CN107442930A - A kind of laser spot dynamic machining method and device - Google Patents
A kind of laser spot dynamic machining method and device Download PDFInfo
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- CN107442930A CN107442930A CN201710568597.3A CN201710568597A CN107442930A CN 107442930 A CN107442930 A CN 107442930A CN 201710568597 A CN201710568597 A CN 201710568597A CN 107442930 A CN107442930 A CN 107442930A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of laser spot dynamic machining method and device, belong to laser processing application technical field, its general principle of the inventive method is in laser drill, cutting, welding, etching and hot tearing separate process, laser spot is no longer fixed a certain position transfixion, but moved downward or upward along workpiece to be processed thickness optical axis direction with certain speed, or with certain frequency linearity or swing or spirally move up and down.Present invention also offers realize as above method laser spot dynamic machining method and device.The inventive method and device overcome serial processing problems caused by laser beam axis energy density distribution is uneven in traditional processing mode.
Description
Technical field
The invention belongs to laser processing application technical field, and in particular to a kind of laser spot dynamic machining MATERIALS METHODS and
Device.
Background technology
At present, the conventional method of Reciprocity of Laser ＆ Materials is to be fixed on certain for being applied material using laser spot
One position, then start laser beam and start to drill to material, cut, etch, weld etc. and process.
In laser processing procedure, laser spot is to be in transfixion state.This Laser Focusing processing mode is because swashing
Light focus on light beam be taper focal beam spot can cause it is uneven along in laser beam axis energy density distribution, i.e.,：In the energy of focal point
Metric density highest, focal point is more remote, and energy density is lower, as a result causes material to be heated along optical axis direction uneven.Focal point
It is high and be rapidly reached vaporization temperature that material absorbs amount of laser light energy density, be vaporized that evaporation material is more and fusing material compared with
It is few.And the material for leaving focal point absorbs that laser energy is relatively low, and causing to be vaporized evaporation material starts to gradually reduce, fusing material
It is stepped up.When from laser spot farther place, due to material, to absorb laser energy lower and be in molten state.
It is as follows to summarize the problem of this processing mode is present：
(1) during laser drill and cutting processing, because the vaporization of material more occurs in laser spot
Place, and the material outside focal point is in fusing compared with multimode, cause to be melted material far more than being vaporized evaporation material；
(2) it is few not only result in removal amount for a small amount of vaporization material, and caused deboost is also smaller；It is less
Deboost is difficult to more fusing material excluding area to be machined, cause substantial amounts of fusing material be set in again hole wall or
Cut on end wall, form re cast layer；
(3) re cast layer laser machined on hole wall will cause bellmouth and joint-cutting to be formed, and reduce the vertical of processing hole wall
Degree, influence to laser machine dimensional accuracy；
(4) re cast layer, which is formed, can also cause the roughness of Laser Processing to increase, while can also be formed as splitting in re cast layer
The defects of line, micro- stomata, coarse grains, laser processing quality is caused to decline；
(5) re cast layer and mother metal physical and chemical performance are inconsistent and adhesion is weaker, and this can also give subsequent treatment application
Some problems are brought, being such as coated with conducting film circuit in double teeming layer surface because of re cast layer micro-crack or can come off and breaking；
(6) melt material is more and vaporization less also result in forms a large amount of dross at material export processing, it is necessary to
By subsequent treatment；
(7) in the laser hot tearing separation process of transmission material, this edge focuses on laser beam axis Energy distribution not
, can cause it is uneven along thickness direction thermo parameters method, cause induction stress field skewness, cause separation
Micro-crack moves towards out of control；
(8) in laser beam welding, static focus hot spot can make appearance of weld poor, easily be produced in formed weld
The defects of stomata, slag inclusion, micro-crack；
(9) static laser spot can decline because energy density is far gone with focal point, cause material thermal conductivity loss to increase
Add, cause utilization ratio of laser energy to decline.
