CN107745166A - Phased array active antenna front multilayer bonded copper base welding method - Google Patents
Phased array active antenna front multilayer bonded copper base welding method Download PDFInfo
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- CN107745166A CN107745166A CN201710843741.XA CN201710843741A CN107745166A CN 107745166 A CN107745166 A CN 107745166A CN 201710843741 A CN201710843741 A CN 201710843741A CN 107745166 A CN107745166 A CN 107745166A
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- copper base
- solder
- bonded copper
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- structure part
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
Abstract
A kind of a kind of phased array active antenna front multilayer bonded copper base welding method proposed by the present invention, it is desirable to provide welding method that can effectively avoid multilayer bonded copper base welding quality unstable.The technical scheme is that：Prepare a frock consistent with multilayer bonded copper base profile and its circle battle array is distributed in the L-shaped fixture of tool pedestal；Cavity body structure part front welding region applies steel mesh printing solder, and places being heated at reflux on plate of heater；Prepare a frock consistent with multilayer bonded copper base profile and its circle battle array is distributed in the L-shaped fixture of tool pedestal；Multilayer bonded copper base surface is provided with SMP welding up, is fixed on tool pedestal crowning, and solder ring, SMP radio frequency connectors are placed in cavity body structure part reverse side SMP mounting holes and applies scaling powder；Tin is warded off at the multilayer bonded copper base back side, and multilayer bonded copper base is fixed on pin and applies fluxing agent cavity body structure part solder side, is placed in being heated at reflux on plate of heater；Heat backflow front welding multilayer bonded copper base and cavity body structure part, while SMP radio frequency connectors are welded to the cavity body structure part cavity back side.
Description
Technical field
The present invention relates to a kind of ㎜ large scale multilayers bonded copper base 4 of the ㎜ of phased array active antenna front 14mm × 216 × 3.5
Welding tooling and its metallic carrier and radio frequency connector integration welding technique.
Background technology
With the fast development of microelectric technique and large scale integrated circuit, antenna is set to turn into huge, stupid in electronic equipment
The problem of heavy parts, becomes prominent, and the demand that can coordinate with instrument size and have the miniature antenna of effective electrical property is compeled further
Cut.Millimeter Wave Phased Array Antenna is more and more frivolous and develops towards conformal bending direction.Millimeter wave two dimension active phase array antenna
It is characterized in that scale is big, integrated level is high, it is desirable to device miniaturization and adaptation stage+module.Generally realize that High Density Integration two dimension has
Source phased array antenna, two kinds are divided by Circuit assembly form：Horizontal integrating is longitudinally assembled i.e. " tile style "；Top-down design laterally assembles
That is " brick ".Tile style phased array mode is distributed in MMIC in the plane parallel with antenna opening diametric plane, passes through the stacking of longitudinal direction
Assembling forms phased array.Data-Link antenna, satellite communication antena, the airborne terminal dual-mode antenna of unmanned plane satellite communication etc. between machine
The band phased array antenna system employed, though having antenna house protection and encapsulation process, inner antenna structure is it is possible to be exposed to
In air, system long-term reliability still deposits larger hidden danger.In structure and process aspect, be presented as the size of microstrip antenna front with
The increase of antenna aperature and array element quantity and increase, the complexity and precision of microstrip antenna front shape are with working frequency
Improve and increase, the assembly reliability demand of antenna array is as aerial position to differentiation conformal out of my cabin from increasing in cabin.
Millimeter Wave Phased Array Antenna system transmits face, ground plane and metalized ground hole, surface mounted package SMP solder joint groups by signal
Into, active front-side circuit, and the T/R module numbers arranged in antenna array are more, and thousands of are dispersed with antenna array
T/R components, they arrange it is compact, heat-dissipating space is small, and this make it that the heat flow density of antenna array is very big, if these heats can not and
When taken away from antenna array, can cause antenna array temperature raise, cause T/R assembly properties decline in addition fail.Millimeter wave phase
Control battle array microstrip antenna generally use has more than 300 6SMP radio frequency connectors 6, active antenna front generally refined imperial CLTE-XT
Series and Tai Kangli TSM-DS3PTFE series multilayers bonded copper base 4, gross thickness is 0.55~3.3mm, and substrate size size is not
Deng circuit substrate full-size has a ㎜ of the ㎜ of 14mm × 216 × 3.5 at present, active circuit more than 80, SMP radio frequency connectors 6, more
Layer bonded copper base 4 welds with silver-plated cavity body structure part 8.Circuit design density is high on the active front substrate of multilayer, and amount of solder is whole
One of individual welding process key point, the extremely difficult control of amount of solder.Because substrate size is big and thick, welding pressure is difficult control.
