CN205798711U - A kind of machining integrated laser of measuring planarizes burnishing device - Google Patents
A kind of machining integrated laser of measuring planarizes burnishing device Download PDFInfo
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- CN205798711U CN205798711U CN201620698424.4U CN201620698424U CN205798711U CN 205798711 U CN205798711 U CN 205798711U CN 201620698424 U CN201620698424 U CN 201620698424U CN 205798711 U CN205798711 U CN 205798711U
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- laser
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- displacement transducer
- scanning system
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Abstract
This utility model provides a kind of machining integrated laser of measuring and planarizes burnishing device, including laser Machining head, two-dimensional laser displacement transducer and multidimensional workbench；Multidimensional workbench includes Z-direction motion and translation rotating mechanism；Described Z-direction motion is for adjusting the Z-direction distance between laser Machining head and surface of the work；Described two-dimensional laser displacement transducer is for surveying on straight line the Z-direction distance value between multiple points of proportional spacing at equal intervals and two-dimensional laser displacement transducer；The laser beam that external laser sends is after light path system transmits, and laser beam is incident and focuses on the surface of workpiece, galvanometer scanning system realize the focal beam spot scanning motion at surface of the work of laser beam.It is integrated with processing that this utility model can realize measurement, can effectively measure the material thickness that each laser scanning is removed, thering is provided foundation for dynamically adjusting of technological parameter, when polishing for laser scanning, dynamically adjusting of grid provides premise, improves work efficiency and machining accuracy.
Description
Technical field
This utility model belongs to technical field of laser processing, is specifically related to a kind of machining integrated laser of measuring and planarizes
Burnishing device.
Background technology
Along with the development of material surface technology, surface polishing technique becomes a technology the most important.Polishing skill
Art, also known as mirror surface machining, is to manufacture smooth and machining deformation layer is the least, does not has the face processing technique of scratch.Should in industry
In with, the requirement to material surface roughness is more and more higher, gradually develops into from micron order, submicron order, nanoscale
Subnano-class.In order to meet the needs of application, multiple polishing technology has been had to be employed in the industrial production.Polishing technology has:
Mechanical polishing, ultrasonic polishing, chemical polishing, ion beam polishing, electrobrightening, fluid polishing, magnetic grinding and polishing etc..These are thrown
Light technology is widely used in fields such as electronic equipment, precision optical machinery, instrument and meter, optical element, medical apparatus and instruments.
Laser polishing technology is one of 21 century the most promising and maximally effective polishing technology.Laser polishing is substantially
Being exactly laser and material surface interactions, it defers to the universal rule of laser and material effects.The phase interaction of laser and material
With mainly there being two kinds of effects: heat effect and photochemical effect.According to the mechanism of action of laser Yu material, can laser polishing is simple
It is divided into two classes: a class is heat polishing, another kind of for cold polishing.Heat polishing typically uses continuous long wavelength laser, mainly uses during polishing
Wavelength is YAG laser and the CO of wavelength 10.6 μm of 1.06 μm2Laser instrument, the mechanism of effect is Reciprocity of Laser & Materials
Heat effect, removed the composition of material surface by processes such as fusing, evaporations, therefore, as long as the thermophysical property of material is good,
All can be polished with it.Cold polishing typically rushes short wavelength laser with short pulse, mainly uses UV excimer laser during polishing
Or femtosecond pulse laser.Femto-second laser has the narrowest pulse width, is nearly free from heat effect when it and material effects.Accurate
Molecular laser wavelength is short, belongs to ultraviolet and DUV spectral coverage, have strong pulse energy and photon energy, high repetition rate,
Narrow pulse width.Most metal and nonmetallic materials have strong absorptance to ultraviolet light.Cold polishing is the most logical
Cross " melting " effect, i.e. photochemical breakdown effect.The mechanism of effect is " Single Photon Absorption " or " multiphoton absorption ", absorbed
After photon, the chemical bond in material is interrupted or lattice structure is destroyed, and in material, composition is stripped.In polishing process,
Heat effect can be ignored, and thermal stress is the least, does not cracks, and does not affect adjacent material, and material removal amount is easy to control, so, special
It is not suitable for precise polished, is especially suitable for hard brittle material.Cold polishing can complete a few thing that thermal laser polishing can not complete, because of
This, have incomparable superiority at aspects such as fine polishing, hard brittle material and macromolecular material polishings.
