CN204747769U - Laser on line measurement processes detection device - Google Patents

Laser on line measurement processes detection device Download PDF

Info

Publication number
CN204747769U
CN204747769U CN201520350839.8U CN201520350839U CN204747769U CN 204747769 U CN204747769 U CN 204747769U CN 201520350839 U CN201520350839 U CN 201520350839U CN 204747769 U CN204747769 U CN 204747769U
Authority
CN
China
Prior art keywords
laser
processing
workpiece
measurement
ldms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201520350839.8U
Other languages
Chinese (zh)
Inventor
段军
邓磊敏
张菲
曾晓雁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan flex Laser Technology Co., Ltd.
Original Assignee
Huazhong University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huazhong University of Science and Technology filed Critical Huazhong University of Science and Technology
Priority to CN201520350839.8U priority Critical patent/CN204747769U/en
Application granted granted Critical
Publication of CN204747769U publication Critical patent/CN204747769U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a laser on line measurement processes detection device, the device is including being located processing laser instrument, optic system and the laser beam machining head in the same light path in proper order, and the laser rangefinder system, computer control system removes subassembly and workstation, measured data before the laser rangefinder system is used for obtaining work piece processing after, is including the space coordinate value and the normal line angle of every some work piece to offer computer control system. The device collects laser survey, processing and measuring in an organic whole, can realize before the laser beam machining that on line measurement waits to process the plane or the curved surface geometry appearance of work piece, obtains true plane or spatial structure size and characteristic, eliminate wait to process the work piece because of the deformation of production in processing treatment flowsheet in earlier stage or secular distortion cause and theoretical digifax between the error, improved laser beam machining precision and quality. The device can two -dimensional platform and the measurement of three -dimensional curved surface and detection size precision and quality to can improve laser beam machining precision and quality.

Description

A kind of laser on-line measurement processing checkout gear
Technical field
The utility model belongs to laser measuring technique field, is specially a kind of laser on-line measurement processing checkout gear.
Background technology
Along with the demand that Laser Processing dimensional accuracy, quality stability, repeatability and uniformity improve constantly, the geometric accuracy before and after Laser Processing and roughness quality all need to carry out strict measurement and detection.Current measurement and detection method is all adopt offline mode to carry out geometric accuracy and mass measurement and detection by the contourgraph of contact type off-machine electrical measurement or non-contact optical mode to processing object.All there are the following problems for this off-line measurement and detection mode: be first cannot be known the heat distortion amount that rapidoprint causes by laser before and after Laser Processing, cause Laser Processing geometric accuracy inevitably to there is error; Secondly, can only measurement and detection planar dimension precision and roughness and cannot measurement and detection curved surface dimensional accuracy and roughness, measurement and detection scope is restricted; In addition, when the degree of depth detected, width and roughness need to continue to add man-hour as do not met index request, processed sample must return on Laser Processing platform and carry out reorientating processing, not only wastes time and energy, too increases uncertainty and the uniformity of accurate to dimension simultaneously; Finally, these two kinds of measurement and detection instrument not only complex structure, bulky and heavy, and measurement and detection size range is limited, measurement and detection can not be carried out to large-size sample and high to testing environment requirement, on-line measurement and detection cannot be used for.These problems are all stablized becoming laser processing technology and the obstruction of uniformity and the development of high efficiency aspect to the high accuracy of processing across yardstick, high-quality.
At present, in laser measurement, CN202928523U discloses " a kind of laser measurement system for on-line measurement ", it comprises test desk and laser aid, described laser aid comprises emission part and the acceptance division at the both sides place being relatively arranged on described test desk, described test desk comprises: measure base plate, described measurement base plate is formed with multiple first recess, in described multiple first recess, is respectively arranged with height adjuster.This technical scheme replaces mechanical probes contact type measurement mode, only for a kind of method of measurement plane base plate recess, three dimensions physical dimension cannot be measured, purposes is very limited, and this technical scheme does not provide any method about laser measurement, principle and precision, is actually and cannot applies.CN103900489A discloses " a kind of line laser structured light measuring three-dimensional profile method and corresponding device ", object is placed in horizontal reference plane by this device, one word line laser device is at the control lower swing of magnetostriction microdisplacement controller, form the scanning plane to object to be detected, pendulum angle ω is determined by the size of object, ensures the profile of a word line laser device complete scan object to be detected.There are the following problems in this invention: first, because a word line laser device carries out oscillating motion by magnetostriction microdisplacement controller, and the camera obtaining laser diffusion is transfixion, therefore, physical geometry size relationship between one wordline laser beam and camera is not fixed value, and causing cannot position relationship between Accurate Calibration laser instrument and camera; Secondly, because laser instrument is as the motion that swings back and forth, therefore, the factors such as the conversion that small vibrations and both forward and reverse directions swing all cause angle of oscillation speed to be a variable, therefore the next accurate survey calculation curved space each point coordinate value of so-called at the uniform velocity swing and normal direction cannot be obtained, there is the random measurement error of calculation; Finally, because the transfixion and laser instrument of measuring object and camera only carry out small swing, therefore, be subject to the restriction of the camera depth of field and camera imaging plane, cause measurement category little, large scale measuring three-dimensional profile cannot be used for, more not say for online three-dimensional high-precision measurement and detection application.