Therefore, it is necessary to new laser spot processing method or device be developed, can overcome present in prior art
Relevant issues.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, the present invention proposes a kind of side of laser spot dynamic machining
Method, its general principle are in laser drill, cutting, welding, etching and hot tearing separate process, and laser spot is no longer solid
Fixed a certain position transfixion, but moved downward or upward along workpiece to be processed thickness optical axis direction with certain speed, or
Swing or spirally move up and down, the laser beam axis energy density distribution in overcoming in a manner of traditional processing with certain frequency linearity
Processing problems caused by uneven.
To achieve the above object, according to one aspect of the present invention, there is provided a kind of laser spot dynamic machining method, add
During work, speed dynamic mobile of the laser spot hot spot along optical axis to set.
In one embodiment of the invention, laser spot hot spot with the speed that sets along workpiece to be processed thickness optical axis side
To moving downward or upward.
In one embodiment of the invention, laser spot hot spot is moved with the frequency linearity set, or laser spot light
Warble of the spot to set, or laser spot hot spot are spirally moved up and down with the frequency set.
According to the second aspect of the invention, there is provided a kind of laser spot dynamic machining device for realizing as above method,
It include laser, beam-expanding collimation mirror, dynamic focusing mirror, guide-lighting mirror, can straight line back and forth movement mechanism, xy workbench and industry control
Machine, wherein, dynamic focusing mirror includes positive and negative focusing microscope group and a piece of negative focusing eyeglass, and xy workbench is used to carry work to be processed
Part, negative focusing eyeglass be arranged on can in straight line back and forth movement mechanism, with can along moving linearly, industrial computer simultaneously with laser, can
Straight line back and forth movement mechanism is connected with xy workbench, can control the switch of laser respectively, can straight line back and forth movement mechanism
Movement and xy workbench movement, the laser beam axis that beam-expanding collimation mirror, dynamic focusing mirror, guide-lighting mirror are launched along laser
Direction is set gradually, and guide-lighting mirror is used for the laser reflection of laser transmitting to workpiece to be processed.
In one embodiment of the invention, when laser spot performs dynamic boring processing, industrial computer control laser
The speed for sending laser beam and controlling the straight line back and forth movement mechanism drive negative focusing eyeglass in dynamic focusing mirror to set is forward
Or move along a straight line backward so that laser spot with the thickness optical axis direction of the speed that sets along workpiece to be processed up or down
It is mobile, the processing of laser spot dynamic boring is completed, then, industrial computer controls xy movable workbench workpieces to be processed to arrive another again
Position, above laser spot dynamic boring procedure is repeated, until completing all Drilling operations.
In one embodiment of the invention, in addition to focus lamp, focus lamp are arranged on guide-lighting mirror lower end, and focus lamp is used for
Secondary focusing is carried out to the focusing laser beam of dynamic focusing output, to obtain smaller focal beam spot diameter, so as to for reality
Now bore the hole of smaller diameter or realize narrower cutting and weld seam.
According to the third aspect of the invention, a kind of laser spot dynamic machining dress for realizing as above method is additionally provided
Put, it include laser, beam-expanding collimation mirror, dynamic focusing mirror, can straight line back and forth movement mechanism, xy bidimensionals scanning galvanometer, xy works
Make platform and industrial computer, wherein, dynamic focusing mirror includes positive and negative focusing microscope group and a piece of negative focusing eyeglass, and xy workbench is used to carry
Workpiece to be processed, negative focusing eyeglass is arranged on can be in straight line back and forth movement mechanism, with can be along moving linearly, and industrial computer is simultaneously with swashing
Light device, can straight line back and forth movement mechanism, xy bidimensionals scanning galvanometer and xy workbench be connected, so that laser can be controlled respectively
Switch, can straight line back and forth movement mechanism movement, the movement of xy bidimensional scanning galvanometers and the movement of xy workbench, beam-expanding collimation
The direction for the laser beam axis that mirror, dynamic focusing mirror, xy bidimensionals scanning galvanometer are launched along laser is set gradually, the scanning of xy bidimensionals
Galvanometer is used to shake the laser beam focus that focuses on exported from dynamic focus lamp in the setting position of workpiece to be processed, the scanning of xy bidimensionals
Mirror is made up of x directions reflecting optics and y directions reflecting optics, for controlling laser beam in x/y plane scanning machining track.
