CN210928116U - Printed circuit board with heat conduction release structure - Google Patents
Printed circuit board with heat conduction release structure Download PDFInfo
- Publication number
- CN210928116U CN210928116U CN201921234034.1U CN201921234034U CN210928116U CN 210928116 U CN210928116 U CN 210928116U CN 201921234034 U CN201921234034 U CN 201921234034U CN 210928116 U CN210928116 U CN 210928116U
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- CN
- China
- Prior art keywords
- insulating
- layer
- circuit layer
- heat
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052709 silver Inorganic materials 0.000 claims abstract description 5
- 239000004332 silver Substances 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 4
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 abstract description 3
- 230000005571 horizontal transmission Effects 0.000 abstract description 3
- 238000005057 refrigeration Methods 0.000 description 7
- 238000009825 accumulation Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a printed circuit board with a heat conduction release structure, which comprises an insulating substrate, wherein one side of the insulating substrate is sequentially provided with an inner circuit layer, an insulating layer and an outer circuit layer, and a conductive column penetrating through the insulating layer is connected between the inner circuit layer and the outer circuit layer; one side that the insulating layer is close to the outer circuit layer is equipped with the groove of stepping down, is equipped with the welding breach in the outer circuit layer, and the groove of stepping down and welding breach are equipped with same insulating radiating block in, and one side that the inlayer circuit was kept away from to insulating radiating block is fixed with the pad, and one side that the pad is close to the inner circuit layer is fixed with electrically conductive foot, and electrically conductive foot is located between insulating radiating block and the outer circuit layer, is connected with silver glue film between electrically conductive foot and the outer circuit layer. The utility model discloses be provided with special heat radiation structure at the back of pad, heat radiation structure runs through outer circuit layer and insulating layer, and the heat can be directly along horizontal transmission, can avoid the heat to gather in electronic components's bottom, can improve electronic components's heat dispersion.
Description
Technical Field
The utility model relates to a circuit board field specifically discloses a printed circuit board with heat conduction release structure.
Background
Since the Circuit board is manufactured by electronic printing, it is called a printed Circuit board (pcb), which is also called pcb (printed Circuit board), and is an important electronic component, and is a support for the electronic component and a carrier for electrical connection of the electronic component. After the electronic equipment adopts the printed board, because of the consistency of the printed boards of the same type, the error of manual wiring is avoided, and the quality of the electronic equipment can be ensured.
When the heat accumulation type printed circuit board is applied to electronic equipment, electronic components are welded and installed on the printed circuit board, heat can be generated in the working process of the electronic components, and the heat accumulation can influence the overall working performance of the printed circuit board. For a relatively large electronic device, such as a printed circuit board in a computer, heat is dissipated through a heat dissipating fan set, but the fan set cannot be accommodated inside a small electronic device, heat generated during operation of the circuit board in the small electronic device cannot be effectively released, heat accumulation can form a high-temperature environment, and the service life of the printed circuit board and electronic components thereon can be shortened after long-time operation in the high-temperature environment.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a printed circuit board with a heat conduction releasing structure to effectively improve the heat dissipation efficiency of electronic components, thereby ensuring the service life of the whole circuit board.
In order to solve the prior art problem, the utility model discloses a printed circuit board with a heat conduction release structure, which comprises an insulating substrate, wherein one side of the insulating substrate is sequentially provided with an inner circuit layer, an insulating layer and an outer circuit layer, and a conductive post penetrating through the insulating layer is connected between the inner circuit layer and the outer circuit layer; one side that the insulating layer is close to the outer line layer is equipped with the groove of stepping down, be equipped with the welding breach in the outer line layer, it is equipped with same insulating radiating block to sink in groove of stepping down and the welding breach, one side that insulating radiating block kept away from the inner line layer is fixed with the pad, the pad is located the top on outer line layer, one side that the pad is close to the inner line layer is fixed with electrically conductive foot, electrically conductive foot is located between insulating radiating block and the outer line layer, be connected with silver glue film between electrically conductive foot and the outer line layer.
Furthermore, one side of the insulating substrate, which is far away from the inner circuit layer, is provided with a heat dissipation groove.
