CN104883812A - Method for improving thermal conduction capacity of printed board of surface-mount device - Google Patents
Method for improving thermal conduction capacity of printed board of surface-mount device Download PDFInfo
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- CN104883812A CN104883812A CN201510293339.XA CN201510293339A CN104883812A CN 104883812 A CN104883812 A CN 104883812A CN 201510293339 A CN201510293339 A CN 201510293339A CN 104883812 A CN104883812 A CN 104883812A
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- Prior art keywords
- printed board
- mount device
- thermal conduction
- heat
- surface mount
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Abstract
The invention provides a method for improving the thermal conduction capacity of a printed board of a surface-mount device, and aims to provide an instructive and operable realization method for overcoming the defects of a thermal conduction printed board in the prior art such as low thermal conductivity, long thermal conduction path, large thermal conduction resistance, high working temperature and low thermal reliability. The method is realized through the following technical scheme: first, the layout of plated through holes and thermal conduction copper pins is determined according to the power consumption parameter range of a high-heat-flux surface-mount device; a replicable and scalable thermal conduction path is established according to the determined assembly relationship among the surface-mount device with a metal welding surface on the bottom surface, a printed board and a metal box; then, all thermal conduction through holes are sealed by adhesive tapes resistant to high temperature in the opposite positions of the thermal conduction through holes of the surface-mount device on the surface of the printed board; and the thermal conduction copper pins are respectively pressed and welded into the corresponding thermal conduction through holes. The problems existing in a high-heat-flux surface-mount device in a low-pressure or vacuum environment such as long thermal conduction path and low thermal conduction reliability are solved.
Description
Technical field
The present invention is about the method improving the surface mount device printed board capacity of heat transmission, relate to surface mount device printed board, the design of conduction copper pin, process flow for assembling, especially the high heat flux surface mount device electronic equipment of low pressure, operate under vacuum conditions.
Background technology
In spaceborne effective lotus product, the packing forms during high heat flux surface mount, is mostly non-airtight structure, and is in (10
-6~ 10
-7pa) vacuum environment is run, face long-life highly reliable requirement, thermal design is very one of important content in development.Because heat radiation freely will not cause that high heat flux surface mount device package case temperature is higher, thermal reliability is poor, the air simultaneously often utilized in ground-based electronic equipment, the high heat flux surface mount device electronic product worked under all inapplicable above-mentioned environment of various measures of heat loss through convection, therefore high heat flux surface mount device contact heat conductien and Space Thermal radianting capacity how is increased, particularly contact heat conductien ability, shorten conducting path, reduce thermal-conduction resistance, improve the key core problem that thermal contact conductance becomes spaceborne electronic product.
The typical mounting means of currently available technology spaceborne high heat flux electronic product device mainly contains kind of the situation of three shown in Fig. 4.
Shown in the first Fig. 4 a, the lead-out wire of components and parts 2 is directly welded in printed board 1, and case surface does not contact with printed board 1.
Components and parts 2, with installation journal stirrup 10, are fixed on cabinet housing 3 with securing member 4 by components and parts 2 housing shown in the second Fig. 4 b.
Shown in the third Fig. 4 c, the lead-out wire 5 of components and parts 2 is directly welded in printed board 1, and case surface directly or indirectly contacts with printed board 1 or cabinet housing 3 surface.
In above-mentioned three kinds of mounting means components and parts, by component's feet install pass thermal and device directly with the heat dissipating method of metal shell or heat-conducting plate transmission of heat by contact and measure ripe, only needing to add suitable heat conduction auxiliary packing at contact-making surface can meet instructions for use.
In actual use, because printed board material is compared with metal material, its capacity of heat transmission poor (copper T2:385.1W/m DEG C, aluminium alloy 2A12:121.4 W/m DEG C, epoxy resin bonded fiber FR4:(0.3 ~ 0.4) W/m DEG C), and printed board material mostly is anisotropic characteristic, heat conductivity of printed circuit board can be low, causes path length, thermal conduction resistance to cause greatly the defect that high heat flux surface mount device thermal reliability is low.Although copper rate can be covered, increases the methods such as ground plane area by changing printing board surface, volume can improve printed board lateral thermal conductivity energy, but the heat conductivility of the printed board face of being perpendicular to electronic device, but because metallization cross-sectional area is less, the surface mount device case temperature that printed board thermal conduction resistance causes more greatly is higher, and this measure promotes limited to heat conductivility.
