CN108882537A - A kind of drilling holes on circuit board method - Google Patents
A kind of drilling holes on circuit board method Download PDFInfo
- Publication number
- CN108882537A CN108882537A CN201811025745.8A CN201811025745A CN108882537A CN 108882537 A CN108882537 A CN 108882537A CN 201811025745 A CN201811025745 A CN 201811025745A CN 108882537 A CN108882537 A CN 108882537A
- Authority
- CN
- China
- Prior art keywords
- laser
- circuit board
- drilling holes
- power
- board method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
A kind of the step of the present invention provides drilling holes on circuit board methods, are related to the technical field of wiring board processing, and drilling holes on circuit board method is included in mark software operation interface setting map file；By the laser spot setting of the laser beam of laser transmitting the upper copper surface the step of；By vibration mirror scanning map file, and the step of using laser ablation pore-forming.In process, user utilizes the laser beam of laser along the map file ablation on upper copper surface, to form hole in the circuit board.High in machining efficiency, be in process not in Drill Crack the problems such as smaller to the damage of original part of laser drill, cost is relatively low, meanwhile, laser drill can process aperture in the micro-hole of 20-100um, it is not likely to produce bore edges burr phenomena, can satisfy current technique requirement.
Description
Technical field
The present invention relates to wiring board processing technique fields, more particularly, to a kind of drilling holes on circuit board method.
Background technique
Flexible circuit board is made of copper foil coating, binder and flexible media film three parts.LCP (liquid crystal polymer
Polymer) add with the characteristics such as optical anisotropy, the dielectric constant anisotropy of small molecule liquid crystal and macromolecule are excellent
Work characteristic has the advantages such as outstanding frequency decay, heat transfer property and moisture resistance, thin as medium using novel LCP material
Film meets the requirement such as high heat resistance, good insulating.In recent years, to the demand of high-frequency low-consumption transmission, soft board base is done using LCP
Material is using more and more extensive.
Through-hole and blind hole machining are technical process important in flexible circuit board manufacture, industrially frequently with machine drilling
Mode.
But machine drilling low efficiency, it is larger to the damage of original part, easily occur the problems such as Drill Crack in process,
So as to cause increased costs.Simultaneously as machine drilling is also easy to produce bore edges burr phenomena, with the development of electronic component,
Higher and higher to the size requirement of drilling holes on circuit board, machine drilling is difficult to obtain micro-hole with high accuracy, it is difficult to meet current
Technique requirement.
Summary of the invention
The purpose of the present invention is to provide a kind of drilling holes on circuit board methods, to improve machine drilling existing in the prior art
Low efficiency, it is larger to the damage of original part, easily occur the problems such as Drill Crack in process, so as to cause increased costs, and
Machine drilling is also easy to produce bore edges burr phenomena, it is difficult to meet the technical issues of current technique requires.
Drilling holes on circuit board method provided by the invention, including：
In the step of map file is arranged in mark software operation interface；
By the laser spot setting of the laser beam of laser transmitting the upper copper surface the step of；
By vibration mirror scanning map file, and the step of using laser ablation pore-forming.
Further, when processing through-hole, laser successively the upper copper of ablation wiring board, middle layer LCP material and under
Layer copper foil, and laser output power is lasting constant.
Further, when processing blind hole, laser exports the first power to remove upper copper, laser output second
Power is to remove middle layer LCP material, and the first power is greater than the second power.
Further, the output power of laser is 3.0-7.5W, scan rate of vibrating mirror 1000-6000mm/s.
Further, the first power and the second power are 2.0-4.0W, and the difference of the first power and the second power is small
In 1W；Scan rate of vibrating mirror is 1000-6000mm/s.
Further, before the step of laser spot of laser beam is arranged on upper copper surface, CCD camera is utilized
The step of being positioned with Working position of the coordinate penalty method to wiring board.
Further, before the step of laser spot of laser beam is arranged on upper copper surface, using removable
Platform the step of wiring board is moved to Working position.
Further, platform is vacuum absorbing platform.
Further, map file is rounded or spiral shape.
Further, laser is ultraviolet nanosecond laser.
Drilling holes on circuit board method provided by the invention, in process, user is using the laser beam of laser along upper
The map file ablation of layer copper foil surface, to form hole in the circuit board.
