CN104853523A - Buried and embedded copper block PCB manufacturing method - Google Patents
Buried and embedded copper block PCB manufacturing method Download PDFInfo
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- CN104853523A CN104853523A CN201510251730.3A CN201510251730A CN104853523A CN 104853523 A CN104853523 A CN 104853523A CN 201510251730 A CN201510251730 A CN 201510251730A CN 104853523 A CN104853523 A CN 104853523A
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- copper billet
- pcb board
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- pressing
- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a buried and embedded copper block PCB manufacturing method, which comprises steps of laminating treatment of a buried copper block, groove milling, gold immersion, laminating treatment of an embedded copper block and the like. The step of lamination of the buried copper block comprises a buried copper block lamination pre-treatment process. The buried copper block lamination pre-treatment process comprises groove treatment on the edge of the bottom part of the copper block, round corner treatment on the edge of the copper block, and chamfer treatment on the edge corner of the copper block. The step of lamination of the embedded copper block comprises an embedded copper block lamination pre-treatment process, which comprises groove treatment on the edge of the bottom part of a groove hole into which the copper block needs to be embedded, round corner treatment on the edge of the groove hole into which the copper block needs to be embedded and chamfer treatment on the edge corner of the groove hole into which the copper block needs to be embedded. The buried and embedded copper block PCB manufacturing method has the advantages of high product yield, high production efficiency, good quality consistency and simple operation.
Description
Technical field
The present invention relates to circuit board fabrication processing technique field, be specially a kind of manufacture method of potting copper billet pcb board.
Background technology
In the manufacture method of current potting copper billet pcb board, there is following problem:
Burying in copper billet pressing, owing to designing the restriction of upper accuracy, burying copper billet and pcb board thickness there is some difference (tolerance as height tolerance or customer requirement), making to bury copper billet edge and pcb board forms step.The existence of this step, there is excessive glue phenomenon when pressing in stepped locations.Polishing removal resin glue is carried out in the general abrasive band that uses at present, but due to the out-of-flatness of stepped locations, the resin of stepped locations cannot effectively remove totally, if effective removal resin glue adds belt-sanding number of times, pcb board can face again the bad problem of dew base material.
In embedding copper billet pressing, in order to ensure the compactness of pressing, in the design process of the copper billet embedded, general comparatively PCB notch position is slightly large for the size of copper billet, and at use pressing equipment, copper billet is poured in pcb board groove because copper billet size is larger than pcb board groove accordingly, producing copper billet cannot effective location, easily offsets; And pressing equipment cannot evenly be exerted pressure, easily cause pcb board to damage, and can only sample making be carried out, cannot mass.Further, if copper billet offsets in telescopiny, pre-large too much, the gap size made between copper billet and PCB groove is differed, follow-up carry out welding resistance time cannot carry out consent to fine hole, easy Tibetan bubble, affects the quality of product, also increases the making risk of enterprise.
Summary of the invention
The object of this invention is to provide a kind of manufacture method of potting copper billet pcb board, have the advantages that product yield is high, production efficiency is high, quality consistency is good and simple to operate.
The present invention can be achieved through the following technical solutions:
The invention discloses a kind of manufacture method of potting copper billet pcb board, pcb board be processed with the slotted eye imbedded for copper billet and the metallization slotted eye embedded for copper billet, comprise the following steps:
Bury copper billet pressing process; Comprise and bury copper billet pressing pretreatment procedure to needing to imbed the copper billet of slotted eye on pcb board, described in bury copper billet pressing pretreatment procedure and comprise groove process is carried out to copper billet bottom margin, chamfered is carried out to the corner angle of copper billet;
Embedding copper billet pressing process: comprise needing the copper billet embedding slotted eye on pcb board to carry out embedding copper billet pressing pretreatment procedure, described embedding copper billet pressing pretreatment procedure comprises to be needed the bottom margin embedding slotted eye to carry out groove place to copper billet, needs the seamed edge embedding slotted eye to carry out corners process and need the corner angle embedding slotted eye to carry out chamfered to copper billet to copper billet.
By burying copper billet pressing pretreatment procedure and embedding copper billet pressing pretreatment procedure, increasing the design of copper tooth, copper billet and cell wall, resin glue contact-making surface are increased, be also conducive to pressing micro-fixing, reduce cell wall, copper billet damage.Both ensure that stability and the consistency of quality, and achieved again the standardized production of the course of processing, enhancing productivity for mass lays the foundation; And, can not impact follow-up filling holes with resin operation, simplify belt sanding link, while guaranteed quality, improve the efficiency of producing further.
