CN107745166B - Welding method for phased array active antenna array surface multilayer copper-clad substrate - Google Patents
Welding method for phased array active antenna array surface multilayer copper-clad substrate Download PDFInfo
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- CN107745166B CN107745166B CN201710843741.XA CN201710843741A CN107745166B CN 107745166 B CN107745166 B CN 107745166B CN 201710843741 A CN201710843741 A CN 201710843741A CN 107745166 B CN107745166 B CN 107745166B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
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Abstract
The invention provides a welding method of a phased array active antenna array surface multilayer copper-clad substrate, and aims to provide a welding method capable of effectively avoiding unstable welding quality of the multilayer copper-clad substrate. The invention is realized by the following technical scheme: preparing a tool with the same shape as the multilayer copper-clad substrate and L-shaped clamps of which circular arrays are distributed on a tool base; applying steel mesh printing solder to the welding area on the front surface of the cavity structural member, and placing the welding area on a reflux heating plate of a heater; preparing a tool with the same shape as the multilayer copper-clad substrate and an L-shaped clamp of which the circular array is distributed on a tool base; arranging an SMP (symmetrical multi-processing) welding surface on the surface of the multilayer copper-clad substrate, fixing the multilayer copper-clad substrate on a convex surface of a tool base, and placing a welding ring, an SMP radio frequency connector and scaling powder in an SMP mounting hole on the back surface of the cavity structural member; the back of the multilayer copper-clad substrate is tin-plated, the multilayer copper-clad substrate is fixed on the welding surface of the cavity structural member coated with the soldering flux by a pin and is placed on a reflux heating plate of a heater; and welding the multilayer copper-clad substrate and the cavity structural member on the front surface of the hot reflow, and welding an SMP (symmetrical multi-processing) radio frequency connector on the back surface of the cavity structural member.
Description
Technical Field
The invention relates to a phased-array active antenna array surface 14 mm-216 mm-3.5 mm large-size multilayer copper-clad substrate 4 welding tool and a metal carrier and radio frequency connector integrated welding process method thereof.
Background
With the rapid development of microelectronics and large-scale integrated circuits, the problem of antennas becoming large and bulky components in electronic devices becomes prominent, and the need for small antennas that can be compatible with device size and have effective electrical performance is increasing. Millimeter wave phased array antennas are becoming thinner and are moving towards conformal bending. The millimeter wave two-dimensional active phased array antenna is characterized by large scale, high integration level and requirements on equipment miniaturization and adaptation to platform installation. Generally, a high-density integrated two-dimensional active phased array antenna is realized, and two types are divided according to a circuit assembly form: transversely integrated and longitudinally assembled, namely 'tile type'; the vertical integration and the horizontal assembly are brick-type. The tile-type phased array system is configured such that MMICs are distributed in a plane parallel to the aperture plane of an antenna, and a phased array is formed by longitudinal stacking and assembling. The system with the phased array antenna is adopted by an inter-aircraft data chain antenna, a satellite communication antenna, an unmanned aerial vehicle satellite communication vehicle-mounted terminal transceiver antenna and the like, although the antenna housing is protected and sealed, the internal structure of the antenna is still likely to be exposed in the air, and the long-term reliability of the system still has great hidden danger. In the aspects of structure and process, the size of the array surface of the microstrip antenna is increased along with the increase of the aperture and the number of array elements of the antenna, the complexity and the precision of the shape of the microstrip antenna array are increased along with the improvement of working frequency, and the requirement on the assembly reliability of the antenna array surface is increased along with the evolution of the antenna position from the inside of the cabin to the outside of the cabin in a conformal manner. The millimeter wave phased array antenna system comprises a signal transmission surface, a ground surface, a metalized ground hole, surface mounting package SMP (symmetric multi-processing) welding spots and an active front circuit, wherein the number of T/R modules arranged in the antenna array surface is large, thousands of T/R components are distributed on the antenna array surface, the T/R components are arranged compactly, and the heat dissipation space is small, so that the heat flow density of the antenna array surface is high, and if the heat cannot be taken away from the antenna array surface in time, the temperature of the antenna array surface is increased, and the performance of the T/R components is reduced or even fails. The millimeter wave phased array microstrip antenna generally adopts more than 300 6SMP radio frequency connectors 6, the active antenna array surface generally adopts a clolong CLTE-XT series and a Taconly TSM-DS3PTFE series multilayer copper-coated substrate 4, the total thickness is 0.55-3.3 mm, the sizes of the substrates are different, the maximum size of the current circuit substrate is 14mm multiplied by 216 mm multiplied by 3.5 mm, more than 80 active circuits are provided, and the SMP radio frequency connectors 6, the multilayer copper-coated substrate 4 and the silver-plated cavity structural member 8 are welded. The design density of circuits on the multi-layer active array substrate is high, the solder amount is one of key points in the whole welding process, and the solder amount is extremely difficult to control. Due to the large size and thickness of the substrate, the soldering pressure is difficult to control.