From the foregoing, it will be observed that laser drill is high in machining efficiency, and it is smaller to the damage of original part, it is in process not in bore
The problems such as head rupture, cost is relatively low, meanwhile, laser drill can process aperture in the micro-hole of 20-100um, be not likely to produce hole
Burrs on edges phenomenon can satisfy current technique requirement.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the step block diagram of drilling holes on circuit board method provided in an embodiment of the present invention；
Fig. 2 be another embodiment of the present invention provides drilling holes on circuit board method step block diagram；
Fig. 3 is the step block diagram for the drilling holes on circuit board method that further embodiment of this invention provides；
Fig. 4 is the structural schematic diagram that wiring board provided in an embodiment of the present invention processes through-hole；
Fig. 5 is the structural schematic diagram of wiring board processing blind hole provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of drilling equipment provided in an embodiment of the present invention.
Icon：1- wiring board；2- galvanometer；3- upper copper；The middle layer 4- LCP；5- lower copper foil；6- through-hole；7- blind hole；8-
CCD camera；9- platform；10- plait mill；11- crossbeam；12- sliding block.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that such as occur term " center ", "upper", "lower", "left", "right",
"vertical", "horizontal", "inner", "outside" etc., indicated by orientation or positional relationship be orientation based on the figure or position
Relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have
There is specific orientation, be constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, as occurred
Term " first ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
As shown in Fig. 1 and Fig. 4-6, drilling holes on circuit board method provided in this embodiment is included in mark software operation circle
The step of map file is arranged in face；By the laser spot setting of the laser beam of laser transmitting 3 surface of upper copper the step of；Pass through
Galvanometer 2 scans map file, and the step of using laser ablation pore-forming.
Wherein, due to the laser beam of galvanometer 2 from upper copper 3 lead to lower layer during there are slight difference, cause
It will form certain taper between 1 upper and lower level of wiring board.
If the thickness and the number of plies of wiring board 1 change, setting for laser spot can be adjusted according to the actual (real) thickness of material
Seated position and working power.
When wiring board 1 is whole thicker, laser spot can be first located in the upper layer of material, when the material on upper layer processes
Cheng Hou, then the middle layer and the lower layer that enable the laser spot of laser beam focus on material.
The material thicker for size, the output power of the laser of upper layer setting are higher than lower layer, and upper and lower level difference power
Value is less than 1W, and power is higher, and taper is smaller, and heat affecting is more serious.Breeding, power is lower, and material bottom is influenced by heat smaller.
Drilling holes on circuit board method provided in this embodiment, the step of 3 surface of the upper copper setting map file including assist side 1
Suddenly；By the setting of the laser spot of laser beam 3 surface of upper copper the step of；Map file is scanned by galvanometer 2, and is burnt using laser
The step of losing pore-forming.In process, user utilizes the laser beam of laser along the map file ablation on 3 surface of upper copper,
To form hole in assist side 1.
From the foregoing, it will be observed that laser drill is high in machining efficiency, and it is smaller to the damage of original part, it is in process not in bore
The problems such as head rupture, cost is relatively low, meanwhile, laser drill can process aperture in the micro-hole of 20-100um, be not likely to produce hole
Burrs on edges phenomenon can satisfy current technique requirement.
As shown in figure 4, on the basis of the above embodiments, further, when processing through-hole 6, laser successively ablation line
Upper copper 3, middle layer LCP4 material and the lower copper foil 5 of road plate 1, and laser output power is lasting constant.
Wherein, after upper copper 3 is removed, LCP film, which is influenced by heat, generates certain indent than more serious, when laser beam is poly-
When collecting in assist side 1, scanning speed is lower, and the energy that wiring board 1 is acted in the unit time is higher, and hot stack is more obvious,
It is thus preferable in process, user should choose the scanning speed of laser output power and galvanometer 2 appropriate, from
And improve processing efficiency.
Further, under focus state, focal position is located at the surface of the upper copper 3 of wiring board 1, wherein preferably
Machined parameters are：The output power of laser is 3.0-7.5W, and 2 scanning speed of galvanometer is 1000-6000mm/s.
In addition, after processing is completed, user can be formed with metallographic microscope, confocal microscope or three-D detection processing
Through-hole 6.
