CN106425103B - A kind of welding method of infrared laser to non-ferrous metal - Google Patents
A kind of welding method of infrared laser to non-ferrous metal Download PDFInfo
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- CN106425103B CN106425103B CN201610929324.2A CN201610929324A CN106425103B CN 106425103 B CN106425103 B CN 106425103B CN 201610929324 A CN201610929324 A CN 201610929324A CN 106425103 B CN106425103 B CN 106425103B
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- 238000003466 welding Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 24
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 239000002184 metal Substances 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 9
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims description 43
- 239000013307 optical fiber Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000009736 wetting Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 230000007306 turnover Effects 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 230000000007 visual effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 20
- 238000007747 plating Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/211—Bonding by welding with interposition of special material to facilitate connection of the parts
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
A kind of welding method the present invention relates to infrared laser to non-ferrous metal, belong to Laser Processing solder technical field.It is accurately positioned using visual-alignment technology, carries out texturing pretreatment using low frequency laser by pin pin are electroplated on connector, recycle high-frequency laser to heat pin toe featherings region.The present invention has the characteristics that small reflection, local heating, quickly heats, quickly cools down, and can effectively reduce the fire damage of pin pin elements, and can solve the problem that the problem of tin material is ascended, and is greatly enhanced solder yield.
Description
Technical field
The present invention relates to Laser Processing solder technical field, and in particular to a kind of welding of infrared laser to non-ferrous metal
Method.
Background technology
With the raising of electronic industrial products design level and manufacturing technology, laser soldering technology is continued to develop, existed
It is used widely in electronics industry.In recent years, with electronic product towards it is multi-functional, miniaturization direction development, PCBA（Will
Various electronic devices are assembled in the circuit board by surface packaging technique）Process technology and the continuous of electronic components density carry
Height, high pad number, ultra-fine pin pin spacing high density, miniaturized electronic component appearance, the size for interconnecting solder joint constantly subtracts
Small, interconnection welding spot reliability also requires more and more higher so that the interconnection technique of electronic component is faced with increasing challenge.
At the same time, just worldwide carry out for the needs of environmental protection, " unleaded " of solder, due to applicable unleaded pricker
Material（Such as Sn-Ag-Cu solders）Fusing point be generally higher by 30-40 DEG C than Sn-Pb solder, thus cause the soldering peak value of lead-free brazing
Temperature reaches more than 250 DEG C, easily makes electronic component thermally damaged.High-density packages device has not only been further exacerbated by draw
" bridging " problem of wire bonding point, is also proposed newly to the Mutual Influence Law between soldering processes, baseplate material, and different materials
Requirement.
At present, QFP (Quad flat package) pin pin center spacing minimum has reached 0.2mm, single device
On pin pin numbers can reach more than 80.The methods of traditional wave-soldering, IR reflow soldering, welds this kind of thin space pin pin
When, " bridging " of adjacent pin pin solder joint easily occurs, is extremely difficult to stable yields.It is soft also to there is similar laser now
The processing method of soldering, a kind of laser soldering method of Patent No. 200910189069, for processing PCB A insert pin,
Wire rod and PCBA welding there is no open defect, but for the laser soldering of PCBA and plating pin pin welding can be caused unstable
Fixed phenomenon, because laser soldering is using continuous or Gao Zhongying laser welding, plating pin pin and the pre- upper soldering on PCBA
Disk is in close contact, and plating pin pin typically use copper gold coated article and alloy nickel plating part, have high reflection to above two laser
Property, pin pin absorption laser energy is unstable to cause heat transfer to the pre- upper inconsistent influence welding yields of soldering disk energy.
The content of the invention
A kind of the defects of purpose of the present invention is aiming at prior art, there is provided welding side of infrared laser to non-ferrous metal
Method.Laser soldering field especially suitable for PCBA and pin pin.
The technical solution adopted by the present invention is：Including：It is accurately positioned, will be electroplated on connector using visual-alignment technology
Pin pin carry out texturing pretreatment using low frequency laser, recycle high-frequency laser to heat pin toe featherings region.
In such scheme, using Gao Zhongying optical fiber laser.