Microstrip antenna is a new antenna which has been gradually developed in the last 30 years. A common microstrip antenna is a metal ground plate on a double-sided copper-coated low-loss dielectric substrate (such as a polytetrafluoroethylene glass fiber cloth substrate (PTFE)), one surface of the substrate is used as a metal ground plate, the other surface of the substrate is manufactured into a metal patch with a certain shape by methods such as photoetching, and the like, the microstrip line and an axis probe are used for feeding the patch, the antenna array adopts a four-in-four unequal power divider and 4 in-phase cables to form a feeding network, 4 microstrip antenna sub-arrays are combined into a total array, the phased array microstrip antenna is very complicated to assemble, the thickness of a PTFE printed circuit board is large, the substrate penetration rate, the alignment precision and the SMP short circuit are extremely difficult to control, more than 300 SMP (symmetric multi-processor) parts need to be welded on a structural part, when the printed circuit board is required to be welded and a surface mounting package SMP connector is required, solder can not flow into an air cavity, and one can not be short-circuited, if parameters of the welding temperature, time, pressure and the quantity of the solder are matched with each other are improperly controlled, a failure of the welding will be caused. Welding of large-size and multi-layer active substrates is one of the key processes in the micro-assembly process technology, and the assembly difficulty is very high. Phased array antennas present the challenge of large area, highly reliable connections to the process and the difficulty of the future challenge will continue to rise. For the functional part with the structure of the microstrip antenna array surface, because the space of the antenna is small, the connection is difficult to realize in a general screw installation mode, and the connection can be realized by matching with mature welding and other processes. However, because many devices are soldered and the circuit layout density is high and complicated, it is necessary to reasonably design the mounting sequence and the temperature gradient for implementing step soldering, which is one of the design difficulties. Alternative methods within the current industry are bolting, gluing and welding. However, in the face of the current requirement of large-area and high-reliability connection, the three connection process methods have major problems at present.
The screwing method has the advantages of simple process, high speed, low cost and repairability, but the screwing method can not meet the requirement of large-area reliable connection in principle. The screws are connected with the microstrip plate and the metal carrier through local pressure on machinery, and after the connection is screwed, especially when the connection area is large and the number of the screws is limited, a large number of air gaps still exist on a joint surface, and the electrical performance of the microstrip plate and the circuit assembly is seriously influenced under the high-frequency characteristic. In addition, the binding force of the screw connection is difficult to master, the connection is not tight due to insufficient binding force, and the local deformation or cracking of the micro-strip plate can be caused by stress concentration due to too large binding force.
