CN111438443B - Method for processing controllable micro-groove on surface of workpiece through laser multiple scanning ablation - Google Patents
Method for processing controllable micro-groove on surface of workpiece through laser multiple scanning ablation Download PDFInfo
- Publication number
- CN111438443B CN111438443B CN202010416857.7A CN202010416857A CN111438443B CN 111438443 B CN111438443 B CN 111438443B CN 202010416857 A CN202010416857 A CN 202010416857A CN 111438443 B CN111438443 B CN 111438443B
- Authority
- CN
- China
- Prior art keywords
- micro
- groove
- laser
- ablation
- determining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Abstract
The invention provides a method for processing a controllable micro-groove on the surface of a workpiece by multiple scanning and ablation of laser, aiming at the problem that the existing laser ablation process is difficult to accurately control and process three-dimensional appearance, and belongs to the field of high-energy beam special processing. Firstly, calculating a laser scanning path according to the three-dimensional shape of a target; and then, finishing laser ablation processing on the surface of the workpiece to be processed and leveled by a planned laser scanning path. The invention is suitable for scenes with special requirements on surface appearance or performance, such as a super-structure surface, micro-mold manufacturing, a biochip, a flexible electronic circuit and the like.
Description
Technical Field
The invention relates to a method for processing a controllable micro-groove on the surface of a workpiece through multiple times of laser scanning ablation, belonging to the field of special manufacturing and high-energy beam manufacturing.
Background
The laser ablation is a modern precision processing method, which removes the surface layer material of a workpiece according to a preset path track by the high energy density characteristic of a focused laser beam and the motion control of a high-precision workpiece or an optical component so as to realize specific pattern texture or surface appearance. Compared with a machining method, the laser ablation machining has no cutter loss, smaller machining scale and higher precision; moreover, the laser beam after optical focusing has very high power density, and is particularly suitable for processing tiny characteristics such as hard alloy, ceramics, glass, diamond and the like on the surface of a high-hardness and high-brittleness material.
Laser marking is one of the representative applications of laser ablation, and similarly laser engraving and laser direct writing techniques. These techniques utilize the interaction of a laser beam with a material to cause a change in color, morphology, and properties of the surface or interior of the material. In recent years, laser ablation has been widely used in the fields of super-textured surface processing, surface microtexturing, micromold manufacturing, biochips, flexible electronic circuits, and the like. For example: chinese patent: CN201810832783, laser processing is connected with each other and is intersected with the micro-groove channel structure of rectangular cross section to strengthen the mixing reaction efficiency of liquid in the channel. For another example: chinese patent: CN201610926875, it has three-order capillary structure to process, realizes the auxiliary drive to the reaction liquid. The following steps are repeated: the document, acoustic metamaterial, physics, volume 41, paragraph 10 of 2012 describes that the distribution of phase and intensity of sound field, etc. is controlled by the structure of subwavelength acoustic units, so as to realize functions such as focusing, negative refraction, stealth carpet, etc., and simultaneously avoid huge loss of internal propagation of the bulk metamaterial.
The above applications put new process requirements on laser ablation processing, such as: the ablation surface is required to have no micro-cracks, the ablation scale and precision reach micron or nanometer, the ablation appearance is three-dimensionally controllable, and the like. To meet the above requirements, new processes for laser ablation have also emerged, as described in cited patents 1 to 3.
The above documents adopt a method of adjusting laser parameters and laser scanning paths to realize controllable laser ablation processing of different profiles, shapes and sizes. The laser scan path is more directly modulated than the laser parameters, which typically include layering or lapping. The layering method is to strip workpiece materials in a layering mode by utilizing tiny laser spots, and machining of complex shapes in the depth direction is achieved. The lapping method is to lap the laser spots on the processing surface to realize the processing of the complex appearance texture on the surface of the workpiece.
The invention provides a method for processing a controllable micro-groove on the surface of a workpiece by laser multi-time scanning ablation, which has the core that the shape of the micro-groove with specific depth, width and cross section outline is taken as a target, and a specific algorithm-ablation function fitting method is applied to determine an optimized laser scanning path; and controlling the laser beam to process according to the laser scanning path, and processing the target micro-groove appearance on the surface of the workpiece.
Compared with the laser ablation micro-groove which is not processed by the method, the cross section of the micro-groove processed by the method is accurate and controllable in shape, comprises a profile function, the width of the micro-groove and the depth of the micro-groove, and can obviously improve the smoothness of the bottom of the micro-groove. The characteristics can greatly expand the application range and the application effect of laser ablation processing. For example, in the case of patent 4, the laser processing can be used instead of the electrical discharge processing, so that the processing efficiency is improved, and the processing cost is reduced.