Utility model content
The utility model provides a kind of laser on-line measurement processing checkout gear, and object is to solve existing measuring technique Problems existing, to improve Laser Processing precision and quality.
A kind of laser on-line measurement processing checkout gear that the utility model provides, comprises the processing laser instrument, light path system and the laser Machining head that are positioned at successively in same light path; It is characterized in that, this system also comprises LDMS, computer control system, moving assembly and workbench;
LDMS, for obtaining the forward and backward measurement data of work pieces process, comprises spatial value and normal angle that workpiece often puts, and is supplied to computer control system; LDMS and laser Machining head are rigidly connected by connector and are fixed on moving assembly, and workbench is positioned at below laser Machining head, for installing described workpiece; Described LDMS, laser Machining head and workpiece can carry out three-dimensional space motion with moving assembly and workbench;
Described computer control system is connected with processing laser instrument, laser Machining head, LDMS, moving assembly and the workbench signal of telecommunication, for controlling each component working, and to from LDMS, moving assembly and and the data of four axle workbench process, to obtain process data and to detect data.
As the improvement of technique scheme, described LDMS is by send a little or the measurement laser instrument of line laser bundle, all optical alignment convergent lens light path, condenser lens and light collector form; Described equal optical alignment convergent lens light path comprises collimating mirror and convergent lens, is focused on again, then project on workpiece to be processed after the first all optical alignments of the light beam for being sent by measurement laser instrument by convergent lens; Condenser lens, for receiving the reverberation of workpiece, reduces its spot diameter or width of light beam; During work, by measurement laser instrument to processing before or processing after workpiece launch a branch of point or line laser bundle, and focus on surface of the work by equal optical alignment convergent lens light path, surface of the work by laser beam reflection to condenser lens, focal imaging forms hot spot on light collector, be the signal of telecommunication by light collector by the light signal progress of disease, after treatment measurement result outputted to computer control system.
As the further improvement of technique scheme, described moving assembly is Z axis travel mechanism, and described workbench is four axle workbench.
The utility model has following technological merit:
1. laser measurement, processing and detection are integrated in one by the utility model, plane or the surface geometry scale topography of on-line measurement workpiece to be processed before Laser Processing can be realized, obtain true planar or spatial constructional dimensions and feature, eliminate workpiece to be processed because processing in handling process the error caused by the distortion or secular distortion that produce and between theoretical digital-to-analogue in early stage, improve Laser Processing precision and quality;
2. after Laser Processing, without the need to offline inspection, can realize online detecting rapidly accurate to dimension and quality and deflection, as do not reached index request, again can process online, until meet index request, save manpower and time, improve Laser Processing make efficiency, stability, repeatability and uniformity;
3. the on-line measurement of the utility model device, processing and measuring ability not only may be used for two-dimensional plane measurement and detection dimensional accuracy and quality, but also can be used for D surface masurement and detect dimensional accuracy and quality, thus add the range of application of measurement and detection;
4. the on-line measurement of the utility model device, processing and measuring ability do not limit by the size of workpiece to be processed, thus expand measurement and detection size range.