Specifically include following steps：
(1), regulation optical system first makes laser spot 1-5mm above finished surface, makes CCD focus and processing table
Face overlaps；
(2) after the pre- upper Sion of PCBA pads to be welded, is installed into band pin pin connectors, it is integrally attached in tool, controls
Tool is fixed in two-dimensional stage；
(3), using computer panel card and visual-alignment welding control software, adjusting two-dimensional stage and hoistable platform makes PCBA
On " mark " point, shown in CCD field of view center clearly, carry out " mark " point masterplate；
(4) pin toe feathering figures, are carried out in visual-alignment welding control software according to PCBA pad sizes, setting is suitable
Laser pulse width, low frequency, speed of welding, processing pass；
(5) the masterplate attribute and pin toe feathering figure coordinates of visual-alignment " mark " point, are adjusted, is made with visual-alignment
Laser is accurately beaten carries out texturing among pin pin to pin pin；
(6) pin pin weld pattern and texturing figure weight, are carried out in visual-alignment welding control software according to PCBA pad sizes
Close, set suitable laser pulse width, high-frequency, speed of welding, processing pass；
(7) laser, is triggered, with visual-alignment under laser emission effect, pre- upper tin fusing, the tin of melting welds to PCBA
Auxiliary exhibition wetting between disk and pin pin contact surfaces；
(8) laser, is closed, tin material natural cooling, forms solder side.
In above-mentioned technical proposal, luminous energy caused by described Gao Zhongying optical fiber laser, laser parameter be wavelength 1055-
1070nm, mean power 20W, highest single pulse energy 1.2mJ, the beam quality M2 factors are less than or equal to 1.3, minimum pulse width
2nm。
Further, in above-mentioned steps (1), laser spot 1-5mm above finished surface makes the laser facula be
70-90um, coaxial vision alignment system CCD focus overlap with finished surface.
Further, in above-mentioned steps (2), PCBA pad sizes are 0.4X0.2mm-2.0X1.5mm, spacing 0.2-
1mm, it is two-sided to share 10-80 pads, the band two-sided shared 10-80 pin pin of pin pin connectors, wide 0.2-1.5mm.
Further, in above-mentioned steps (4), parameter be 1-5um of laser pulse width, 13-50KHZ of frequency, Lase times 2-
8 times, 30-100mm/s of laser speed.The effect of the step be using low frequency, narrow spaces, at a slow speed by pin pin carry out hair
Change, the plating pin pin oxides after texturing easily absorb luminous energy.
Further, in above-mentioned steps (5), regulation " mark " point masterplate attribute, make overall positioning precision for ±
0.02mm.The effect of the step is to be accurately positioned laser, improves welding quality.
Further, in above-mentioned steps (6), setup parameter be 10-50um of laser pulse width, 100-1000KHZ of frequency, swash
Light number 10-20 times, 100-1200mm/s of laser speed.The effect of the step is using high-frequency, long pulsewidth, quickly made
Pre- upper tin fusing, the tin of melting soak to auxiliary exhibition between PCBA pads and pin pin contact surfaces.
Further, in above-mentioned steps (7) or (11), two-dimensional stage remains stationary state in During laser emission.
Further, after above-mentioned steps (8), comprise the following steps：
(1), if justifying PCBA is multiple, mobile two-dimensional stage puts " mark " on next PCBA and enters CCD
Field of view center；
(2) pin toe featherings and weld pattern and parameter, are readjusted, sets suitable laser pulse width, frequency, welding speed
Degree, processing pass；
(3), retriggered laser, the pre- upper tin of PCBA pads is made to be filled between pad and pin pin contact surfaces with visual-alignment
Divide auxiliary exhibition；
(4) laser, is closed, liquid tin natural cooling, forms solder side；
(5) it, will be repeated the above steps after PCBA turn-overs and complete welding processing.
The present invention, to infrared laser absorptivity principle, is accurately positioned using visual-alignment technology, used according to non-ferrous metal
Gao Zhongying optical fiber laser will carry out texturing pretreatment reduction reflection increase absorption by plating pin pin on connector with low frequency laser
Rate, recycle high-frequency laser to heat pin toe featherings region, with the increase of laser energy, pin pin high density,
The pre- tin for making pin pin and contact pads face by heat transfer under the laser action of high-energy produces more turbulent flows and disturbance, from
And enough thermodynamic conditions are provided, promote interface tin material to melt scattered, complete soldering processing.