Disclosure of Invention
The method for processing the controllable micro-groove on the surface of the workpiece through the multiple scanning ablation of the laser has the advantages that the precise control of the cross section shape of the processed micro-groove is realized, wherein the cross section shape comprises a profile function, the width of the micro-groove and the depth of the micro-groove; the smoothness of the cross section profile is obviously improved, and the application range and the application effect of the laser ablation processing technology are expanded.
The technical scheme adopted by the invention is as follows: determining the path of multiple laser scanning by using the micro-groove morphology with specific depth, width and cross section profile as a target and applying a specific algorithm-ablation function fitting method; and controlling the laser beam to process according to the laser scanning path, and processing the micro-groove shape with the target size and structure on the surface of the workpiece.
Taking the figure 1 as an example in the specification, an ablation function fitting method is implemented to determine the paths of multiple laser scanning, and the method comprises the steps A) to G). The thick solid line in the figure is the cross-sectional profile of the target micro-groove, the micro-groove run and the laser beam scan path direction are perpendicular to the paper.
A) Establishing a micro-groove cross section function expression; and establishing an x-y Cartesian coordinate system by taking the surface of the workpiece as an abscissa and the central line of the cross section profile of the micro-groove as an ordinate. Then, the expression for the cross section of the micro-groove is:
f(x)＝-a·cos(πx/w)，-w/2≤x≤w/2， (1)
wherein a is the depth of the micro-groove and w is the width of the micro-groove.
B) Scanning a path number; since the micro-groove cross section is symmetrical about the y-axis, each sub-scan path of the laser beam in the positive x-axis is also symmetrical about the y-axis. In the direction of the positive half axis of the x axis, the sub-scanning paths are numbered S1，S2，...，SnThe distance between adjacent sub-scanning paths is Deltax1，Δx2，...，Δxn。
C) Determining a laser ablation removal function; the laser beam removes the workpiece material by ablation; to machine a micro-groove with a cross-section expression of f (x), the laser ablation removal function g (x) is:
g(x)＝-f(x)＝a·cos(πx/w)，-w/2≤x≤w/2 (2)
D) determining a removed material rate of change function; in the interval-w/2 is more than or equal to x and less than or equal to w/2, the change rate of the ablation workpiece material is in accordance with the derivative function g' (x) of g (x):
g′(x)＝aπw-1sin(πxw-1)，-w/2≤x≤w/2 (3)
E) determining the separation Deltax of adjacent sub-scan pathsnThe expression of (1); definition of Δ xnRate of change omega along the x-axisn：
ωn＝(Δxn+1-Δxn)Δxn＝Δxn+1/Δxn-1， (4)
ωnThe smaller the laser beam scanning is, the higher the overlapping coefficient of the adjacent two laser beam scanning is; according to the laser ablation principle, the higher the overlapping coefficient of two adjacent laser beam scans is, the more obvious the ablation effect of the laser beam on a unit area is, and omeganOc g' (x), therefore:
wherein C is a constant coefficient.
Bringing formula (4) into formula (5) and finishing to obtain:
wherein n is a positive integer.
F) Determining Δ xnThe constraint of (2); the lapping method is adopted, the surface material of the workpiece is removed by using laser beam to scan and ablate for a plurality of times,there is an overlap region between the laser beams of adjacent scan paths. Defining the overlap ratio eta of adjacent laser beams, there are:
η＝1-Δx/RL (7)
wherein R isLIs the laser beam spot diameter.
In order to form a coincidence region between the laser beams of the adjacent scanning paths, the scanning paths of the laser beams also need to satisfy:
Δxn≤RL/(ηmin+1) (8)
wherein eta isminIs the minimum overlap ratio of the laser beams of adjacent scan paths.
On the other hand, in order to satisfy the designed trench width, each sub-scanning path distribution satisfies:
G) and searching a proper constant C value.
Drawings
FIG. 1 is a schematic representation of a sinusoidal-like wire micro-groove cross-section.
Fig. 2 is a schematic view of a multiple scan path of a laser beam perpendicular to a view of a workpiece surface.
Fig. 3 is a graph of the actual processing effect of sine-like line micro-grooves.
FIG. 4 is a schematic cross-sectional view of a triangular-like micro-groove.
Fig. 5 is a diagram showing the actual processing effect of triangular-like micro grooves.
FIG. 6 is a diagram of the actual processing effect of three-dimensional micro-pyramid-shaped features.