Accompanying drawing explanation
Fig. 1 is the structural representation of the first laser on-line measurement processing checkout gear detailed description of the invention;
Fig. 2 is the structural representation of LDMS measurement and detection device detailed description of the invention;
The point set schematic diagram that Fig. 3 (a), (b) use for step (A3);
Fig. 4 is the structural representation of the first laser on-line machining device detailed description of the invention;
Fig. 5 is the structural representation of the second laser on-line measurement processing checkout gear detailed description of the invention;
Fig. 6 is the structural representation of the second laser on-line machining device detailed description of the invention;
Fig. 7 is the structural representation of the third laser on-line measurement processing checkout gear detailed description of the invention;
Fig. 8 is the structural representation of the third laser on-line machining device detailed description of the invention;
Fig. 9 is the workflow diagram of laser on-line measurement device.
Detailed description of the invention
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described further.It should be noted that at this, the explanation for these embodiments understands the utility model for helping, but does not form restriction of the present utility model.In addition, if below in described each embodiment of the utility model involved technical characteristic do not form conflict each other and just can mutually combine.
As shown in Figure 1, this device comprises processing laser instrument 1 to the device that the utility model first example provides, light path system 2, laser Machining head 3, LDMS 4, computer control system 6, Z axis travel mechanism 12 and four axle workbench 5.LDMS 4 and laser Machining head 3 are rigidly connected by connector 8 and are fixed in Z axis travel mechanism 12, and can move up and down along Z-direction with Z axis travel mechanism 12, workpiece to be processed 7 is fixed on four axle workbench 5.
As shown in Figure 2, LDMS 4 is by send a little or the measurement laser instrument 20 of line laser bundle, all optical alignment convergent lens light path 21, condenser lens 22 and light collector 23 form.
Equal optical alignment convergent lens light path 21 comprises collimating mirror and convergent lens, is focused on again, then project on workpiece to be processed 7 after the first all optical alignments of the light beam that measurement laser instrument 20 can be sent by convergent lens.
Condenser lens 22, for receiving the reverberation of workpiece 7, reduces its spot diameter or width of light beam, focuses to 20 microns or Line beam width is focused on 20 microns, to improve the resolution ratio of measurement and detection as made spot diameter; Condenser lens 22 also can be eliminated and not cause the difference of enlargement ratio at same measurement plane and the geometric error of the distortion produced, parallax and light source, cause probabilistic factor of image edge location, can obtain simultaneously and there is low optical distortion rate and high order focusing heart feature far away, realize accurately reproducing plane especially three-dimensional body characteristic size function.
The operation principle of LDMS 4 have employed laser triangulation principle, by measurement laser instrument 20 to measurement or detect workpiece 7 and launch a branch of point or line laser bundle 9 and focus on workpiece 7 surface by equal optical alignment convergent lens light path 21, workpiece 7 surface by laser beam with certain α angle reflection to condenser lens 22, focal imaging forms hot spot on light collector 23, be the signal of telecommunication by light collector 23 by the light signal progress of disease, after treatment measurement result outputted to computer control system 6.
When distance between LDMS 4 and workpiece 7 surface changes, the facula position on the reflection ray α angle of laser beam and light collector 23 all can change thereupon.Be that the distance of angle after fixing given value and light reflection and measured workpiece is proportional owing to measuring laser instrument 20 and the physical dimension of light collector 23, therefore, the reflected laser light spot exact position on light collector 23 can be obtained, the changing value size of workpiece 7 height distance can be obtained by triangle geometrical relationship, thus obtain the height dimension (z coordinate value) of workpiece 7.When workpiece 7 measurement or detect height will exceed range ability (that is: what the facula position of the reflection of laser beam will overflow light collector 23 accepts scope) of LDMS 4 time, Z axis 12 will upwards (or downwards) a mobile distance, the flare position of workpiece 7 is made to come back to zero point (centre) position of light collector 23, the vector data that the moving distance value of record Z axis 12 and LDMS 4 are worth by computer control system 6, calculate the actual height size (z coordinate value) of workpiece 7.
Four axle workbench 5 are made up of xy two planar movement axles and 360 ° of rotating shaft A and ± 90 ° swinging axle C, for place work piece 7, workpiece 7 is moved and Space Rotating in xy plane, and inputs LDMS 4 to computer control system 6 and focus on the point at workpiece 7 place or the plane coordinates value (x and y coordinate) of line and revolution space angle value (A and C angle value).
The function of computer control system 6 has two, one is controlling functions, namely control laser instrument 1 Output of laser, laser Machining head 3 pairs of workpieces to be processed 7 carry out Laser Processing, and LDMS 4 pairs of workpieces to be processed 7 carry out the movement of measurement and detection and Z axis 12 and four axle workbench 5; Two is data processing functions, and namely to LDMS 4, the data that Z axis 12 and four axle workbench 5 export gather, and process the data collected, and carries out three-dimensionalreconstruction to the structure graph of workpiece 7 and machining area pattern.