In one embodiment of the invention, in addition to scanning focused field lens, scanning focused field lens are arranged on xy bidimensionals and swept
Galvanometer lower end is retouched, the focusing laser beam for being exported to dynamic focusing mirror carries out secondary focusing, to obtain smaller focal beam spot
Diameter, so as to bore the hole of smaller diameter for realizing or realize narrower cutting and weld seam.
In one embodiment of the invention, positive and negative focusing microscope group comprises at least a piece of negative focusing eyeglass and a piece of positive focusing
Eyeglass.
In the present invention, realizing the device critical component of laser spot dynamic machining method of the present invention includes：One can straight line
Mobile negative focusing eyeglass and dynamic focusing mirror, dynamic focusing mirror include positive and negative focusing microscope group (the positive and negative focusing microscope group of one group of fixation
Including a piece of negative focusing eyeglass and a piece of positive focusing lens).Negative focusing eyeglass movable linearly is arranged on linear moving mechanism,
It can carry out coming and going linear motion, change the laser light velocity angle of divergence, fixed positive and negative focusing microscope group is focused.
The operation principle of apparatus of the present invention is：When laser starts drilling, industrial computer controls laser and dynamic poly- simultaneously
Jiao Jing.Laser sends laser beam after beam-expanding collimation mirror beam-expanding collimation, the negative focusing mirror being input to during dynamic focusing mirror focuses on
Piece is by laser-beam divergence, after being focused through fixed positive and negative focusing microscope group, is imported focused spot by guide-lighting mirror to be added
Work workpiece surface or internal a certain position.
When negative focusing eyeglass movable linearly is moved linearly forward or backward with certain speed, the laser light velocity angle of divergence also with
Change, the spot diameter projected on positive and negative focus lamp can also change, so as to change Laser Focusing focus in the position of optical axis,
So that laser spot moves downward or upward along workpiece thickness optical axis direction, laser spot dynamic boring function is realized.
In laser cutting, etching or welding process, industrial computer controls laser, dynamic focusing mirror and bidimensional work simultaneously
Platform.After laser sends laser beam, negative focusing eyeglass movable linearly, can be by laser spot with certain frequency straight line back and forth movement
Along workpiece thickness optical axis direction it is downward on move, while bidimensional workbench drive workpiece movement, realize laser spot dynamic cut
Cut and welding function.
Laser spot dynamic machining method of the present invention can be also engaged using dynamic focusing mirror with bidimensional scanning galvanometer, be realized
Laser spot is to swing or spiral way moves up and down along workpiece to be processed thickness optical axis direction.
In general, by the contemplated above technical scheme of the present invention compared with prior art, it can obtain down and show
Beneficial effect：
Laser Focusing hot spot is processed along optical axis dynamic mobile mode, can improve laser along the uniform of optical axis energy density distribution
Property；Because Laser Focusing hot spot quickly moves along optical axis, absorptivity of the material along laser beam axis direction to laser energy can be improved,
The energy density for making rapidoprint be on laser beam axis to laser energy absorption at focus spot；Due to along laser beam axis
Material is in focal point processing, makes the increase of material vaporization amount, and fusing amount and heat conduction loss are reduced, and improve laser
The utilization rate of energy；
In Drilling operation, the increase of material vaporization amount will increase deslagging removal ability, reduce or eliminate re cast layer, change
Kind drilling taper；Fusing amount and heat conduction loss, which are reduced, to be beneficial to reduce and eliminate re cast layer, improves drilling taper；Material
Vaporization amount increases and fusing amount reduces and advantageously reduces or eliminate cutting drilling dross phenomenon；
In the laser hot tearing separation process of transmission material, laser spot quickly moves along optical axis, improves energy
Along optical axis direction skewness so that, the stress field induced along optical axis is evenly distributed along optical axis thermo parameters method evenly
Property strengthen, so as to realize control separation micro-crack trend；
In laser beam welding, focal beam spot quickly moves along optical axis can make gas pore in weld metal and slag inclusion be easier to escape
Go out, be advantageous to improve laser welded seam quality.