The gluing method is the popularization and application of the multilayer board laminating process among different materials. The laminating process method cures the bonding material under the vacuum condition, and can achieve the good bonding effect without cavities. But the long-term reliability of the bonding process method is not high due to the self physical and chemical properties and characteristics of the bonding material. The engineering can select thermosetting/plastic bonding materials according to different requirements, and the conductive property of the materials can be realized by adding metal particles (such as silver powder). The thermoplastic material can be softened, deformed or re-melted after being heated, so that the application range is narrow. The most commonly selected epoxy thermosetting bonding material is characterized by low-temperature brittleness, when the thermal expansion coefficients of the micro-strip plate and the metal carrier are greatly different, a bonding layer can crack under long-term high and low temperature conditions, and the long-term reliability is not high. Although the electric conduction and heat conduction performance and the connection strength of the welding process method are better than those of the glued joint to a certain extent and have obvious advantages in long-term reliability. However, the technical aspect of realizing the large-area welding process of the array surface of the microstrip antenna is not mature at present, and the method is mainly embodied in the following four aspects:
the shape of the solder is selected, the current process method mainly depends on a lead-tin soldering lug mode to realize the application and control of the solder, the soldering lug needs to use laser to cut the shape of a welding cavity, secondary pollution is caused in the cutting process, and even if the welding lug is cleaned, the welding lug is difficult to remove completely, so that the infiltration effect of a substrate and the cavity is poor, and large-area cavities are formed. The penetration rate is very limited, and because the PTFE printed circuit board is thick and large, the mutual matching parameters among the solder quantity, the welding pressure and the welding time cannot be accurately controlled, short circuit can be caused or the penetration rate is low, generally not higher than 50%, and the high requirements of future high-frequency-band microstrip boards on the penetration rate and the reliability cannot be met.
The ladder welding quality is uncontrollable, and jumbo size, multilayer active substrate and SMP radio frequency connector 6 are not at same face of weld, adopt the ladder welding mode to weld, and tin silver copper welding substrate is positive with the cavity, and the 6 cavity backs of SMP radio frequency connector are welded to the lead-tin, has the problem in several aspects: firstly, the wettability and diffusivity of the tin-silver-copper solder are poor; secondly, increase through the secondary reflow soldering cavity, thirdly, the frock design, the assembly is complicated, the frock of a crimping base plate, the frock of a welding SMP, upper and lower two-layer frock fixed mounting leads to whole welded volume increase, and thickness increases, and the welding time also increases thereupon, and the base plate silvered film changes, and the scaling powder volatilizes totally, does not have the exhaust passage again, and welding process is invisible moreover.
In the aspect of tool design and installation sequence, the design of the current tool mainly uses a spring tool to control pressure, the density of the spring is high, the pressure is too large or too small, too large welding flux completely overflows into an SMP hole, and a micro-gap is formed between a too small substrate and a cavity, so that poor welding is caused. Secondly, the tool is designed and installed in sequence, the circuit surface of the substrate faces upwards, and the joint state of the welding surface of the substrate and the cavity can not be judged basically, so that firstly, pressure is blind, and secondly, no exhaust through hole exists in the welding, and welding failure is caused.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the welding tool and the welding method thereof, which can realize the welding of the large-size and multilayer copper-clad base plates, effectively improve the welding efficiency and quality and effectively avoid the influence of a series of unstable cost, management and welding quality caused by the factors.
The above object of the present invention can be achieved by a method for soldering a phased array active antenna array surface multilayer copper clad substrate, comprising the steps of: preparing a tool with the same shape as the contact surface of the multilayer copper-clad substrate 4 and an L-shaped clamp 3 with a circular array distributed on a tool base 2, applying a solder coating tin layer on the active array surface of the multilayer copper-clad substrate 4, arranging an active circuit opening 7 with a surface not on the same welding surface and the active array surface of the multilayer copper-clad substrate 4 packaged with an SMP radio frequency connector 6 upwards, arranging a passive array surface downwards, arranging an SMP welding surface upwards on the surface, fixing the multilayer copper-clad substrate 4 and a nonmetal protective pad 5 on the convex surface of the tool base 2, arranging a solder ring, an SMP radio frequency connector 6 and applying an SMP soldering flux in an SMP mounting hole on the back surface of a cavity structural member 8 supporting a shielding antenna and a TR component, and blocking the mounting hole of the SMP radio frequency connector 6 by using a cotton ball 1 to ensure that the holes between the solder ring and the cotton ball are tightly combined without looseness; then applying steel mesh printing solder on the welding area of the cavity structural member 8, coating the steel mesh printing solder paste on the welding surface of the multilayer copper-clad substrate 4 and the cavity structural member 8, placing the reflow heating plate 10 of the heater 9, enabling the solder to be uniformly leveled, completely melting the solder, taking down the cavity structural member 8, and cooling for later use; a layer of dense, uniform and continuous coating tin layer is enameled on the back of the multilayer copper-clad substrate 4 for standby; fixing the multilayer copper-clad substrate 4 on the welding surface of a cavity structural member 8 coated with soldering flux by using pins, and adjusting the pressure of the end of the L-shaped clamp 3 towards a bolt, so that the multilayer copper-clad substrate 4 is welded to be tightly combined with a tool and is arranged on a reflux heating plate 11 of a heater 9; the multi-layer copper-clad substrate 4 and the cavity structural member 8 are welded on the front side through thermal reflow generated by the reflow heating plate 11, meanwhile, the SMP radio frequency connector 6 is welded on the back side of the cavity structural member 8, the molten state and the welding line state of the welding flux are observed, the pressure of the L-shaped clamp 3 for fixing the multi-layer copper-clad substrate 4 is adjusted according to the molten state of the welding flux and the micro-gap state of the cavity structural member 8, and the active array surface of the multi-layer copper-clad substrate 4 is integrally welded with the SMP radio frequency connector 6 and the cavity structural member 8.