Illustrate the course of work of said apparatus below:
(1) before laser processing workpiece 7, first start LDMS 4, send and measure laser beam 9 (this laser beam can be a laser and line laser bundle), mobile Z axis 12, make LDMS 4 reach in measurement size accuracy rating with the spacing on the surface of workpiece to be processed 7;
(2) then start four axle workbench, 5 pairs of workpiece 7 physical dimensions to carry out two-dimensional plane (workbench 5 carries out xy two-dimensional plane and moves) or three-dimension curved surface (workbench 5 carries out xz bidimensional and to move and A axle rotates and the oscillating motion of C axle) and carry out pointwise (laser beam is spot beam) or by-line (laser beam is linear beam) scanning survey, by the plane three-dimensional data (x of often obtained, y and z coordinate) or three-dimension curved surface data (x of often, y, z coordinate and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6;
(3) after computer control system 6 carries out noise reduction process to the measurement data gathered by Butterworth wave digital lowpass filter, cubic NURBS curve method is adopted to carry out matching to curved surface, obtain patch through transition, mix, be connected to form final surface model three-dimensional geometry reconstruct, 7 carry out physical dimension reconstruction to machined part, obtain physical dimension and the feature of actual workpiece to be added 7, eliminate workpiece to be processed 7 because of the error in processing in early stage handling process caused by the distortion that produces or secular distortion and between theoretical digital-to-analogue;
(4) workpiece to be processed 7 is moved to below laser-processing system by four axle workbench 5, start laser Machining head 3 and four axle workbench 5, send processing laser beam 10, according to the physical dimension that workpiece 7 to be added is rebuild, two-dimensional plane or three-dimension curved surface processing process (as shown in Figure 2) are carried out to workpiece 7;
(5) after Laser Processing terminates, closing Laser Processing is 3, the workpiece 7 processed is moved on to below LDMS 4 again, start LDMS 4, send detection laser beam 9 (see figure 1), two-dimensional plane is carried out or pointwise (laser beam is spot beam) or by-line (laser beam is linear beam) Scanning Detction are carried out in processing three-dimensional curved surface position by four axle workbench, 5 pairs of workpiece planarization working positions, by the plane three-dimensional data (x of often obtained, y and z coordinate) or the three-dimension curved surface data (x of often, y, z coordinate and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6,
(6) after computer control system 6 carries out noise reduction process to the measurement data gathered by Butterworth wave digital lowpass filter, cubic NURBS curve method is adopted to carry out matching to curved surface, the patch obtained is through transition, mixing, be connected to form the three-dimensional geometry reconstruct of final surface model, physical dimension reconstruction is carried out to machining area, obtain the physical dimension (working width of Laser Processing, length, the degree of depth and height), precision (processing dimension error and site error), Gaussian filter is adopted to carry out profile filtering to laser-textured surface, difference recursive algorithm is adopted to calculate the quality (roughness of laser-textured surface, edge-light cleanliness and perpendicularity) and the deformation data caused of being heated,
(7) judge whether processing dimension, precision and quality meet the demands, if do not met, again workpiece 7 can be moved to below laser Machining head 3 and carry out laser correction processing, after laser correction process finishing, again workpiece 7 is moved to below LDMS 4 and detect, till meeting the demands.Thus realize laser on-line measurement processing be detected as one function.
In the above-mentioned course of work, the data processing of computer control system 6 comprises two parts, and one is the process to process data, and two is the process to detecting data, is illustrated below:
(1) the concrete processing procedure of process data is:
(A1) before to be processed, computer control system 6 receives the measurement data of LDMS 4 pairs of workpieces to be processed 7, comprise xy plane coordinates value and A and the C angle value of often some height z coordinate value and correspondence, namely obtain spatial value and the normal angle of on workpiece 7 to be processed often;
(A2) Butterworth wave digital lowpass filter (amplitude versus frequency characte is steady) is utilized, noise reduction process is carried out to the measurement data of LDMS 4, obtain initial manufacture data, the noise that when moving from Z axis 12 and four axle workbench 5 to eliminate, mechanical oscillation produce is on the impact of measurement and detection dimensional accuracy.
