CN105338746A - Method for forming circuit board without location holes - Google Patents

Method for forming circuit board without location holes Download PDF

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Publication number
CN105338746A
CN105338746A CN201510736517.1A CN201510736517A CN105338746A CN 105338746 A CN105338746 A CN 105338746A CN 201510736517 A CN201510736517 A CN 201510736517A CN 105338746 A CN105338746 A CN 105338746A
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CN
China
Prior art keywords
circuit board
edges
wiring board
finished
gong
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510736517.1A
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Chinese (zh)
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CN105338746B (en
Inventor
李雄杰
王忱
樊建华
黄慧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VICTORY GIANT TECHNOLOGY (HUIZHOU) Co Ltd
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VICTORY GIANT TECHNOLOGY (HUIZHOU) Co Ltd
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Priority to CN201510736517.1A priority Critical patent/CN105338746B/en
Publication of CN105338746A publication Critical patent/CN105338746A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Abstract

The invention discloses a method for forming a circuit board without location holes. A circuit board to be processed with two technological edge is included, and each technological edge is provided with two location holes. The method comprises the following concrete steps: S1, carrying out a primary milling formation to prepare semi-finished product circuit boards A; S2, carrying out an electric test; S3, successively aligning the semi-finished product circuit boards A and overlapping the semi-finished product circuit boards A on the bench surface of a formation machine, one technological edge of the multiple semi-finished product circuit boards A is fixed by use of a positioning pin, and boring is performed at board edge positions of the multiple semi-finished product circuit boards A, and the semi-finished product circuit boards A are fixed by use of positioning pins; S4, carrying out secondary milling to prepare semi-finished product circuit boards B; S5, boring is performed at positions, close to board edges, of the semi-finished product circuit boards B after the technological edges are milled, and the semi-finished product circuit boards B are fixed by use of the positioning pins; S6, carrying out third-time milling to prepare a finished product circuit board; and S7, cleaning, and performing drying processing. According to the invention, milling formation is used for three times, a circuit board formation method is optimized, the board edge of the circuit board is enabled to be flat and smooth, splicing application is facilitated, the quality of the circuit board is improved, the production time is reduced, and the production efficiency is improved.