Compared with the prior art, the invention has the following beneficial effects:
the penetration rate is high. According to the invention, the soldering paste is printed on the welding surface of the cavity structural member 8 by using the steel mesh, the multilayer copper-clad substrate 4 is fixed by using the pin, the cavity structural members 8 and 6SMP radio frequency connectors 6 are integrally welded by using the same kind of solder, and the matching design of the tooling and the pressure is adopted, the substrate is integrally welded by using the same kind of solder, and the cavity structural members 8 and 6SMP radio frequency connectors 6 are adopted, so that the welding of the large-size multilayer copper-clad substrate 4 and the SMP radio frequency connectors 6 are ensured to have no short circuit, no large-area holes, high penetration rate and good production consistency, the integrated welding of the large-size and multilayer active antenna array surface is realized, and the welding of any large-size and multilayer copper-clad substrate 4 can be universal, the production flow is shortened, the production cost is reduced, and the production quality and the production efficiency are improved. Solder paste is applied to the cavity for welding through steel mesh printing, and then heating and refluxing are carried out, so that the good wetting of the solder coating layer on the welding surface of the cavity structural member 8 is realized, the solder amount is controlled accurately, and the penetration rate of the multilayer copper-clad substrate 4 is effectively improved; solder paste is applied to the welding surface of the cavity structural member 8 through the steel mesh, so that the quantification of the solder is realized, the production consistency is met, and the efficiency is greatly improved. The cavity structural member 8 applied with the soldering paste is placed on a heating table to reflow, the position of the solder can be fixed, and the wettability of the lead-tin soldering paste and the silver-plated cavity structural member 8 is very good, so that the coating layer of the cavity is uniform, continuous and compact. Repeated tests verify that when the opening shape of the steel mesh is consistent with the cavity structural part 8, the area is reduced by 20%, the thickness of the steel mesh is 0.16-0.18 mm, the closed angle of the opening is rounded, the substrate welding effect is good, and meanwhile, the welding consistency is good. Tin coating thickness control the amount of tin coating per time is obtained by calculating the area of the welding substrate and multiplying by the thickness of tin coating. Through tin coating on the back of the substrate, the same material welding is realized, the multilayer copper-clad substrate 4 and the cavity structural member 8 are well infiltrated in the welding fusion process, the tin coating amount of the multilayer copper-clad substrate 4 can be adjusted according to the solder reflux state of the welding area of the cavity structural member 8, the control accuracy of the solder is ensured, and repeated tests prove that when the tin coating area is reduced by 20%, the soldering iron temperature is set at 450-500 ℃, the diameter of a soldering tin wire is 0.38mm, and the substrate welding effect is better. The problems that the PTFE printed circuit board is thick and large, the circuit layout density is high, and solder is not easy to infiltrate in the welding process are solved.