According to beam diameter and the measuring speed of LDMS 4, the known pitch of waves is less than the signal of laser beam spot sizes and to be higher than the frequency signal components that moves both vertically of the frequency that tests the speed be noise, gives filtering.
(A3) initial manufacture data are processed, eliminate abnormity point and data compaction further;
In this example, the abnormity point in curve inspection technique elimination data can be utilized, concrete grammar is: for the point set of Fig. 3 (a), first we obtain a SPL by first and last data point least square fitting, and order of a curve can set according to curved interface shape, is generally 3 ~ 4 rank, then the Euclidean distance e of intermediate data points to SPL is calculated respectively, if || e||>=[ε], [ε] is given franchise, then think P ibe noise spot, should give rejecting.
Utilize action-preset angle configuration to carry out data compaction, concrete grammar is: as Fig. 3 (b), and whether we weigh cloud data by action h and angle a two parameters and simplify.When action h is less than we given franchise h0, we think that P2 point does not impact our permissible accuracy, can reject a P2; And when consecutive points close together, when action h is very large again, whether this can weigh with angle a a little to remove, if when a is less than we given franchise a0, we think that P2 point does not impact our precision, can reject a P2.Wherein franchise h0 and a0 is determined by reverse precision.
(A4) cubic NURBS curve method is adopted to carry out surface fitting to the data that step (3) obtains, the patch obtained through transition, mix, be connected to form the three-dimensional geometry reconstruct of final surface model, finally obtain the space geometry size of workpiece to be processed 7 or the physical dimension size of Laser Processing and normal angle;
Computer control system 6 is according to the space geometry size of workpiece to be processed 7 obtained or the physical dimension of Laser Processing and normal angle, utilize laser Machining head 3 pairs of workpieces to be processed 7 to process, eliminate workpiece to be processed 7 because of the error in processing in early stage handling process caused by the distortion that produces or secular distortion and between theoretical digital-to-analogue.
(2) the concrete processing procedure detecting data is
(B1) after process finishing, computer control system 6 receives the measurement data of LDMS 4 pairs of workpiece 7, comprise often some height z coordinate value and corresponding xy plane coordinates value and A and C angle value, namely obtain spatial value and the normal angle of on the workpiece 7 processed often;
(B2) data that obtain step (B1) according to the method that step (A2) is identical (on the workpiece 7 namely processed the spatial value of often and normal angle) carry out noise reduction process, obtain initial detecting data.
(B3) adopt Gaussian filter to carry out profile filtering to initial detecting data, finally adopt difference recursive algorithm to calculate the roughness of laser-textured surface on workpiece to be processed 7.
According to the regulation of standard GB/T/T18777-2009 and international standard ISO16610-21-2011, Gaussian filter is surface roughness profile wave filter, and the Gaussian filter that the utility model uses adopts the approximatioss of Gaussian function and Impulse invariance procedure to design.
(B4) surface profile of workpiece 7 is gone out according to initial detecting Plotting data, to determine the position of etched shape; Again according to the position of the etched shape determined, least square method is adopted to carry out fitting a straight line to the data of its both sides respectively; Finally, calculate the degree of depth and the width of etched shape, under normal circumstances, because test platform out-of-flatness or the reason such as sample surfaces injustice and defectiveness can cause the inclination of measuring profile, cause the deviation of the degree of depth and width calculation result, the method now rotated by coordinate carries out profile leveling process to measurement outline data (degree of depth namely calculated and width), eliminate due to test platform out-of-flatness or sample surfaces not the reason such as gentle defectiveness cause the deviation of the degree of depth and width calculation result.
Monolateral algorithm or bilateral algorithm can be adopted to calculate the degree of depth of etched shape.
The order of step (B3) and (B4) can be exchanged or be carried out simultaneously.
(B5) whether the etching depth that the surface roughness that obtains of determining step (B3), and step (B4) obtains and wide etching degree touch the mark requirement, if so, terminate, otherwise utilize laser Machining head 3 to carry out corrections to process.