Further, bury described in copper billet pressing process be also included in bury copper billet pressing pretreatment procedure after bury copper billet pressing working procedure and the carbon dioxide laser that carry out burn fat cleaning process.Achieving the pressing and forming of copper billet after imbedding slotted eye by burying copper billet pressing working procedure, effectively ensure that the adhesion of copper billet and pcb board; Burn fat cleaning process by carbon dioxide laser, effectively remove the impact that excessive excessive glue causes pcb board following process and performance.
Further, the embedding copper billet pressing working procedure, vacuum resin consent operation and the carbon dioxide laser that have carried out after described embedding copper billet pressing process has also been included in embedding copper billet pressing pretreatment procedure burn fat cleaning process.By embedding copper billet pressing working procedure, effectively ensure that copper billet embeds adhesion that is rear and pcb board; By vacuum resin consent operation, effectively embedding copper billet and pcb board are bonded, strengthen adhesion, be also conducive to the air between embedding copper billet and pcb board gap to be driven out of, guarantee product quality effect.
Further, described carbon dioxide laser burns fat cleaning process by making laser file, uses carbon dioxide laser to carry out Ablative resin, then uses the position of adhesive-bonded fabric grinding pcb board Ablative resin to clean.Simple to operate.Successful.Be convenient to scale process.
Further, described embedding copper billet pressing treatment process comprises the following steps:
Pre-contraposition: after the micro-embedding of slotted eye on the copper billet needing to embed and pcb board, uses high temperature resistant adhesive plaster suitably to fix the copper billet embedded, completes pre-contraposition;
Stacked pressing: arrange plate mode by " steel plate+steel plate+embedding copper billet pcb board+steel plate+steel plate " and carry out increasing by stage and reducing the mode of pressure and time and carry out pressing at normal temperatures.
In the stacked bonding processes of embedding copper billet pressing treatment process, carry out gradient supercharging stage by stage, guarantee that copper billet embeds and evenness, pressing time≤10 minute.
Further, bury described between copper billet pressing process and described embedding copper billet pressing process and also comprise following two steps:
Groove milling: carry out the slotted eye that groove milling forms embedding copper billet according to embedding after copper billet size compensates PCB keyseat rule cun;
Heavy copper: the slotted eye that heavy process for copper flow process carries out pcb board routinely carries out metalized.
Further, described groove process is processed to form copper tooth by drill and obtains, and the boring of described drill 1.6mm cutter footpath, the center of boring is from copper billet edge 0.6mm, and the hole of the boring that final machining obtains is evenly distributed on every bar limit, and on every bar limit, Kong Yukong is tangent.
Further, in described embedding copper billet pressing treatment process, in pre-contraposition, high temperature resistant adhesive plaster need instead paste, what guarantee that zone line contacts with copper billet is light face, ensure that two ends are glue face simultaneously, be attached to pcb board face, the length of the high temperature resistant adhesive plaster of middle anti-subsides is larger than the length of copper billet, avoids glue to be got in copper billet and pcb board gap, ensures the adhesion of copper billet and slotted eye or slotted eye.
Further, described vacuum resin consent operation adopts vacuum resin hole plugging machine to carry out, and replaces conventional welding resistance consent, effectively the copper billet embedded and pcb board are bonded, strengthen adhesion, be also conducive to the air between the copper billet of embedding and pcb board gap to be driven out of, guarantee product quality effect.
The manufacture method of a kind of potting copper billet of the present invention pcb board, has following beneficial effect:
The first, product yield is high, by effectively improving the copper billet and the slotted eye of pcb board or the adhesion of slotted eye imbedding or embed, reducing the frictionally damage of copper billet skew and copper billet, cell wall, improving conforming product rate and the yield of potting copper billet pcb board;
The second, production efficiency is high, by the concrete operation of refinement potting copper billet, realizes the standardized consistency of processing, is conducive to the making of batch potting copper billet pcb board, enhances productivity;
Three, quality consistency is good, can be strengthened the adhesion of copper billet and pcb board slotted eye or slotted eye by process of the present invention, avoids in manufacturing process and occurs that copper billet drops, and also prevents because embedding copper billet copper teeth space gap exists air impact product quality fluctuation;
Four, simple to operate, by process optimization, without the need to belt sanding, effectively prevent belt sanding and occur pcb board dew base material, the resin polishing unfavorable condition such as unclean, simplify the operation link.