Brief description of the drawings
Fig. 1 is one of laser spot dynamic machining method provided in an embodiment of the present invention：Focus moves down schematic diagram；
Fig. 2 is one of laser spot dynamic machining method provided in an embodiment of the present invention：Focus moves up schematic diagram；
Fig. 3 is the laser spot dynamic machining provided in an embodiment of the present invention for realizing one of laser spot dynamic machining method
Schematic device；
Fig. 4 is two schematic diagrames of laser spot dynamic machining method provided in an embodiment of the present invention；
Fig. 5 is the two laser spot dynamic machining provided in an embodiment of the present invention for realizing laser spot dynamic machining method
Schematic device；
Fig. 6 is three device provided in an embodiment of the present invention for realizing laser spot dynamic machining method；
Fig. 7 be it is provided in an embodiment of the present invention another realize three device of laser spot dynamic machining method, the dress
Put on the basis of Fig. 6 shown devices, carry out secondary focusing for focusing on laser beam, its light class diameter is smaller, for processing hole
The smaller welding of the smaller either width of footpath diameter or joint-cutting；
Fig. 8 is the three of laser spot dynamic machining method provided in an embodiment of the present invention：Spiral laser spot dynamic is bored
Hole schematic diagram；
Fig. 9 is the three of laser spot dynamic machining method provided in an embodiment of the present invention：Concentric-ring pattern laser spot dynamic
Drill schematic diagram；
Figure 10 is the three of laser spot dynamic machining method provided in an embodiment of the present invention：Swing type laser spot dynamic adds
Work schematic diagram.
Wherein, one of laser spot dynamic machining method refers to laser spot dynamic boring method；Laser spot dynamic adds
The two of work method refer to the cutting of laser spot dynamic, etching, scribing or welding method；The three of laser spot dynamic machining method are
Refer to laser spot dynamic screw or concentric-ring pattern drilling and swing type processing method.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Conflict can is not formed each other to be mutually combined.
One of specific embodiment of the invention：Laser spot dynamic boring method.
As depicted in figs. 1 and 2, Fig. 1 swashs laser spot dynamic boring method general principle to be provided in an embodiment of the present invention
One of optical focus dynamic machining method：Focus moves down schematic diagram；Fig. 2 is laser spot provided in an embodiment of the present invention dynamic
One of processing method：Focus moves up schematic diagram.
Specifically, the initial focus 1 for focusing on laser beam is located on surface or a certain position of workpiece to be processed 2.Laser
After launching laser beam, focus 1 starts to move down with certain speed, until after aperture 3 needed for being formed on workpiece 2, laser
Device stops sending laser beam, while initial position is returned in the position of laser spot 1.The initial focus 1 for focusing on laser beam also may be used
On the basal surface of workpiece to be processed 2 (as shown in Figure 2), at laser hair after laser beam, focus 1 starts with certain speed
Move up, until after aperture 3 needed for being formed on workpiece 2, laser stops sending laser beam, while the position of laser spot 1
Put and return initial position.