How effectively to improve the Surface mount technology PCB capacity of heat transmission, ensure that the hear rate of device is transmitted by as far as possible short heat dissipation path heat conduction, technically study in the urgent need to realizing two aspects from structural design and technique, determining a kind of method and approach of simple possible, is the technical barrier solving surface mount device thermal reliability.
Summary of the invention
The object of the invention is for above-mentioned prior art thermal conduction printed circuit boards heat conductivility low, thermally conductive pathways is long, thermal conduction resistance is large, cause the weak points such as device shell temperature is higher, thermal reliability is poor, propose a kind of to there is theoretical direction, workable design and processes implementation method, to solve the low defect of high heat flux surface mount device thermally conductive pathways heat radiation reliability under low pressure or vacuum condition.
In order to realize above-mentioned purpose of the present invention, a kind of method improving the surface mount device printed board capacity of heat transmission provided by the invention, is characterized in that comprising the following steps:
(1) first according to the encapsulation shape of high heat flux surface mount device and the contact-making surface geomery of printed board and power consumption parameter scope, the layout of plated-through hole, conduction copper pin is determined;
(2) according to the assembly relation of the ground determined with the surface mount device of metal welding junction, printed board and metal zoarium, set up the thermally conductive pathways with reproducibility and extensibility, then in the reverse side position of printing board surface Mount Device heat conduction through hole, all heat conduction through hole adhesive tapes are sealed;
(3) then ready conduction copper pin is pressed into respectively in corresponding heat conduction through hole and flushes with printed board installed surface, retell bottom above-mentioned surface mount device and weld together with conduction copper pin, finally the High temperature-resistanadhesive adhesive tape at the printed board back side is removed, check the evenness that printed board is installed.
The present invention has following beneficial effect compared to prior art.
First the present invention is according to the encapsulation shape of high heat flux surface mount device and the contact-making surface geomery of printed board and area, printed board thickness and power consumption parameter scope, determine the layout of plated-through hole, conduction copper pin, by determining plated-through hole layout and size, the designing requirement of conduction copper pin, the design of different surfaces Mount Device printed board can be simplified, effectively can improve the heat dissipation characteristics of surface mount device by improving the printed board capacity of heat transmission, realizing the printed board capacity of heat transmission and promoting.Secondly the relevant design set up requires to have reproducibility and extensibility, is convenient to design experiences and knowledge accumulation; Thirdly that the assembling flow path of definition, process and related process parameters require as ensureing that relevant design requires to establish good Project Realization basis, it is main sinking path by heat conduction and heat radiation, by optimize and improve Article 1 heat dissipation path length, reducing thermal conduction resistance, to improve effect to such device heat dissipating state more obviously good.Meet relevant surfaces Mount Device heat conduction and heat radiation demand in vacuum environment in practical engineering application.
The present invention is by actual test after emulation and assembling in kind, and measure effect is obvious.The thermal conduction printed circuit boards design formed, the design of conduction copper pin and printed board Denso dress joined process flow, may be used for improving similar device Heat Conduction Problems in aviation and ground installation.The present invention compensate for prior art because thermally conductive pathways is long, thermal conduction resistance causes greatly the defect that high heat flux surface mount device thermal reliability is low, the demand that high heat flux surface mount device dispels the heat quickly through printed board high-efficiency heat conduction can be met, boost device thermal reliability.Effective way and guide for method are provided to the highly reliable use of high heat flux surface mount device in spaceborne payload electronic product.
Accompanying drawing explanation
Further illustrate the present invention below in conjunction with accompanying drawing and enforcement, but be not therefore limit the present invention among described example ranges.
Fig. 1 shows and is installed on bottom belt heat dissipation metal boss high heat flux Surface Mount Component, printed board exemplary embodiments partial schematic diagram.
Fig. 2 shows the process route flow chart of the inventive method.
Fig. 3 is high heat flux Surface Mount Component, printed board components and parts exemplary embodiments schematic diagram.
Fig. 4 shows three kinds of mounting meanss of the typical components and parts of prior art.
In figure: 1 printed board, 2 components and parts, 3 cabinet housings, 4 securing members, 5 lead-out wires, 6 conduction copper pins, 7 radiation paths, 8 thermally conductive pathways, 9 plated-through holes, 10 install journal stirrup.
Embodiment
Below in conjunction with accompanying drawing, specific embodiment of the invention step is described in further detail.
When utilizing the method to design, first should carry out thermally conductive pathways optimization according to the assembly relation of device, printed board and metal case, determining device is the device of surface soldered attachment, and the situation of path 8 shown in its thermally conductive pathways with Fig. 1 is identical or similar.During by heat dissipation characteristics during improving the printed board capacity of heat transmission and effectively can improving surface mount, the method could be utilized.