Description

A kind of wiring board forming method without location hole
Technical field
The invention belongs to wiring board production technical field, be specifically related to a kind of wiring board forming method without location hole.
Background technology
Along with the development of wiring board industry, the wiring board of various uses also occurs thereupon, make and require also precision increasingly, meticulous, especially due to the backboard of large LED display screen, that polylith wiring board is spliced, without positioning through hole or through-hole diameter too small (below 1.0MM) in plate, seamless spliced between its wiring board is the key of LED display effect, traditional operating type cannot meet this requirement, as wiring board producer, research and develop new manufacture method reduction production cost to enhance productivity, and manufacture out the direction that the wiring board met the requirements of the customers is wiring board producer effort, the management of production process simultaneously also becomes the key point yielded products of quality.
In the wiring board design phase, run in plate without location hole or through-hole diameter too small (below 1.0mm), common way is that design increases technique edges, technique edges adds satisfactory location hole, is convenient to processing and forming, because technique edges can be removed after subsides part, therefore, the method of common removal technique edges has two kinds: 1, design stamp hole and wiring board main body be connected with technique edges, after subsides part completes, breaks except technique edges (see accompanying drawing 1); 2, designed lines plate main body is directly connected with technique edges, cuts V groove by V-CUT, after subsides part completes, breaks except technique edges (see accompanying drawing 2); But the design of above two kinds of removal technique edges, is only limitted to the client allowing technique edges shipment, and technique edges removes rear edges of boards out-of-flatness, directly affects the splicing between wiring board plate, if client does not allow adding technology limit, then above two kinds of designs all can not adopt.Therefore how to without location hole and the wiring board not allowing technique edges to exist is shaping and test position fix becomes wiring board producer problem demanding prompt solution.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is that a kind of edges of boards are smooth, smooth, is convenient to splice the wiring board forming method without location hole used.
In order to solve the problems of the technologies described above, the present invention adopts following scheme to realize: a kind of wiring board forming method without location hole, comprises the wiring board to be processed being provided with two technique edges, and each technique edges is provided with two location holes, and concrete steps are as follows:
S1. wiring board to be processed for polylith is carried out successively externally, overlap is fixed on the backing plate of forming machine table top; Treat processing line plate and carry out first time gong sheet metal forming, make half-finished circuit board A;
S2. electrical testing is carried out to half-finished circuit board A;
S3. polylith half-finished circuit board A qualified for electrical testing is carried out contraposition successively, overlaps on the backing plate of forming machine table top, two location holes on a technique edges in polylith half-finished circuit board A use shop bolt to fix, holing near the polylith half-finished circuit board A edges of boards position without technique edges, and with shop bolt is fixing, polylith half-finished circuit board A is being fixed;
S4. carry out second time gong limit to the half-finished circuit board A of polylith overlap, during gong limit, gong is except the edges of boards of half-finished circuit board A at place, technique edges position not having shop bolt, makes half-finished circuit board B;
S5. the half-finished circuit board B edges of boards position boring after removing technique edges near gong, and fix with shop bolt, pull out the shop bolt be fixed in the location hole of technique edges simultaneously;
S6. carry out third time gong plate to half-finished circuit board B, during gong limit, gong is except the edges of boards of the half-finished circuit board B at another place, technique edges position, makes finished product wiring board;
S7. finished product wiring board is carried out cleaning, dry process.
As improvement of the present invention, the technique edges of described wiring board to be processed is arranged on any both sides of wiring board to be processed.
As improvement of the present invention, during first time gong plate described in step S3, a gong except in wiring board to be processed without the part needing gong to remove in the wiring board edges of boards to be processed at technique edges place and wiring board to be processed.
As a further improvement on the present invention, the quantity of the quantity of the half-finished circuit board A edges of boards position boring described in step S3 and the half-finished circuit board B edges of boards position boring described in step S5 is determined according to the length in wiring board plate face.
Further improve as of the present invention, the quantity of the quantity of the half-finished circuit board A edges of boards position boring described in step S3 and the half-finished circuit board B edges of boards position boring described in step S5 is two.
Compared with prior art, the present invention changes traditional gong sheet metal forming technique, adopt three gong sheet metal formings, optimize wiring board forming method, make the edges of boards of wiring board smooth, smooth, be convenient to splicing use, improve the quality of wiring board, wiring board divides three gong plates, gong groove technique edges during first time gong plate, wiring board is facilitated to locate and test, to carrying out second time gong plate again after to be tested, first gong is except the wiring board edges of boards at the technique edges place not having shop bolt to fix, when third time gong plate at the wiring board edges of boards of gong except another technique edges place, efficiently solve wiring board test problem, improve wiring board location and testing efficiency, optimized production process, avoid in gong plate process and skew or shifting phenomena occur, and when second time and third time gong plate gong except the edges of boards at the place, circuit board technique limit of multiple-layer overlapped, reduce the production time, improve production efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation that the first wiring board of the prior art adopts stamp hole to be connected with technique edges.
Fig. 2 is the structural representation that the second wiring board of the prior art is directly connected with technique edges.
Fig. 3 is the structural representation of the half-finished circuit board A of step S1 in the present embodiment.
Fig. 4 is that the half-finished circuit board A of step S3 in the present embodiment adopts shop bolt fixed structure schematic diagram.
Fig. 5 is the structural representation of the half-finished circuit board B of step S4 in the present embodiment.
Fig. 6 is that the half-finished circuit board B of step S5 in the present embodiment adopts shop bolt fixed structure schematic diagram.
Fig. 7 is the structural representation of the finished product wiring board of step S6 in the present embodiment.
Fig. 8 is the structural representation of the finished product wiring board in the present embodiment.
Wherein: wiring board 1; Technique edges 2; Location hole 3, shop bolt 4.
Embodiment
In order to allow those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, the present invention is further elaborated.
As shown in Figures 3 to 8, a kind of wiring board forming method without location hole, comprises the wiring board to be processed 1 being provided with two technique edges 2, as shown in Figure 3; Two technique edges 2 of described wiring board to be processed are arranged on any both sides of wiring board to be processed.Wherein each technique edges 2 is provided with two location holes 3, treats processing line plate position by this location hole.Concrete steps are as follows:
S1. carried out successively by wiring board to be processed for polylith externally, then overlap is fixed on the backing plate of forming machine table top; Treat processing line plate 1 again to put into gong board device and carry out first time gong sheet metal forming, make half-finished circuit board A; When first time, gong sheet metal forming made half-finished circuit board A, a gong except in wiring board to be processed without the part needing gong to remove in the wiring board edges of boards to be processed at technique edges place and wiring board to be processed, make one-step forming at the beginning of wiring board to be processed, as shown in Figure 3.
S2. electrical testing is carried out to half-finished circuit board A; During electrical testing half-finished circuit board A, whether completely test its circuit, meet the requirements of the customers, if when meeting the requirements of the customers, carry out next step operation processing, if defective time chosen, it is repaired or scraps process, avoid the processing to defective products, cause the waste of the resources of production, increase production cost.
S3. polylith half-finished circuit board A qualified for electrical testing is carried out contraposition, then overlap on the backing plate of forming machine table top, two location holes 3 on a technique edges 2 in polylith half-finished circuit board A use shop bolt 4 to fix, holing near the polylith half-finished circuit board A edges of boards position without technique edges, and with shop bolt 4 is fixing, polylith half-finished circuit board A is fixed, as shown in Figure 4, polylith half-finished circuit board A can be firmly fixed on forming machine table top, avoid, in gong plate process, skew or shifting phenomena occur, produce defective products.
S4. carry out second time gong limit to the half-finished circuit board A of polylith overlap, during gong limit, gong is except the edges of boards of half-finished circuit board A at place, technique edges position not having shop bolt 4, makes half-finished circuit board B, as shown in Figure 5; First gong is except the edges of boards of the half-finished circuit board A at the technique edges place not having shop bolt to fix, and the technique edges of another side has shop bolt 4 to fix ,make wiring board gong plate precision higher, prevent half-finished circuit board A to be moved in gong crack approach.
S5. the half-finished circuit board B edges of boards position boring after removing technique edges near gong, and fix with shop bolt, as shown in Figure 6; Wiring board can be firmly fixed on forming machine table top.Pull out the shop bolt be fixed in the location hole of technique edges simultaneously, facilitate next step to carry out gong plate to it.
S6. carry out third time gong plate to half-finished circuit board B, during gong limit, gong is except the edges of boards of the half-finished circuit board B at another place, technique edges position, makes finished product wiring board, as shown in Figure 7.
S7. as shown in Figure 8, finished product wiring board is separated, then cleans, remove dust or the foreign material in wiring board plate face, improve the quality of finished product wiring board, finally drying process is carried out to finished product wiring board.The finished product wiring board of drying process is transferred in next station and carries out production and processing.
Forming machine used in the present invention is the CNC numerical control gong trigger bed in wiring board production process, is equipment conventional in wiring board production process, the common practise be well known to those skilled in the art.
Above-described embodiment is only wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.