One of party's subtraction unit is realized as shown in figure 3, Fig. 3 realizes that laser spot dynamic adds to be provided in an embodiment of the present invention
The laser spot dynamic machining schematic device of one of work method.As seen from the figure, it include laser 10, beam-expanding collimation mirror 11,
Dynamic focusing mirror 12, guide-lighting mirror 16, xy workbench 17 and industrial computer 18., wherein, dynamic focusing mirror 12 includes movable linearly negative
Focusing lens 13 and positive and negative focusing microscope group 14, negative focusing eyeglass 13 movable linearly is fixed on can straight line back and forth movement mechanism 15
On, positive and negative focusing microscope group 14 is made up of at least a piece of negative focusing mirror and a piece of positive focus lamp.Workpiece to be processed 2 is fixed on xy work
In the plane of platform 17, laser beam foucing is located at the setting position of workpiece 2.Industrial computer 18 controls laser 10, dynamic focusing mirror simultaneously
12 and xy workbench 17.
Method of work of Fig. 3 described devices in laser spot dynamic boring is as follows：
Industrial computer 18 control laser 10 send laser beam, and control in dynamic focusing mirror 12 can straight line back and forth movement machine
Structure 15 drives negative focusing eyeglass 13 to be moved along a straight line forward or backward with the speed of setting, makes laser spot 1 with the speed edge of setting
The thickness optical axis direction of workpiece 2 moves up or down that (thickness optical axis direction is the optical axis direction of laser beam, namely workpiece
2 thickness direction), complete the processing of laser spot dynamic boring.It is another that industrial computer 18 controls the travelling workpiece 2 of xy workbench 17 to arrive again
Individual position, above laser spot dynamic boring procedure is repeated, until completing all small hole machineds.
The two of the specific embodiment of the invention：The cutting of laser spot dynamic, etching, scribing or welding.
The cutting of laser spot dynamic, etching, the general principle of scribing or welding method are as shown in figure 4, Fig. 4 is real for the present invention
Two schematic diagrames of the laser spot dynamic machining method of example offer are provided.
Specifically, the initial focus 1 for focusing on laser beam is located on surface or a certain position of workpiece to be processed 2.Laser
After sending laser beam, laser spot 1 starts to move up and down with the frequency of setting, while the relative laser beam focus 1 of workpiece to be added 2
Motion, after the joint-cutting needed for being formed, etching, scribing or weld seam 4, laser stops sending laser beam, while laser spot 1
Initial position is returned to, workpiece 2 stops movement.Industrial computer 18 controls laser 10 to send laser beam and control in dynamic focusing mirror 12
Can straight line back and forth movement mechanism 15, drive negative focusing eyeglass 13 to come and go linear motion with the frequency of setting, make laser spot 1 with
Thickness optical axis direction of certain frequency along workpiece 2 moves up and down, meanwhile, industrial computer 18 controls xy workbench 17 with certain again
Speed travelling workpiece 2, complete the cutting of laser spot dynamic, etching, scribing or welding processing.
The advantages of this laser spot dynamic machining method is that light path is simple, and laser spot dynamic machining scope is wider.
In order to obtain less focal beam spot diameter, the two of laser spot dynamic machining square law device provided by the invention sees
Shown in Fig. 5, Fig. 5 is the two laser spot dynamic machining provided in an embodiment of the present invention for realizing laser spot dynamic machining method
Schematic device.
Specifically, adding a focus lamp 20 after guide-lighting mirror 16, the focusing that focus lamp 20 exports to dynamic focusing swashs
Light beam carries out secondary focusing, can obtain less focal beam spot diameter, can be achieved to bore less bore dia and narrower cutting and
Weld width.
The method of work and figure of Fig. 5 realize laser spot dynamic machining method two laser spot dynamic machining device
3 described devices are identical.
One of above laser spot dynamic machining method, 2 two kinds of laser spot dynamic machining square law devices common spy
Point is that laser beam is motionless, but xy workbench drives workpiece movement, forms Laser Processing track.