Furthermore, the sinking yielding groove and the heat dissipation groove are symmetrical about the inner circuit layer, and the semiconductor refrigeration piece is arranged in the heat dissipation groove.
Furthermore, the insulating heat dissipation block is an insulating ceramic block.
Furthermore, a heat conduction silica gel layer is connected between the insulating heat dissipation block and the sinking abdicating groove.
Furthermore, a plurality of welding through holes are formed in the welding pad.
The utility model has the advantages that: the utility model discloses a printed circuit board with heat conduction release structure is provided with special heat radiation structure at the back of pad, and heat radiation structure runs through outer circuit layer and insulating layer, and the heat can be directly along horizontal transmission, can avoid the heat to gather in electronic components's bottom, can improve electronic components's heat dispersion to ensure circuit board and last electronic components's stable performance, in addition, it is convenient that electronic components welds on the pad.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
The reference signs are: the heat dissipation structure comprises an insulating substrate 10, a heat dissipation groove 101, an inner circuit layer 11, an insulating layer 12, a conductive column 121, a sinking abdicating groove 122, an outer circuit layer 13, a welding gap 131, a semiconductor refrigeration piece 14, an insulating heat dissipation block 20, a heat conduction silica gel layer 201, a bonding pad 21, a welding through hole 211, a conductive pin 22 and a silver gel layer 23.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1.
The embodiment of the utility model discloses a printed circuit board with heat conduction release structure, including insulating substrate 10, one side of insulating substrate 10 is equipped with interior circuit layer 11, insulating layer 12 and outer circuit layer 13 in proper order, is connected with between interior circuit layer 11 and the outer circuit layer 13 and runs through insulating layer 12 the electrically conductive post 121; one side of the insulating layer 12 close to the outer circuit layer 13 is provided with a sinking abdicating groove 122, the outer circuit layer 13 is provided with a welding gap 131, the same insulating radiating block 20 is arranged in the sinking abdicating groove 122 and the welding gap 131, the insulating radiating block 20 is inserted into the insulating layer 12 through the outer circuit layer 13, the heat released by the insulating radiating block 20 can be transmitted from the transverse direction of the outer circuit layer 13 and the insulating layer 12, the efficiency of heat release can be effectively improved, one side of the insulating radiating block 20 far away from the inner circuit layer 11 is fixed with a welding disc 21, the welding disc 21 is positioned above the outer circuit layer 13, the stability of the connecting structure between the electronic component and the welding disc 21 can be effectively ensured, one side of the welding disc 21 close to the conductive circuit layer 11 is fixed with a conductive pin 22, the conductive pin 22 is positioned between the insulating radiating block 20 and the outer circuit layer 13, a silver glue layer 23 is connected between the conductive pin 22 and the outer circuit layer 13, the stability of the connection structure between the conductive pins 22 and the outer wiring layer 13 can be ensured, and the reliability of the conductive relationship between the bonding pads 21 and the outer wiring layer 13 through the conductive pins 22 can be ensured.
The utility model discloses when using, with electronic components welding on pad 21, electronic components can produce the heat at the during operation, the heat of electronic components bottom passes through pad 21 and transmits insulating radiating block 20 in, insulating radiating block 20 again with the heat fast transfer to around the structure, can effectively avoid the heat to gather with electronic components in, can effectively ensure electronic components's working property, other positions of electronic components except the bottom surface all expose in the outside air, can effectively ensure the radiating efficiency.
The utility model discloses be provided with special heat radiation structure at the back of pad, heat radiation structure runs through outer circuit layer 13 and insulating layer 12, and the heat can be directly along horizontal transmission, can avoid the heat to gather in electronic components's bottom, can improve electronic components's heat dispersion to ensure circuit board and electronic components's on it stable performance, in addition, it is convenient that electronic components welds on pad 21.
In this embodiment, the side of the insulating substrate 10 away from the inner circuit layer 11 is provided with a heat dissipation groove 101, and the heat dissipation performance of the whole circuit board can be effectively improved through the heat dissipation groove 101.