Embodiment
In order to make those skilled in the art person understand technical scheme of the present invention better, below in conjunction with embodiment, product of the present invention is described in further detail.
A manufacture method for potting copper billet pcb board, pcb board is processed with the slotted eye imbedded for copper billet and the metallization slotted eye embedded for copper billet, comprises the following steps:
1, slotted eye pre-treatment is buried: the making of core material circuit is carried out in technological process routinely, AOI detection, groove milling, brown and prepreg sawing sheet, boring, groove milling make, and processing obtains the slotted eye burying copper billet.
2, bury copper billet pressing process, mainly comprise following operation:
2.1, copper billet pressing pretreatment procedure is buried, copper billet pressing pretreatment procedure is buried to needing to imbed the copper billet of slotted eye on pcb board, the described copper billet pressing pretreatment procedure that buries comprises and carries out groove process to copper billet bottom margin, chamfered is carried out to the corner angle of copper billet, described groove process is processed to form copper tooth by drill and obtains, the boring of described drill 1.6mm cutter footpath, the center of boring is from copper billet edge 0.6mm;
2.2, bury copper billet pressing working procedure, undertaken burying copper billet pressing by current Conventional process parameters and flow process;
2.3, carbon dioxide laser burns fat cleaning process, by making laser file, uses carbon dioxide laser to carry out Ablative resin, then uses the position of adhesive-bonded fabric grinding pcb board Ablative resin to clean.
3, groove milling: carry out groove milling after PCB keyseat rule cun being compensated according to embedding copper billet size, form the slotted eye that can embed slotted eye.
4, heavy copper: heavy process for copper flow process is to the slotted eye metalized of the pcb board of gained after groove milling routinely.
5, embedding copper billet pressing process, comprises following operation break-down;
5.1, embedding copper billet pressing pretreatment procedure, described embedding copper billet pressing pretreatment procedure comprises to be needed the bottom margin embedding slotted eye to carry out groove place to copper billet, needs the seamed edge embedding slotted eye to carry out corners process and need the corner angle embedding slotted eye to carry out chamfered to copper billet to copper billet, described groove process is processed to form copper tooth by drill and obtains, the boring of described drill 1.6mm cutter footpath, the center of boring is from copper billet edge 0.6mm;
5.2, embedding copper billet pressing working procedure: after after embedding copper billet micro-embedding pcb board slotted eye, use high temperature resistant adhesive plaster suitably to fix its copper billet, complete pre-contraposition; Arrange plate mode by " steel plate+steel plate+embedding copper billet pcb board+steel plate+steel plate " and carry out pressing, in process, embedding copper billet pressing special parameters is used to carry out pressing, temperature-resistant, pressing divided for 5 stages carried out gradient supercharging, guarantee that copper billet embeds and evenness meets the requirements, pressing time≤10 minute, concrete pressing parameter is as follows:
| Stage | Pressure kg/cm 2 | Temperature DEG C | Time min |
| 1 | 7 | Normal temperature | 1 |
| 2 | 15 | Normal temperature | 2 |
| 3 | 25 | Normal temperature | 5 |
| 4 | 15 | Normal temperature | 1 |
| 5 | 7 | Normal temperature | 1 |
In concrete pre-contraposition process, use high-temperature plastic that embedding copper billet is fixed on pcb board slotted eye position, high-temperature plastic needs following operation: high temperature resistant adhesive plaster need instead paste, what guarantee that zone line contacts with copper billet is light face, ensure that two ends are glue face simultaneously, be attached to pcb board face, the middle anti-length L2 pasting high temperature resistant adhesive plaster need be larger than the length L1 of copper billet, avoids glue to be got in copper billet and pcb board gap;
5.3, vacuum resin consent operation: conveniently consent parameter and operation are entered to pcb board after completing embedding copper billet pressing and carries out vacuum resin consent, test after solidification, in this operation, conventional pcb board vacuum resin hole plugging machine is used to carry out, replace conventional welding resistance consent, effectively embedding copper billet and pcb board are bonded, strengthen adhesion, also be conducive to the air between embedding copper billet and pcb board gap to be driven out of, guarantee product quality effect;