The three of the specific embodiment of the invention：In order to overcome Laser Processing speed slow, and it can not realize that laser spot is moved
The problem of state spiral or concentric-ring pattern drilling and swing type are processed, the present invention provides the three of embodiment.Laser spot
The three of dynamic machining method refer to laser spot dynamic screw or concentric-ring pattern drilling and swing type processing method.
Wherein, Fig. 8 is the three of laser spot dynamic machining method provided in an embodiment of the present invention：Spiral laser spot is moved
State drilling schematic diagram；Fig. 9 is the three of laser spot dynamic machining method provided in an embodiment of the present invention：Concentric-ring pattern laser spot
Dynamic boring schematic diagram；Figure 10 is the three of laser spot dynamic machining method provided in an embodiment of the present invention：Swing type laser is burnt
Point dynamic machining sketch chart.
Fig. 6 is three device provided in an embodiment of the present invention for realizing laser spot dynamic machining method, as seen from the figure, should
Device is one xy bidimensionals scanning galvanometer 25 of addition after dynamic focusing mirror 12.From the focusing laser beam warp of dynamic focus lamp output
After xy bidimensionals scanning galvanometer 25, a certain position of workpiece 2 is focused on.Because xy bidimensionals scanning galvanometer 25 is by x directions and y directions
Reflecting optics form, can its light weight, inertia is small, can be in x/y plane in x/y plane scanning machining track for controlling laser beam
On realize that arbitrarily complicated figure is processed in high-velocity scanning.
The present embodiment device at work, industrial computer 18 simultaneously control in laser 10, dynamic focusing mirror 12 can straight line
Back and forth movement mechanism 15, xy workbench 17 and bidimensional scanning galvanometer 25.
If necessary to obtain less Laser Focusing spot diameter, one can be installed in the delivery outlet of xy bidimensionals scanning galvanometer 25
The scanning focused field lens 26 of proper focal length, secondary focusing is carried out to the focusing laser beam that dynamic focusing mirror 12 exports, sees Fig. 7 institutes
Show.Fig. 7 be it is provided in an embodiment of the present invention another realize three device of laser spot dynamic machining method, the device is being schemed
On the basis of 6 shown devices, secondary focusing is carried out for focusing on laser beam, its light class diameter is smaller, for processing aperture diameter
The smaller welding of smaller either width or joint-cutting.
The present embodiment device operation principle is：In laser spot dynamic boring, industrial computer 18 controls laser 10 to send
Laser beam and control in dynamic focusing mirror 12 can straight line back and forth movement mechanism 15, drive negative focusing eyeglass 13 with certain speed
Move along a straight line forward or backward, while the control of xy bidimensionals scanning galvanometer 25 focuses on laser beam and scans track in x/y plane, so as to real
Now spiral laser spot dynamic boring (as shown in Figure 8) or concentric-ring pattern laser spot dynamic boring (as shown in Figure 9).
In the range of the field sweep of scanning galvanometer 25 after completion of processing, industrial computer 18 controls xy workbench 17 to move on to workpiece 2 newly
The field sweep of scanning galvanometer 25 in the range of continue Drilling operation until Drilling operation terminate.
In the cutting of laser spot dynamic, etching, scribing or welding, industrial computer 18 controls laser 10 to send laser beam simultaneously
Control in dynamic focusing mirror 12 can straight line back and forth movement mechanism 15, drive negative focusing eyeglass 13 to come and go fortune with certain frequency
It is dynamic, while the control of xy bidimensionals scanning galvanometer 25 focuses on laser beam and scans track in x/y plane, and swing type laser spot can be achieved and move
State cutting, etching, scribing or welding manner processing are (as shown in Figure 10).In the range of the field sweep of scanning galvanometer 25 after completion of processing,
The control xy of industrial computer 18 workbench 17, which moves on to workpiece 2 in the range of the new field sweep of scanning galvanometer 25, continues Laser Processing until whole
Work pieces process finishes.