Based on the above embodiment, the sinking and abdicating groove 122 is symmetrical to the heat dissipation groove 101 about the inner circuit layer 11, the semiconductor refrigeration piece 14 is arranged in the heat dissipation groove 101, the semiconductor refrigeration piece 14 is also called as a thermoelectric refrigeration piece, when direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so as to achieve the purpose of refrigeration, heat generated during the operation of the electronic component is transferred from the bonding pad 21 to the insulating heat dissipation block 20, and partial heat is released through the inner circuit layer 11 and then through the semiconductor refrigeration piece 14, so as to ensure the working performance of the electronic component.
In this embodiment, the insulating heat dissipation block 20 is an insulating ceramic block, and the insulating ceramic has good insulating property and heat conduction property.
Based on the above embodiment, the heat conductive silicone layer 201 is connected between the insulating heat dissipation block 20 and the sinking and abdicating groove 122, preferably, the heat conductive silicone layer 201 is also connected between the insulating heat dissipation block 20 and the conductive pins 22 and the bonding pads 21, respectively, and the heat dissipation effect of the circuit board can be effectively improved through the heat conductive silicone layer 201.
In this embodiment, the bonding pad 21 is provided with a plurality of bonding through holes 211, and when an electronic component is bonded to the bonding pad 21, solder paste flows into the bonding through holes 211, so that the stability of the bonding structure between the bonding pad 21 and the electronic component can be effectively improved.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. The printed circuit board with the heat conduction release structure is characterized by comprising an insulating substrate (10), wherein one side of the insulating substrate (10) is sequentially provided with an inner circuit layer (11), an insulating layer (12) and an outer circuit layer (13), and a conductive column (121) penetrating through the insulating layer (12) is connected between the inner circuit layer (11) and the outer circuit layer (13); insulating layer (12) are close to one side of outer line layer (13) is equipped with sinks and steps down groove (122), be equipped with welding notch (131) in outer line layer (13), sink step down groove (122) with be equipped with same insulating radiating block (20) in welding notch (131), insulating radiating block (20) are kept away from one side of interior line layer (11) is fixed with pad (21), pad (21) are located the top of outer line layer (13), pad (21) are close to one side of interior line layer (11) is fixed with electrically conductive foot (22), electrically conductive foot (22) are located insulating radiating block (20) with between outer line layer (13), electrically conductive foot (22) with be connected with silver glue film (23) between outer line layer (13).
2. The printed circuit board with the heat conducting release structure according to claim 1, wherein a side of the insulating substrate (10) away from the inner circuit layer (11) is provided with a heat dissipation groove (101).
3. The PCB with the thermally conductive releasing structure as claimed in claim 2, wherein the sinking and receding groove (122) and the heat dissipation groove (101) are symmetrical about the inner circuit layer (11), and a semiconductor chilling plate (14) is disposed in the heat dissipation groove (101).
4. A printed circuit board with a thermally conductive relief structure according to claim 1, characterized in that the insulating heat slug (20) is an insulating ceramic slug.
5. The PCB with the heat conduction releasing structure as claimed in claim 4, wherein a heat conduction silicone rubber layer (201) is connected between the insulating heat dissipation block (20) and the sinking and abdicating groove (122).
6. A printed circuit board with a thermally conductive releasing structure according to claim 1, wherein a plurality of solder through holes (211) are provided on the soldering land (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921234034.1U CN210928116U (en) | 2019-07-31 | 2019-07-31 | Printed circuit board with heat conduction release structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921234034.1U CN210928116U (en) | 2019-07-31 | 2019-07-31 | Printed circuit board with heat conduction release structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210928116U true CN210928116U (en) | 2020-07-03 |
Family
ID=71353080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921234034.1U Expired - Fee Related CN210928116U (en) | 2019-07-31 | 2019-07-31 | Printed circuit board with heat conduction release structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210928116U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115460763A (en) * | 2022-09-29 | 2022-12-09 | 深圳市思坦科技有限公司 | A printed circuit board, preparation method and display device |
-
2019
- 2019-07-31 CN CN201921234034.1U patent/CN210928116U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115460763A (en) * | 2022-09-29 | 2022-12-09 | 深圳市思坦科技有限公司 | A printed circuit board, preparation method and display device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200703 |
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| CF01 | Termination of patent right due to non-payment of annual fee |