River superfine (" laser technology ", 2006 the 6th phases) is pointed out, laser is when being polished different materials, and system is
Some difference.The main composition of laser polishing system of the prior art has: laser instrument, beam homogenizer, surface testing are anti-
Feedback system, three-D displacement platform and computer control system.Laser polishing generally uses two kinds of methods: one is that laser beam is fixed
Motionless, displacement platform drives workpiece motion s；Another kind be displacement platform and workpiece motionless, light beam moves as requested.Use continuous laser
During polishing, laser action, at material surface, detects equipment tracing detection, when real-time feedback control determines each tiny segment effect
Between (or scanning speed) or control zoom focusing system change laser power density.When polishing with pulse laser, laser action
At material surface, detecting equipment tracing detection, real-time feedback control determines pulse number or the control of each tiny segment effect
Zoom focusing system processed changes the energy density of laser.In laser polishing process, detection technique and real-time feedback control skill
Art is crucial, determines the grade of polishing to a great extent.But, in current practical application in industry field, either adopt
Be heat polishing or cold polishing principles, glossing in existing laser polishing technology controls to be substantially open loop approach.
Although there have University Of Tianjin Zhang Fenglie et al. to propose the laser energy density of laser polishing process based on ccd image detection to be real-time
Control program, but rely on ccd image collection and successive image to process and obtain surface undulation pattern, it is clear that precision is relatively low, and is subject to
Illumination uniformity, laser emission, many restrictions of workpiece luminous reflectance uniformity own.Further, how will measure in real time
Integrated with processing, Seamless integration-, promote working (machining) efficiency, also there is no preferable solution.
Utility model content
This utility model is for above-mentioned the deficiencies in the prior art, it is provided that a kind of machining integrated laser of measuring planarizes
Burnishing device.
This utility model is achieved by the following technical solution:
A kind of machining integrated laser of measuring planarizes burnishing device, passes including laser Machining head, two-dimensional laser displacement
Sensor and multidimensional workbench；Using the upper surface of multi-dimensional movement platform as datum level, using datum level as XOY plane, according to right hand spiral shell
Rotation rule sets up XYZ three-dimensional cartesian coordinate system；
Described multidimensional workbench includes Z-direction motion and translation rotating mechanism, and workpiece to be processed is installed on datum level
On, translation rotating mechanism drive workpiece to do translational motion and rotary motion about the z axis；Described Z-direction motion is used for adjusting
Z-direction distance between whole laser Machining head and surface of the work；
Described translation rotating mechanism includes that displacement platform and turntable, described displacement platform at least have one along X-direction
Freedom of motion, described turntable at least has a rotational freedom about the z axis；
Described two-dimensional laser displacement transducer is used for surveying multiple points of proportional spacing at equal intervals and two-dimensional laser displacement on straight line
Z-direction distance value between sensor；The line L of multiple uniform point distance measurements at equal intervals of two-dimensional laser displacement transducerNDirection
It is parallel to Y-axis；The Laser Measurement output face of two-dimensional laser displacement transducer is parallel with datum level, and the two spacing is maintained at two dimension and swashs
In the finding range of Optical displacement sensor；
Described laser Machining head includes galvanometer scanning system and focusing objective len；Galvanometer scanning system can be that one-dimensional galvanometer is swept
Retouch system, it is also possible to be 2-D vibration mirror scanning system；The laser beam that external laser sends through light path system transmit after, laser beam
Incident and focus on the surface of workpiece, the galvanometer scanning system in laser Machining head realize the focal beam spot of laser beam at workpiece
The scanning motion on surface.
Preferably, described two-dimensional laser displacement transducer is one.
Preferably, described two-dimensional laser displacement transducer is two；Galvanometer scanning system in laser Machining head is arranged on
Between two two-dimensional laser displacement transducers, the distance between two two-dimensional laser displacement transducers is two-dimensional laser displacement sensing
The integral multiple of device Sampling Distance.
Laser Machining head and two in measurement machining integrated laser described in the utility model planarizing burnishing device
Dimension laser displacement sensor with the use of, it is possible to achieve measure and process integrated, can effectively measure each laser scanning and go
The material thickness removed, provides foundation for dynamically adjusting of technological parameter；In this utility model, multidimensional workbench has multiple simultaneously
Freedom of motion, when polishing for laser scanning, dynamically adjusting of grid provides premise.This measurement machining integrated laser is put down
Integralization burnishing device can be used for laser planarizing polishing, improves work efficiency and machining accuracy.
