CN105979720A - Method for improving heat-conducting capability of printed board for surface mount device - Google Patents
Method for improving heat-conducting capability of printed board for surface mount device Download PDFInfo
- Publication number
- CN105979720A CN105979720A CN201610452217.5A CN201610452217A CN105979720A CN 105979720 A CN105979720 A CN 105979720A CN 201610452217 A CN201610452217 A CN 201610452217A CN 105979720 A CN105979720 A CN 105979720A
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- China
- Prior art keywords
- heat
- printed board
- surface mount
- mount device
- conducting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a method for improving the heat-conducting capability of a printed board for a surface mount device and aims at providing an implementation method with guidance and operability for the disadvantages of a high working temperature, poor thermal reliability and the like caused by low heat-conducting property, a long heat-conducting path and high in thermal-conduction resistance of the heat-conducting printed board in the prior art. The method is implemented through the technical scheme as follows: firstly, the layout of plated-through holes and heat-conducting copper pins is determined according to the power consumption parameter range of the high-heat flux surface mount device; the heat-conducting path with replicability and expandability is built according to the determined assembly relationship among the surface mount device with a metal weld surface on the bottom surface, the printed boar and a metal box body; all heat-conducting through holes are sealed by a high-temperature resistant adhesive tape at the reverse surface positions of the heat-conducting through holes of the surface mount device on the printed board; and the heat-conducting copper pins are pressed into the corresponding heat-conducting through holes respectively and are welded. According to the method, the defect of low heat-conducting reliability of the heat-conducting path of the high-heat flux surface mount device under low pressure or vacuum is overcome.
Description
Technical field
The present invention, about the method improving the surface mount device printed board capacity of heat transmission, relates to surface mount device and prints
The high heat flux surface patch worked under plate, the design of conduction copper pin, process flow for assembling, especially low pressure, vacuum condition
Dress device electronic equipment.
Background technology
In spaceborne effective lotus product, the packing forms during high heat flux surface mount, it is mostly non-airtight knot
Structure, and it is in (10-6~10-7Pa) running in vacuum environment, face long-life highly reliable requirement, thermal design is the heaviest in development
Want one of content.Owing to heat radiation the most freely will cause that high heat flux surface mount device package case temperature is higher, thermal reliability
Difference, the air being simultaneously frequently utilized that in ground-based electronic equipment, work under the most inapplicable above-mentioned environment of various measures of heat loss through convection
High heat flux surface mount device electronic product, the most how to increase high heat flux surface mount device contact heat conductien
With Space Thermal radianting capacity, particularly contact heat conductien ability, shorten conducting path, reduce thermal-conduction resistance, improve thermal contact conductance
Become the key core problem of spaceborne electronic product.
The currently available technology spaceborne high heat flux typical mounting means of electronic product device mainly has three shown in Fig. 4
The situation of kind.
Shown in the first Fig. 4 a, the lead-out wire of components and parts 2 is directly welded in printed board 1, case surface not with printed board 1
Contact.
Components and parts 2, with installing journal stirrup 10, are fixed on cabinet with securing member 4 by components and parts 2 housing shown in the second Fig. 4 b
On housing 3.
Shown in the third Fig. 4 c, the lead-out wire 5 of components and parts 2 is directly welded in printed board 1, case surface and printed board 1 or
Cabinet housing 3 surface directly or indirectly contacts.
In above-mentioned three kinds of mounting means components and parts, install by component's feet pass thermal and device directly with metal shell or
Heat dissipating method and the measure of heat-conducting plate transmission of heat by contact are the most ripe, it is only necessary to add suitable heat conduction auxiliary packing i.e. at contact surface
Use requirement can be met.
In actual use, owing to printed board material is compared with metal material, its capacity of heat transmission poor (copper T2:
385.1W/m DEG C, aluminium alloy 2A12:121.4 W/m DEG C, epoxy resin bonded fiber FR4:(0.3 ~ 0.4) W/m DEG C), and
Printed board material mostly is anisotropic characteristic, and heat conductivity of printed circuit board can be low, causes path length, thermal conduction resistance to cause greatly high hot-fluid
The defect that density surface mount device thermal reliability is low.Although copper rate can be covered by changing printing board surface, increases ground plane
The methods such as area, volume can improve printed board lateral thermal conductivity energy, but the heat conductivility of the printed board face of being perpendicular to electronic device,
But owing to metallization cross-sectional area is less, the surface mount device case temperature that printed board thermal conduction resistance causes more greatly is higher, should
Heat conductivility is promoted limited by measure.
