CN111182710A - Copper particle embedded heat dissipation circuit board and manufacturing process thereof - Google Patents
Copper particle embedded heat dissipation circuit board and manufacturing process thereof Download PDFInfo
- Publication number
- CN111182710A CN111182710A CN201911297612.0A CN201911297612A CN111182710A CN 111182710 A CN111182710 A CN 111182710A CN 201911297612 A CN201911297612 A CN 201911297612A CN 111182710 A CN111182710 A CN 111182710A
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- Prior art keywords
- circuit board
- copper
- heat dissipation
- diameter
- embedded
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of circuit board manufacturing equipment, in particular to a copper particle embedded heat dissipation circuit board and a manufacturing process thereof, which mainly comprise the following steps: the circuit board is formed by laminating four layers of boards, the heating area is positioned on the circuit board, at least one heat dissipation hole is arranged in the heating area, and the copper particles are embedded into the heat dissipation holes. The best material for the embedded metal particles is copper, since the particles will accompany almost all the flow of the board into a conventional circuit board. Compared with the prior art, the beneficial effects are: the traditional idea of externally welding a radiating element is abandoned, embedded copper particles are adopted as a medium for relieving heat influence at the position where the local heat gathering of a small peak occurs, and the influence of the local heat gathering on use is avoided while an auxiliary radiating element is not added according to the traditional mode.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing equipment, in particular to a copper particle embedded heat dissipation circuit board and a manufacturing process thereof.
Background
When a wiring board is used as an interconnection substrate of a circuit, a part of the area may generate heat by itself. In conventional design and practice, this is achieved by laying an array/matrix of metallized holes in a heat-collecting zone and welding corresponding auxiliary heat-dissipating elements.
Some customers will put forward a new requirement, and some plates which are designed and laid out have newly found that a local heat-collecting area exists in the using process, but the auxiliary heat-radiating element is not supported if the auxiliary heat-radiating element is added in a traditional mode based on the peripheral patch element and the assembly space limit. While local heat accumulation affects usage.
The applicant has seen the shortcomings of the conventional circuit board, inherits the spirit of research innovation and lean refinement, combines production practice, and provides a practical solution by using a professional scientific method, so that the application of the scheme is provided.
Disclosure of Invention
In order to overcome at least one of the defects of the prior art, the invention provides a copper particle embedded heat dissipation circuit board, which tries to relieve the heat generation in the small peak period by embedding flat copper particles in a local part.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides an embedding copper grain heat dissipation circuit board mainly includes: the circuit board is formed by laminating four layers of boards, the heating area is positioned on the circuit board, at least one heat dissipation hole is arranged in the heating area, and the copper particles are embedded into the heat dissipation holes. The best material for the embedded metal particles is copper, since the particles will accompany almost all the flow of the board into a conventional circuit board.
Specifically, the louvre set up in district center that generates heat, the louvre is located 5.5 mm's circular area, the thickness of louvre is 1.6 mm. The copper particles can be embedded into the plate and tightly sleeved without falling out, the copper particles can be machined by a precise three-dimensional lathe, the machined size is accurate and stable, and hard brass is selected
Specifically, the copper particles are cylinders, the diameter of each copper particle is 5.49mm, the thickness of each copper particle is 1.55mm, and one side edge of each copper particle is a chamfer of 0.3 mm. The accuracy and the consistency of the size of the drilled hole are guaranteed to the maximum extent.