5.4, carbon dioxide laser burns resin operation: after filling holes with resin, cave in after embedding copper billet edge and pcb board exist step, conventional grinding cannot remove resin effectively completely, laser file need be made, carbon dioxide laser and special parameters is used to carry out burning resin, adhesive-bonded fabric is used to grind after removing resin, make plate face clean, without resin residue, laser processing documenting need by actual prepreg gummosis, vacuum resin consent cull situation carries out dimension compensation, require that the region of ablation is larger than copper billet size, guarantee that copper billet and pcb board jointing edge gummosis can fully be removed by laser, laser path need by circle and the tangent design of circle, routine presses 0.1mm aperture, the pitch of holes of 0.1mm carries out paving hole, use special little energy laser parameter, prevent aperture overstocked, energy excessive causing excessively punctures copper face, its concrete optimum configurations is as follows:
| Parameter | Pulsewidth (us) | Energy (mj) | Send out number | MASK(mm) |
| Carbon dioxide laser burns resin | 6 | 6 | 1 | 3.3 |
6, pcb board embedding copper billet reprocessing: carry out follow-up making by the technological process of existing conventional line plate, finally can obtain the pcb board finished product after potting copper billet.
The above, be only preferred embodiment of the present invention, not does any pro forma restriction to the present invention; The those of ordinary skill of all industry all can shown in by specification and the above and implement the present invention swimmingly; But all those skilled in the art are not departing within the scope of technical solution of the present invention, disclosed above technology contents can be utilized and make a little change, modify with differentiation equivalent variations, be Equivalent embodiments of the present invention; Meanwhile, all according to substantial technological of the present invention to the change of any equivalent variations that above embodiment is done, modify and differentiation etc., within the protection range all still belonging to technical scheme of the present invention.
Claims (10)
1. a manufacture method for potting copper billet pcb board, pcb board is processed with the slotted eye imbedded for copper billet and the metallization slotted eye embedded for copper billet, it is characterized in that comprising the following steps:
Bury copper billet pressing process; Comprise and bury copper billet pressing pretreatment procedure to needing to imbed the copper billet of slotted eye on pcb board, described in bury copper billet pressing pretreatment procedure and comprise groove process is carried out to copper billet bottom margin, chamfered is carried out to the corner angle of copper billet;
Embedding copper billet pressing process: comprise needing the copper billet embedding slotted eye on pcb board to carry out embedding copper billet pressing pretreatment procedure, described embedding copper billet pressing pretreatment procedure comprises to be needed the bottom margin embedding slotted eye to carry out groove place to copper billet, needs the seamed edge embedding slotted eye to carry out corners process and need the corner angle embedding slotted eye to carry out chamfered to copper billet to copper billet.
2. the manufacture method of potting copper billet pcb board according to claim 1, is characterized in that: described in bury copper billet pressing process be also included in bury copper billet pressing pretreatment procedure after bury copper billet pressing working procedure and the carbon dioxide laser that carry out burn fat cleaning process.
3. the manufacture method of potting copper billet pcb board according to claim 1, is characterized in that: the embedding copper billet pressing working procedure, vacuum resin consent operation and the carbon dioxide laser that have carried out after described embedding copper billet pressing process has also been included in embedding copper billet pressing pretreatment procedure burn fat cleaning process.
4. the manufacture method of the potting copper billet pcb board according to Claims 2 or 3, it is characterized in that: described carbon dioxide laser burns fat cleaning process by making laser file, use carbon dioxide laser to carry out Ablative resin, then use the position of adhesive-bonded fabric grinding pcb board Ablative resin to clean.
5. the manufacture method of potting copper billet pcb board according to claim 4, is characterized in that: described embedding copper billet pressing treatment process comprises the following steps:
Pre-contraposition: after the micro-embedding of slotted eye on the copper billet needing to embed and pcb board, uses high temperature resistant adhesive plaster suitably to fix the copper billet embedded, completes pre-contraposition;
Stacked pressing: arrange plate mode by " steel plate+steel plate+embedding copper billet pcb board+steel plate+steel plate " and carry out increasing by stage and reducing the mode of pressure and time and carry out pressing at normal temperatures.