Detailed Description
The invention adopts the following specific implementation modes: firstly, determining the depth, width and cross section profile of the appearance of a micro groove to be processed; secondly, determining the path of the laser for multiple scanning by using a specific algorithm-ablation function fitting method; and thirdly, controlling the laser beam to process according to the laser scanning path, and processing the target micro-groove appearance on the surface of the workpiece.
Taking the processing of the sine-like line micro-groove of fig. 1 as an example, the second step is implemented, and the path of the laser scanning for multiple times is determined by using a specific algorithm-ablation function fitting method, which includes steps a) to G).
A) And establishing an x-y Cartesian coordinate system by taking the surface of the workpiece as an abscissa and the central line of the cross section profile of the micro-groove as an ordinate. Then, the expression for the cross section of the micro-groove is:
f(x)＝-a·cos(πx/w)，-w/2≤x≤w/2，
wherein a is the depth of the micro-groove and w is the width of the micro-groove.
B) Scanning a path number; since the micro-groove cross section is symmetrical about the y-axis, each sub-scan path of the laser beam in the positive x-axis is also symmetrical about the y-axis. In the direction of the positive half axis of the x axis, the sub-scanning paths are numbered S1，S2，...，SnThe distance between adjacent sub-scanning paths is Deltax1，Δx2，...，Δxn。
C) Determining a laser ablation removal function; the laser beam removes the workpiece material by ablation; to machine a micro-groove with a cross-section expression of f (x), the laser ablation removal function g (x) is:
g(x)＝-f(x)＝a·cos(πx/w)，-w/2≤x≤w/2
D) determining a removed material rate of change function; in the interval-w/2 is more than or equal to x and less than or equal to w/2, the change rate of the ablation workpiece material is in accordance with the derivative function g' (x) of g (x):
g′(x)＝aπw-1sin(πxw-1)，-w/2≤x≤w/2
E) determining the separation Deltax of adjacent sub-scan pathsnThe expression of (1); definition of Δ xnRate of change omega along the x-axisn：
ωn＝(Δxn+1-Δxn)Δxn＝Δxn+1/Δxn-1，
ωnThe smaller the laser beam scanning is, the higher the overlapping coefficient of the adjacent two laser beam scanning is; according to the laser ablation principle, the higher the overlapping coefficient of two adjacent laser beam scans is, the more obvious the ablation effect of the laser beam on a unit area is, and omeganOc g' (x), therefore:
wherein C is a constant coefficient.
The formula is arranged to obtain:
wherein n is a positive integer.
F) Determining Δ xnThe constraint of (2). Removing the surface material of the workpiece by adopting a lapping method and using laser beams to perform multiple scanning ablation, wherein a superposition area exists between the laser beams of adjacent scanning paths, and the overlapping rate eta of the adjacent laser beams is defined by the following steps:
η＝1-Δx/RL
wherein R isLIs the laser beam spot diameter.
In order to form a coincidence region between the laser beams of the adjacent scanning paths, the scanning paths of the laser beams also need to satisfy:
Δxn≤RL/(ηmin+1)
wherein eta isminIs the minimum overlap ratio of the laser beams of adjacent scan paths.
On the other hand, in order to satisfy the designed trench width, each sub-scanning path distribution satisfies:
G) and searching a proper constant C value.
The second step of the detailed description is the core technical feature of the present invention, which will be discussed separately for different embodiments below. It should be noted that there are many variations in the cross-sectional profile of the micro-groove, and the laser parameters and the workpiece material are different, but the technical solution of the method of the present invention is within the protection scope of the present invention.
The first embodiment.
The micro-groove morphology as shown in fig. 1 is obtained by laser beam multiple scanning ablation process. In the figure, the cross-sectional profile of the micro-groove morphology is a sine-like line, and the thick solid line is the cross-sectional profile of the target micro-groove. The micro-groove target process width was 100 microns and depth was 20 microns. The micro-groove trend and the laser beam scanning path direction are vertical to the paper surface.
The workpiece material is 304 stainless steel, and the surface roughness is Ra0.1 micron. The micro-groove target processing depth is 20 microns and the width is 100 microns. The laser is selected from a picosecond laser, the wavelength is 1064nm, the laser pulse width is 10ps, the pulse repetition frequency is 500KHz, the maximum output power is 10w, the laser beam spot diameter is 20 micrometers, and the laser beam focal plane is superposed with the surface of a workpiece. Initial laser output power PLIs the maximum output power P MAX50% of the total.
For the processing target of the example, the specific process of determining the path of the laser multiple scanning comprises steps a) to G) by using a specific algorithm-ablation function fitting method.
