CN210610120U - Heat dissipation mechanism for surface mounting part of frequency converter - Google Patents

Heat dissipation mechanism for surface mounting part of frequency converter Download PDF

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Publication number
CN210610120U
CN210610120U CN201920880218.9U CN201920880218U CN210610120U CN 210610120 U CN210610120 U CN 210610120U CN 201920880218 U CN201920880218 U CN 201920880218U CN 210610120 U CN210610120 U CN 210610120U
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China
Prior art keywords
heat
dissipation mechanism
circuit board
pcb
heat conduction
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Active
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CN201920880218.9U
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Chinese (zh)
Inventor
许雄飞
张红兵
马立新
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Zhejiang Dafeng Technology Co ltd
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Zhejiang Dafeng Technology Co ltd
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Priority to CN201920880218.9U priority Critical patent/CN210610120U/en
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Abstract

The utility model relates to a converter pastes dress piece heat dissipation mechanism, electronic parts including PCB circuit board and paster installation, be equipped with the pad on one side of PCB circuit board, electronic parts is equipped with the leg, thereby the leg welding will on the pad electronic parts with the SMD installation of PCB circuit board is in the same place, be equipped with on the pad and link up the via hole of PCB circuit board, the via hole in be equipped with the pad welding is the heat conduction piece together, be equipped with insulating heat conduction diaphragm and radiator on one side of PCB circuit board, the radiator passes through insulating heat conduction diaphragm with the heat conduction piece heat conductivity links together. The utility model provides a converter pastes dress spare heat dissipation mechanism has solved the short problem of life that the dress spare on the converter leads to because the radiating effect is poor.

Description

Heat dissipation mechanism for surface mounting part of frequency converter
Technical Field
The utility model relates to a converter especially relates to a converter pastes dress spare heat dissipation mechanism.
Background
Since the chip mounting has an advantage of high productivity, electronic components such as IGBTs and MOSFETs are also mounted on the circuit of the inverter by the chip mounting method (hereinafter, the electronic components mounted by the chip mounting method are referred to as "chip mounting"). However, the frequency converter is often used in an environment with an undesirable ambient temperature, and the mounting of the surface mount device has a poor heat dissipation effect, so that heat generated by the mounting part cannot be effectively dissipated, and the service life of the mounting part when the mounting part is used on the frequency converter is shortened.
SUMMERY OF THE UTILITY MODEL
The utility model provides a converter pastes dress spare heat dissipation mechanism has solved the short problem of life that the dress spare on the converter leads to because the radiating effect is poor.
The above problems are solved by the following technical solutions: the utility model provides a converter pastes dress piece heat dissipation mechanism, includes the electronic parts of PCB circuit board and paster installation, be equipped with the pad on one side of PCB circuit board, electronic parts is equipped with the leg, thereby the leg welding will on the pad electronic parts with PCB circuit board SMD installs together, its characterized in that, be equipped with on the pad and link up the via hole of PCB circuit board, be equipped with in the via hole with the pad welds heat conduction piece together, be equipped with insulating heat conduction diaphragm and radiator on one side of PCB circuit board, the radiator passes through insulating heat conduction diaphragm with the heat conduction piece thermal conductivity links together. Besides the existing way, the heat of the electronic component is dissipated, and is also transferred to the radiator through the heat conduction block to be dissipated. Thereby playing the role of improving the heat dissipation effect. This approach is particularly applicable to single-sided circuit boards. The heat sink is located on the back side and does not interfere with the wiring of the circuit board.
Preferably, at least two welding feet are provided, at least two bonding pads are provided, the two welding feet are welded with the two bonding pads in a one-to-one correspondence manner, and the heat-conducting blocks in the through holes of the two bonding pads are in heat-conducting insulation connection with the same radiator through the same insulating heat-conducting membrane. The radiating effect and the layout compactness are good.
Preferably, one end of the heat conducting block, which is far away from the bonding pad, is welded with a heat conducting bulge protruding out of the PCB, the insulating heat conducting membrane is isolated between the heat conducting bulge and the radiator, and the insulating heat conducting membrane connects the heat conducting bulge and the radiator in a heat conducting and insulating manner. The reliability in the thermal conductive connection can be improved.
Preferably, the heat dissipation and fixing effects are good.
Preferably, a lower ventilation channel is formed between the insulating heat-conducting membrane and the PCB. The heat dissipation effect can be improved.
Preferably, the heat conducting block is solder. Can form the heat conduction piece in the fixed mounting process, the preparation is convenient. And the heat-conducting block can play a role of increasing the reliability of the connection of the electronic component.
Preferably, an upper ventilation channel is formed between the electronic component and the PCB circuit board. The heat dissipation effect is good.
Preferably, the heat sink is fixed to the PCB by screws. The fixation is reliable.
Preferably, the insulating and heat-conducting membrane is fixed only by clamping the heat sink with the heat-conducting block. It is fixed convenient, can conveniently change when insulating heat conduction diaphragm is ageing.
The utility model discloses following beneficial effect has: can carry out good heat dissipation to paster spare to solved current paster mounting means because the radiating effect is not good, thereby can not use the problem on the equipment that requires high to the heat dissipation.
Drawings
Fig. 1 is a schematic view of the present invention.
In the figure: the PCB comprises a PCB circuit board 1, an electronic component 2, a bonding pad 3, a heat conduction block 4, a heat conduction bulge 5, an insulating heat conduction membrane 6, a radiator 7, a lower ventilation channel 8 and an upper ventilation channel 9.
Detailed Description
Referring to fig. 1, a heat dissipation mechanism for a frequency converter mounting component includes a PCB circuit board 1 and a chip-mounted electronic component 2. One side of the PCB circuit board is provided with a welding disc 3. The electronic components are provided with solder tails (not shown in the figures). The solder legs are soldered to the pads to mount the electronic components to the PCB in a surface mount manner. The bonding pad is provided with a via hole penetrating through the PCB. And a heat conducting block 4 welded together with the bonding pad is arranged in the through hole. One end of the heat conducting block, which is far away from the welding disc, is welded with a heat conducting bulge 5 protruding out of the PCB. The insulating and heat-conducting membrane 6 is isolated between the heat-conducting protrusions and the heat sink 7. The insulating heat-conducting membrane is used for connecting the heat-conducting bulge and the heat radiator in a heat-conducting and heat-insulating way. The insulating heat-conducting membrane and the radiator are positioned on one side of the PCB. At least two welding feet are provided. The number of the welding feet is at least two, the two welding feet are welded with the two welding pads in a one-to-one correspondence mode, and the heat conducting blocks in the through holes of the two welding pads are in heat-conducting insulation connection with the same radiator through the same insulating heat conducting membrane. The projection of the heat conduction bulge along the thickness direction of the PCB is larger than the opening area of the via hole. And a lower ventilation channel 8 is formed between the insulating heat-conducting membrane and the PCB. The heat conducting block is soldering tin. An upper ventilation channel 9 is formed between the electronic components and the PCB circuit board. The bonding pad protrudes out of the PCB. The radiator is fixed on the PCB circuit board by the connection of the nut after passing through the PCB circuit board through the screw. The insulating heat-conducting membrane is clamped and fixed only by the matching of the radiator and the heat-conducting block.
The utility model discloses a manufacture process does: a manufacturing method of a radiating mechanism of a frequency converter surface-mounted part is characterized by comprising the following steps of firstly, manufacturing welding pads with the same number as that of welding pins of an electronic part to be welded on a PCB on the PCB; secondly, arranging a via hole penetrating through the PCB on each bonding pad; thirdly, welding the welding feet of the electronic component to be welded on the PCB to the corresponding welding pads in a reflow soldering mode, wherein the through holes are changed into blind holes which are positioned at one end of the electronic component and are closed after the welding feet are welded, so that the soldering tin cannot flow into an upper ventilation channel to generate a short circuit phenomenon in the subsequent welding process; fourthly, welding the heat-conducting protrusions and the welding pads together through wave soldering, and solidifying soldering tin in the through holes to form heat-conducting blocks when the heat-conducting protrusions are welded through wave soldering; and fifthly, covering the insulating heat-conducting membrane on the heat-conducting protrusion, fixing the radiator on the PCB, and clamping the insulating heat-conducting membrane by the radiator in cooperation with the heat-radiating protrusion so that the insulating heat-conducting membrane realizes insulation and heat conduction between the radiator and the heat-conducting protrusion.