In the present embodiment, user enables the output power of laser remain unchanged in process, to process logical
Hole 6.
As shown in figure 5, on the basis of the above embodiments, further, when processing blind hole 7, laser output first
Power is to remove upper copper 3, and laser exports the second power to remove middle layer LCP4 material, and the first power is greater than the second function
Rate.
Further, under focus state, focal position is located at the surface of the upper copper 3 of wiring board 1, wherein preferably
Machined parameters are：First power and the second power are 2.0-4.0W, and the difference of the first power and the second power is less than 1W；Vibration
2 scanning speed of mirror is 1000-6000mm/s.
In addition, after processing is completed, user can be formed with metallographic microscope, confocal microscope or three-D detection processing
Blind hole 7.
In the present embodiment, user changes the output power of laser in process, to process blind hole 7.
As shown in Figure 2 and Figure 6, on the basis of the above embodiments, further, it is arranged by the laser spot of laser beam
Before 3 surface of upper copper the step of, the Working position of wiring board 1 is positioned using CCD camera 8 and coordinate penalty method
The step of.
CCD is the abbreviation of charge-coupled device, and light can be become charge and by charge storage and transfer by it, can also be incited somebody to action
The charge taking-up of storage makes voltage change, therefore is ideal 8 element of CCD camera, and the CCD camera 8 constituted with it has
It is small in size, light-weight, be unaffected by the magnetic field, the characteristic with anti-vibration and shock and be widely used.
Coordinate penalty method can be orthosis, and specific bearing calibration is as follows：
Wiring board 1 to be processed is placed in machining position, with galvanometer 2 marking, 9 circles, 9 circles is enable to be paved with CCD phase substantially
Current motor coordinate P1 is recorded in the visual field of machine 8.Mobile motor enables CCD camera 8 to grab nine circles of institute's marking to CCD
Camera 8 is demarcated, and current motor coordinate P2 is recorded.Calculate galvanometer 2 and 8 distance L=P2-P1 of CCD camera；
By acquired value L compensation on corresponding to the corresponding graphics processing in processing parts all on wiring board 1.According to compensation
3 Mark Point point coordinate positions with CCD camera 8 carry out crawl of taking pictures in map file afterwards.It is taken pictures coordinate meter by CCD camera 8
The direction the XY offset and rotation angle for calculating wiring board 1, offset and rotation angle are compensated again in processing map file.Root
It is processed according to compensated map file again.
Preferably, effectively increasing fortune by the way of substituting traditional linear mould group cooperation servo motor using linear motor
Dynamic stroke improves the positioning accuracy and stability in motion process especially under high speed state.
As shown in Figure 3 and Figure 6, on the basis of the above embodiments, further, it is arranged by the laser spot of laser beam
Before 3 surface of upper copper the step of, the step of wiring board 1 is moved to Working position using moveable platform 9.
Further, platform 9 is vacuum absorbing platform.
Working position, which may be provided with, takes out dirt device, takes out dirt device for removing the dust formed in borehole engineering, such energy
Enough guarantee the cleaning of 1 processing environment of wiring board.
Wherein, vacuum absorbing platform may include plait mill 10, vacuum pump, vacuum suction pipe and absorption platform, absorption
Be arranged at intervals with multiple absorption through-holes on platform, plait mill 10 is arranged on absorption platform, vacuum pump by vacuum suction pipe with
Multiple absorption through-hole connections.In use, wiring board 1 is placed on the conveyer belt of plait mill 10, the shaft of plait mill 10
To take wiring board 1 to machining area, vacuum pump is opened air between absorption platform and wiring board 1 from absorption through hole for rotation
Extraction, to form vacuum, carries out absorption positioning to wiring board 1；When after processing is completed, the rotation axis of plait mill 10 is rotated, with
The wiring board 1 that drilling is completed is spread out of, to complete the cyclic process of continuous charging and discharging.
The crossbeam 11 extended in X direction and the sliding block being arranged on crossbeam 11 should be set on the drilling equipment of wiring board 1
12, galvanometer 2 is fixedly connected with sliding block 12, and galvanometer 2 can be moved along the x axis by sliding block 12 on crossbeam 11.By coiled strip
The direction of motion of the conveyer belt of machine 10 is considered as Y direction, and the injection direction of the laser beam of galvanometer 2 is Z-direction, X-axis, Y-axis with
And Z axis is mutually perpendicular to.