A manufacturing process of a heat dissipation circuit board embedded with copper particles comprises the following steps: a brass strip with the length of 0.5m and the diameter of 6mm is selected and milled by a precision machine tool to be processed into a cylinder, and the size of copper grains is 5.49mm in diameter and 1.55mm in thickness. Meanwhile, in order to enable the copper particles to be smoothly embedded, a chamfer angle of 0.3mm is formed on one column side of the copper particles; step two: laminating four layers of copper plates into a circuit board, checking local intermittent heating areas on the circuit board, and moving the heating areas out of circular areas with the diameter of 6.5mm if the wiring of the heating areas is adjusted; step three: drilling a hole in a circular area by adopting a drill bit with the diameter of 5.5mm, wherein the diameter of each heat dissipation hole is 5.5mm, embedding copper particles into the heat dissipation holes, lightly pushing the end with the chamfer into the CS surface of the circuit board by hand, placing the circuit board on thin adhesive paper, and knocking the circuit board in by using an adhesive hammer; step four: the circuit board embedded with the copper particles is subjected to processes of deburring, copper melting, full-board electroplating and surface treatment of nickel and gold.
Compared with the prior art, the beneficial effects are: the traditional thought of externally welding a radiating element is abandoned, embedded copper particles are used as a medium for relieving heat influence at the position where a small peak local heat gathering occurs, the use is prevented from being influenced by the local heat gathering while an auxiliary radiating element is not additionally arranged in a traditional mode, a plate is embedded into a copper particle area for longitudinal slice observation, the copper particles are matched and fastened with a hole wall, the periphery of surface layer electroplated copper is covered, and the appearance is normal; the plate simulates the reflow soldering thermal process, and avoids the machine adjusting influence caused by abnormal conditions and inferred local overheating before the abnormal conditions occur.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.
As shown in fig. 1, a heat dissipation circuit board with embedded copper particles mainly includes: the circuit board 1 is formed by laminating four layers of boards, the heating area 2 is positioned on the circuit board 1, at least one heat dissipation hole 3 is arranged in the heating area 2, and the copper particles 3 are embedded into the heat dissipation holes 3.
Above-mentioned scheme, louvre 3 set up in 2 centers in district that generate heat, louvre 3 is located 5.5 mm's circular area, louvre 3's thickness is 1.6 mm. The copper particle 4 is a cylinder, the diameter of the copper particle 4 is 5.49mm, the thickness of the copper particle 4 is 1.55mm, and one side edge of the copper particle 4 is a chamfer angle of 0.3 mm.
A manufacturing process of a heat dissipation circuit board embedded with copper particles comprises the following steps: a brass strip with the length of 0.5m and the diameter of 6mm is selected and milled by a precision machine tool to be processed into a cylinder, and the size of copper grains 4 is 5.49mm in diameter and 1.55mm in thickness. Meanwhile, in order to enable the copper particles to be smoothly embedded, a chamfer angle of 0.3mm is formed on one column side of the copper particles; step two: laminating four layers of copper plates into a circuit board 1, checking local intermittent heating areas 2 on the circuit board 1, and moving the heating areas 2 out of a circular area with the diameter of 6.5mm if the wiring of the heating areas 2 is adjusted; step three: drilling a hole in a circular area by adopting a drill bit with the diameter of 5.5mm, wherein the diameter of each heat dissipation hole 3 is 5.5mm, embedding copper particles 4 into the heat dissipation holes 3, slightly pushing the CS surface of the circuit board 1 with a chamfer end by hand, placing the board on thin adhesive paper, and knocking the board in by using an adhesive hammer; step four: the circuit board 1 embedded with the copper particles 4 is subjected to processes of deburring, copper melting, full-board electroplating and surface treatment of nickel and gold.
Testing the plate according to the conventional on-off condition, and determining the plate is qualified; embedding the plate into the copper particle area, observing longitudinal slices, enabling the copper particles to be matched and fastened with the hole wall, covering the periphery of the surface layer electroplated copper, and enabling the appearance to be normal; the plate simulates the reflow soldering process, and no abnormity occurs; the plate is delivered to a client for a part pasting trial, the real user feedback effect is good, and the tuning influence caused by the inferred local overheating does not occur any more.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (4)
1. The utility model provides an embedding copper grain heat dissipation circuit board mainly includes: circuit board (1) and district (2), louvre (3), copper grain (4) generate heat, its characterized in that: the circuit board (1) is formed by laminating four layers of boards, the heating area (2) is positioned on the circuit board (1), at least one heat dissipation hole (3) is formed in the heating area (2), and the copper particles (3) are embedded into the heat dissipation hole (3).
2. The circuit board of claim 1, wherein: the heat dissipation holes (3) are arranged at the center of the heating area (2), the heat dissipation holes (3) are located in a circular area with the diameter of 5.5mm, and the thickness of the heat dissipation holes (3) is 1.6 mm.
3. The circuit board of claim 2, wherein: the copper particles (4) are cylinders, the diameter of each copper particle (4) is 5.49mm, the thickness of each copper particle (4) is 1.55mm, and the edge of one side of each copper particle (4) is a chamfer of 0.3 mm.
4. A manufacturing process of a heat dissipation circuit board embedded with copper particles is characterized in that:
the method comprises the following steps: a brass bar with the length of 0.5m and the diameter of 6mm is selected, milling is carried out by adopting a precision machine tool, the brass bar is processed into a cylinder, the size of a copper particle (4) is 5.49mm in diameter and 1.55mm in thickness, and meanwhile, a chamfer with the thickness of 0.3mm is formed on one column side of the brass bar for the smooth embedding of the copper particle;
step two: laminating four layers of copper plates into a circuit board (1), checking local intermittent heating areas (2) on the circuit board (1), and moving the heating areas (2) out of a circular area with the diameter of 6.5mm if the wiring of the heating areas (2) is adjusted;
step three: drilling a hole in a circular area by adopting a drill bit with the diameter of 5.5mm, wherein the diameter of the heat dissipation hole (3) is 5.5mm, embedding copper particles (4) into the heat dissipation hole (3), lightly pushing the end with the chamfer into the CS surface of the circuit board (1) by hand, placing the board on thin adhesive packing paper, and knocking the board in by using an adhesive hammer;
step four: the circuit board (1) embedded with the copper particles (4) is subjected to processes of deburring, copper melting, full-board electroplating and surface treatment of nickel and gold.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019110302693 | 2019-10-28 | ||
| CN201911030269 | 2019-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111182710A true CN111182710A (en) | 2020-05-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911297612.0A Pending CN111182710A (en) | 2019-10-28 | 2019-12-17 | Copper particle embedded heat dissipation circuit board and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111182710A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2227076A1 (en) * | 2008-09-28 | 2010-09-08 | Huawei Technologies Co., Ltd. | Multilayer circuit board and production method thereof and communication device |
| CN103096638A (en) * | 2011-10-27 | 2013-05-08 | 北大方正集团有限公司 | Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof |
| CN104472022A (en) * | 2013-06-12 | 2015-03-25 | 名幸电子股份有限公司 | Manufacturing method for heat-dissipating substrate |
| CN104853523A (en) * | 2015-05-18 | 2015-08-19 | 惠州市金百泽电路科技有限公司 | Buried and embedded copper block PCB manufacturing method |
| CN105979720A (en) * | 2016-06-21 | 2016-09-28 | 合肥羿振电力设备有限公司 | Method for improving heat-conducting capability of printed board for surface mount device |
-
2019
- 2019-12-17 CN CN201911297612.0A patent/CN111182710A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2227076A1 (en) * | 2008-09-28 | 2010-09-08 | Huawei Technologies Co., Ltd. | Multilayer circuit board and production method thereof and communication device |
| CN103096638A (en) * | 2011-10-27 | 2013-05-08 | 北大方正集团有限公司 | Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof |
| CN104472022A (en) * | 2013-06-12 | 2015-03-25 | 名幸电子股份有限公司 | Manufacturing method for heat-dissipating substrate |
| CN104853523A (en) * | 2015-05-18 | 2015-08-19 | 惠州市金百泽电路科技有限公司 | Buried and embedded copper block PCB manufacturing method |
| CN105979720A (en) * | 2016-06-21 | 2016-09-28 | 合肥羿振电力设备有限公司 | Method for improving heat-conducting capability of printed board for surface mount device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200519 |
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| RJ01 | Rejection of invention patent application after publication |