Claims (9)

1. The utility model provides a converter pastes dress piece heat dissipation mechanism, includes the electronic parts of PCB circuit board and paster installation, be equipped with the pad on one side of PCB circuit board, electronic parts is equipped with the leg, thereby the leg welding will on the pad electronic parts with PCB circuit board SMD installs together, its characterized in that, be equipped with on the pad and link up the via hole of PCB circuit board, be equipped with in the via hole with the pad welds heat conduction piece together, be equipped with insulating heat conduction diaphragm and radiator on one side of PCB circuit board, the radiator passes through insulating heat conduction diaphragm with the heat conduction piece thermal conductivity links together.
2. The heat dissipation mechanism as claimed in claim 1, wherein there are at least two solder feet, there are at least two solder pads, the two solder feet are soldered to the two solder pads in a one-to-one correspondence, and the heat conduction blocks in the vias of the two solder pads are thermally conductively and electrically connected to the same heat sink through the same insulating and heat conducting membrane.
3. The heat dissipation mechanism of claim 1, wherein a heat conduction bump protruding from the PCB is welded to an end of the heat conduction block away from the pad, the insulating and heat conducting membrane is isolated between the heat conduction bump and the heat sink, and the insulating and heat conducting membrane thermally and conductively connects the heat conduction bump and the heat sink together.
4. The heat dissipation mechanism for a surface mounted component of a frequency converter according to claim 3, wherein a projection of the heat conduction protrusion along a thickness direction of the PCB is larger than an opening area of the via hole.
5. The heat dissipation mechanism for a surface-mounted component of a frequency converter according to claim 3, wherein a lower ventilation channel is formed between the insulating and heat-conducting membrane and the PCB.
6. The heat dissipation mechanism for a surface mounted component of a frequency converter according to claim 1, wherein the heat conducting block is solder.
7. The heat dissipation mechanism for a transducer mounting component of claim 1, wherein an upper ventilation channel is formed between the electronic component and the PCB.
8. The heat dissipation mechanism for a transducer mounting component according to claim 1, wherein the heat sink is fixed to the PCB by screws.
9. The heat dissipation mechanism of claim 8, wherein the insulating and heat conducting membrane is fixed only by the heat sink being clamped by the heat conducting block.
CN201920880218.9U 2019-06-12 2019-06-12 Heat dissipation mechanism for surface mounting part of frequency converter Active CN210610120U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920880218.9U CN210610120U (en) 2019-06-12 2019-06-12 Heat dissipation mechanism for surface mounting part of frequency converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920880218.9U CN210610120U (en) 2019-06-12 2019-06-12 Heat dissipation mechanism for surface mounting part of frequency converter

Publications (1)

Publication Number Publication Date
CN210610120U true CN210610120U (en) 2020-05-22

Family

ID=70686881

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920880218.9U Active CN210610120U (en) 2019-06-12 2019-06-12 Heat dissipation mechanism for surface mounting part of frequency converter

Country Status (1)

Country Link
CN (1) CN210610120U (en)

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