | Matsushita Electric Works, Ltd. | Backup board for machining process |
JP2010540260A (en) * | 2007-09-28 | 2010-12-24 | トライ−スター ラミネーツ、 インク. | Improved system and method for drilling holes in a printed circuit board |
CN201491399U (en) * | 2009-09-16 | 2010-05-26 | 深圳市深联电路有限公司 | Bottom backing board of printed circuit board (PCB) |
CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103240452A (en) * | 2013-05-21 | 2013-08-14 | 无锡江南计算技术研究所 | Polytetrafluoroethylene (PTFE) plate milling and cutting method |
CN103240452B (en) * | 2013-05-21 | 2015-10-07 | 无锡江南计算技术研究所 | A kind of PTFE sheet material milling method |
CN103561538A (en) * | 2013-09-10 | 2014-02-05 | 镇江华印电路板有限公司 | Method for making soft and hard double-sided circuit board |
CN103561538B (en) * | 2013-09-10 | 2016-05-11 | 镇江华印电路板有限公司 | Soft or hard double-sided circuit board manufacturing method |
CN104869761A (en) * | 2015-05-08 | 2015-08-26 | 深圳崇达多层线路板有限公司 | Manufacture method of rigid-flexible printed circuit board with outer-layer flexible printed circuit board |
CN104869761B (en) * | 2015-05-08 | 2018-03-02 | 深圳崇达多层线路板有限公司 | A kind of preparation method of flex plate in the rigid-flexible combined circuit board of outer layer |
CN108990289A (en) * | 2018-08-16 | 2018-12-11 | 吉安市满坤科技有限公司 | A kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr |
WO2020135204A1 (en) * | 2018-12-28 | 2020-07-02 | 深圳市景旺电子股份有限公司 | High-frequency circuit board and manufacturing method therefor |
CN111263526A (en) * | 2020-03-23 | 2020-06-09 | 西安微电子技术研究所 | Dry-type milling method for aluminum-based printed circuit board |
CN111601465A (en) * | 2020-04-28 | 2020-08-28 | 胜宏科技(惠州)股份有限公司 | White oil board forming and stacking method |
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Address after: 518102, Shenzhen, Guangdong province Baoan District Xixiang iron Gang reservoir No. 167 Applicant after: Shenzhen Kinwong Electronic Co., Ltd. Address before: 518102, Shenzhen, Guangdong province Baoan District Xixiang iron Gang reservoir No. 167 Applicant before: Kinwong Electronic (Shenzhen) Co., Ltd. |
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