Consulting Fig. 1 ~ Fig. 3. Fig. 1 shows high heat flux surface mount device 2 and is installed on bottom belt heat dissipation metal boss, realize belonging to the third mounting means with the surface mount device of printed board 1 ground connection coating welding by SMT technique, its components and parts 2, cabinet housing 3 case surface contact with printed board 1, the heat dissipation hot path of components and parts 2, article one, be by lead-out wire 5 and contact-making surface conductive printed plate 1, through printed board 1 heat conduction, with the thermal contact conductance of cabinet housing 3, by thermally conductive pathways 8, heat is reached cabinet housing 3; Another is to other object radiations around components and parts 2 by the radiation path 7 of components and parts 2.(1) according to the inventive method, the implementation in specific implementation path should determine packing forms and the function consumption parameter area of high heat flux surface mount device in spaceborne payload product; (2) according to device encapsulation shape, with soldering of printed boards face size and printed board thickness, determine the design principle requirement of printed board heat-conducting metal hole arrangement, size and conduction copper pin size; (3) according to the assembled relation of surface mount device, definition assembling flow path, process and parameter request, complete the assembling of surface mount device and printed board.Design concrete steps comprise: 1 determining device must be the surface mount device of ground with metal welding junction, as DDS, VCO and amplifier etc.Simultaneously according to spaceborne product device, its power consumption is medium power consumption (0.1W ~ 0.3W) and large power consumption (>=0.3W) device.As long as 2 analysis device hear rates pass to metal shell by thermally conductive pathways 8 mode by underrun printed board, device workpiece thermal environment effectively can be improved by improving the printed board capacity of heat transmission.3 according to the layout in the weld metal face, ground of device and size, the size of optimal design determination printed board metallization thermal hole, quantity and distribution, is coated with gold-plated or silver-plated according to the size of printed board thickness determination conduction copper pin and plated surface.Wherein plated-through hole 9 heat conduction through-hole rate is within 5% ~ 15% scope, and effectiveness comparison is good.
Consult Fig. 2, Fig. 3. first according to the encapsulation shape of high heat flux surface mount device and the contact-making surface geomery of printed board and area, printed board thickness and consume parameter area, determine the layout of plated-through hole, conduction copper pin; According to the aperture of heat conduction through hole and the thickness of slab of printed board, the supporting copper post matched with printed board.After completing the design of corresponding printed board and conduction copper post, processing, adopting rationally effective process to carry out dress connection, is that guarantee the method normally plays a role marking basic guarantee.According to the assembly relation of the ground determined with the surface mount device of metal welding machine side, printed board 1 and metal case, set up the thermally conductive pathways with reproducibility and extensibility, then in the fermentation position of printed board 1 surface mount device heat conduction through hole 9, all heat conduction through holes 9 are sealed by 3M High temperature-resistanadhesive adhesive tape; Printed board lain on metal platform, to be pressed into respectively by ready conduction copper pin 6 in corresponding heat conduction through hole 9 with tweezers and to flush with printed board 1 installed surface, the copper post that guarantee is put into flushes with printed board installed surface.Welding together bottom above-mentioned surface mount device with conduction copper pin 6.Smear soldering paste at printed board end face by silk-screen, to labeling device according to device and selected solder welding requirements, adopt typical SMT technological process to carry out welding; In welding process, the soldering paste of fusing relies on the mobility of self just can fill up the gap of copper post and printed board plated-through hole, and part bottom device and copper post weld together, and complete device and printed board assembly work.Finally the 3M High temperature-resistanadhesive adhesive tape at printed board 1 back side is removed, check the evenness of printed board installed surface.Can realize improving the purpose of design of surface mount device by the printed board capacity of heat transmission.
Consult Fig. 3. in order to more clearly understand this invention, below in conjunction with Fig. 3, the design of printed board and conduction copper post is described.
First this surface mount device is DDS chip, and its packing forms is bottom square pad radiating surface, according to its hear rate and solder side size, printed board ground plane makes 16 × φ 0.9 plated-through hole.Via area rate reaches 7.1%.Secondly be coated with according to printing board surface plating, design conduction copper pin, adopts electroplate process.