How to be effectively improved the Surface mount technology PCB capacity of heat transmission, it is ensured that the heat consumption of device is by the shortest heat dissipation path
Heat conduction is transmitted, and technically in the urgent need to studying in terms of realizing two from structure design and technique, determines a kind of simple possible
Method and approach, be solve surface mount device thermal reliability technical barrier.
Summary of the invention
It is an object of the invention to for above-mentioned prior art thermal conduction printed circuit boards heat conductivility low, thermally conductive pathways length, heat conduction heat
Resistance is big, causes the weak points such as device shell temperature is higher, thermal reliability is poor, proposes one and has theoretical direction, operable
The design and processes implementation method that property is strong, to solve high heat flux surface mount device heat conduction road under low pressure or vacuum condition
The defect that footpath heat radiation reliability is low.
In order to realize the above-mentioned purpose of the present invention, a kind of raising surface mount device printed board heat conduction energy that the present invention provides
The method of power, it is characterised in that comprise the following steps:
(1) first according to the encapsulation shape of high heat flux surface mount device and the contact surface geomery of printed board and power consumption
Parameter area, determines plated through-hole, the layout of conduction copper pin；
(2) according to the ground determined with the fit assembly relation of the surface mount device of metal welding junction, printed board and metal,
Set up the thermally conductive pathways with reproducibility and extensibility, then in the reverse side position of printing board surface Mount Device heat conduction through hole
Put, all of heat conduction through hole adhesive tape is sealed；
(3) flush with printed board installed surface in then ready conduction copper pin is respectively pressed into the heat conduction through hole of correspondence, retell
Weld together with conduction copper pin bottom above-mentioned surface mount device, finally the High temperature-resistanadhesive adhesive tape at the printed board back side is removed, inspection
Look into the flatness that printed board is installed.
The present invention has the advantages that compared to prior art.
First the present invention encapsulation shape according to high heat flux surface mount device and the contact surface shape chi of printed board
Very little and area, printed board thickness and power consumption parameter scope, determine plated through-hole, the layout of conduction copper pin, by determining plated through-hole
Layout and size, the design requirement of conduction copper pin, can be simplified the design of different surfaces Mount Device printed board, be printed by raising
The making sheet capacity of heat transmission can be effectively improved the heat dissipation characteristics of surface mount device, it is achieved the printed board capacity of heat transmission promotes.Secondly set up
Relevant design require there is reproducibility and extensibility, it is simple to design experiences and knowledge accumulation；It it is thirdly the group of definition
Dress flow process, process and related process parameters require as ensureing that relevant design requires to establish good Project Realization basis, its
It is main sinking path by heat conduction and heat radiation, by optimizing and improve Article 1 heat dissipation path length, reducing thermal conduction resistance to this
The improvement of class device heat dissipating state is better substantially.Meet in practical engineering application relevant surfaces Mount Device in vacuum environment
Middle heat conduction and heat radiation demand.
The present invention is by actual test after emulation and assembling in kind, and measure effect is obvious.Formed thermal conduction printed circuit boards design,
The design of conduction copper pin and printed board Denso fill joined process flow, may be used for improving similar device heat conduction in aviation and ground installation
Problem.The present invention compensate for prior art and causes greatly high heat flux surface mount device due to thermally conductive pathways length, thermal conduction resistance
The defect that thermal reliability is low, can meet the need that high heat flux surface mount device dispels the heat quickly through printed board high-efficiency heat conduction
Ask, boost device thermal reliability.To the highly reliable use of high heat flux surface mount device in spaceborne payload electronic product
Provide effective way and guide for method.
Accompanying drawing explanation
Further illustrate the present invention below in conjunction with the accompanying drawings with enforcement, but be not therefore to limit the present invention to described reality
Among example scope.
Fig. 1 shows and is installed on bottom belt heat dissipation metal boss high heat flux Surface Mount Component printed board typical case in fact
Execute example partial schematic diagram.
Fig. 2 shows the process route flow chart of the inventive method.
Fig. 3 is high heat flux Surface Mount Component printed board components and parts exemplary embodiments schematic diagram.
Fig. 4 shows three kinds of mounting means of the typical components and parts of prior art.