The welding effect is good. Aiming at the fact that a large-size multilayer copper-clad substrate 4 and an SMP (symmetrical multi-processing) radio frequency connector 6 are not on the same welding surface, the multilayer copper-clad substrate 4 and a cavity structural member 8 are welded on the front side, the SMP radio frequency connector 6 is welded on the back side of a cavity and the SMP is independently welded, the substrate, the cavity structural member 8 and the SMP are integrally welded by the same welding flux, the SMP can be prevented from falling off, and a series of problems caused by large-size tooling and secondary backflow can be avoided. The welding effect is good, and the contact does not fall off, rosin joint and short circuit. The pressure of the bow-shaped clamp is adjusted through the torque screwdriver, so that the pressure of the bow-shaped clamp is balanced, and good welding is realized. Through repeated experiments, when the shape of the welding tool surface is consistent with that of the multilayer copper-clad substrate 4 and the protruding height is 3mm, 10 arc-shaped clamps are designed and installed on the tool base, the torque parameter is 70N & lt m & gt, the temperature is kept for 60S, the welding effect is good, the substrate penetration rate reaches more than 85%, and the active circuit and the connector are not short-circuited, rosin joint and the like.
The production cost is obviously reduced. Through the matching design of the tool and the pressure, the welding pressure can be controlled, the solder cannot overflow, and the active circuit and the SMP cannot be short-circuited; the production efficiency is improved by more than 100%, the substrate, the cavity and the SMP homogeneous solder are integrally welded, the secondary reflow process is reduced, and meanwhile, the welding quality is improved. The workload of assembly personnel and process design personnel is greatly reduced, the production cost is obviously reduced, and the efficiency is obviously improved.
By utilizing the invention, the phased-array antenna multilayer copper-clad substrate with large number of radio frequency connectors, high welding density and large size can realize high penetration rate, high alignment precision and high welding success power of the radio frequency connectors, more than 300 SMP radio frequency contact elements are not short-circuited or rosin-welded, more than 80 multilayer copper-clad substrates 4 are not short-circuited, and solder is not accumulated with redundant solder. The welding quality is improved, and the quality control of the welding process can be realized.
Drawings
FIG. 1 is a schematic diagram of a welding tool for a phased array active antenna array surface multilayer copper-clad substrate.
FIG. 2 shows a welding flow chart of the phased array active antenna array surface multilayer copper clad substrate of the invention.
In the figure: 1 cotton ball, 2 tooling bases, 3L-shaped clamps, 4 multilayer copper-clad substrates, 5 nonmetal protective pads, 6SMP radio frequency connectors, 7 active circuit openings, 8 cavity structural members, 9 heaters, 10 bolts and 11 reflux heating plates
The invention is further illustrated with reference to the following figures and examples, without thereby limiting the scope of the invention to the described examples.
Detailed Description
See fig. 1. According to the invention, a tool with the same shape as the contact surface of a multilayer copper-clad substrate 4 and an L-shaped clamp 3 with a circular array distributed on a tool base 2 are prepared, a solder coating tin layer is applied to the active array surface of the multilayer copper-clad substrate 4, the active array surface of the multilayer copper-clad substrate 4 with an active circuit opening 7 and an SMP radio frequency connector 6 packaged therein is upward, then the passive array surface is downward, the SMP welding surface is installed on the surface, the multilayer copper-clad substrate 4 and a nonmetal protective pad 5 are fixed on the convex surface of the tool base 2, a solder ring, the SMP radio frequency connector 6 and a soldering flux are placed in an SMP mounting hole on the reverse side of a cavity structural member 8 supporting a shielding antenna and a TR component, and a cotton ball 1 is adopted to block the mounting hole of the SMP radio frequency connector 6, so that the holes between the solder ring and the cotton ball are tightly combined without looseness; then applying steel mesh printing solder on the welding area of the cavity structural member 8, coating the steel mesh printing solder paste on the welding surface of the multilayer copper-clad substrate 4 and the cavity structural member 8, placing the reflow heating plate 10 of the heater 9, enabling the solder to be uniformly leveled, completely melting the solder, taking down the cavity structural member 8, and cooling for later use; a layer of dense, uniform and continuous coating tin layer is enameled on the back of the multilayer copper-clad substrate 4 for standby; fixing the multilayer copper-clad substrate 4 on the welding surface of a cavity structural member 8 coated with soldering flux by using pins, and adjusting the pressure of the end of the L-shaped clamp 3 towards a bolt, so that the multilayer copper-clad substrate 4 is welded to be tightly combined with a tool and is arranged on a reflux heating plate of a heater 9; the multi-layer copper-clad substrate 4 and the cavity structural member 8 are welded on the front side through thermal reflow generated by the reflow heating plate 11, meanwhile, the SMP radio frequency connector 6 is welded on the back side of the cavity structural member 8, the molten state and the welding line state of the welding flux are observed, the pressure of the L-shaped clamp 3 for fixing the multi-layer copper-clad substrate 4 is adjusted according to the molten state of the welding flux and the micro-gap state of the cavity structural member 8, and the active array surface of the multi-layer copper-clad substrate 4 is integrally welded with the SMP radio frequency connector 6 and the cavity structural member 8.