Lasing light emitter is selected, is selection infrared laser light source, utilizes low frequency and Gao Chong caused by Gao Zhongying optical fiber laser
Frequency luminous energy and its laser parameter：Wavelength 1055--1070nm, mean power 20W, highest single pulse energy 1.2mJ, beam quality
The M2 factors are less than or equal to 1.3, minimum pulse width 2nm.Luminous energy caused by Gao Zhongying optical fiber laser can be very good by texturing
Plating pin pin oxide afterwards absorbs, and makes pin pin energy conduction to the pre- tin of pad by heat transfer, while Gao Zhongying optical fiber
Laser is easily done by controlling pulsewidth and repetition rate to realize the accurate control of laser emission energy.
Beneficial effects of the present invention:Due to by this method carry out soldering have reflect small, local heating, quick heating,
The features such as quick cooling, the fire damage of pin pin elements can be effectively reduced, and can solve the problem that the problem of tin material is ascended, greatly
Improve solder yield.Compared with the welding methods such as traditional wave-soldering, IR reflow soldering, Hotbar solderings, thoroughly eliminate
" bridging " problem of adjacent pin pin solder joint, many components for installing on circuit boards are not easy to be put by electrostatic during thin space
The influence of electricity, the damage that static discharge is inducted may be such that component partly or entirely damages, reduce yield rate, so as to improve
Manufacturing cost.When carrying out soldering with laser system, because laser system is kind of a heat source non-contact, will not have to component too big
Heat affecting, so as to the danger of minimizing electrostatic electric discharge damage.Compared with traditional method for laser welding, solve plating pin pin pair
Laser has high reflectivity, and pin pin absorption laser energy is unstable, causes heat transfer to the pre- upper inconsistent influence of soldering disk energy
Weld yield issues.
This process can be easily applied in traditional laser welding machine equipment, without entering to existing equipment
Row significantly technological transformation.Using low energy densities, low frequency, the optical fiber laser of short time laser emission under to electricity
Plate pin pin and carry out advance texturing, absorptivity of the increase pin pin to laser energy；In high-energy-density, high-frequency, short time
The pre- texturing region of laser emission pin pin of optical fiber laser, pre- upper tin fusing, the tin of melting contact to PCBA pads and pin pin
Auxiliary exhibition wetting, completes welding between face.The pin pin that the process is applied to Type-c connectors weld.
Brief description of the drawings
Fig. 1 is the schematic diagram of Type-c connectors of the embodiment of the present invention；
Fig. 2 is PCBA of embodiment of the present invention schematic diagram；
Fig. 3 is the schematic diagram after Type-c of embodiment of the present invention connectors installation PCBA；
Fig. 4 is that pin of embodiment of the present invention pin are carried out the schematic diagram after texturing by low frequency laser；
Fig. 5 is Type-c of embodiment of the present invention connectors and PCBA be welded after schematic diagram；
Fig. 6 is Type-c of embodiment of the present invention connectors and PCBA be welded after pin pin schematic diagram.
In figure：The fixed shell of 1-Type-c connectors；PCBA bayonet socket is installed on 2-Type-c connectors；3-Type-c
Pin pin on connector；Pre- upper soldering disk on 4-PCBA；" mark " point on 5-PCBA；6-PCBA；7- laser roughenings area
Domain；8- laser weldings region.
Embodiment
The present invention is described in further detail with specific embodiment below in conjunction with the accompanying drawings, is easy to that this hair is well understood
It is bright, but they do not form to the present invention and limited.