The second detailed description of the invention that the utility model is enumerated as shown in Figure 4, the utility model device comprises laser instrument 1, light path system 2, laser Machining head 3, LDMS 4, computer control system 6, by Z axis and 360 ° of rotating shaft A and ± 90 ° kinematic system that swinging axle C is formed 13 and xy diaxon workbench 15.LDMS 4 and laser Machining head 3 are rigidly connected by connector 8 and are fixed in kinematic system 13, and move up and down and the rotation of A axle and the swing of C axle along Z-direction with kinematic system 13, workpiece to be processed 7 is fixed on xy bidimensional axle workbench 15.Before laser processing workpiece 7, first start LDMS 4, send and measure laser beam 9 (this laser beam can be a laser and line laser bundle), Z axis in moving movement system 13, LDMS 4 is made to reach in measurement size accuracy rating with the spacing on the surface of workpiece to be processed 7, then the Z axis started in diaxon workbench 15 and moving movement system 13 carries out the Z axis in two-dimensional plane or moving movement system 13 to workpiece 7, 360 ° of rotating shaft A and ± 90 ° of swinging axle C carry out three-dimension curved surface and carry out pointwise (laser beam is spot beam) or by-line (laser beam is linear beam) scanning survey, by the plane three-dimensional data (x of often obtained, y and z coordinate) or the three-dimension curved surface data (x of often, y, z coordinate and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6, 7 carry out physical dimension reconstruction to machined part, obtain physical dimension and the feature of actual workpiece to be added 7, eliminate workpiece to be processed 7 because of the error in processing in early stage handling process caused by the distortion that produces or secular distortion and between theoretical digital-to-analogue, workpiece to be processed 7 is moved to below laser Machining head 3 by diaxon workbench 15, start laser Machining head 3, kinematic system 13 and diaxon workbench 15, send processing laser beam 10, according to the physical dimension that workpiece 7 to be added is rebuild, two-dimensional plane or three-dimension curved surface processing process (as shown in Figure 5) are carried out to workpiece 7, Laser Processing terminates, close laser Machining head 3, the workpiece 7 processed is moved on to below LDMS 4 again, first start LDMS 4, send and measure laser beam 9 (as shown in Figure 4), two-dimensional plane or three-dimension curved surface position pointwise (laser beam is spot beam) or by-line (laser beam is linear beam) Scanning Detction is carried out by the position of kinematic system 13 and the processing of the diaxon workbench 15 pairs of workpiece planarizations, by the plane three-dimensional data (x of often obtained, y and z coordinate) or the three-dimension curved surface data (x of often, y, z coordinate and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6, the physical dimension of carrying out machining area is rebuild, obtain the physical dimension (working width of Laser Processing, length, the degree of depth and height), precision (processing dimension error and site error) and quality (roughness, edge-light cleanliness, perpendicularity and heat affected area) and the deformation data caused of being heated, judge processing dimension, whether precision and quality meet the demands, if do not met, again workpiece 7 can be moved to below laser Machining head 3 and carry out laser correction processing, after laser correction process finishing, again workpiece 7 is moved to below LDMS 4 and detect, till meeting the demands.Thus realize laser on-line measurement processing be detected as one function.
The third detailed description of the invention that the utility model is enumerated as shown in Figure 6, the utility model device comprises laser instrument 1, light path system 2, laser Machining head 3, LDMS 4, computer control system 6 and by XYZ tri-axle and 360 ° of rotating shaft A and ± 90 ° kinematic system that swinging axle C is formed 16 and workbench 17.LDMS 4 and laser Machining head 3 are rigidly connected by connector 8 and are fixed in kinematic system 16, and swing with XYZ axle and A axle rotating shaft and C axle axle and carry out three-dimensional space motion, workpiece to be processed 7 is fixed on workbench 17.Before laser processing workpiece 7, first start LDMS 4, send and measure laser beam 9 (this laser beam can be a laser and line laser bundle), Z axis in moving movement system 16, LDMS 4 is made to reach in measurement size accuracy rating with the spacing on the surface of workpiece to be processed 7, then start kinematic system 16 pairs of workpiece 7 and carry out two-dimensional plane or three-dimension curved surface carries out pointwise (laser beam is spot beam) or by-line (laser beam is linear beam) scanning survey, by the plane three-dimensional data (x of often obtained, y and z coordinate) or the three-dimension curved surface data (x of often, y, z coordinate value and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6, carry out workpiece 7 physical dimension to be added to rebuild, obtain physical dimension and the feature of actual workpiece to be added 7, eliminate workpiece to be processed 7 because of the error in processing in early stage handling process caused by the distortion that produces or secular distortion and between theoretical digital-to-analogue, by kinematic system 16, laser Machining head 3 is moved to above workpiece to be processed 7, start laser Machining head 3, send processing laser beam 10, according to the physical dimension that workpiece 7 to be added is rebuild, two-dimensional plane or three-dimension curved surface processing process (as shown in Figure 7) are carried out to workpiece 7, Laser Processing terminates, close laser Machining head 3, by kinematic system 16 LDMS 4 moved on to again above the workpiece 7 processed, first start LDMS 4, send and measure laser beam 9 (as shown in Figure 6), two-dimensional plane is carried out to workpiece planarization working position or pointwise (laser beam is spot beam) or by-line (laser beam is linear beam) Scanning Detction are carried out in three-dimension curved surface position, by the plane three-dimensional data (x of often obtained, y and z coordinate) or the three-dimension curved surface data (x of often, y, z coordinate and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6, the physical dimension of carrying out machining area is rebuild, obtain the physical dimension (working width of Laser Processing, length, the degree of depth and height), precision (processing dimension error and site error) and quality (roughness, edge-light cleanliness, perpendicularity and heat affected area) and the deformation data caused of being heated, judge processing dimension, whether precision and quality meet the demands, if do not met, again laser Machining head 3 can be moved to above workpiece 7 and carry out laser correction processing, after laser correction process finishing, again LDMS 4 is moved to above workpiece 7 and detect, till meeting the demands.Thus realize laser on-line measurement processing be detected as one function.