The utility model provides a 4 welding frock of phased array active antenna array face multilayer copper clad base plate, includes: the tool comprises a disc-shaped tool base 2 and L-shaped clamps 3 fixedly connected to the circumference of the tool base 2 in a sliding mode, the long edge of each L-shaped clamp 3 points to the circle center in the circumferential direction and is arranged on a circumferential annular groove of the tool base 2 according to the circumference, sliding grooves and bolts 10 used for fixing a multilayer copper-clad substrate 4 and a cavity structural member 8 are formed in the long edge of each L-shaped clamp, the contact surface of the tool base 2 locally protrudes to bear the multilayer copper-clad substrate 4 and the cavity structural member 8, and the protruding shape is consistent with that of the multilayer copper-clad substrate 4, so that pressure equalizing in the welding process is achieved. The non-metallic protective pad 5 may be a teflon protective pad for protecting the multi-layered copper-clad substrate 4. The contact surface of the multilayer copper-clad substrate 4 and the tool base 2 is consistent in appearance, an active circuit opening 7 and an SMP (symmetrical multi processing) radio frequency connector 6 are packaged on the surface of the multilayer copper-clad substrate 4, and the welding surface of the SMP is installed on the surface of the end bolt facing the L-shaped clamp 3. The bottom surface of the multilayer copper-clad substrate 4 faces downwards and is fixed on the nonmetal protective pad 5 on the convex surface of the tool base 2, so that pressure balance is facilitated, and the multilayer copper-clad substrate 4 is protected from being damaged. In order to ensure good welding between the large-size and multi-layer copper-clad substrate 4 circuit and the cavity structural member 8, the solder adopts 63Sn37Pb alloy solder paste, and the surface of the cavity structural member 8 is a gold-plated layer or a silver-plated layer.
When the solder ring of the SMP radio frequency connector 6 is phi 2.5, the diameter of the solder is phi 0.38mm, the diameter of the cotton ball is phi 4, and the height of the cotton ball is 5mm, the cotton ball around the SMP mounting hole is pressed by using tweezers, so that the solder ring and the SMP cotton ball are tightly combined.
See fig. 2. The integrated welding of the large-size and multilayer active front antenna comprises the following specific operation steps:
applying steel mesh printing solder on the cavity structural component 8 to accurately control the solder at the welding area, and then printing the soldering paste on the cavity structural component 8 by using the steel mesh so that the soldering paste is uniform and continuous, wherein the thickness of the steel mesh is 0.16-0.18 mm, and the size of the steel mesh is shrunk by about 20%; then placing the cavity structural part 8 applied with the soldering paste on a reflow heating plate 11 for reflow, enabling the solder to be uniformly leveled, completely melting the solder, taking down the cavity structural part 8 and cooling for later use;
manually coating tin on the back of the multilayer copper-clad substrate 4, wherein the temperature of a soldering iron is set to be 450-500 ℃, the diameter of a solder wire is phi 0.38mm-0.43mm, the tin coating is coated with the solder, the area of the tin coating is reduced by at least 20%, and a layer of compact, uniform and continuous coating layer is formed for later use; applying soldering flux in the SMP holes on the back surface of the cavity structural member 8, then placing a solder ring with the diameter phi of 0.38mm and an SMP radio frequency connector 6, and then filling the SMP mounting holes with cotton balls 1 with the diameter phi of 4 and the height of 5mm, so that the connectors are tightly combined with the cavity structural member 8 without looseness.