A) In the cartesian coordinate system as shown in fig. 1, the expression of the cross section of the micro-groove is:
f(x)＝-20cos(πx/100)，-50≤x≤50
B) the scanning paths of the laser beams are symmetrically distributed along the y axis: in the direction of the positive half axis of the x axis, the sub-scanning paths are numbered S1，S2，...，SnThe distance between adjacent sub-scanning paths is Deltax1，Δx2，...，Δxn。
C) To machine a micro-groove with a cross-section expression of f (x), the laser ablation removal function g (x) is:
g(x)＝-f(x)＝20cos(0.0314x)，-50≤x≤50
D) within the interval-50 ≤ x ≤ 50, the change rate of ablation of workpiece material should be consistent with the derivative function g' (x) of g (x):
g′(x)＝0.63sin(0.0314x)，-50≤x≤50
E) extending along the x-axis forward direction, the spacing Δ x of the scanning pathnRate of change of (ω)nThe following relationships exist:
ωn＝(Δxn+1-Δxn)Δxn＝Δxn+1/Δxn-1
ωn＝C sin[0.0314(Δx1+Δx2+…+Δxn)]
finishing to obtain:
Δxn+1＝{C sin[0.0314(Δx1+Δx2+…+Δxn)]+1}*Δxn (6)
F)Δxnthe constraint conditions of (1) are:
Δxn≤20/(ηmin+1)，
wherein eta isminTaking η for minimum overlap of laser beams of adjacent scan pathsmin＝50％，RLThe spot diameter of the laser beam was 20 μm.
G) And searching a proper constant C value.
Table 1 shows the values when Δ x1When C is 1, 0.8, 0.6 or 0.4,. DELTA.xnThe value of the constraint condition is satisfied.
As can be seen from Table 1, when Δ x is measured1And (4) value determination, wherein the smaller the C value is, the larger the scanning times n of the positive x half shaft is. The following table gives Δ x1Δ x when C is 1, 0.8, 0.6 and 0.4 ═ 4nThe value of the constraint condition is satisfied.
When comparing Table 1 and Table 2, it can be seen that Δ x1The value increases and the number of scans n of the positive x-axis decreases. As can be seen from a combination of tables 1 and 2, when the width and cross-sectional profile of the micro groove to be processed are determined, the width and cross-sectional profile of the micro groove are changedBy C and Δ x1The value of (2) can find a multiple scanning scheme which meets constraint conditions and has better laser scanning times and paths.
Table 1: c ═ 1, Δ x1 Scheme 2, and table 2: c ═ 0.8, Δ x1The scheme of 4 is more in accordance with the constraint condition.
Evaluation table 1: c ═ 1, Δ x1Micro-groove width w processed by multiple scanning of laser beam of 2 schemeReal-1Comprises the following steps:
wReal-1＝2∑Xn+RL＝100.96
evaluation table 2: c ═ 0.8, Δ x1Micro-groove width processed by multiple scanning of laser beam of 4 schemeswReal-2Comprises the following steps:
wReal-2＝2∑Xn+RL＝108.5
the multiple scan paths of the laser beam, where C is 0.8 in table 2, are plotted in fig. 2 from a view angle perpendicular to the workpiece surface. Fig. 2 includes 13 laser beam scanning paths symmetrically distributed about the Z-axis, with the arrows representing the laser beam scanning paths and the solid lines representing the centerlines of the respective sub-scanning paths. For ease of understanding, fig. 2 shows only a small piece of micro-groove processing. When the length of the target micro-groove is longer or is a curve, the offset between laser scanning paths at each time is determined by an ablation function fitting method, and the same machining effect of the width, the depth and the cross section profile of the micro-groove can be realized; therefore, these situations are all within the scope of the present invention.
The steps A) to G) are the process of determining the path of the laser scanning for multiple times by using a specific algorithm-ablation function fitting method. By implementing the above process, micro-grooves of a specific width and cross-sectional profile can be machined. The following discusses how the laser beam may be manipulated to produce a target micro-groove depth.
Firstly, detecting the shape of a micro-groove processed by a laser beam through a Taylor instrument or a three-dimensional shape instrument, on one hand, verifying whether the width and the cross section profile meet the design requirements, and on the other hand, obtaining the depth of the micro-groove, wherein the depth of the micro-groove is defined as the distance from the bottommost part of the micro-groove to the surface of a workpiece. In this embodimentWhere C is 1, Δ x1The depth of the micro-groove processed by the 2 scheme is about 5 microns, C is 0.8, and delta x1The depth of the micro-grooves machined by the scheme 4 is 3.5 microns.