Accompanying drawing explanation
Fig. 1 is the structural representation measuring processing integral processing apparatus described in the present embodiment；
Fig. 2 is two-dimensional laser displacement transducer described in the utility model, workpiece and XYZ axle schematic diagram.
Detailed description of the invention
The utility model is described in more detail with detailed description of the invention below in conjunction with the accompanying drawings.
As it is shown in figure 1, this utility model provides and a kind of measures processing integral processing apparatus, including laser Machining head 1,
Two-dimensional laser displacement transducer 2 and multidimensional workbench 3.
Using the upper surface of multi-dimensional movement platform 3 as datum level, using datum level as XOY plane, build according to right-hand rule
Vertical XYZ three-dimensional cartesian coordinate system.
Described multidimensional workbench 3 includes Z-direction motion and translation rotating mechanism, and workpiece 4 to be processed is installed on translation
On datum level on rotating mechanism, by translation rotating mechanism drive workpiece to be processed do translational motion (X to or XY to) with
And rotary motion about the z axis.
Described Z-direction motion is for adjusting the Z-direction distance between laser Machining head 1 and workpiece 4 surface, and described Z-direction is transported
Motivation structure is lifting Z axis or Z-direction displacement platform；If Z-direction motion is lifting Z axis, then laser Machining head 1 is installed on lifting Z
On axle, lifting Z axis laser Machining head is driven to do Z-direction elevating movement；If Z-direction motion is Z-direction displacement platform, then by Z-direction position
Moving stage drives workpiece to be processed to do Z-direction elevating movement.
Described translation rotating mechanism includes displacement platform and turntable, and displacement platform can only support that one-dimensional X is to motion, it is also possible to
Support that two Dimensional XY, to motion, it is furthermore preferred that displacement platform can be combined into one structure with Z-direction motion, forms XYZ tri-axle fortune
Dynamic platform.The position of displacement platform and turntable is interchangeable, and i.e. displacement platform is upper, turntable under；Or displacement platform under, rotate
Platform is upper.
Described two-dimensional laser displacement transducer 2 (the ZG2 type sensor of such as Omron), can survey the straight of certain length scope
Distance value between n proportional spacing point and two-dimensional laser displacement transducer on line.Two-dimensional laser displacement transducer can be one
Individual, it is also possible to be two.As in figure 2 it is shown, the line L of the individual point distance measurement at equal intervals of the n of two-dimensional laser displacement transducerNDirection put down
Row in Y-axis, if the point distance measurement at equal intervals of two-dimensional laser displacement transducer be spaced apart dy.
Requiring that the Laser Measurement output face of two-dimensional laser displacement transducer 2 is parallel with datum level, the two spacing is maintained at two
In the finding range of dimension laser displacement sensor 2.
Described laser Machining head 1 includes galvanometer scanning system and focusing objective len.Galvanometer scanning system can be one-dimensional galvanometer
Scanning system, it is also possible to be 2-D vibration mirror scanning system.
If two-dimensional laser displacement transducer 2 is two, the galvanometer scanning system in laser Machining head 1 is arranged on two two dimensions
Between laser displacement sensor 2, the distance between two two-dimensional laser displacement transducers 2 is that two-dimensional laser displacement transducer 2 takes
The integral multiple of sample spacing, so can ensure that the measurement point of two two-dimensional laser displacement transducers 2 is complete in scanning workpiece fabrication
Full weight is closed.
If the galvanometer scanning system in laser Machining head 1 uses one-dimensional galvanometer scanning system, galvanometer scanning system is defeated
Go out the scanning direction of laser beam along Y direction；If galvanometer scanning system uses 2-D vibration mirror scanning system, vibration mirror scanning
The scanning direction of system outgoing laser beam is along Y direction and X-direction.
The laser beam that external laser 5 sends is after light path system 6 transmits, and laser beam is vertical or with the incidence of certain drift angle also
Focus on the surface of workpiece 4, the galvanometer scanning system in laser Machining head 1 realize the focal beam spot of laser beam at workpiece 4 table
The scanning motion in face.Described light path system 6 can comprise beam-expanding collimation mirror, turning mirror and shaping mirror etc..
This embodiment is one-dimensional galvanometer scanning system for measuring galvanometer scanning system in processing integral processing apparatus, two dimension
Laser displacement sensor is one, and displacement platform only supports that one-dimensional X is to the situation of motion.
Use the method that above-mentioned measurement machining integrated laser planarizing burnishing device carries out workpiece planarizing polishing, tool
Body comprises the steps:
(1) clamping workpiece is planarized on burnishing device in the measurement machining integrated laser shown in Fig. 1.