Claims (5)
1. improve the method for the surface mount device printed board capacity of heat transmission, it is characterized in that comprising the following steps:
(1) first according to the encapsulation shape of high heat flux surface mount device and the contact-making surface geomery of printed board and power consumption parameter scope, the layout of plated-through hole, conduction copper pin is determined;
(2) according to the assembly relation of the ground determined with the surface mount device of metal welding junction, printed board and metal zoarium, set up the thermally conductive pathways with reproducibility and extensibility, then in the reverse side position of printing board surface Mount Device heat conduction through hole, all heat conduction through hole adhesive tapes are sealed;
(3) then ready conduction copper pin is pressed into respectively in corresponding heat conduction through hole and flushes with printed board installed surface, retell bottom above-mentioned surface mount device and weld together with conduction copper pin, finally the High temperature-resistanadhesive adhesive tape at the printed board back side is removed, check the evenness that printed board is installed.
2. by the method for the raising surface mount device printed board capacity of heat transmission according to claim 1, it is characterized in that, components and parts (2), cabinet housing (3) case surface contact with printed board (1), the heat dissipation hot path of components and parts (2), article one, be by lead-out wire (5) and contact-making surface conductive printed plate (1), through printed board (1) heat conduction, with the thermal contact conductance of cabinet housing (3), by thermally conductive pathways (8), heat is reached cabinet housing (3); Another is to other object radiations around components and parts 2 by the radiation path (7) of components and parts (2).
3. by the method for the raising surface mount device printed board capacity of heat transmission according to claim 1, it is characterized in that, in welding process, the soldering paste of fusing relies on the mobility of self to fill up the gap of conduction copper pin (6) and printed board plated-through hole (9), bottom device and conduction copper pin (6), printed board (1) are welded together, completes device and printed board assembly work.
4. by the method for the raising surface mount device printed board capacity of heat transmission according to claim 1, it is characterized in that, very according to the size of printed board (1) thickness determination conduction copper pin 6, plated surface is coated with gold-plated or silver-plated.
5., by the method for the raising surface mount device printed board capacity of heat transmission according to claim 1, it is characterized in that, the heat conduction through-hole rate of plated-through hole (9) is within 5% ~ 30% scope; See accompanying drawing: Fig. 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510293339.XA CN104883812A (en) | 2015-06-01 | 2015-06-01 | Method for improving thermal conduction capacity of printed board of surface-mount device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510293339.XA CN104883812A (en) | 2015-06-01 | 2015-06-01 | Method for improving thermal conduction capacity of printed board of surface-mount device |
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| CN104883812A true CN104883812A (en) | 2015-09-02 |
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|---|---|---|---|
| CN201510293339.XA Pending CN104883812A (en) | 2015-06-01 | 2015-06-01 | Method for improving thermal conduction capacity of printed board of surface-mount device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101618A (en) * | 2015-07-23 | 2015-11-25 | 合肥扬帆通信元器件有限公司 | Method for improving heat conduction capability of surface-mounted device printed board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5375039A (en) * | 1992-09-29 | 1994-12-20 | Robert Bosch Gmbh | Circuit board heat dissipation layering arrangement |
| US20040037044A1 (en) * | 2002-08-21 | 2004-02-26 | Alexander Cook | Heat sink for surface mounted power devices |
| CN101240435A (en) * | 2008-03-06 | 2008-08-13 | 复旦大学 | Plating self-welding method for three-dimensional micro-electrode array |
| CN103179781A (en) * | 2013-01-06 | 2013-06-26 | 中国电子科技集团公司第十研究所 | Method for improving thermal conduction capability of printed board of surface-mounted device |
| CN105101613A (en) * | 2014-11-19 | 2015-11-25 | 芜湖蓝宙电子科技有限公司 | Method for improving heat conduction capability of printed board of surface-mounted device |
-
2015
- 2015-06-01 CN CN201510293339.XA patent/CN104883812A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5375039A (en) * | 1992-09-29 | 1994-12-20 | Robert Bosch Gmbh | Circuit board heat dissipation layering arrangement |
| US20040037044A1 (en) * | 2002-08-21 | 2004-02-26 | Alexander Cook | Heat sink for surface mounted power devices |
| CN101240435A (en) * | 2008-03-06 | 2008-08-13 | 复旦大学 | Plating self-welding method for three-dimensional micro-electrode array |
| CN103179781A (en) * | 2013-01-06 | 2013-06-26 | 中国电子科技集团公司第十研究所 | Method for improving thermal conduction capability of printed board of surface-mounted device |
| CN105101613A (en) * | 2014-11-19 | 2015-11-25 | 芜湖蓝宙电子科技有限公司 | Method for improving heat conduction capability of printed board of surface-mounted device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101618A (en) * | 2015-07-23 | 2015-11-25 | 合肥扬帆通信元器件有限公司 | Method for improving heat conduction capability of surface-mounted device printed board |
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Application publication date: 20150902 |
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