6. the manufacture method of potting copper billet pcb board according to claim 5, is characterized in that: in the stacked bonding processes of embedding copper billet pressing treatment process, carries out gradient supercharging stage by stage, guarantees that copper billet embeds and evenness, pressing time≤10 minute.
7. the manufacture method of potting copper billet pcb board according to claim 6, is characterized in that: described in bury between copper billet pressing process and described embedding copper billet pressing process and also comprise following two steps:
Groove milling: carry out the slotted eye that groove milling forms embedding copper billet according to embedding after copper billet size compensates PCB keyseat rule cun;
Heavy copper: the slotted eye that heavy process for copper flow process carries out pcb board routinely carries out metalized.
8. the manufacture method of potting copper billet pcb board according to claim 7, is characterized in that: described groove process is processed to form copper tooth by drill and obtains, and the boring of described drill 1.6mm cutter footpath, the center of boring is from copper billet edge 0.6mm.
9. the manufacture method of potting copper billet pcb board according to claim 8, it is characterized in that: in described embedding copper billet pressing treatment process, in pre-contraposition, high temperature resistant adhesive plaster need instead paste, what guarantee that zone line contacts with copper billet is light face, ensure that two ends are glue face simultaneously, be attached to pcb board face, the length of the high temperature resistant adhesive plaster of middle anti-subsides is larger than the length of copper billet.
10. the manufacture method of potting copper billet pcb board according to claim 8, is characterized in that: described vacuum resin consent operation adopts vacuum resin hole plugging machine to carry out.
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| CN201510251730.3A CN104853523A (en) | 2015-05-18 | 2015-05-18 | Buried and embedded copper block PCB manufacturing method |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430922A (en) * | 2015-12-18 | 2016-03-23 | 景旺电子科技(龙川)有限公司 | Manufacturing method for embedding metal matrix into printed board |
| CN106102325A (en) * | 2016-06-30 | 2016-11-09 | 广德宝达精密电路有限公司 | A kind of manufacture method of half built-in copper billet printed board |
| CN108055767A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | A kind of PCB and its manufacturing method |
| CN108990273A (en) * | 2018-08-03 | 2018-12-11 | 诚亿电子（嘉兴）有限公司 | Bury T-type copper billet PCB plate production method |
| CN109076708A (en) * | 2016-04-26 | 2018-12-21 | 株式会社村田制作所 | The manufacturing method of resin multilayer substrate |
| CN109661098A (en) * | 2018-12-04 | 2019-04-19 | 深圳众力新能源科技有限公司 | A kind of embedding steel structure of PCB metal aperture and its processing technology |
| CN109936916A (en) * | 2019-03-05 | 2019-06-25 | 惠州市特创电子科技有限公司 | A kind of hole internal plug copper billet 5G high frequency circuit board and preparation method thereof |
| CN110461084A (en) * | 2019-07-19 | 2019-11-15 | 恩达电路(深圳)有限公司 | Thick copper metal substrate presses copper billet method |
| CN110856346A (en) * | 2018-08-21 | 2020-02-28 | 健鼎（无锡）电子有限公司 | Printed circuit board and method for manufacturing the same |
| CN110859027A (en) * | 2018-08-22 | 2020-03-03 | 健鼎（无锡）电子有限公司 | Printed circuit board and method for manufacturing the same |
| CN111182710A (en) * | 2019-10-28 | 2020-05-19 | 汕头凯星印制板有限公司 | Copper particle embedded heat dissipation circuit board and manufacturing process thereof |
| CN111901987A (en) * | 2020-09-15 | 2020-11-06 | 乐健科技（珠海）有限公司 | Circuit board with embedded heat conductor and preparation method thereof |
| CN112235956A (en) * | 2020-11-06 | 2021-01-15 | 惠州市盈帆实业有限公司 | Production and manufacturing process of copper-embedded circuit board based on PVC material |
| CN112888181A (en) * | 2020-11-06 | 2021-06-01 | 惠州市盈帆实业有限公司 | Production method of copper-embedded mixed-compression circuit board based on PVC material |
| CN117042305A (en) * | 2023-10-09 | 2023-11-10 | 四川英创力电子科技股份有限公司 | Manufacturing method for improving flatness of copper-clad laminate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201789685U (en) * | 2010-08-25 | 2011-04-06 | 深圳中富电路有限公司 | Copper block for board embedded with same |
| US20120073747A1 (en) * | 2010-09-28 | 2012-03-29 | Samsung Electro-Mechanics Co., Ltd. | Embedded printed circuit board and method of manufacturing the same |
| CN102933032A (en) * | 2012-10-29 | 2013-02-13 | 无锡江南计算技术研究所 | Printed wiring board lamination and copper block embedding method |
| CN103347365A (en) * | 2013-06-07 | 2013-10-09 | 东莞生益电子有限公司 | Method for removing laminated flowing glue on PCB surface |
| CN103987187A (en) * | 2014-05-19 | 2014-08-13 | 深圳市景旺电子股份有限公司 | PCB inlaid with copper block and manufacturing method thereof |
-
2015
- 2015-05-18 CN CN201510251730.3A patent/CN104853523A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201789685U (en) * | 2010-08-25 | 2011-04-06 | 深圳中富电路有限公司 | Copper block for board embedded with same |
| US20120073747A1 (en) * | 2010-09-28 | 2012-03-29 | Samsung Electro-Mechanics Co., Ltd. | Embedded printed circuit board and method of manufacturing the same |
| CN102933032A (en) * | 2012-10-29 | 2013-02-13 | 无锡江南计算技术研究所 | Printed wiring board lamination and copper block embedding method |
| CN103347365A (en) * | 2013-06-07 | 2013-10-09 | 东莞生益电子有限公司 | Method for removing laminated flowing glue on PCB surface |
| CN103987187A (en) * | 2014-05-19 | 2014-08-13 | 深圳市景旺电子股份有限公司 | PCB inlaid with copper block and manufacturing method thereof |
Cited By (21)
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| CN109076708A (en) * | 2016-04-26 | 2018-12-21 | 株式会社村田制作所 | The manufacturing method of resin multilayer substrate |
| CN109076708B (en) * | 2016-04-26 | 2021-04-20 | 株式会社村田制作所 | Method for manufacturing resin multilayer substrate |
| CN106102325A (en) * | 2016-06-30 | 2016-11-09 | 广德宝达精密电路有限公司 | A kind of manufacture method of half built-in copper billet printed board |
| CN108055767A (en) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | A kind of PCB and its manufacturing method |
| CN108990273A (en) * | 2018-08-03 | 2018-12-11 | 诚亿电子（嘉兴）有限公司 | Bury T-type copper billet PCB plate production method |
| CN110856346A (en) * | 2018-08-21 | 2020-02-28 | 健鼎（无锡）电子有限公司 | Printed circuit board and method for manufacturing the same |
| CN110856346B (en) * | 2018-08-21 | 2022-05-03 | 健鼎（无锡）电子有限公司 | Printed circuit board and method for manufacturing the same |
| CN110859027A (en) * | 2018-08-22 | 2020-03-03 | 健鼎（无锡）电子有限公司 | Printed circuit board and method for manufacturing the same |
| CN110859027B (en) * | 2018-08-22 | 2022-05-17 | 健鼎（无锡）电子有限公司 | Printed circuit board and method for manufacturing the same |
| CN109661098B (en) * | 2018-12-04 | 2020-08-25 | 深圳众力新能源科技有限公司 | PCB metal hole copper embedding structure and processing technology thereof |
| CN109661098A (en) * | 2018-12-04 | 2019-04-19 | 深圳众力新能源科技有限公司 | A kind of embedding steel structure of PCB metal aperture and its processing technology |
| CN109936916A (en) * | 2019-03-05 | 2019-06-25 | 惠州市特创电子科技有限公司 | A kind of hole internal plug copper billet 5G high frequency circuit board and preparation method thereof |
| CN110461084A (en) * | 2019-07-19 | 2019-11-15 | 恩达电路(深圳)有限公司 | Thick copper metal substrate presses copper billet method |
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| CN111901987B (en) * | 2020-09-15 | 2021-10-29 | 乐健科技（珠海）有限公司 | Circuit board with embedded heat conductor and preparation method thereof |
| CN111901987A (en) * | 2020-09-15 | 2020-11-06 | 乐健科技（珠海）有限公司 | Circuit board with embedded heat conductor and preparation method thereof |
| CN112888181A (en) * | 2020-11-06 | 2021-06-01 | 惠州市盈帆实业有限公司 | Production method of copper-embedded mixed-compression circuit board based on PVC material |
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