Claims (5)

1. without a wiring board forming method for location hole, it is characterized in that, comprise the wiring board to be processed being provided with two technique edges, each technique edges is provided with two location holes, and concrete steps are as follows:
S1. wiring board to be processed for polylith is carried out successively externally, overlap is fixed on the backing plate of forming machine table top; Treat processing line plate and carry out first time gong sheet metal forming, make half-finished circuit board A;
S2. electrical testing is carried out to half-finished circuit board A;
S3. polylith half-finished circuit board A qualified for electrical testing is carried out contraposition successively, overlaps on the backing plate of forming machine table top, two location holes on a technique edges in polylith half-finished circuit board A use shop bolt to fix, holing near the polylith half-finished circuit board A edges of boards position without technique edges, and with shop bolt is fixing, polylith half-finished circuit board A is being fixed;
S4. carry out second time gong limit to the half-finished circuit board A of polylith overlap, during gong limit, gong is except the edges of boards of half-finished circuit board A at place, technique edges position not having shop bolt, makes half-finished circuit board B;
S5. the half-finished circuit board B edges of boards position boring after removing technique edges near gong, and fix with shop bolt, pull out the shop bolt be fixed in the location hole of technique edges simultaneously;
S6. carry out third time gong plate to half-finished circuit board B, during gong limit, gong is except the edges of boards of the half-finished circuit board B at another place, technique edges position, makes finished product wiring board;
S7. finished product wiring board is carried out cleaning, dry process.
2. the wiring board forming method without location hole according to claim 1, is characterized in that, the technique edges of described wiring board to be processed is arranged on any both sides of wiring board to be processed.
3. the wiring board forming method without location hole according to claim 2, it is characterized in that, during first time gong plate described in step S3, a gong except in wiring board to be processed without the part needing gong to remove in the wiring board edges of boards to be processed at technique edges place and wiring board to be processed.
4. the wiring board forming method without location hole according to claim 3, it is characterized in that, the quantity of the quantity of the half-finished circuit board A edges of boards position boring described in step S3 and the half-finished circuit board B edges of boards position boring described in step S5 is determined according to the length in wiring board plate face.
5. the wiring board forming method without location hole according to claim 4, it is characterized in that, the quantity of the quantity of the half-finished circuit board A edges of boards position boring described in step S3 and the half-finished circuit board B edges of boards position boring described in step S5 is two.
CN201510736517.1A 2015-11-03 2015-11-03 A kind of circuit panel forming method of no positioning hole Active CN105338746B (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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CN105338746B CN105338746B (en) 2018-01-12