Fixing the multilayer copper-clad substrate 4 on the welding surface (front surface) of the cavity structural member 8 coated with the soldering flux by using a pin, accurately aligning the welding surface, and then sequentially installing a tool to enable the welding multilayer copper-clad substrate 4 to be tightly combined with the tool; placing a cavity structural member (8) on a reflow heating plate 11 for heating, cutting a section of soldering wire to be placed around the cavity as an indication solder, placing the indication solder around the surface of the cavity structural member 8, then, when the indication solder reaches a molten state, melting the solder from a central point to the periphery, observing the molten state of the welding area of the solder, adjusting the pressure of a bolt 10 by using a torque screw with the parameter of 70N m according to the melting time and state of the solder, wetting and diffusing the solder on the surface of the cavity structural member 8, and then, keeping the temperature for 60S. Because the multilayer copper clad laminate 4 is thick, the pressure of the L-shaped clamp on the multilayer copper clad laminate 4 is changed along with the melting of the solder, and the integral welding of the active array surface of the large-size multilayer copper clad laminate 4 is finally realized according to the melting state of the solder and the micro-gap state of the multilayer copper clad laminate 4 and the cavity structural member 8.
After the welding of the cavity structural member 8 is finished, the cavity structural member 8 is moved away from the reflux heating plate 11 by using a heat insulation tool, and is placed on a metal plate for natural cooling; soaking the cavity structural part 8 in the cleaning solution for 5 minutes to soften the cotton ball, clamping and taking out the cotton ball by using tweezers, then putting the cavity structural part 8 into a container, and carrying out ultrasonic cleaning on the cavity by using an alcohol and acetone mixed solution.
Claims (6)
1. A welding method for a phased array active antenna array surface multilayer copper-clad substrate is characterized by comprising the following steps: preparing a tool with the same shape as the contact surface of the multilayer copper-clad substrate (4) and an L-shaped clamp (3) distributed on a tool base (2) in a circular array mode, then applying steel mesh printing solder on the welding area of the cavity structural member (8), coating the steel mesh printing solder paste on the welding surface of the multilayer copper-clad substrate (4) and the cavity structural member (8) to enable the solder paste to be uniform and continuous, then placing the cavity structural member (8) applied with the solder paste on a reflow heating plate (11) for heating and reflow to enable the solder to be uniform and level, completely melting the solder, taking down the cavity structural member (8) for cooling for later use; manual tin coating is adopted on the welding surface of the multilayer copper-clad substrate (4), a compact, uniform and continuous coating layer is formed, and the solder is leveled uniformly and continuously for later use;
the bottom surface of a multilayer copper-clad substrate (4) faces downwards, a welding surface provided with an SMP connector is upward, the multilayer copper-clad substrate (4) and a nonmetal protective pad (5) are fixed on a convex surface of a tool base (2), and a solder ring, an SMP radio frequency connector (6) and a scaling powder are placed in an SMP mounting hole on the reverse side of a cavity structural member (8) supporting a shielding antenna and a TR component;
applying soldering flux in SMP holes on the back surface of a cavity structural member (8) supporting a shielding antenna and a TR component, placing a solder ring and an SMP radio frequency connector (6), and filling a cotton ball (1) with the diameter of phi 4 and the height of 5mm in the SMP mounting holes to enable the connector to be tightly combined with the cavity structural member (8) without looseness;
fixing a nonmetal protective pad (5) by a positioning pin and fixing a multilayer copper-clad substrate (4) on a convex surface of a tool base (2), fixing a cavity structural member (8) coated with soldering flux by the multilayer copper-clad substrate (4) by using a pin to ensure that the cavity structural member is aligned accurately, then installing a tool, enabling the tool to be welded with the multilayer copper-clad substrate (4) to be tightly combined with the tool base (2) through the nonmetal protective pad (5), then placing the tool on a reflux heating plate (11) of a heater (9) for heating, and welding the multilayer copper-clad substrate (4) and the cavity structural member (8) on the front surface through heat reflux generated by the reflux heating plate (11);