The micro-groove target processing depth is 20 microns because of:
20＝5+5+5+5
thus, let C be 1, Δ x1The scheme 2 is repeated for 4 times at the same position of the surface of the workpiece, and the sine-like micro-groove with the depth close to 20 microns can be obtained. And the surface of the workpiece is cleaned between each processing, so that the loss of laser beam energy caused by laser ablation of the oxide layer is reduced.
Example two.
The difference between the second embodiment and the first embodiment is that the target processing depth of the micro-groove is 8 μm.
Because of the following:
8≈5+3.5
thus, let C be 1, Δ x12 scheme and C0.8, Δ x1The scheme 4 processes the same position of the workpiece surface for 1 time respectively, and then the sine-like micro-groove with the depth of about 8 microns can be obtained. And cleaning the surface of the workpiece between two times of processing to reduce the energy loss of the laser beam caused by laser ablation of the oxide layer.
The actual processing effect of the second embodiment is shown in fig. 3.
Example three.
The micro-groove morphology as shown in fig. 4 is obtained by laser beam multiple scanning ablation process. In the figure, the cross section profile of the micro-groove is triangular, the thick solid line is the cross section profile of the target micro-groove, and the trend of the micro-groove and the scanning path direction of the laser beam are perpendicular to the paper surface.
The workpiece material is 304 stainless steel, and the surface roughness is Ra0.1 micron. The micro-groove target processing depth is 12 microns and the width is 150 microns. The laser is selected from a picosecond laser, the wavelength is 1064nm, the laser pulse width is 10ps, the pulse repetition frequency is 500KHz, the maximum output power is 10w, the laser beam spot diameter is 20 micrometers, and the laser beam focal plane is superposed with the surface of a workpiece. Initial laser output power PLIs the maximum output power P MAX50% of the total.
In this embodiment, the path of the laser multiple scans is determined using a specific algorithm-ablation function fitting method, including steps a) -G).
A) And establishing an x-y Cartesian coordinate system by taking the surface of the workpiece as an abscissa and the central line of the cross section profile of the micro-groove as an ordinate. Then, in the first quadrant, the expression for the cross section of the micro-groove is:
f(x)＝-aL·(2x/w-1)，0≤x≤w/2，
wherein a isLIs the depth of the micro-groove and w is the width of the micro-groove.
B) Scanning a path number; since the micro-groove cross section is symmetrical about the y-axis, each sub-scan path of the laser beam in the positive x-axis is also symmetrical about the y-axis. In the direction of the positive half axis of the x axis, the sub-scanning paths are numbered S1，S2，...，SnThe distance between adjacent sub-scanning paths is Deltax1，Δx2，...，Δxn。
C) Determining a laser ablation removal function; the laser beam removes the workpiece material by ablation; to machine a micro-groove with a cross-section expression of f (x), the laser ablation removal function g (x) is:
g(x)＝-f(x)＝aL·(2x/w-1)，0≤x≤w/2
D) determining a removed material rate of change function; in the interval 0 ≤ x ≤ w/2 of the laser beam, the change rate of ablation of workpiece material should be consistent with the derivative function g' (x) of g (x):
g′(x)＝2aL/w
E) determining the separation Deltax of adjacent sub-scan pathsnThe expression of (1); definition of Δ xnRate of change omega along the x-axisn：
ωn＝(Δxn+1-Δxn)Δxn＝Δxn+1/Δxn-1，
ωnThe smaller the laser beam scanning is, the higher the overlapping coefficient of the adjacent two laser beam scanning is; according to the laser ablation principle, the higher the overlapping coefficient of two adjacent laser beam scans is, the more obvious the ablation effect of the laser beam on a unit area is, and omeganOc g' (x), therefore:
ωn＝C/w
wherein C is a constant coefficient.
The formula is arranged to obtain:
Δxn+1＝(C/w+1)*Δxn
wherein n is a positive integer.
F) Determining Δ xnThe constraint of (2). The overlap joint method is adopted, the surface material of the workpiece is removed by using laser beams to carry out multiple scanning ablation, and the laser beams in adjacent scanning paths have an overlapped area. Defining the overlap ratio eta of adjacent laser beams, there are:
η＝1-Δx/RL
wherein R isLIs the laser beam spot diameter.
In order to form a coincidence region between the laser beams of the adjacent scanning paths, the scanning paths of the laser beams also need to satisfy:
Δxn≤RL/(ηmin+1)
wherein eta isminIs the minimum overlap ratio of the laser beams of adjacent scan paths.
On the other hand, in order to satisfy the designed trench width, each sub-scanning path distribution satisfies:
G) and searching a proper constant C value.