In order to further illustrate the superiority of processing method of the present invention, with reference to specific process embodiment to the present invention
Method describes in detail.
Example 1：
A pair of thickness of the specific embodiment of the invention are used as 1mm Al2O3Ceramic material carries out laser spot dynamic and bored
Hole machined.
Lasing light emitter in laser spot dynamic boring system is pulse width 25ns, repetition rate 100kHz, and wavelength is
1064nm, power output are 50W pulse laser, the removable negative focusing eyeglass scope 2mm in dynamic focusing mirror, and laser gathers
Burnt spot diameter is 50 μm and can be along optical axis moving range 20mm.Laser spot is located at material surface to be processed, drilling is set
When laser spot moved down with 0.5mm/s speed.
Test result indicates that：It it is 70 μm in the hole diameter that ceramics obtain, wall taper is less than 0.1 °, and hole wall is without re cast layer
And micro-crack, heat affected area are less than 1 μm.Orifice surface and bottom are substantially without residue.
Example 2：
Two pairs of thickness of the specific embodiment of the invention are used to carry out laser spot dynamic for 20mm soda-lime glass material
Fire check cutting separation processing.
Lasing light emitter in laser spot dynamic diced system is that wavelength is 1064nm, and power output is 100W continuous laser
Device, the removable negative focusing eyeglass scope 5mm in dynamic focusing mirror, Laser Focusing spot diameter are 0.1mm and can moved along optical axis
Dynamic scope 50mm.Laser spot is located in the middle part of material to be processed, sets fire check to cut in separation process laser spot to shake
Width is 2mm, frequency is that 50Hz is moved up and down.
Test result indicates that：Glass separating cut is smooth precipitous, no chipping phenomenon, breach end face flat smooth, and can enter
The camber line cutting separation of row certain curvature.
Example 3：
Three pairs of thickness of the specific embodiment of the invention are used as 2mm Al2O3Ceramic material carries out laser scan type focus
Dynamic bores the aperture of 1mm diameters.
Lasing light emitter in laser spot dynamic boring system is pulse width 25ns, repetition rate 500kHz, and wavelength is
1064nm, power output are 50W pulse laser, the removable negative focusing eyeglass scope 2mm in dynamic focusing mirror, and laser gathers
Burnt spot diameter is 10 μm and can be along optical axis moving range 20mm.Laser spot is located at material surface to be processed, drilling is set
When laser spot moved down with 1mm/s speed, sweep speed 1m/s.
Test result indicates that：It is 1.02mm in the hole diameter that ceramics obtain, wall taper is less than 0.01 °, and hole wall is without weight
Cast layer and micro-crack, heat affected area are less than 0.5m.Orifice surface and bottom are without residue.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., all should be included
Within protection scope of the present invention.
Claims (9)
- A kind of 1. laser spot dynamic machining method, it is characterised in that in process, laser spot hot spot is along optical axis to set Speed dynamic mobile.
- 2. a kind of laser spot dynamic machining method as claimed in claim 1, it is characterised in that laser spot hot spot is to set Speed moved downward or upward along workpiece to be processed thickness optical axis direction.
- 3. a kind of laser spot dynamic machining method as claimed in claim 1, it is characterised in that laser spot hot spot is to set Frequency linearity movement, or warble of the laser spot hot spot to set, or frequency spiral of the laser spot hot spot to set Formula moves up and down.