setting technological parameters of a heating plate, cutting a section of soldering tin wire to be placed around a cavity to be used as an indication solder, heating the cavity to place the indication solder, placing the indication solder around the surface of a disc of a cavity structural member (8), indicating that the solder is molten, and then starting the melting of the solder from a central point to the periphery when the indication solder reaches a molten stateMelting, observing the melting state of the welding area of the solder, adjusting the pressure of a clamp according to the melting time and the state of the solder, adjusting the pressure of a bolt (10) by using a torque screw with the parameter of 70N & lt + & gt, changing the pressure of an L-shaped clamp (3) on the multilayer copper-clad substrate (4) along with the melting of the solder, wetting and diffusing the solder on the surface of the cavity structural member (8), and then preserving heat by 60SAnd observing the molten state and the welding seam state of the solder, adjusting the pressure of the L-shaped clamp (3) for fixing the multilayer copper-clad substrate (4) according to the molten state of the solder and the micro-gap state of the multilayer copper-clad substrate (4) and the disc of the cavity structural member (8), and integrally welding the multilayer copper-clad substrate (4) and the disc of the cavity structural member (8) welded with the SMP radio frequency connector (6) to realize the integral welding of the active array surface of the large-size multilayer copper-clad substrate (4).
2. The method of soldering a phased array active antenna array multi-layer copper clad substrate of claim 1, wherein: the solder adopts 63Sn37Pb alloy solder paste, and the surface of the cavity structural member (8) is a gold plating layer or a silver plating layer.
3. The phased array active antenna array front multilayer copper clad substrate welding method of claim 1, characterized in that: when the solder ring of the SMP radio frequency connector (6) is phi 2.5, the diameter of the solder is phi 0.38mm, the diameter of the cotton ball is phi 4, and the height of the cotton ball is 5mm, tweezers are used to press the cotton balls around the SMP mounting hole, so that the solder ring and the SMP cotton ball are tightly combined.
4. The phased array active antenna array front multilayer copper clad substrate welding method of claim 1, characterized in that: the bottom surface of a multilayer copper-clad substrate (4) faces downwards, a welding surface provided with an SMP connector is upward, the multilayer copper-clad substrate (4) and a nonmetal protective pad (5) are fixed on a convex surface of a tool base (2), and a solder ring, the SMP radio frequency connector (6) and soldering flux are placed in an SMP mounting hole on the reverse side of a cavity structural member (8) supporting a shielding antenna and a TR component.
5. The phased array active antenna array front multilayer copper clad substrate welding method of claim 1, characterized in that: after the cavity structural member (8) is welded, the cavity structural member (8) is moved away from the reflux heating plate (11) by using a heat insulation tool and is placed on a metal plate for natural cooling; soaking the cavity structural part (8) in cleaning solution for 5 minutes until the cotton ball becomes soft, clamping and taking out the cotton ball by using tweezers, then putting the cavity structural part (8) into a container, and carrying out ultrasonic cleaning on the cavity by using alcohol and acetone mixed solution.
6. A phased array active antenna array surface multilayer copper clad substrate welding tool adopting the welding method of claim 1 comprises the following steps: the frock base (2) of a disc slides and connects L shape anchor clamps (3) on frock base (2) circumference admittedly, its characterized in that: the long edge of each L-shaped of the L-shaped clamp (3) points to the circle center in the circumferential direction and is arranged on the circumferential ring groove of the tool base (2) according to the circumference, a sliding groove and a bolt (10) used for fixing the multilayer copper-clad substrate (4) and the cavity structural member (8) are formed in the long edge of each L-shaped, the local bulge of the contact surface of the tool base (2) bears the multilayer copper-clad substrate (4) and the cavity structural member (8), the bulge shape is consistent with the multilayer copper-clad substrate (4), and pressure equalizing in the welding process is achieved.
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| CN109079278B (en) * | 2018-10-10 | 2020-11-13 | 北京遥感设备研究所 | SMP connects pressure self-adjusting welding frock |
| CN112165792B (en) * | 2020-11-02 | 2021-10-12 | 丽水阡陌汽车电子有限公司 | Circuit board elastic sheet welding equipment |
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