Table 3 shows the values when Δ x1Δ x when C is 1, 0.8, 0.6 and 0.4 ═ 4nThe value of the constraint condition is satisfied.
The steps A) to G) are the process of determining the path of the laser scanning for multiple times by using a specific algorithm-ablation function fitting method. In table 3, the micro-groove width of the C-20 scheme is closer to the design value, and the laser beam is scanned 23 times in total.
By detection, the depth of the micro-groove is 6 microns, because:
12＝6+6
therefore, the triangular-like micro-groove with the depth close to 12 microns can be obtained by repeating the machining for 2 times at the same position on the surface of the workpiece by using the scheme of C-20. And the surface of the workpiece is cleaned between each processing, so that the loss of laser beam energy caused by laser ablation of the oxide layer is reduced.
The actual processing effect of the third embodiment is shown in fig. 5.
Example four.
Example four a more complex three-dimensional micro-pyramid like topography was machined into the workpiece surface, as shown in fig. 6. The fourth technical proposal of the embodiment is to directionally and quantitatively remove the workpiece material by using the laser ablation method of the third embodiment for multiple times. The specific method of the laser ablation method of the third application embodiment is to process the micro-groove shapes with the cross section contour similar to a triangle, which are orthogonal and parallel, on the surface of the workpiece, wherein the micro-groove shapes have equal intervals, and the intervals are equal to the width of the micro-grooves similar to the triangle.
The actual processing effect of the fourth example is shown in fig. 6.
Claims (5)
1. A method for processing controllable micro-grooves on the surface of a workpiece by laser multiple scanning ablation comprises the following specific steps:
1) determining the depth, width and cross section profile of the appearance of the micro groove of the processing target;
2) determining the path of the laser for multiple scanning by using a specific algorithm-ablation function fitting method;
3) controlling a laser beam to process according to a laser scanning path to process a micro-groove with a target width and a cross section profile;
4) detecting the shape of the micro-groove processed by the laser beam in a multi-scanning way to obtain the depth of the micro-groove processed for the first time;
5) estimating the ratio of the appearance depth of the target micro-groove to the depth of the primarily processed micro-groove and calculating the whole;
6) according to the estimation and solution results in the previous step, repeated laser scanning ablation processing is carried out on the same position of the surface of the workpiece for multiple times, and a micro groove with the target depth is processed;
the ablation function fitting method in the step 2) comprises the following specific steps:
2-1) establishing a micro-groove cross section function expression;
2-2) numbering the laser beam scanning paths;
2-3) determining a laser ablation removal function;
2-4) determining a change rate function of the material removed by laser ablation;
2-5) determining an expression of the distance between adjacent sub-scanning paths;
2-6) determining a constraint condition of the distance between adjacent sub-scanning paths;
2-7) determining a proper value of a constant coefficient in an expression of the distance between adjacent sub-scanning paths;
by applying the method for multiple times, the intersecting and parallel micro-groove morphology is processed on the surface of the workpiece, so that a more complex three-dimensional morphology array is obtained.
2. The method of claim 1 for machining a controlled micro-groove in the surface of a workpiece by laser multiple scan ablation, wherein: and processing the micro-groove shapes with the cross section contour being similar to a triangle, wherein the cross section contours being orthogonal and parallel are similar to a triangle on the surface of the workpiece, the micro-groove shapes have equal intervals, and the intervals are equal to the width of the similar triangle micro-grooves, so that the array three-dimensional micro pyramid-shaped shape is obtained by processing.
3. The method of claim 1 for machining a controlled micro-groove in the surface of a workpiece by laser multiple scan ablation, wherein: in order to process the sine-like line micro-groove morphology, the corresponding ablation function fitting method comprises the following steps A) to G):
A) in a cartesian coordinate system, the mathematical expression for determining the cross section of the micro-groove is:
f(x)＝-a·cos(πx/w)，-w/2≤x≤w/2
wherein a is the depth of the micro-groove, and w is the width of the micro-groove;
B) scanning a path number;
C) determining a laser ablation removal function g (x) as:
g(x)＝-f(x)＝a·cos(πx/w)，-w/2≤x≤w/2；
D) determining the removed material rate of change function g' (x) as:
g′(x)＝aπw-1sin(πxw-1)，-w/2≤x≤w/2；
E) determining the separation Deltax of adjacent sub-scan pathsnExpression (c):
F) determining Δ xnThe constraint of (2); comprises the following steps:
Δxn≤RL/(ηmin+1)
wherein eta isminIs the minimum overlap ratio of the laser beams of adjacent scan paths;
determining constants C and deltax according to the laser scanning times and the micro-groove processing width1And (4) taking values.