- 4. realize the laser spot dynamic machining device of the method as described in one of claim 1-2, it is characterised in that it includes Laser (10), beam-expanding collimation mirror (11), dynamic focusing mirror (12), guide-lighting mirror (16), can straight line back and forth movement mechanism (15), xy Workbench (17) and industrial computer (18), wherein,Dynamic focusing mirror (12) includes positive and negative focusing microscope group (14) and a piece of negative focusing eyeglass (13),Xy workbench (17) is used to carry workpiece to be processed (2), and negative focusing eyeglass (13) is arranged on can straight line back and forth movement mechanism (15) on, moved linearly with energy edge,Industrial computer (18) at the same with laser (10), can straight line back and forth movement mechanism (15) and xy workbench (17) be connected, with Can control respectively laser (10) switch, can the movement of straight line back and forth movement mechanism (15) and the movement of xy workbench (17),The side for the laser beam axis that beam-expanding collimation mirror (11), dynamic focusing mirror (12), guide-lighting mirror (16) are launched along laser (10) To setting gradually,Guide-lighting mirror (16) is used for the laser reflection of laser (10) transmitting to workpiece to be processed (2).
- 5. laser spot dynamic machining device as claimed in claim 4, it is characterised in that perform dynamic boring in laser spot During processing, industrial computer (18) control laser (10) send laser beam and control in dynamic focusing mirror (12) can straight line come and go fortune Motivation structure (15) drives negative focusing eyeglass (13) to be moved along a straight line forward or backward with the speed of setting,So that laser spot (1) is moved up or down with thickness optical axis direction of the speed of setting along workpiece to be processed (2), The processing of laser spot dynamic boring is completed,Then, industrial computer (18) controls the mobile workpiece to be processed (2) of xy workbench (17) to arrive another position again, repeats to swash above Optical focus dynamic boring procedure, until completing all Drilling operations.
- 6. laser spot dynamic machining device as claimed in claim 4, it is characterised in that also including focus lamp (20), focus on Mirror (20) is arranged on guide-lighting mirror (16) lower end, and focus lamp (20) is used to carry out secondary gather to the focusing laser beam of dynamic focusing output Jiao, to obtain smaller focal beam spot diameter, so as to bore the hole of smaller diameter for realizing or realize narrower cutting and weldering Seam.
- 7. realize the laser spot dynamic machining device of the method as described in one of claim 1-3, it is characterised in that it includes Laser (10), beam-expanding collimation mirror (11), dynamic focusing mirror (12), can straight line back and forth movement mechanism (15), xy bidimensionals scanning shake Mirror (25), xy workbench (17) and industrial computer (18), wherein,Dynamic focusing mirror (12) includes positive and negative focusing microscope group (14) and a piece of negative focusing eyeglass (13),Xy workbench (17) is used to carry workpiece to be processed (2), and negative focusing eyeglass (13) is arranged on can straight line back and forth movement mechanism (15) on, moved linearly with energy edge,Industrial computer (18) at the same with laser (10), can straight line back and forth movement mechanism (15), xy bidimensionals scanning galvanometer (25) and Xy workbench (17) is connected, with can control respectively the switch of laser (10), can straight line back and forth movement mechanism (15) movement, The movement of xy bidimensionals scanning galvanometer (25) and the movement of xy workbench (17),The laser light that beam-expanding collimation mirror (11), dynamic focusing mirror (12), xy bidimensionals scanning galvanometer (25) are launched along laser 10 The direction of axle is set gradually,The focusing laser beam focus that xy bidimensionals scanning galvanometer (25) is used to export from dynamic focus lamp is in workpiece to be processed (2) Setting position,Xy bidimensionals scanning galvanometer (25) is made up of x directions reflecting optics and y directions reflecting optics, for controlling laser beam in xy Flat scanning machining locus.
- 8. laser spot dynamic machining device as claimed in claim 7, it is characterised in that also includeScanning focused field lens (26), scanning focused field lens (26) are arranged on xy bidimensionals scanning galvanometer (25) lower end, for dynamic The focusing laser beam of focus lamp (12) output carries out secondary focusing, to obtain smaller focal beam spot diameter, so as to for reality Now bore the hole of smaller diameter or realize narrower cutting and weld seam.
- 9. the laser spot dynamic machining device as described in claim 4 or 7, it is characterised in that positive and negative focusing microscope group (14) is extremely Include a piece of negative focusing eyeglass and a piece of positive focusing lens less.
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