Example:
Example 1:
Adopt one of the utility model device to carry out grinding for Ultra-Violet Laser at quartz-ceramics device surface, require that laser grinding surface smoothness is less than 0.01mm for ± 0.01mm and Grinding Roughness.Before laser grinding processing quartz-ceramics device surface, first start LDMS 4, send and measure laser beam 9 (this laser beam is Line beam), mobile Z axis mobile system, LDMS 4 is made to reach in measurement size accuracy rating with the spacing of processing quartz-ceramics device surface to be ground, then start four axle workbench, 5 pairs of quartz-ceramics device surface physical dimensions and carry out two-dimensional plane (workbench 5 carries out xy two-dimensional plane and moves), by-line scanning survey, by the plane three-dimensional data (x of often obtained, y and z coordinate), input computer control system 6, physical dimension reconstruction is carried out to quartz-ceramics device surface to be processed, obtain physical dimension and the feature of actual quartz-ceramics device surface to be added, then quartz-ceramics device to be processed is moved to below laser Machining head 3 by four axle workbench 5, start laser Machining head 3 and four axle workbench 5, send processing laser beam 10, the physical dimension according to workpiece quartz-ceramics device surface to be added carries out the processing of two-dimensional plane laser grinding, after Laser Processing terminates, close laser Machining head 3, the quartz-ceramics device of grinding is moved on to below LDMS 4 again, start LDMS 4, send and measure laser beam 9, by-line (laser beam is linear beam) Scanning Detction is carried out by four axle workbench, 5 pairs of quartz-ceramics device surfaces, by the plane three-dimensional data (x of often obtained, y and z coordinate), input computer control system 6, the physical dimension of carrying out machining area is rebuild, the surface smoothness obtaining laser grinding processing is still greater than ± 0.01mm, again quartz-ceramics device is moved to below laser Machining head 3 and carry out laser correction grinding, after laser correction grinding terminates, again quartz-ceramics device is moved to below LDMS 4 and detect, until in triplicate, English ware face component flatness reaches ± and 0.0085mm and Grinding Roughness are 0.008mm.Meet requirement, thus realize laser on-line measurement processing be detected as one function.