Require that described workpiece meets following condition: the waviness of workpiece is less than the Z-direction range of two-dimensional laser displacement transducer,
Workpiece is less than the galvanometer scanning system sweep length along Y direction along the width of Y direction, and workpiece is little along the length of X-direction
In the X of displacement platform to range；The height of workpiece is less than Z-direction range and the two-dimensional laser displacement transducer of displacement platform
Z-direction range sum.
(2) controlling two-dimensional laser displacement transducer and workpiece at X-direction relative translation motion (can be that displacement platform drives
Workpiece or two-dimensional laser displacement transducer move in the X-axis direction), make two-dimensional laser displacement transducer scan one along X-direction
The polished part in subjob surface, two-dimensional laser displacement transducer is sampled once every fixed range dx, it is hereby achieved that work
The fluctuating topographic data of the polished part in part surface, i.e. obtains the polished part of surface of the work and presses dx, dy interval acquisition uniformly survey
(x, y, z), wherein z is the height value that two-dimensional laser displacement transducer records to the coordinates matrix M of amount point；
(3) laser instrument is by setting technological parameter outgoing laser beam, focuses on surface of the work polished after laser Machining head
Part, makes the scanning galvanometer system of laser Machining head be scanned by setting scanning speed, scanning direction and LN(Y-axis side, direction
To) parallel.Make laser Machining head (one of workpiece or laser Machining head are along X-axis side with workpiece generation relative translation motion simultaneously
To motion), make polished part of surface of the work of laser beam flying.
(4) according to the method for step (2), two-dimensional laser displacement transducer is made to rescan a subjob table along X-direction
The polished part in face, it is thus achieved that after laser scanning the polished part of surface of the work uniformly measure new coordinates matrix M ' a little (x ', y ',
z’)。
Preferably, can be after step (2), laser Machining head and workpiece relative motion are returned to the process of initial position
In, i.e. during reversely returning starting point, complete this step.
(5) δ=z ' is calculatedmax-z’minIf δ less than or equal to the target flatness of workpiece, then proceeds to step (11)；Otherwise,
Enter step (6)；Wherein, z 'maxFor in the new coordinates matrix M ' (x ', y ', z ') uniformly measuring point obtained in step (4)
All maximums measuring some z ' value, z 'minMinima for z ' value；
(6) the laser scanning grid chart of surface of the work is built, it is desirable to each sizing grid phase in laser scanning grid chart
Deng, grid along X to size Gx and meet along size Gy of Y-direction:
Gx ＞ max (D, dx, dy, P) and Gy ＞ max (D, dx, dy, P)；
Wherein, D is the spot diameter of galvanometer scanning system scanning, and dx, dy are respectively the coordinates matrix M ' uniformly measuring point
In (x ', y ', z '), adjacent two X measured between point are spaced to interval and Y-direction；P is the scanning accuracy of galvanometer scanning system；As
This must contain at least one in M ' (x ', y ', z ') in then can ensureing each grid in laser scanning grid chart measures point；
(7) weights are given to each grid in laser scanning grid chart；
If only exist in grid one measure point, then weights k=(z '-z 'min)/Δ, wherein, z ' is measurement in this grid
Z ' value in the corresponding M ' of point (x ', y ', z '), Δ is the material thickness that galvanometer scanning system carries out that single laser scanning is removed；
If there are N (N ＞ 1) individual measurement point, then weights in grid
ki=(z 'i-z’min)/Δ, wherein, z 'iFor the z ' measured in the corresponding M ' of point (x ', y ', z ') arbitrary in this grid
Value.
Δ can obtain by the following method:
First close laser instrument, control two-dimensional laser displacement transducer run-down surface of the work, it is thus achieved that surface of the work rises and falls
In the data of pattern, that is step (2) uniformly measure point coordinates matrix M (x, y, z)；Open laser instrument afterwards, by shaking
Scarnning mirror system carries out single pass to surface of the work；Finally recycling two-dimensional laser displacement transducer run-down workpiece table
Face, that is obtain the new coordinates matrix M ' (x ', y ', z ') uniformly measuring point in step (4)；By calculating twice two-dimensional laser
The difference of the height value of displacement sensor can obtain galvanometer scanning system and carry out the material thickness Δ that single laser scanning is removed,
I.e. uniformly measure point coordinates matrix M (x, y, z) and the M ' (x ', y ', z ') twice measurement height value in same measurement position it
Difference: Δ=z-z '.