As shown in Fig. 1-Fig. 6, processing object of the present invention is Type-c connectors, and PCBA pad sizes are 1X0.22mm (long
X is wide), spacing 0.2mm is two-sided to share 20 pads, and pin pin connectors are two-sided shares 20 pin pin, wide 0.2mm for band.Adjust first
Section optical system makes laser spot 1-5mm above finished surface（Positive out of focus）, it is 70-90um to make laser facula, is then adjusted
Coaxial vision alignment system, CCD focus is overlapped with finished surface, follow the steps below：
The first step：After the pre- upper Sion of PCBA pads to be welded is installed into band pin pin connectors, tool is integrally attached to
In, tool is fixed in two-dimensional stage.PCBA pad sizes are 1X0.22mm (long X is wide), spacing 0.2mm, two-sided to share 20
Pad, pin pin connectors are two-sided shares 20 pin pin, wide 0.2mm for band.
Second step：Using computer panel card and visual-alignment welding control software, adjusting two-dimensional stage and hoistable platform makes
" mark " point on PCBA, the masterplate for clearly, carrying out " mark " point is shown in CCD field of view center.
3rd step：Pin toe feathering figures, setup parameter are carried out in visual-alignment welding control software according to PCBA pad sizes
For 1-5um of laser pulse width, 13-50KHZ of frequency, Lase times 2-8 times, 30-100mm/s of laser speed.
4th step：The masterplate attribute and pin toe feathering figure coordinates of visual-alignment " mark " point are adjusted, with visual-alignment
Laser is accurately beaten and texturing is carried out to pin pin among pin pin.
5th step：Pin pin weld pattern and texturing figure are carried out in visual-alignment welding control software according to PCBA pad sizes
Shape overlaps, and setup parameter is 10-50um of laser pulse width, 100-1000KHZ of frequency, Lase times 10-20 times, laser speed
100—1200mm/s。
6th step：Trigger laser, with visual-alignment under laser emission effect, pre- upper tin fusing, the tin of melting to
Auxiliary exhibition wetting between PCBA pads and pin pin contact surfaces.
7th step：Laser is closed, tin material natural cooling, forms solder side, two-dimensional stage keeps quiet in During laser emission
Only state.
8th step：If justifying PCBA is multiple, mobile two-dimensional stage makes " mark " on next PCBA to put entrance
CCD field of view center.
9th step：Pin toe featherings and weld pattern and parameter are readjusted, sets suitable laser pulse width, frequency, welding
Speed, processing pass.
Tenth step：Retriggered laser, make the pre- upper tin of PCBA pads between pad and pin pin contact surfaces with visual-alignment
Abundant auxiliary exhibition.
11st step：Laser is closed, liquid tin natural cooling, forms solder side, two-dimensional stage is protected in During laser emission
Hold inactive state.
12nd step：Welding processing is completed by being repeated the above steps after PCBA turn-overs.
The content that this specification is not described in detail belongs to prior art known to professional and technical personnel in the field.
Claims (8)
1. a kind of infrared laser is to the welding method of non-ferrous metal, it is characterised in that including：It is accurately fixed using visual-alignment technology
Position, texturing pretreatment is carried out using low frequency laser by pin pin are electroplated on connector, recycles high-frequency laser to pin toe featherings
Change region to be heated；Using Gao Zhongying optical fiber laser；Specifically include following steps：
(1), regulation optical system first makes laser spot 1-5mm above finished surface, makes CCD focus and finished surface weight
Close；
(2) after the pre- upper Sion of PCBA pads to be welded, is installed into band pin pin connectors, it is integrally attached in tool, tool is solid
It is scheduled in two-dimensional stage；
(3), using computer panel card and visual-alignment welding control software, adjusting two-dimensional stage and hoistable platform makes on PCBA
" mark " point, the masterplate for clearly, carrying out " mark " point is shown in CCD field of view center；
(4) pin toe feathering figures, are carried out in visual-alignment welding control software according to PCBA pad sizes, set suitable laser
Pulsewidth, low frequency, speed of welding, processing pass；
(5) the masterplate attribute and pin toe feathering figure coordinates of visual-alignment " mark " point, are adjusted, makes laser with visual-alignment
Accurate beat carries out texturing among pin pin to pin pin；
(6), pin pin weld pattern is carried out in visual-alignment welding control software according to PCBA pad sizes to overlap with texturing figure,
Set suitable laser pulse width, high-frequency, speed of welding, processing pass；
(7), trigger laser, with visual-alignment under laser emission effect, pre- upper tin fusing, the tin of melting to PCBA pads and
Auxiliary exhibition wetting between pin pin contact surfaces；
(8) laser, is closed, tin material natural cooling, forms solder side.
