CN210491303U

CN210491303U - Heat radiator

Info

Publication number: CN210491303U
Application number: CN201921023976.5U
Authority: CN
Inventors: 高江平
Original assignee: Shenzhen Heineng Technology Co Ltd
Current assignee: Shenzhen Heineng Technology Co Ltd
Priority date: 2019-07-03
Filing date: 2019-07-03
Publication date: 2020-05-08
Anticipated expiration: 2029-07-03

Abstract

The utility model discloses a heat dissipation device, which comprises a PCB (printed circuit board), an electronic device and a heat radiator, wherein a welding position is arranged on the PCB, and a pin or a welding disc of the electronic device is welded on a first welding position and is connected to the surface of the PCB; the radiator is fixed on the second welding position and connected to the surface of the PCB; the soldering sites are connected by metal wiring layers on the PCB. The utility model discloses simple structure uses SMT technology easily to realize automatic equipment, and great promotion production efficiency can realize automatic installation. The utility model discloses utilize the metal wiring layer on the PCB as heat-conducting medium, conduct the radiator to the heat on the electron device to dispel the heat away through the radiator, thereby avoid traditional radiator need with the restriction that the electron device contact caused, gain better effect.

Description

Heat radiator

Technical Field

The utility model relates to an electronic product heat dissipation technical field, in particular to heat abstractor.

Background

When the printed circuit on the Printed Circuit Board (PCB) and the electronic devices thereon work, heat is generated, which leads to temperature rise, and heat dissipation measures are required for parts and electronic devices that generate heat seriously or at high temperature. A common heat dissipation method is to add a heat sink to a part or device to be dissipated, and to help dissipate heat by the contact between the heat sink and a heat generating part or device. However, for some heating electronic devices and parts with smaller structural size or irregular appearance structure, the heat sink is difficult to ensure good contact with the heating part and is difficult to mount and fix, and even if the heat sink can be used normally, the mounting efficiency is low, and it is difficult to realize automatic production.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a simple structure, simple to operate can realize the heat abstractor of the small-size electronic device and the irregular electronic device and the position that generates heat of automatic installation.

In order to solve the technical problem, the utility model discloses a technical scheme does:

a heat dissipation device is arranged on a PCB and comprises the PCB, an electronic device and a heat radiator, wherein a metal circuit layer, a first welding position and a second welding position are arranged on the PCB; the electronic device is provided with a pin or a welding disc, is fixed on the first welding position and is connected to the surface of the PCB; the radiator is fixed on the second welding position and connected to the surface of the PCB; the first welding position and the second welding position are connected through one or more branch lines on the metal line layer.

Preferably, the heat sink and the electronic device are connected through a branch line on the PCB.

Preferably, at least one of the first welding position and the second welding position is provided.

Preferably, the metal circuit layer is a heat conducting material, and a copper circuit layer is preferred.

Preferably, the thickness of the metal line layer between the first welding position and the second welding position is greater than or equal to 0.017mm, preferably 0.035mm or 0.07 mm.

Preferably, the heat sink has a soldering surface for connecting with a soldering site on the PCB.

Preferably, the soldering surface on the heat sink can be coated with solder paste.

Preferably, the radiator and the PCB are fixedly connected through solder paste, and the connecting part is a second welding position on the PCB.

Preferably, the heat sink is made of a highly thermally conductive material, preferably copper and aluminum.

Preferably, the heat sink is mounted to the PCB board using Surface Mount Technology (SMT).

The beneficial effects of the utility model reside in that:

the utility model discloses heat abstractor simple structure easily assembles, uses SMT technology easily to realize automatic equipment, great promotion production efficiency and with low costs. The utility model discloses utilize the metal wiring layer on the PCB as heat-conducting medium, conduct the radiator to the heat on the electron device to dispel the heat away through the radiator, thereby avoid traditional radiator need with the restriction that the electron device contact caused, radiator among the novel heat abstractor does not have extra installation technology structure (like the screw hole) and accessory (like the screw), processing is simple.

Drawings

Fig. 1 is a schematic structural view of an embodiment of a heat dissipation device of the present invention;

fig. 2 is a schematic structural view of a PCB board in an embodiment of the heat dissipation device of the present invention;

fig. 3 is a schematic structural diagram of a heat sink in an embodiment of the heat dissipation apparatus of the present invention.

In the figure, 1-PCB, 11-first soldering position, 12-copper-attached circuit, 13-second soldering position,

2-electronic device, 3-heat sink, 31 bonding surface on heat sink.