Microstrip antenna is a kind of new antenna gradually to grow up in the past 30 years.Conventional microstrip antenna is in two-sided deposited
Copper low loss dielectric substrate is (such as on polytetrafluoroethylglass glass fiber cloth substrate (PTFE), simultaneously as metal ground plate, another side
The methods of passing through photoetching corrosion produces the metal patch of definite shape, using microstrip line and axis probe to patch.Should
Antenna array does not wait power splitter and 4 to form feeding network with phase cable using one point four, and 4 microstrip antenna submatrixs are synthesized always
Battle array.The assembling of phased array microstrip antenna is extremely complex, and thickness has greatly PTFE printed circuit boards again, substrate penetration rate, aligning accuracy and SMP
The extremely difficult control of short circuit, the SMP of welding more than more than 300 are needed on structural member, it is desirable to weld printed circuit board and surface mounted package
During SMP connectors, solder cannot flow into air chamber, and one all can not be short-circuit, if welding temperature, time, pressure and solder
It is improper to measure the state modulator being mutually matched, will result in welding failure.Gu the welding of large scale, multilayer active base plate is micro-group dress work
One of critical process in skill technology, assembling difficulty are very big.Phased array antenna process oriented proposes large area, highly reliable connection
Challenge and the difficulty of Challenges for Future will also constantly rise.For this structure function part of microstrip antenna front, micro-strip plate with
The fit on of structural member, because the space of antenna is smaller, general spiral shell dress mode is difficult to connect, can be more ripe by coordinating
The techniques such as welding.But due to more than soldering apparatus part and circuit layout density is high and complicated, realize that ladder weldering needs to rationally design peace
Dress order and thermograde, this is also one of difficult point of design.Alternative is spiral shell dress, is glued and welds current line in the industry.But
It is larger problem at present be present in face of current large area, highly reliable connection requirement, these three Joining Technology methods.
Spiral shell dress method technique is simple, speed is fast, cost is low, can repair, but spiral shell dress can not meet large area in principle
Be reliably connected demand.Screw after spiral shell load connects, is particularly by local pressure connection micro-strip plate and metallic carrier mechanically
When connection area is big, screw number is limited, can still there is substantial amounts of the air gap on faying face, can be to micro-strip plate under high frequency characteristics
And the electrical property of circuit unit causes to have a strong impact on.The adhesion that other spiral shell load connects is difficult to grasp, and adhesion deficiency can cause
Connection is not close, and adhesion too conference causes stress concentration micro-strip plate is locally deformed with or is ftractureed.
Adhering method is popularization and application of the multi-layer sheet laminating technology between foreign material.Lamination process method is in vacuum condition
Lower solidification adhesives, the good bonding effect in " no cavity " can be reached.But it is constrained to adhesives itself physicochemical property
And feature, the long-term reliability of technique for sticking method be not high.The bonding materials of thermosetting/plasticity can be selected in difference according to demand in engineering
Material, the conduction property of material can be realized by adding metallic particles (such as silver powder).Thermoplastic after being heated due to that can occur
Softening transform melts phenomenon again, and application is narrow.The epoxy-based thermosetting adhesives most often selected, the characteristics of its is maximum are low
Warm fragility, when the coefficient of thermal expansion of micro-strip plate and metallic carrier difference is larger, it can produce bonding layer under long-term high/low temperature condition
Crackle, long-term reliability be not high.Although the conduction of welding technique, heat conductivility and bonding strength are better than to a certain extent
It is glued and with the obvious advantage on long-term reliability.But microstrip antenna front large-area welding technology aspect is realized at present still
It is immature, in terms of being mainly reflected in following four：
The selection of the shape of solder, the mode that current process method relies primarily on slicker solder weld tabs realize the application and control of solder,
Weld tabs needs to be caused second of pollution with laser cutting welding cavity geometry, cutting process, even cleaned, it is also difficult to removes dry
Only, cause the effect of impregnation of substrate and cavity is poor, large area cavity.Penetration rate is extremely limited, due to PTFE printed circuit thicknesss of slab
And it is big, amount of solder, welding pressure, it is mutually matched parameter between weld interval and can not accurately controls, will result in short circuit or weldering
Saturating rate is low, is generally not more than 50%, following high band micro-strip plate can not be met to penetration rate and the high request of reliability.