In figure: 1 printed board, 2 components and parts, 3 cabinet housings, 4 securing members, 5 lead-out wires, 6 conduction copper pins, 7 radiation paths, 8
Thermally conductive pathways, 9 plated through-holes, 10 install journal stirrup.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is embodied as step and is described in further detail.
When utilizing the method to be designed, should first lead according to the assembly relation of device, printed board and metal case
Hot path optimizes, and determines the device that device is surface soldered attachment, and its thermally conductive pathways is identical with the situation of path 8 shown in Fig. 1 or class
Seemingly.When can be effectively improved the heat dissipation characteristics during surface mount by improving the printed board capacity of heat transmission, the method could be utilized.
Refering to Fig. 1 ~ Fig. 3. Fig. 1 shows that high heat flux surface mount device 2 is installed on bottom belt heat dissipation metal boss,
Can realize belonging to the third mounting means with the surface mount device of printed board 1 ground connection coating welding by SMT technique, its components and parts
2, cabinet housing 3 case surface contacts with printed board 1, the heat dissipation hot path of components and parts 2, and one is by lead-out wire 5 and to connect
Contacting surface conductive printed plate 1, through printed board 1 heat conduction and the thermal contact conductance of cabinet housing 3, is reached heat by thermally conductive pathways 8
Cabinet housing 3；Another is by the radiation path 7 of components and parts 2 other object radiations around components and parts 2.(1) according to this
Bright method, the implementation implementing path should determine that high heat flux surface mount device in spaceborne payload product
Packing forms and function consumption parameter area；(2) according to the encapsulation shape of device and soldering of printed boards face size and print thickness of slab
Degree, determines printed board heat-conducting metal hole arrangement, size and the design principle requirement of conduction copper pin size；(3) paste according to surface
The assembled relation of dress device, definition assembling flow path, process and parameter request, complete the dress of surface mount device and printed board
Join.Design concrete steps include: 1 determines that device must be the ground surface mount device with metal welding junction, such as DDS, VCO
And amplifier etc..Simultaneously according to spaceborne product device, its power consumption is medium power consumption (0.1W ~ 0.3W) and big power consumption (>=0.3W)
Device.As long as 2 analysis device heat consumptions pass to metal shell, by carrying by thermally conductive pathways 8 mode by underrun printed board
The high printed board capacity of heat transmission can be effectively improved device workpiece thermal environment.3 according to the ground of device weld metal covering layout and
Size, optimizes design and determines the printed board metallization size of thermal hole, quantity and distribution, determine conduction copper according to printed board thickness
The size of pin and plated surface are coated with gold-plated or silver-plated.Wherein plated-through hole 9 heat conduction through-hole rate is within the scope of 5% ~ 15%, effect ratio
Better.
Refering to Fig. 2, Fig. 3. first according to encapsulation shape and the contact surface of printed board of high heat flux surface mount device
Geomery and area, printed board thickness and consumption parameter area, determine plated through-hole, the layout of conduction copper pin；Lead to according to heat conduction
The aperture in hole and the thickness of slab of printed board, the supporting copper post matched with printed board.Complete corresponding printed board and conduction copper post
After design, processing, use rationally effective process to carry out dress connection, be to ensure that the method marking basis that normally plays a role is protected
Card.According to the ground determined with surface mount device, printed board 1 and the assembly relation of metal case of metal welding machine side, build
The vertical thermally conductive pathways with reproducibility and extensibility, then in the fermentation position of printed board 1 surface mount device heat conduction through hole 9
Put, all of heat conduction through hole 9 3M High temperature-resistanadhesive adhesive tape is sealed；Printed board is lain on metal platform, will prepare with tweezers
Good conduction copper pin 6 flushes with printed board 1 installed surface in being respectively pressed into the heat conduction through hole 9 of correspondence, it is ensured that the copper post put into and print
Making sheet installed surface flushes.Weld together with conduction copper pin 6 bottom by above-mentioned surface mount device.Pass through at printed board end face
Silk-screen smears soldering paste, to labeling device according to device and selected solder welding requirements, uses typical case's SMT technological process to weld
?；In welding process, the soldering paste of fusing relies on the mobility of self just can fill up copper post and printed board plated-through hole
Gap, part bottom device welds together with copper post, completes device and printed board assembly work.Finally printed board 1 is carried on the back
The 3M High temperature-resistanadhesive adhesive tape in face is removed, and checks the flatness of printed board installed surface.Can realize improving surface mount device by print
The purpose of design of the making sheet capacity of heat transmission.