Detailed Description

The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

As shown in fig. 1 and fig. 2, in a preferred embodiment of the present invention, a heat dissipation device for a printed circuit board and an electronic device thereon includes a printed circuit board 1, an electronic device 2, and a heat sink 3, wherein the electronic device 2 is soldered on a first soldering position 11, and a soldering material is fixed on a surface of the PCB board 1 by using solder paste; the radiator 3 is welded on the second welding position 13, and the welding material is fixed on the surface of the PCB 1 by using solder paste; the first welding position 11 and the second welding position 13 are connected through a copper-attached circuit 12 on the PCB 1, and the copper-attached circuit 12 is a branch circuit on a copper circuit layer on the PCB 1.

The utility model discloses in the preferred embodiment, radiator and PCB board use the tin cream to connect fixedly, and the connection position is the second welding position on the PCB board.

Specifically, in this embodiment, after the electronic device 2 and the heat sink 3 are soldered on the PCB board 1, a complete heat conduction path is formed: the electronic device 2 generates heat, the heat is conducted to a welding position 13 (filled with solder paste) of the PCB and the radiator through a copper-attached circuit 12 through a welding position 11 (filled with solder paste) of the electronic device and the PCB, then conducted to the radiator 3, and finally radiated to the air through the radiator.

Specifically, in this embodiment, the PCB is a printed circuit board.

As shown in fig. 2, in a preferred embodiment of the present invention, the heat sink and the electronic device are connected by a metal branch circuit on the PCB.

Specifically, in this embodiment, the PCB 1 has a first soldering location 11 and a second soldering location 13, the first soldering location 11 and the second soldering location 13 are connected by a copper-attached line 12, and the copper-attached line 12 is a branch line on a copper-attached line layer on the PCB 1; the thickness of the copper-clad wire 12 affects the heat transfer effect, and the thicker the copper-clad wire, the better the heat transfer effect, so the thickness of the copper-clad wire layer here cannot be too thin, and the common processing specification of the PCB is considered, and the specification of 0.035mm or 0.07mm is preferred.

As shown in fig. 3, in the preferred embodiment of the present invention, the heat sink is made of high thermal conductive material, preferably copper and aluminum are specific, in this embodiment, the heat sink 3 is copper or aluminum, the heat sink 3 has a soldering surface 31, the soldering surface 31 can be solder paste, the heat sink 3 is soldered to the PCB board 1 through solder paste, and the soldering portion is the second soldering portion 13 on the PCB board.

In a preferred embodiment of the present invention, the heat sink is mounted to the PCB using Surface Mount Technology (SMT).

Specifically, in the embodiment, the heat dissipation device is processed by using a Surface Mount Technology (SMT), and the electronic device is soldered to the PCB by using solder paste, so that heat is transferred to the copper-attached circuit; meanwhile, the radiator is connected with the PCB through the solder paste, so that heat is conducted to the radiator from the copper-attached circuit to form a complete radiating passage.

Specifically, in this embodiment, the heat dissipation device uses the copper-attached circuit on the PCB as a heat transfer medium to connect the heat-generating electronic device and the heat sink for heat dissipation, so as to form a complete heat dissipation path. The radiator is welded on the PCB through the solder paste without directly contacting with the device, so that the difficult problem of contact between a small-size electronic device and an electronic device with an irregular structure is avoided; the radiator used by the heat dissipation device is directly welded on the PCB through the solder paste, and the heat dissipation device has no installation process structure and accessories, is simple to process and has low cost; the heat dissipation device is assembled by using the SMT process, automatic production can be realized, and the production efficiency is high.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.

Claims

1. A heat dissipation device is arranged on a PCB and is characterized by comprising the PCB, an electronic device and a heat radiator, wherein a metal circuit layer, a first welding position and a second welding position are arranged on the PCB; the electronic device is provided with a pin or a welding disc, is fixed on the first welding position and is connected to the surface of the PCB; the radiator is fixed on the second welding position and connected to the surface of the PCB; the first welding position and the second welding position are connected through one or more branch lines on the metal line layer.

2. The heat dissipating device of claim 1, wherein the heat sink and the electronic component are connected by metal branch traces on the PCB.

3. The heat sink of claim 1, wherein at least one of the first bonding location and the second bonding location is present.

4. The heat dissipating device of claim 1, wherein the metal circuit layer is a thermally conductive material.

5. The heat dissipation device of claim 1, wherein a thickness of the metal trace layer between the first bonding location and the second bonding location is greater than or equal to 0.017 mm.

6. The heat dissipating device of claim 1, wherein the heat sink has a soldering surface for connecting to a soldering site on the PCB.

7. The heat sink of claim 6, wherein the bonding surface of the heat sink is solder-pasted.

8. The heat dissipating device of claim 1, wherein the heat sink is fixed to the PCB by solder paste, and the connection point is a second soldering point on the PCB.

9. The heat dissipating device of claim 1, wherein the heat sink is made of a high thermal conductivity material.

10. The heat dissipating device of claim 1, wherein the heat sink is mounted to the PCB board using Surface Mount Technology (SMT).