4. The method of claim 1 for machining a controlled micro-groove in the surface of a workpiece by laser multiple scan ablation, wherein: in order to process the micro-groove morphology similar to a triangle, the corresponding ablation function fitting method comprises the following steps A) to G):
A) in a cartesian coordinate system, the expression for determining the cross section of the triangular-like micro groove is as follows:
f(x)＝-aL·(2x/w-1)，0≤x≤w/2，
wherein a isLThe depth of the micro-groove is defined, and w is the width of the micro-groove;
B) scanning a path number;
C) determining the laser ablation removal function g (x):
g(x)＝-f(x)＝aL·(2x/w-1)，0≤x≤w/2
D) determining a removed material rate of change function g' (x):
g′(x)＝2aL/w
E) determining the separation Deltax of adjacent sub-scan pathsnExpression (c):
Δxn+1＝(C/w+1)*Δxn；
F) determining Δ xnThe constraint conditions of (2) include:
Δxn≤RL/(ηmin+1)
wherein eta isminIs the minimum overlap ratio of the laser beams of adjacent scan paths;
and determining values of the constants C and delta x1 according to the laser scanning times and the micro-groove processing width.
5. A method of machining controlled micro-grooves in the surface of a workpiece by laser multiple scan ablation according to claim 3 or 4, wherein: the micro-groove processing of different depths is realized through different constant C and delta x1 value schemes, the widths of the different micro-grooves are close, and the cross section profile types are the same; and repeating the machining for multiple times at the same position of the surface of the workpiece by using different constant C and delta x1 value schemes to obtain the depths of the micro grooves which are different from the original schemes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019110737021 | 2019-11-05 | ||
| CN201911073702 | 2019-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111438443A CN111438443A (en) | 2020-07-24 |
| CN111438443B true CN111438443B (en) | 2022-03-22 |
Family
ID=71655531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010416857.7A Active CN111438443B (en) | 2019-11-05 | 2020-05-15 | Method for processing controllable micro-groove on surface of workpiece through laser multiple scanning ablation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111438443B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112684677B (en) * | 2021-03-12 | 2021-07-09 | 苏州苏大维格科技集团股份有限公司 | Three-dimensional micro-nano morphology structure manufactured by laser direct writing lithography machine and preparation method thereof |
| CN113344823B (en) * | 2021-06-29 | 2022-05-10 | 河北工业大学 | Three-dimensional roughness characterization method for ablation area morphology of silver wire type contact |
| CN114353697B (en) * | 2021-12-09 | 2023-04-11 | 中国科学院西安光学精密机械研究所 | Ablation process structure surface topography measuring method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0588486A2 (en) * | 1992-08-26 | 1994-03-23 | Tektronix, Inc. | Bi-channel electrode configuration for an addressing structure using an ionizable gaseous medium and method of operating it |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN101590569A (en) * | 2009-06-12 | 2009-12-02 | 江苏大学 | A kind of method and apparatus of compositely preparing surface-layer biomimetic structure by laser |
| JP2018202420A (en) * | 2017-05-30 | 2018-12-27 | 日本電産コパル株式会社 | Laser processing method and laser processing device, and method for manufacturing electronic equipment |
| CN109948288A (en) * | 2019-04-01 | 2019-06-28 | 大连理工大学 | A kind of nanosecond laser ablation microflute cross section profile prediction technique |
| CN110202266A (en) * | 2019-05-14 | 2019-09-06 | 中国电子科技集团公司第三十八研究所 | A kind of regulation method of femtosecond laser processing diamond microflute cross sectional shape |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005040042A1 (en) * | 2005-08-23 | 2007-03-01 | Eickhorn, Geb. Fischer, Annette | Laser cutting of metal workpieces has the laser beam aligned at an angle to the workpiece surface following prepared grooves for accurate cutting |
| CN101497279B (en) * | 2009-02-26 | 2010-06-23 | 王晓宇 | Measuring and machining integrated laser three-dimensional marking method and device |
| EP2476497B1 (en) * | 2010-04-19 | 2015-05-13 | Yamazaki Mazak Corporation | Cutting method and cutting device |
| CN102990227A (en) * | 2011-09-08 | 2013-03-27 | 技鼎股份有限公司 | Single-wavelength multilayer laser machining method |
| CN105458515B (en) * | 2014-09-11 | 2018-01-05 | 大族激光科技产业集团股份有限公司 | A kind of sapphire laser grooving device and its grooving method |