2. a kind of infrared laser according to claim 1 is to the welding method of non-ferrous metal, it is characterised in that described height
Luminous energy caused by repetition optical fiber laser, laser parameter are 1055-1070nm of wavelength, mean power 20W, highest single pulse energy
Measure 1.2mJ, the beam quality M2 factors are less than or equal to 1.3, minimum pulse width 2nm.
3. a kind of infrared laser according to claim 1 is to the welding method of non-ferrous metal, it is characterised in that above-mentioned steps
(1) in, laser spot 1-5mm above finished surface, it is 70-90um, coaxial vision alignment system CCD to make laser facula
Focus overlapped with finished surface.
4. a kind of infrared laser according to claim 1 is to the welding method of non-ferrous metal, it is characterised in that above-mentioned steps
(2) in, PCBA pad sizes are 0.4X0.2mm-2.0X1.5mm, spacing 0.2-1mm, two-sided to share 10-80 pads, band
The two-sided shared 10-80 pin pin of pin pin connectors, wide 0.2-1.5mm.
5. a kind of infrared laser according to claim 1 is to the welding method of non-ferrous metal, it is characterised in that above-mentioned steps
(4) in, parameter is 1-5um of laser pulse width, 13-50KHZ of frequency, Lase times 2-8 times, 30-100mm/s of laser speed.
6. a kind of infrared laser according to claim 1 is to the welding method of non-ferrous metal, it is characterised in that above-mentioned steps
(5) in, the masterplate attribute of regulation " mark " point, it is ± 0.02mm to make overall positioning precision.
7. a kind of infrared laser according to claim 1 is to the welding method of non-ferrous metal, it is characterised in that above-mentioned steps
(6) in, setup parameter is 10-50um of laser pulse width, 100-1000KHZ of frequency, Lase times 10-20 times, laser speed
100—1200mm/s。
8. a kind of infrared laser according to claim 1 is to the welding method of non-ferrous metal, it is characterised in that above-mentioned steps
(8) after, comprise the following steps：
(1), if justifying PCBA is multiple, mobile two-dimensional stage puts " mark " on next PCBA and enters CCD visual fields
Center；
(2) pin toe featherings and weld pattern and parameter, are readjusted, set suitable laser pulse width, frequency, speed of welding, plus
Work pass；
(3), retriggered laser, with visual-alignment make the pre- upper tin of PCBA pads between pad and pin pin contact surfaces fully it is auxiliary
Exhibition；
(4) laser, is closed, liquid tin natural cooling, forms solder side；
(5) it, will be repeated the above steps after PCBA turn-overs and complete welding processing.
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| CN109685784A (en) * | 2018-12-19 | 2019-04-26 | 森大（深圳）技术有限公司 | Pcb board position error calibration method, device, equipment and storage medium |
| CN110996557A (en) * | 2020-01-15 | 2020-04-10 | 深圳市聚永能科技有限公司 | Method and apparatus for laser roughening copper foil surface of printed circuit board |
| US11945046B2 (en) | 2020-11-24 | 2024-04-02 | Ford Global Technologies, Llc | Laser edge welding of copper substrates |
| CN114985924A (en) * | 2022-05-19 | 2022-09-02 | 深圳泰德激光技术股份有限公司 | Thin material laser welding method and component |
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| CN104084693A (en) * | 2014-07-25 | 2014-10-08 | 深圳市大族激光科技股份有限公司 | Laser welding method for high-reflecting material |
| EP3053699A1 (en) * | 2015-01-21 | 2016-08-10 | Audi Ag | Device for joining components |
| CN204621388U (en) * | 2015-05-13 | 2015-09-09 | 吴中区横泾嘉运模具厂 | The attachment plug trimming positioning module of temperature-sensitive water pipe head laser weld mould |
| CN205184062U (en) * | 2015-11-27 | 2016-04-27 | 安徽华东光电技术研究所 | Apron laser soldering and sealing frock |
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