The uncontrollable large scale of Stepped welding quality, multilayer active base plate and SMP radio frequency connectors 6 not in same solder side,
Welded using Stepped welding mode, SAC welding substrate and cavity front, the cavity back side of slicker solder welding SMP radio frequency connectors 6,
Several aspects be present and fly problem：First, tin-silver-copper solder wellability and diffusivity are poor；Second, cavity is welded by secondary back
Increase, third, Fixture Design, assembling complexity, the frock of a crimping substrate, welding SMP frock, upper and lower two layers of frock
It is fixedly mounted, the volume for causing entirely to weld increases, and thickness increase, weld interval is consequently increased, and substrate silver coating changes
Become, scaling powder volatilizees totally, does not have exhaust passage again, and also not visible in welding process.
In terms of Fixture Design and erection sequence, spring frock control pressure, and bullet are mainly applied in the design of current frock
Spring density is higher, causes pressure excessive or too small, and excessive solder is all spilt into SMP holes, has between too small substrate and cavity
Slit, cause failure welding.Next to that Fixture Design erection sequence, substrate circuit is face-up, the patch of substrate solder side and cavity
Conjunction state can not judge substantially, first, causing pressure blindly, second, welding is internal without exhaust hole, cause welding to fail.
The content of the invention
The purpose of the present invention is directed in place of above-mentioned the deficiencies in the prior art, there is provided one kind can realize large scale, multilayer
Bonded copper base welds, and can effectively improve welding efficiency and quality, can effectively avoid a series of costs, pipe caused by above-mentioned factor
The welding tooling and its welding method of the influence of reason and welding quality unstable.
The above-mentioned purpose of the present invention can be reached by following measures, and a kind of phased array active antenna front multilayer applies copper
Substrate welding method, it is characterised in that comprise the following steps：Prepare one and the consistent work of facial contour is contacted with multilayer bonded copper base 4
Dress and its circle battle array are distributed in the L-shaped fixture 3 of tool pedestal 2, and the long side of each L-shaped points to the center of circle in the circumferential；Multilayer applies copper
Substrate 4 is formed with active circuit perforate 7 with surface and encapsulation SMP radio frequency connectors 6 do not face in same solder side, passive circuit
Under, surface is provided with SMP welding up, and multilayer bonded copper base 4 is fixed on the crowning of tool pedestal 2 with nonmetallic neonychium 5,
Support screened shielded antanna, TR components the reverse side SMP mounting holes of cavity body structure part 8 in place solder ring, SMP radio frequency connectors 6 and
Apply scaling powder, the mounting hole of SMP radio frequency connectors 6 is blocked using cotton ball 1, hole between its solder ring, cotton ball is closely tied
Close non-loosening；Then apply steel mesh printing solder on the welding region position of cavity body structure part 8, then steel mesh Printing Paste is coated
To the solder side of multilayer bonded copper base 4 and cavity body structure part 8, and being heated at reflux on plate 10 of heater 9 is placed, make its solder equal
Uniform flow is put down, and is treated that solder all melts, is removed cavity body structure part 8 and cool down, standby；Warded off at the back side of multilayer bonded copper base 4 one layer of densification,
Uniformly, tin layers are continuously coated, and it is standby；Multilayer bonded copper base 4 is fixed on into painting fluxing agent cavity body structure part 8 with pin to weld
Junction, and the end for adjusting L-shaped fixture 3 makes it weld multilayer bonded copper base 4 and combined closely with frock, is placed in bolt pressure
Heater 9 is heated at reflux on plate；Heater 9 is heated to reflux heating plate 11, by being heated at reflux heat backflow caused by plate 11 just
Face welding multilayer bonded copper base 4 and cavity body structure part 8, while SMP radio frequency connectors 6 are welded to the cavity back side of cavity body structure part 8,
Melt solder state and weld seam state are observed, the microgap state depending on its melt solder state and with cavity body structure part 8, adjusts L
Clamp 3 fixes the pressure of multilayer bonded copper base 4, and multilayer bonded copper base 4 and 6 active front of SMP radio frequency connectors are integrally welded
Connect.