(8) open laser instrument, by Z-direction motion, the focal position of laser is adjusted to z 'minWith z 'maxBetween, control
Galvanometer scanning system processed carries out k scanning to each grid in laser scanning grid chart by the weights k that step (7) calculates and adds
Work；
(9) by turntable, workpiece is rotated about the z axis any one angle；
(10) step (2) is returned；
(11) terminate.
It is apparent to one skilled in the art that this utility model can change into various ways, and such change is not
Think and depart from scope of the present utility model.All such technical staff to described field obviously revise, and will include
Within the scope of present claims.
Claims (3)
1. measure machining integrated laser planarizing burnishing device for one kind, it is characterised in that include that laser Machining head, two dimension swash
Optical displacement sensor and multidimensional workbench；
Described multidimensional workbench includes Z-direction motion and translation rotating mechanism, and workpiece to be processed is installed on datum level, by
Translation rotating mechanism drives workpiece to do translational motion and rotary motion about the z axis；Described Z-direction motion is used for adjusting laser
Z-direction distance between processing head and surface of the work；
Described translation rotating mechanism includes that displacement platform and turntable, described displacement platform at least have moving along X-direction
Degree of freedom, described turntable at least has a rotational freedom about the z axis；
Described two-dimensional laser displacement transducer is used for surveying multiple points of proportional spacing at equal intervals and two-dimensional laser displacement sensing on straight line
Z-direction distance value between device；The line L of multiple uniform point distance measurements at equal intervals of two-dimensional laser displacement transducerNDirection parallel
In Y-axis；The Laser Measurement output face of two-dimensional laser displacement transducer is parallel with datum level, and the two spacing is maintained at two-dimensional laser position
In the finding range of displacement sensor；
Described laser Machining head includes galvanometer scanning system and focusing objective len；Galvanometer scanning system is one-dimensional galvanometer scanning system,
Or 2-D vibration mirror scanning system；The laser beam that external laser sends is after light path system transmits, and laser beam is incident and gathers
Burnt on the surface of workpiece, the galvanometer scanning system in laser Machining head realize focal beam spot the sweeping at surface of the work of laser beam
Retouch motion.
Measurement machining integrated laser the most according to claim 1 planarizing burnishing device, it is characterised in that described two
Dimension laser displacement sensor is one.
Measurement machining integrated laser the most according to claim 1 planarizing burnishing device, it is characterised in that described two
Dimension laser displacement sensor is two；Galvanometer scanning system in laser Machining head is arranged on two two-dimensional laser displacement transducers
Between, the distance between two two-dimensional laser displacement transducers is the integral multiple of two-dimensional laser displacement transducer Sampling Distance.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620698424.4U CN205798711U (en) | 2016-07-05 | 2016-07-05 | A kind of machining integrated laser of measuring planarizes burnishing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620698424.4U CN205798711U (en) | 2016-07-05 | 2016-07-05 | A kind of machining integrated laser of measuring planarizes burnishing device |
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| CN201620698424.4U Expired - Fee Related CN205798711U (en) | 2016-07-05 | 2016-07-05 | A kind of machining integrated laser of measuring planarizes burnishing device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108115269A (en) * | 2017-12-29 | 2018-06-05 | 上海驰声新材料有限公司 | Non-crystaline amorphous metal laser cryogenic polishing system and method |
| CN111318808A (en) * | 2019-08-30 | 2020-06-23 | 南京理工大学 | Meter-scale large-caliber optical element CO2Laser polishing device and polishing method |
| CN111880474A (en) * | 2020-07-21 | 2020-11-03 | 苏州热工研究院有限公司 | Z-axis self-adaptive laser processing system and processing method thereof |
-
2016
- 2016-07-05 CN CN201620698424.4U patent/CN205798711U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108115269A (en) * | 2017-12-29 | 2018-06-05 | 上海驰声新材料有限公司 | Non-crystaline amorphous metal laser cryogenic polishing system and method |
| CN111318808A (en) * | 2019-08-30 | 2020-06-23 | 南京理工大学 | Meter-scale large-caliber optical element CO2Laser polishing device and polishing method |
| CN111318808B (en) * | 2019-08-30 | 2022-05-20 | 南京理工大学 | Meter-scale large-caliber optical element CO2Laser polishing device and polishing method |
| CN111880474A (en) * | 2020-07-21 | 2020-11-03 | 苏州热工研究院有限公司 | Z-axis self-adaptive laser processing system and processing method thereof |
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