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106550543A (en) * 2016-10-26 2017-03-29 广东骏亚电子科技股份有限公司 A kind of circuit panel forming method without location hole
CN106900139A (en) * 2017-04-20 2017-06-27 胜宏科技(惠州)股份有限公司 It is a kind of high-accuracy without technique edges LED circuit board moulding process
CN108818724A (en) * 2018-06-05 2018-11-16 江西旭昇电子有限公司 Route panel forming method without location hole in cell board
CN109348625A (en) * 2018-10-16 2019-02-15 欣强电子(清远)有限公司 A kind of LED lamp panel shaping process
CN109496059A (en) * 2018-11-21 2019-03-19 梅州市志浩电子科技有限公司 Production method without location structure PCB
CN109587954A (en) * 2018-12-12 2019-04-05 东莞市若美电子科技有限公司 No interior positioning milling plate production technology
CN110139483A (en) * 2019-04-16 2019-08-16 珠海中京电子电路有限公司 A kind of printed circuit board forming processing method
CN111590105A (en) * 2020-05-30 2020-08-28 涟水县苏杭科技有限公司 Secondary positioning processing technology for routing groove of PCB (printed circuit board)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090133920A1 (en) * 2007-11-23 2009-05-28 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and manufacturing method of the same
CN102065641A (en) * 2009-11-17 2011-05-18 富葵精密组件(深圳)有限公司 Production method of circuit board
CN102438399A (en) * 2011-09-30 2012-05-02 景旺电子科技(龙川)有限公司 Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof
CN103237414A (en) * 2013-04-22 2013-08-07 胜华电子(惠阳)有限公司 Key circuit board production method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090133920A1 (en) * 2007-11-23 2009-05-28 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and manufacturing method of the same
CN102065641A (en) * 2009-11-17 2011-05-18 富葵精密组件(深圳)有限公司 Production method of circuit board
CN102438399A (en) * 2011-09-30 2012-05-02 景旺电子科技(龙川)有限公司 Metal PCB (Printed Circuit Board) space-free jointed board and cutting method thereof
CN103237414A (en) * 2013-04-22 2013-08-07 胜华电子(惠阳)有限公司 Key circuit board production method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106550543A (en) * 2016-10-26 2017-03-29 广东骏亚电子科技股份有限公司 A kind of circuit panel forming method without location hole
CN106900139A (en) * 2017-04-20 2017-06-27 胜宏科技(惠州)股份有限公司 It is a kind of high-accuracy without technique edges LED circuit board moulding process
CN106900139B (en) * 2017-04-20 2019-05-14 胜宏科技(惠州)股份有限公司 A kind of high-accuracy no technique edges LED circuit board moulding process
CN108818724A (en) * 2018-06-05 2018-11-16 江西旭昇电子有限公司 Route panel forming method without location hole in cell board
CN108818724B (en) * 2018-06-05 2020-06-05 江西旭昇电子有限公司 Circuit board forming method without positioning holes in unit board
CN109348625A (en) * 2018-10-16 2019-02-15 欣强电子(清远)有限公司 A kind of LED lamp panel shaping process
CN109496059A (en) * 2018-11-21 2019-03-19 梅州市志浩电子科技有限公司 Production method without location structure PCB
CN109587954A (en) * 2018-12-12 2019-04-05 东莞市若美电子科技有限公司 No interior positioning milling plate production technology
CN110139483A (en) * 2019-04-16 2019-08-16 珠海中京电子电路有限公司 A kind of printed circuit board forming processing method
CN111590105A (en) * 2020-05-30 2020-08-28 涟水县苏杭科技有限公司 Secondary positioning processing technology for routing groove of PCB (printed circuit board)

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