The present invention has the advantages that compared to prior art：
Penetration rate is high.The present invention fixes multilayer bonded copper base 4 using steel mesh Printing Paste to the solder side of cavity body structure part 8, pin,
The welding integrated with 6 solder of the same race of 6SMP radio frequency connectors of cavity body structure part 8 and the matched design of frock and pressure, use are of the same race
Solder integration welding substrate, cavity body structure part 8 and 6SMP radio frequency connectors 6, it is ensured that large scale multilayer bonded copper base 4 weld and
SMP radio frequency connectors 6 are without short circuit, and no large area cavity, penetration rate is high, and conformity of production is preferable, realizes large scale, multilayer has
The integration welding of source antenna front, and the welding of any large scale, multilayer bonded copper base 4 can be general, shortens production
Flow, reduce production cost, improve the quality of production and production efficiency.Printed by steel mesh and apply soldering paste to cavity welding,
Then it is heated to reflux, realizes that the infiltration of the solder side solder-coated layer of cavity body structure part 8 is good, amount of solder control is accurate, effectively improves
The penetration rate of multilayer bonded copper base 4；Soldering paste is applied in the solder side of cavity body structure part 8 by steel mesh, so as to realize that solder quantifies, and it is full
Sufficient conformity of production, efficiency also greatly improve.The cavity body structure part 8 for applying soldering paste is placed into warm table backflow, weldering can be fixed
The position of material, and lead-tin soldering soldering paste and the silver-plated wellability of cavity body structure part 8 are very good, so as to realize cavity coat uniformly,
Continuously, it is fine and close.By validation trial, when steel mesh opening shape and cavity body structure part 8 are consistent, area reduces 20%, steel mesh
The ㎜ of thickness 0.16~0.18, to perforate wedge angle rounding, substrate welding effect is preferable, while it is also preferable to weld uniformity.Ward off tin thickness
Degree controls the area by calculating welding substrate, is multiplied by the thickness for warding off tin, is warded off the amount of tin every time.By being warded off in substrate back
Tin, realize that same material is welded, multilayer bonded copper base 4 infiltrates well with cavity body structure part 8 in melting process is welded, but also
Can be according to the welding region solder reflux state of cavity body structure part 8, adjust multilayer bonded copper base 4 wards off tin amount, it is ensured that solder control
System is accurate, by validation trial, reduces 20% when warding off tin area, flatiron temperature is arranged on 450~500 DEG C, and solder stick is straight
Footpath 0.38mm, substrate welds effect are preferable.Avoid PTFE printed circuits thickness of slab and big, circuit layout density height, welding process
The problem of middle solder is not easy to infiltrate.
Welding effect is good.The present invention is for large scale, multilayer bonded copper base 4 with SMP radio frequency connectors 6 not in same weldering
Junction, using multilayer bonded copper base 4 and the welding of the front of cavity body structure part 8, SMP radio frequency connectors 6 are welded at the cavity back side and SMP
Single independent welding, realize that substrate, cavity body structure part 8 weld with SMP using solder of the same race is integrated, can both prevent SMP from falling
Fall, a series of problem that and can avoids large-scale frock and secondary back is brought, SMP mounting holes are blocked using cotton ball, passed through
Validation trial, when the solder ring of SMP radio frequency connectors 6 is φ 2.5, solder a diameter of φ 0.38mm, a diameter of φ of cotton ball
4, the high 5mm of cotton balls, the cotton balls of SMP mounting hole surroundings is pressed using tweezers, hole between its solder ring, SMP cotton balls is closely tied
Close.Welding effect is preferable, and for contact without coming off, rosin joint is short-circuit.Bent clamp pressure is adjusted by torque screwdrivers, makes it
Pressure is balanced, so as to realize good welding.By validation trial, when welding tooling face and the shape of multilayer bonded copper base 4
Unanimously, height of projection 3mm, 10 bent clamps of design and installation in tool pedestal, torsion parameter are 70N ﹒ m, are incubated 60S, weldering
Connect and work well, substrate penetration rate reaches more than 85%, and active circuit and connector are without short circuit, rosin joint etc..
Production cost substantially reduces.By the matched design of frock and pressure, welding pressure can control, and solder will not overflow
Go out, active circuit and SMP will not short circuits；Production efficiency improves more than 100%, substrate, cavity and SMP solder integrated weldings of the same race
Connect, reduce secondary back process, meanwhile, welding quality also improves therewith.Greatly reduce assembler and technological design personnel
Workload, production cost substantially reduces, and efficiency significantly improves.
More to radio frequency connector quantity using the present invention, welding density is high, and large-sized phased array antenna multilayer is applied copper-based
Plate, it is possible to achieve penetration rate is high, aligning accuracy is high, radio frequency connector welding success rate is high, more than 300 SMP radio-frequency contact parts
Not short-circuit, not rosin joint, 4 circuit holes of bonded copper base of multilayer more than 80 are not short-circuit, and solder is accumulated without excess solder.Improve welding quality,
The quality control of welding process can be realized.
Brief description of the drawings
Fig. 1 is phased array active antenna front multilayer bonded copper base welding tooling organigram of the present invention.
What Fig. 2 showed is the welding process figure of phased array active antenna front multilayer bonded copper base of the present invention.
In figure：1 cotton balls, 2 tool pedestals, 3L clamps, 4 multilayer bonded copper bases, 5 nonmetallic neonychiums, 6SMP radio frequencies connect
Plug-in unit, 7 active circuit perforates, 8 cavity body structure parts, 9 heaters, 10 bolts, 11 are heated at reflux plate
The present invention is further illustrated with reference to the accompanying drawings and examples, but does not therefore limit the present invention to described embodiment
Among scope.
Embodiment
Refering to Fig. 1.According to the present invention, prepare one and the consistent frock of facial contour and its circle are contacted with multilayer bonded copper base 4
Battle array is distributed in the L-shaped fixture 3 of tool pedestal 2, and the long side of each L-shaped points to the center of circle in the circumferential；Multilayer bonded copper base 4 and table
Face is formed with active circuit perforate 7 and encapsulation SMP radio frequency connectors 6 not in same solder side, and passive circuit is face-down, surface installation
There is SMP welding up, multilayer bonded copper base 4 is fixed on the crowning of tool pedestal 2 with nonmetallic neonychium 5, in cavity body structure
Solder ring, SMP radio frequency connectors 6 are placed in the reverse side SMP mounting holes of part 8 and applies scaling powder, blocking SMP using cotton ball 1 penetrates
The mounting hole of frequency connector 6, hole is set between its solder ring, cotton ball to combine closely non-loosening；Then in the weld zone of cavity body structure part 8
Apply steel mesh printing solder on the position of domain, then steel mesh Printing Paste is coated to the weldering of multilayer bonded copper base 4 and cavity body structure part 8
Junction, and being heated at reflux on plate 11 of heater 9 is placed, make the uniform levelling of its solder, treat that solder all melts, remove cavity knot
Component 8 cools down, standby；Warded off at the back side of multilayer bonded copper base 4 one layer of densification, uniformly, continuously coat tin layers, it is and standby；To be more
Layer bonded copper base 4 is fixed on pin applies the solder side of fluxing agent cavity body structure part 8, and adjusts the end of L-shaped fixture 3 to bolt pressure
Power, it is welded multilayer bonded copper base 4 and combined closely with frock, be placed in being heated at reflux on plate for heater 9；Heater 9 adds
Heat is heated at reflux plate 11, by being heated at reflux heat backflow front welding multilayer bonded copper base 4 caused by plate 11 and cavity body structure part
8, while SMP radio frequency connectors 6 are welded to the cavity back side of cavity body structure part 8, melt solder state and weld seam state are observed, depending on it
Melt solder state and the microgap state with cavity body structure part 8, adjustment L-shaped fixture 3 fix the pressure of multilayer bonded copper base 4,
6 active front of multilayer bonded copper base 4 and SMP radio frequency connectors is integrally molded.
A kind of welding tooling of phased array active antenna front multilayer bonded copper base 4, including：One discoidal tool pedestal
2, slip connects firmly the L-shaped fixture 3 on the circumference of tool pedestal 2, and the long side of each L-shaped of L-shaped fixture 3 points to circle in the circumferential
The heart, circumferentially it is arranged in the circumferential groove in its end portion of the tool pedestal 2, is formed with the long side of L-shaped for fixing multilayer bonded copper base 4
With the chute with bolt 10 of cavity, while bolt 10 can be used to adjust pressure position and pressure；The contact surface of tool pedestal 2 is local
Projection carrying multilayer bonded copper base 4 and cavity body structure part 8, convex shape is consistent with multilayer bonded copper base 4, is welded so as to realize
Pressure in journey.Nonmetallic neonychium 5 can be that polytetrafluoroethylene (PTFE) neonychium is used for protecting multilayer bonded copper base 4.Multilayer applies copper
Substrate 4 contacts that facial contour is consistent with tool pedestal 2, and the surface of tool pedestal 2 is formed with active circuit perforate 7 and not in same welding
The encapsulation SMP radio frequency connectors 6 in face, surface are provided with SMP solder side towards the end of L-shaped fixture 3 to bolt.Multilayer is applied copper-based
The bottom of plate 4 is face-down, is fixed on the nonmetallic neonychium 5 of the crowning of tool pedestal 2, contributes to pressure balanced, and protect more
Layer bonded copper base 4 is not damaged.To ensure large scale, the circuit of multilayer bonded copper base 4 and the good welding of cavity body structure part 8, weldering
Material selects 63Sn37Pb solder soldering paste, and the surface of cavity body structure part 8 is Gold plated Layer or silver coating.
When the solder ring of SMP radio frequency connectors 6 is φ 2.5, a diameter of φ 0.38mm of solder, a diameter of φ 4 of cotton ball, cotton balls
High 5mm, the cotton balls of SMP mounting hole surroundings is pressed using tweezers, hole between its solder ring, SMP cotton balls is combined closely.
Refering to Fig. 2.The antenna integrated welding concrete operation step in the active front of large scale, multilayer is as follows：
Steel mesh printing solder is applied on cavity body structure part 8, makes the solder control of welding region position accurate, is then printed using steel mesh
Brush soldering paste to cavity body structure part 8, make its soldering paste uniformly, it is continuous, steel mesh thickness is 0.16~0.18 ㎜, steel mesh dimensional contraction 20%
Left and right；Then the cavity body structure part 8 for applying soldering paste is placed and flowed back in backflow heating plate 10, make the uniform levelling of its solder, it is to be welded
Material all meltings, remove cavity body structure part 8 and cool down, standby；
Using warding off tin wards off tin at the back side of multilayer bonded copper base 4 by hand, flatiron temperature is arranged on 450~500 DEG C, solder stick diameter phi
0.38mm-0.43mm, it is presented one and wards off tin area diminution at least 20%, fine and close, uniform, continuous coat, make solder levelling
Uniformly continuous, it is standby；
Apply scaling powder in the reverse side SMP holes of cavity body structure part 8, then place diameter phi 0.38mm solder ring and SMP radio frequencies
Connector 6, then diameter phi 4, high 5mm cotton balls 1 are filled SMP mounting holes, its connector is closely tied with cavity body structure part 8
Close, non-loosening.
Multilayer bonded copper base 4 is fixed on pin and applies the solder side (front) of fluxing agent cavity body structure part 8, makes its contraposition
Accurately, then mounting tool successively, makes it weld multilayer bonded copper base 4 and is combined closely with frock；Cavity body structure part (8) is placed
It is heated at reflux on plate (11) and is heated, one section of solder stick of cutting is placed on cavity surrounding as instruction solder, will indicate solder
Be placed on the surrounding on cavity body structure part (8) surface, then, when indicating that solder reaches molten condition, solder it is molten from central point to
Surrounding starts to melt, it was observed that when solder welds big junction product melting, according to melt solder time and state, uses parameter as 70N ﹒
The pressure of m torsion screw adjustment bolt (10), make solder in cavity body structure part (8) moistened surface and spread, be then incubated
60S.Because multilayer bonded copper base 4 is thick, L-type fixture changes to the pressure of multilayer bonded copper base 4 with melt solder, depending on its weldering
Expect molten condition, and the microgap state of multilayer bonded copper base 4 and cavity body structure part 8, it is copper-based finally to realize that large scale, multilayer are applied
The active front of plate 4 is integrally molded.
Cavity body structure part 8 welds completion and finished, and is moved away from cavity body structure part 8 with heat-insulated instrument and is heated at reflux plate 10, puts gold
Belong to natural cooling on plate；Cavity body structure part 8 is immersed in cleaning fluid, 5 minutes time, so that cotton balls softens, pressed from both sides with tweezers
Capture out, then cavity body structure part 8 is put into container, cavity be cleaned by ultrasonic clearly using alcohol, acetone mixed solution
Wash.
Claims (10)
1. a kind of phased array active antenna front multilayer bonded copper base welding method, it is characterised in that comprise the following steps：Prepare
One contacts the consistent frock of facial contour with multilayer bonded copper base (4) and its justifies the L-shaped fixture that battle array is distributed in tool pedestal (2)
(3), by surface be formed with not same solder side active circuit perforate (7) and be packaged with the multilayers of SMP radio frequency connectors (6) and apply
Copper base (4) Active Phased Array is face-up, and passive array is face-down, is fixed on tool pedestal (2) crowning；Then shield in support
Placement solder ring, SMP radio frequency connectors in cavity body structure part (8) reverse side SMP mounting holes of antenna, TR components is covered on (6) to apply
Scaling powder, SMP radio frequency connectors (6) mounting hole is blocked using cotton ball (1), hole between its solder ring, cotton ball is closely tied
Close non-loosening；Secondly apply steel mesh printing solder on cavity body structure part (8) welding region position, steel mesh Printing Paste is coated
To multilayer bonded copper base (4) and the solder side of cavity body structure part (8), it is positioned over being heated at reflux on plate (10) for heater (9) and adds
Heat, treat that solder all melts uniform levelling, remove cavity body structure part (8) cooling, it is standby；Warded off at multilayer bonded copper base (4) back side
One layer of densification, uniformly, continuously coat tin layers, it is and standby；Multilayer bonded copper base (4) is fixed on pin and applies fluxing agent chamber
Body structural member (8) solder side, and the end for adjusting L-shaped fixture (3) makes its multilayer bonded copper base (4) and frock tight to bolt pressure
Close combination, then be placed in and be heated at reflux on plate (11)；Copper is applied by being heated at reflux heat backflow front welding multilayer caused by plate (11)
Substrate (4) and cavity body structure part (8), while SMP radio frequency connectors (6) are welded to cavity body structure part (8) cavity back side, observation weldering
Expect molten condition and weld seam state, the microgap state depending on its melt solder state and with cavity body structure part (8), adjustment L-shaped folder
Has the pressure of (3) fixed multilayer bonded copper base (4), by multilayer bonded copper base (4) and the active front one of SMP radio frequency connectors (6)
Body welds.
2. phased array active antenna front multilayer bonded copper base welding method as claimed in claim 1, it is characterised in that：Solder
From 63Sn37Pb solder soldering paste, the surface of cavity body structure part 8 is Gold plated Layer or silver coating.
3. phased array active antenna front multilayer bonded copper base welding method as claimed in claim 1, it is characterised in that：Steel mesh
Thickness is 0.16~0.18 ㎜, steel mesh dimensional contraction 15%-25%.
4. phased array active antenna front multilayer bonded copper base welding method as claimed in claim 1, it is characterised in that：When
SMP radio frequency connectors (6) solder ring is φ 2.5, a diameter of φ 0.38mm of solder, a diameter of φ 4 of cotton ball, the high 5mm of cotton balls, is made
With the cotton balls of tweezers pressing SMP mounting hole surroundings, hole between its solder ring, SMP cotton balls is set to combine closely.
5. phased array active antenna front multilayer bonded copper base welding method as claimed in claim 1, it is characterised in that：Using
Warding off tin wards off tin at multilayer bonded copper base (4) back side by hand, and flatiron temperature is arranged on 450~500 DEG C, solder stick diameter 0.38mm-
0.43mm, it is presented one and wards off tin area diminution at least 20%, fine and close, uniform, continuous coat.
6. phased array active antenna front multilayer bonded copper base welding method as claimed in claim 1, it is characterised in that：By chamber
Body structural member (8) is placed to be heated in backflow heating plate (11), and one section of solder stick of cutting is placed on cavity surrounding as instruction
Solder, it will indicate that solder is placed on the surrounding on cavity body structure part (8) surface, then, when indicating that solder reaches molten condition, weldering
Material is molten to be melted since central point is to surrounding, it was observed that when solder welds big junction product melting, according to melt solder time and state,
Parameter is used as the pressure of 70N ﹒ m torsion screw adjustment bolt (10), make solder in cavity body structure part (8) moistened surface simultaneously
Diffusion, is then incubated 60S.
7. phased array active antenna front multilayer bonded copper base welding method as claimed in claim 1, it is characterised in that：Multilayer
It is consistent that bonded copper base (4) contacts facial contour with tool pedestal (2), and multilayer bonded copper base (4) is formed with active circuit perforate (7) and not
In the encapsulation SMP radio frequency connectors (6) of same solder side, surface be provided with SMP solder side towards the end of L-shaped fixture (3) to
Bolt.
8. phased array active antenna front multilayer bonded copper base welding method as claimed in claim 1, it is characterised in that：Multilayer
Bonded copper base (4) bottom is face-down, is fixed on the nonmetallic neonychium (5) of tool pedestal (2) crowning.
9. phased array active antenna front multilayer bonded copper base welding method as claimed in claim 1, it is characterised in that：Cavity
Structural member (8) welding finishes, and is moved away from cavity body structure part (8) with heat-insulated instrument and is heated at reflux plate (11), is placed on metallic plate certainly
So cooling；Cavity body structure part (8) is immersed in cleaning fluid, 5 minutes time, softening cotton balls, is clamped and taken out with tweezers, then will
Cavity body structure part (8) is put into container, and ultrasonic cleaning cleaning is carried out to cavity using alcohol, acetone mixed solution.
A kind of 10. Welder of phased array active antenna front multilayer bonded copper base 4 using welding method described in claim 1
Dress, including：One discoidal tool pedestal (2), slip connect firmly the L-shaped fixture (3) on tool pedestal (2) circumference, and it is special
Sign is：The long side of each L-shaped of L-shaped fixture (3) points to the center of circle in the circumferential, is circumferentially arranged in the tool pedestal (2)
Circumferential groove in its end portion on, the chute with bolt (10) for fixing multilayer bonded copper base (4) and cavity is formed with the long side of L-shaped,
Tool pedestal (2) contact surface local crowning carrying multilayer bonded copper base (4) and cavity body structure part (8), convex shape is applied with multilayer
Copper base (4) unanimously, realizes the pressure in welding process.
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| CN201710843741.XA CN107745166B (en) | 2017-09-15 | 2017-09-15 | Welding method for phased array active antenna array surface multilayer copper-clad substrate |
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| CN201710843741.XA CN107745166B (en) | 2017-09-15 | 2017-09-15 | Welding method for phased array active antenna array surface multilayer copper-clad substrate |
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Also Published As
| Publication number | Publication date |
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| CN107745166B (en) | 2022-07-08 |
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