| US9919363B2 (en) * | 2014-09-23 | 2018-03-20 | Attostat, Inc. | System and method for making non-spherical nanoparticles and nanoparticle compositions made thereby |
| PL3287533T3 (en) * | 2015-04-20 | 2020-07-27 | Nippon Steel Corporation | Oriented magnetic steel plate |
| CN106938359A (en) * | 2017-03-29 | 2017-07-11 | 武汉理工大学 | A kind of controllable method for preparing of metal bionic micro-nano structure |
| CN107175409A (en) * | 2017-05-26 | 2017-09-19 | 苏州菲镭泰克激光技术有限公司 | The three-dimensional laser fine machining system and method for crisp and hard material |
| CN108342700A (en) * | 2018-03-22 | 2018-07-31 | 上海理工大学 | A kind of method for the laser lift-off metallic film that pattern is controllable |
| CN108837782B (en) * | 2018-07-26 | 2023-12-22 | 华南理工大学 | Micro-reaction tube with complex internal channel structure and manufacturing method thereof |
-
2020
- 2020-05-15 CN CN202010416857.7A patent/CN111438443B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0588486A2 (en) * | 1992-08-26 | 1994-03-23 | Tektronix, Inc. | Bi-channel electrode configuration for an addressing structure using an ionizable gaseous medium and method of operating it |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
| CN101590569A (en) * | 2009-06-12 | 2009-12-02 | 江苏大学 | A kind of method and apparatus of compositely preparing surface-layer biomimetic structure by laser |
| JP2018202420A (en) * | 2017-05-30 | 2018-12-27 | 日本電産コパル株式会社 | Laser processing method and laser processing device, and method for manufacturing electronic equipment |
| CN109948288A (en) * | 2019-04-01 | 2019-06-28 | 大连理工大学 | A kind of nanosecond laser ablation microflute cross section profile prediction technique |
| CN110202266A (en) * | 2019-05-14 | 2019-09-06 | 中国电子科技集团公司第三十八研究所 | A kind of regulation method of femtosecond laser processing diamond microflute cross sectional shape |
Non-Patent Citations (1)
| Title |
|---|
| 激光热力效应对不同材料电化学刻蚀形貌的作用研究;张朝阳等;《中国激光》;20150531(第42期);17-23 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111438443A (en) | 2020-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111438443B (en) | Method for processing controllable micro-groove on surface of workpiece through laser multiple scanning ablation | |
| CN1274453C (en) | Method of laser milling | |
| CN106001927B (en) | One kind measurement machining integrated laser planarizing polishing method | |
| Snoeys et al. | Current trends in non-conventional material removal processes | |
| WO2015096693A1 (en) | Scanning method for manufacturing three-dimensional object layer by layer | |
| Wu et al. | Precision grinding of a microstructured surface on hard and brittle materials by a microstructured coarse-grained diamond grinding wheel | |
| US10486267B2 (en) | Laser ablation method with patch optimization | |
| Chow et al. | Experimental study on the effect of varying focal offset distance on laser micropolished surfaces | |
| JP2012016735A (en) | Laser beam machining device and laser beam machining method | |
| JP7478255B2 (en) | Method for creating recesses in a substrate - Patent application | |
| CN1295052C (en) | Method of laser milling using constant tool path algorithm | |
| Debnath et al. | Non-traditional micromachining processes: opportunities and challenges | |
| Bilbao-Guillerna et al. | Waterjet and laser etching: The nonlinear inverse problem | |
| Xue et al. | Improvement in surface quality of microchannel structures fabricated by revolving tip-based machining | |
| EP2272628B1 (en) | Processing method for a workpiece | |
| CN205798711U (en) | A kind of machining integrated laser of measuring planarizes burnishing device | |
| Zheng et al. | An adaptive direct slicing method based on tilted voxel of two-photon polymerization | |
| CN102091863A (en) | Laser processing device and laser processing method | |
| Kulakov et al. | Surface damage during ultrasonic consolidation of 3003‐H18 aluminum | |
| JP7337524B2 (en) | Microfabrication device, microfabrication method, transfer mold, and transfer product | |
| US20070121166A1 (en) | Process for multi-layer material removal of a three-dimensional surface by using a raster image describing the surface | |
| JP7023624B2 (en) | Microfabrication equipment, control equipment, master manufacturing method, and microfabrication method of base material for master | |
| CN111085782A (en) | Processing method of polycarbonate plastic | |
| CN115091266B (en) | Rebound error compensation method for ultra-precisely cutting titanium alloy microstructure surface | |
| Kibria et al. | Pulsed Nd: YAG laser micro-turning of Alumina to study the effect of overlap factors on surface roughness performance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |