CN201002157Y - Selective laser micro-braze-welding system based on vibration mirror scanning - Google Patents

Selective laser micro-braze-welding system based on vibration mirror scanning Download PDF

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Publication number
CN201002157Y
CN201002157Y CN 200620154525 CN200620154525U CN201002157Y CN 201002157 Y CN201002157 Y CN 201002157Y CN 200620154525 CN200620154525 CN 200620154525 CN 200620154525 U CN200620154525 U CN 200620154525U CN 201002157 Y CN201002157 Y CN 201002157Y
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China
Prior art keywords
laser
mirror
scanning
reflecting mirror
welding system
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Expired - Fee Related
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CN 200620154525
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Chinese (zh)
Inventor
黄延禄
杨永强
卫国强
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South China University of Technology SCUT
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South China University of Technology SCUT
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Abstract

The utility model provides a vibration mirror scanning - based selective laser micro soldering system and comprises a laser generator, a semireflecting mirror, a holophote, a feedback scanning system, a F-Theta mirror, a controller, a laser generator, a semireflecting mirror and a holophote, which are in optical path connection orderly; the semireflecting mirror and the holophote are in optical path connection with the relative feedback scanning system; two feedback scanning systems are in optical path connection with the workpieces through the same F-Theta mirror; the process panel of the workpieces is arranged on the focal plane of the F-Theta mirror; the laser generator and the feedback scanning system are in signal connection with the controller; the system combines a high speed scanning vibration mirror and a high quality semiconductor laser or an optical-fiber laser and a high speed switch optical gate, for realizing the energy input of the instantaneous multiple-spot welding of program control; the side of the welding spot reaches 50 - 100 micrometers; large area of micro-spot welding can be completed instantaneously in the mode of vibration mirror scanning.

Description

Based on the little braze welding system of the selective laser of vibration mirror scanning
Technical field
The utility model relates to Electronic Packaging laser braze welding technology, specifically is meant based on the little braze welding system of the selective laser of vibration mirror scanning.
Background technology
In current and significant period of time, surface installation technique (SMT) and through-hole mounting (Throughhole) will be most important chip fabrication techniques.Use when two kinds of technical combinations, when perhaps leaking defect repair such as weldering, bridge joint, the selectivity solder technology has just embodied its huge superiority.Because environmental protection requirement, the application of unleaded scolder has caused about 40 ℃ of Reflow Soldering increase in temperature, and a series of problems such as scolder wettability variation.Traditional wave-soldering and Reflow Soldering belong to the whole mode of heating of substrate-components and parts, and this causes present widely used FR4 substrate may be subjected to the thermal burn damage.And for temperature-sensitive element, electromagnetic sensor and moisture-sensitive element and substrate, traditional wave-soldering and Reflow Soldering may cause components and parts actual effect or substrate damage.Adopt the selectivity soldering processes, the heat affected area is very little, can thoroughly solve traditional reflow welding, wave-soldering process equipment when unleaded welding because temperature raises problems such as the adjacent electronic elements of bringing wears out, circuit board distortion.
The selectivity soldering tech mainly contains following several types at present: selectivity wave-soldering (selectivewave soldering), selectivity fountain soldering (selective fountain soldering), selectivity soldering able to programme (programmable selective soldering), little wave soldering (miniwave soldering), laser braze welding (laser soldering), disk soldering (round-table soldering), hot gas soldering (hot-gas soldering), selectivity infra-red heat fluid welding (selective RF shield soldering) etc.Wherein, laser soldering is mainly used in the welding of printed circuit board (PCB), especially is useful for the chip component package technique.Adopt laser soldering to compare following advantage with alternate manner:
(1) the extensive adaptability of welding position: can be to the inaccessible position welding of general welding method.
(2) the extensive adaptability of welding device: be applicable to temperature-sensitive, electromagnetic susceptibility, moisture-sensitive components and parts.
(3) local irradiation, microcell is heated: do not injure in abutting connection with components and parts and substrate.
(4) laser power, spot size are adjusted continuously in good time and are easy to control, laser braze welding yield rate height.
(5) 2-D vibration mirror scanning can accurately realize the geometric figure of various complicated shapes.
(6) high laser power density and high speed of welding, laser weld pulse frequency and the pulsewidth that can modulate.
(7) with the noncontact heating, the fusing bandwidth, without any need for aid, can double-sided elements equipment back processing on double-sided printed-circuit board.
(8) laser beam is easy to realize beam split, and optical elements such as available pellicle mirror, speculum, prism, scanning mirror carry out the time and space to be cut apart, and can realize multiple spot balanced welding simultaneously.
Vibration mirror scanning is widely used in laser marking machine, has abroad begun this technology is applied to laser-beam welding machine.Adopt lamp pumping Nd:YAG laser instrument or CO2 laser instrument because the relation of beam quality and wavelength, but focal beam spot generally more than 0.1mm, power density cooperates with vibration mirror scanning can realize high-speed welding.
Abroad to the little soldering of high speed precinct laser, though in the Electronic Packaging technology, important use is arranged, owing to reasons such as technical know-hows, the report of seldom relevant welding jig and welding procedure mechanism aspect.Domestic Electronic Packaging Study on Technology is especially seldom having report aspect the little soldering in constituency, though the correlative study of laser braze welding technical method is arranged, but its described soldering all is not based on the little soldering of high speed selective laser of vibration mirror scanning and connects, and does not relate to the research of relevant device and technical indicator yet.
Send out content
The purpose of this utility model is to overcome the shortcoming and defect of above-mentioned prior art, provide based on the little braze welding system of the selective laser of vibration mirror scanning, it can realize the energy input of programme controlled instantaneous multiple spot welding, welding spot size is little, can be implemented in moment finishes large-area little means of spot welds, welding efficiency height.
The purpose of this utility model is achieved through the following technical solutions: this is based on the little braze welding system of the selective laser of vibration mirror scanning, comprise laser generator, half-reflecting mirror, completely reflecting mirror, the reaction type scanning galvanometer, F-θ mirror, controller, laser generator and half-reflecting mirror, completely reflecting mirror light path successively connects, half-reflecting mirror, completely reflecting mirror is connected with corresponding reaction type scanning galvanometer light path respectively, two reaction type scanning galvanometers are connected with the workpiece light path respectively by same F-θ mirror, the processing plane of described workpiece is positioned on the focal plane of F-θ mirror, described laser generator, the reaction type scanning galvanometer is connected with controller signals respectively.
Must realize the utility model for better, described laser generator comprises completely reflecting mirror, laser pump cavity, the partially reflecting mirror that sets gradually, and is provided with Q-switch between described partially reflecting mirror and the laser pump cavity, and the partially reflecting mirror front portion is provided with beam expanding lens.
Described reaction type scanning galvanometer comprises X, Y both direction scanning galvanometer, it is installed in respectively in the rotating shaft of digital control servomotor, described controller is provided with the control corresponding card and is connected respectively with laser generator, two digital servomotors, also is respectively arranged with the X that is connected with controller, the angular displacement sensor of Y both direction in the rotating shaft of two digital servomotors.
Described controller comprises computer or single-chip microcomputer, single board computer etc.; Semiconductor laser or optical fiber laser are adopted in beam quality factor M2<1.5 of described laser generator.
Described semiconductor laser adopts the semiconductor pumped Nd:YAG laser instrument of 200W, perhaps adopts 50~100W optical fiber laser.
Described workpiece is placed on the processing platform, and this processing platform can carry out the adjustment of above-below direction and accurately fine setting.
The utility model compared with prior art has following advantage and beneficial effect:
(1) utilizes optical elements such as spectroscope and scanning galvanometer to carry out the time and space and cut apart, realize multiple spot balanced welding simultaneously; Adopt the semiconductor pumped Nd:YAG laser generator of wavelength 1.06 μ m, the available fiber transmission can be difficult for welding portion at usual manner and process, and flexibility is good; Focusing is good, is easy to realize the automation of multistation device.
(2) can use laser instrument to have two kinds at present: the CO of 10.6 mum wavelengths as solderer 2The Nd:YAG laser instrument of laser instrument and 1.06 mum wavelengths, they run on continuous duty, and because of the wavelength difference, effect is inequality.Since the transmission of Nd:YAG laser instrument available fiber, face of weld luminance factor CO 2Laser instrument is low, and beam energy is big and the circuit board absorbability is little by the solder flux absorbability, and the optical system cheapness, and it is applied widely.
(3) semiconductor laser and optical-fiber laser have beam quality preferably, and wavelength is near infrared band, are easy to the absorption of metal material.The line focus system can obtain 30~50 microns and assemble hot spots, makes the yardstick of little connection at micron order, and power density can satisfy the needs of scolder instant melting.Can reach the laser focusing light beam by scanning galvanometer and move, adopt the Q-switch pattern, can realize that per second near 1000 solder joints, improves welding efficiency greatly with the speed of 8m/min.
(4) numerically controlled high-velocity scanning galvanometer and high-quality semiconductor laser or optical-fiber laser and speed-sensitive switch optical gate are combined, constitute a kind of new little jockey of high speed selective laser, can realize the energy input of programme controlled instantaneous multiple spot welding, welding spot size reaches 50~100 microns.The vibration mirror scanning mode can be implemented in moment and finish large-area little means of spot welds, and its efficient is compared not inferior with reflow welding, is the new technology that substitutes traditional reflow welding.
Description of drawings
Fig. 1 is the structural representation of the utility model based on the little braze welding system of selective laser of vibration mirror scanning;
Fig. 2 is the structural representation of laser generator shown in Figure 1;
Fig. 3 is the structural representation of reaction type scanning galvanometer shown in Figure 1.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but embodiment of the present utility model is not limited thereto.
Embodiment one
As shown in Figure 1, this is based on the little braze welding system of the selective laser of vibration mirror scanning, comprise that 1 device takes place laser, half-reflecting mirror 2, completely reflecting mirror 3, reaction type scanning galvanometer 4, F-θ mirror 5, controller 6, laser generator 1 and half-reflecting mirror 2, completely reflecting mirror 3 light path successively connects, half-reflecting mirror 2, completely reflecting mirror 3 is connected with corresponding reaction type scanning galvanometer 4 light paths respectively, two reaction type scanning galvanometers 4 are connected with workpiece 7 light paths respectively by same F-θ mirror 5, the processing plane of workpiece 7 is positioned on the focal plane of F-θ mirror 5, laser generator 1, reaction type scanning galvanometer 4 is connected with controller 6 signals respectively.
As shown in Figure 2, laser generator 1 comprises completely reflecting mirror 9, laser pump cavity 11, the partially reflecting mirror 10 that sets gradually, and is provided with Q-switch 12 between partially reflecting mirror 10 and the laser pump cavity 11, and partially reflecting mirror 10 front portions are provided with beam expanding lens 13.
Reaction type scanning galvanometer 4 comprises X, Y both direction scanning galvanometer 15,17, it is installed in respectively in the rotating shaft of digital control servomotor 14,16, controller 6 is provided with control corresponding card, USB interface holding wire and laser generator 1, two digital servomotors 14,16 are connected respectively, also is respectively arranged with the X that is connected with controller, the angular displacement sensor 18 of Y both direction in the rotating shaft of two digital servomotors 14,16.
Controller 6 can be computer or single-chip microcomputer, single board computer etc.; Semiconductor laser or optical fiber laser are adopted in beam quality factor M2<1.5 of laser generator 1.
Semiconductor laser adopts the semiconductor pumped Nd:YAG laser instrument of 200W, perhaps adopts 50~100W optical fiber laser.
Workpiece 7 is placed on the processing platform 8, and this processing platform 8 can carry out the adjustment of above-below direction and accurately fine setting.
This based on the course of work that the little braze welding system of the selective laser of vibration mirror scanning carries out the little soldering of selective laser is: under controller 6 controls, operation material in the pump excitation laser pump cavity 11 in the laser generator 6, light is between completely reflecting mirror 9 and partially reflecting mirror 10, vibration and progressively amplification in the laser pump cavity 11 just, when reaching threshold value, promptly transmit laser beam from partially reflecting mirror 10 suddenly, after beam expanding lens 13 expands bundle, by half anti-mirror 2 and total reflective mirror 3 beam split, after the beam split two bundle laser carries out gated sweep by reaction type scanning galvanometer 4 respectively, and through 5 focusing of F-θ mirror, by adjusting up and down and accurate trim process platform 8, the surface to be machined of workpiece 7 is on F-θ mirror 5 focal planes, thereby guarantee accurate aligning to Working position on the workpiece 7, by Q-switch 12, realize carrying out the spot welding of selectivity high speed by default path.
Wherein, reaction type scanning galvanometer 4 carries out gated sweep and is meant that controller 6 is by control figure servomotor 14,16, drive X, Y both direction scanning galvanometer 15,17 in digital servomotor 14,16 rotating shafts, X in digital servomotor 14,16 rotating shafts, the angular displacement sensor 18 of Y both direction pass to controller 6 with the actual displacement angle of scanning galvanometer 15,17, and with set angle displacement relatively after feed back, thereby realize the scanning angle control of X, Y both direction scanning galvanometer 15,17.
As mentioned above, just can realize the utility model preferably.

Claims (6)

1, based on the little braze welding system of the selective laser of vibration mirror scanning, it is characterized in that: comprise laser generator, half-reflecting mirror, completely reflecting mirror, the reaction type scanning galvanometer, F-θ mirror, controller, laser generator and half-reflecting mirror, completely reflecting mirror light path successively connects, half-reflecting mirror, completely reflecting mirror is connected with corresponding reaction type scanning galvanometer light path respectively, two reaction type scanning galvanometers are connected with the workpiece light path respectively by same F-θ mirror, the processing plane of described workpiece is positioned on the focal plane of F-θ mirror, described laser generator, the reaction type scanning galvanometer is connected with controller signals respectively.
2, according to the little braze welding system of the described selective laser of claim 1 based on vibration mirror scanning, it is characterized in that: described laser generator comprises completely reflecting mirror, laser pump cavity, the partially reflecting mirror that sets gradually, be provided with Q-switch between described partially reflecting mirror and the laser pump cavity, the partially reflecting mirror front portion is provided with beam expanding lens.
3, according to the little braze welding system of the described selective laser of claim 1 based on vibration mirror scanning, it is characterized in that: described reaction type scanning galvanometer comprises X, Y both direction scanning galvanometer, it is installed in respectively in the rotating shaft of digital control servomotor, described controller is provided with the control corresponding card and is connected respectively with laser generator, two digital servomotors, also is respectively arranged with the X that is connected with controller, the angular displacement sensor of Y both direction in the rotating shaft of two digital servomotors.
4, according to the little braze welding system of each described selective laser of claim 1~3, it is characterized in that based on vibration mirror scanning: beam quality factor M2<1.5 of described laser generator, adopt semiconductor laser or optical fiber laser.
5, according to the little braze welding system of each described selective laser based on vibration mirror scanning of claim 1~3, it is characterized in that: described controller comprises computer or single-chip microcomputer, single board computer.
6, according to the little braze welding system of the described selective laser based on vibration mirror scanning of claim 4, it is characterized in that: described semiconductor laser adopts the semiconductor pumped Nd:YAG laser instrument of 200W, perhaps adopts 50~100W optical fiber laser.
CN 200620154525 2006-12-08 2006-12-08 Selective laser micro-braze-welding system based on vibration mirror scanning Expired - Fee Related CN201002157Y (en)

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CN101518855B (en) * 2009-03-27 2011-08-24 华中科技大学 Multifunctional laser processing device
CN102319959A (en) * 2011-08-22 2012-01-18 华南理工大学 Surface microstructure-forming system based on coherent laser
CN102430858A (en) * 2011-10-10 2012-05-02 华中科技大学 Automatic focusing adjustor for laser processing
CN103551741A (en) * 2013-10-18 2014-02-05 昆山思拓机器有限公司 Processing device and process for conductive rubber pad
CN104089578A (en) * 2014-07-25 2014-10-08 深圳市大族激光科技股份有限公司 Vibration lens center detection device and method
CN104191089A (en) * 2014-09-11 2014-12-10 苏州菲镭泰克激光技术有限公司 Three-dimensional dynamic focusing marking system and method based on light beam output by laser device
CN104551396A (en) * 2013-10-23 2015-04-29 深圳市通发激光设备有限公司 Large-breadth optical fiber output galvanometer scanning laser welding machine
CN104551403A (en) * 2014-12-26 2015-04-29 广东省工业技术研究院(广州有色金属研究院) Thick-plate narrow-gap laser scanning filler wire welding method
CN104741795A (en) * 2015-03-31 2015-07-01 武汉先河激光技术有限公司 Efficient laser etching device for small OGS
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CN107052579A (en) * 2017-03-29 2017-08-18 苏州镭缘激光科技有限公司 A kind of continuous timesharing laser soldering device
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CN101518855B (en) * 2009-03-27 2011-08-24 华中科技大学 Multifunctional laser processing device
CN102319959A (en) * 2011-08-22 2012-01-18 华南理工大学 Surface microstructure-forming system based on coherent laser
CN102430858A (en) * 2011-10-10 2012-05-02 华中科技大学 Automatic focusing adjustor for laser processing
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CN103551741A (en) * 2013-10-18 2014-02-05 昆山思拓机器有限公司 Processing device and process for conductive rubber pad
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CN104761132A (en) * 2014-01-02 2015-07-08 上海微电子装备有限公司 Double beam-coupled laser-assisted frit packaging system and method
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