Refering to Fig. 3. in order to be more clearly understood that this invention, below in conjunction with Fig. 3, the design of printed board and conduction copper post is entered
Line description.
First this surface mount device is DDS chip, and its packing forms is bottom square pad radiating surface, according to its heat
Consumption and solder side size, make 16 × φ 0.9 plated through-hole on printed board ground plane.Via area rate reaches 7.1%.Secondly root
It is coated with according to printing board surface plating, designs conduction copper pin, use electroplate to process.
Claims (5)
1. the method improving the surface mount device printed board capacity of heat transmission, it is characterised in that comprise the following steps:
(1) first according to the encapsulation shape of high heat flux surface mount device and the contact surface geomery of printed board and power consumption
Parameter area, determines plated through-hole, the layout of conduction copper pin；
(2) according to the ground determined with the fit assembly relation of the surface mount device of metal welding junction, printed board and metal,
Set up the thermally conductive pathways with reproducibility and extensibility, then in the reverse side position of printing board surface Mount Device heat conduction through hole
Put, all of heat conduction through hole adhesive tape is sealed；
(3) flush with printed board installed surface in then ready conduction copper pin is respectively pressed into the heat conduction through hole of correspondence, retell
Weld together with conduction copper pin bottom above-mentioned surface mount device, finally the High temperature-resistanadhesive adhesive tape at the printed board back side is removed, inspection
Look into the flatness that printed board is installed.
2. the method improving the surface mount device printed board capacity of heat transmission as described in claim 1, it is characterised in that components and parts
(2), cabinet housing (3) case surface contact with printed board (1), the heat dissipation hot path of components and parts (2), one be by draw
Line (5) and contact surface conductive printed plate (1), through printed board (1) heat conduction and the thermal contact conductance of cabinet housing (3), pass through heat conduction
Heat is reached cabinet housing (3) by path (8)；Another is that the radiation path (7) by components and parts (2) is around components and parts 2
Other object radiations.
3. the method improving the surface mount device printed board capacity of heat transmission as described in claim 1, it is characterised in that in welding
During, the soldering paste of fusing relies on the mobility of self to fill up the gap of conduction copper pin (6) and printed board plated-through hole (9),
Bottom device is welded together with conduction copper pin (6), printed board (1), completes device and printed board assembly work.
4. the method improving the surface mount device printed board capacity of heat transmission as described in claim 1, it is characterised in that very according to print
Making sheet (1) thickness determines the size of conduction copper pin 6, and plated surface is coated with gold-plated or silver-plated.
5. the method improving the surface mount device printed board capacity of heat transmission as described in claim 1, it is characterised in that metallization
The heat conduction through-hole rate of through hole (9) is within the scope of 5% ~ 30%；
See accompanying drawing: Fig. 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610452217.5A CN105979720A (en) | 2016-06-21 | 2016-06-21 | Method for improving heat-conducting capability of printed board for surface mount device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610452217.5A CN105979720A (en) | 2016-06-21 | 2016-06-21 | Method for improving heat-conducting capability of printed board for surface mount device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105979720A true CN105979720A (en) | 2016-09-28 |
Family
ID=57021534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610452217.5A Withdrawn CN105979720A (en) | 2016-06-21 | 2016-06-21 | Method for improving heat-conducting capability of printed board for surface mount device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105979720A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182710A (en) * | 2019-10-28 | 2020-05-19 | 汕头凯星印制板有限公司 | Copper particle embedded heat dissipation circuit board and manufacturing process thereof |
| CN114615830A (en) * | 2022-02-18 | 2022-06-10 | 江门崇达电路技术有限公司 | Method for improving copper block embedded circuit board stitching glue overflow |
-
2016
- 2016-06-21 CN CN201610452217.5A patent/CN105979720A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182710A (en) * | 2019-10-28 | 2020-05-19 | 汕头凯星印制板有限公司 | Copper particle embedded heat dissipation circuit board and manufacturing process thereof |
| CN114615830A (en) * | 2022-02-18 | 2022-06-10 | 江门崇达电路技术有限公司 | Method for improving copper block embedded circuit board stitching glue overflow |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160928 |
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| WW01 | Invention patent application withdrawn after publication |