Should be provided with control system on the drilling equipment of wiring board 1, control system respectively with galvanometer 2, plait mill 10, vacuum
Pump, sliding block 12 and CCD camera 8 connect, and all structural members can be enabled to realize precisely cooperation and height under software control in this way
Speed processing, to improve the processing efficiency of drilling equipment.
In the present embodiment, the setting of moveable vacuum absorbing platform 9 can guarantee in process flat of wiring board 1
Whole property and stability.
On the basis of the above embodiments, further, map file is rounded or spiral shape.
Further, laser is ultraviolet nanosecond laser.
In the present embodiment, the stable output power of ultraviolet nanosecond laser can be improved the efficiency of processing.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, those skilled in the art should understand that：Its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of drilling holes on circuit board method, which is characterized in that including：
In the step of map file is arranged in mark software operation interface；
By the laser spot setting of the laser beam of laser transmitting the upper copper surface the step of；
By map file described in vibration mirror scanning, and the step of using laser ablation pore-forming.
2. drilling holes on circuit board method according to claim 1, which is characterized in that when processing through-hole, laser successively ablation
The upper copper, middle layer LCP material and the lower copper foil of the wiring board, and laser output power is lasting constant.
3. drilling holes on circuit board method according to claim 1, which is characterized in that when processing blind hole, the laser is defeated
For the first power to remove the upper copper, the laser exports the second power to remove the middle layer LCP material, and institute out
The first power is stated greater than second power.
4. drilling holes on circuit board method according to claim 2, which is characterized in that the output power of the laser is 3.0-
7.5W, the scan rate of vibrating mirror are 1000-6000mm/s.
5. drilling holes on circuit board method according to claim 3, which is characterized in that first power and second power
It is 2.0-4.0W, and the difference of first power and second power is less than 1W；The scan rate of vibrating mirror is 1000-
6000mm/s。
6. drilling holes on circuit board method according to claim 1, which is characterized in that set by the laser spot of the laser beam
Before setting the upper copper surface the step of, using CCD camera and coordinate penalty method to the Working position of the wiring board
The step of being positioned.
7. drilling holes on circuit board method according to claim 1, which is characterized in that set by the laser spot of the laser beam
Before setting the upper copper surface the step of, the wiring board is moved to the step of Working position using moveable platform
Suddenly.
8. drilling holes on circuit board method according to claim 7, which is characterized in that the platform is vacuum absorbing platform.
9. drilling holes on circuit board method according to claim 1, which is characterized in that the map file is rounded or spiral shape.
10. drilling holes on circuit board method according to claim 1, which is characterized in that the laser is ultraviolet nanosecond laser
Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811025745.8A CN108882537A (en) | 2018-09-04 | 2018-09-04 | A kind of drilling holes on circuit board method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811025745.8A CN108882537A (en) | 2018-09-04 | 2018-09-04 | A kind of drilling holes on circuit board method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108882537A true CN108882537A (en) | 2018-11-23 |
Family
ID=64323012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811025745.8A Pending CN108882537A (en) | 2018-09-04 | 2018-09-04 | A kind of drilling holes on circuit board method |
Country Status (1)
| Country | Link |
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| CN (1) | CN108882537A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114393639A (en) * | 2022-01-21 | 2022-04-26 | 广东小镓技术有限公司 | Multilayer circuit board drilling method and multilayer circuit board drilling device |
| CN115763869A (en) * | 2022-12-16 | 2023-03-07 | 广东省科学院新材料研究所 | Support connector for solid oxide fuel cell or electrolytic cell and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114393639B (en) * | 2022-01-21 | 2024-03-19 | 淮安特创科技有限公司 | Multilayer circuit board drilling method and multilayer circuit board drilling device |
| CN115763869A (en) * | 2022-12-16 | 2023-03-07 | 广东省科学院新材料研究所 | Support connector for solid oxide fuel cell or electrolytic cell and preparation method thereof |
| CN115763869B (en) * | 2022-12-16 | 2024-04-16 | 广东省科学院新材料研究所 | Support connector for solid oxide fuel cell or electrolytic cell and preparation method thereof |
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Application publication date: 20181123 |