Example 2:
Two of the utility model device are adopted to carry out lithography for optical-fiber laser at composite and flexible curved surface aluminium film surface, require that laser etches the circle ring array pattern that internal diameter is 3mm, external diameter is 5mm on aluminium film, etching annulus trueness error is less than ± 0.02mm, distance of center circle between annulus is less than ± 0.02mm from trueness error, be 0.04mm to aluminium film thickness, the aluminium film of laser ablation part need be removed completely, but is less than 0.02mm to carrier damage.Before laser ablation processing composite and flexible curved surface aluminium film surface, first start LDMS 4, send and measure laser beam 9 (this laser beam is some light beam), Z axis in moving movement system 13, LDMS 4 is made to reach in measurement size accuracy rating with the spacing of processing composite and flexible curved surface aluminium film surface to be etched, start Z axis in diaxon workbench 15 and moving movement system 13 and 360 ° of rotating shaft A and ± 90 ° swinging axle C carries out three-dimension curved surface point by point scanning measurement to composite and flexible curved surface aluminium film surface physical dimension, by the three-dimension curved surface data (x of often, y, z coordinate value and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6, treat lithography composite and flexible curved surface aluminium film surface and carry out physical dimension reconstruction, obtain physical dimension and the feature of actual processing composite and flexible curved surface aluminium film surface to be etched, by diaxon workbench 15, processing composite and flexible curved surface aluminium film to be etched is moved to below laser Machining head 3, start laser Machining head 3, kinematic system 13 and diaxon workbench 15, send processing laser beam 10, carry out the process of three-dimension curved surface lithography according to the physical dimension that processing composite and flexible curved surface aluminium film surface to be etched is rebuild, laser ablation process finishing, close laser Machining head 3, again move on to below LDMS 4 by processing composite and flexible curved surface aluminium film, start LDMS 4, send and measure laser beam 9, point by point scanning detection is carried out by kinematic system 13 and diaxon workbench 15 pairs of processing three-dimensional curved surface positions, by the plane three-dimensional data (x of often obtained, y and z coordinate) or the three-dimension curved surface data (x of often, y, z coordinate and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6, the physical dimension of carrying out machining area is rebuild, obtain laser ablation annulus trueness error and be less than ± 0.02mm, distance of center circle between annulus is less than for ± 0.02mm from trueness error, but some aluminium membrane material etching depth is less than 0.04mm, fail to remove completely, do not meet the demands.Composite and flexible curved surface aluminium film is re-moved below laser Machining head 3 and carries out laser correction lithography, after laser correction lithography terminates, again flexible curved surface aluminium film is moved to below LDMS 4 and detect, curved surface aluminium film etching depth reaches 0.048mm, remove aluminium membrane material completely, 0.01mm is less than to carrier damage, meets the demands.Thus realize laser on-line measurement processing be detected as one function.
Example 3:
Three of the utility model device are adopted to carry out laser ablation processing for optical-fiber laser on large-scale combined rigidity curved surface copper film surface, requiring that laser etches inner width on copper film is 3mm, the outer wide back-shaped array pattern for 5mm, etching a period of time pattern precision error is less than ± 0.02mm, a period of time centre distance trueness error is less than ± 0.02mm, be 0.012mm to logical film thickness, the copper film of laser ablation part need be removed completely, but is less than 0.03mm to carrier damage.Before laser ablation machining large combined rigidity curved surface copper film surface, first start LDMS 4, send and measure laser beam 9 (this laser beam is Line beam), Z axis in moving movement system 16, LDMS 4 is made to reach in measurement size accuracy rating with the spacing of processing composite and flexible curved surface aluminium film surface to be etched, XYZ axle in startup kinematic system 16 and 360 ° of rotating shaft A and ± 90 ° swinging axle C carry out three-dimension curved surface by-line scanning survey to large-scale combined rigidity curved surface copper film surface geometry size, by the three-dimension curved surface data (x of often, y, z coordinate value and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6, treat lithography large-scale combined rigidity curved surface copper film surface and carry out physical dimension reconstruction, obtain physical dimension and the feature on actual machining large combined rigidity curved surface copper film surface to be etched, laser Machining head 3 is moved to above machining large combined rigidity curved surface copper film to be etched, start laser Machining head 3 and kinematic system 13, send processing laser beam 10, the physical dimension according to machining large combined rigidity curved surface copper film resurfacing to be etched carries out the process of three-dimension curved surface lithography, laser ablation process finishing, close laser Machining head 3, LDMS 4 is moved on to again above machining large combined rigidity curved surface copper film, start LDMS 4, send and measure laser beam 9, by-line Scanning Detction is carried out by kinematic system 13 pairs of lithography three-dimension curved surface positions, by the plane three-dimensional data (x of often obtained, y and z coordinate) or the three-dimension curved surface data (x of often, y, z coordinate and the A axle anglec of rotation and C axle pendulum angle) input computer control system 6, the physical dimension of carrying out lithography region is rebuild, obtain laser ablation a period of time pattern accuracy error and be less than ± 0.02mm, a period of time centre distance trueness error is less than for ± 0.02mm, but some copper film material etching depth is less than 0.012mm, fail to remove completely, do not meet the demands.Laser Machining head 3 is re-moved above large-scale combined rigidity curved surface copper film and carry out laser correction lithography, after laser correction lithography terminates, again LDMS 4 is moved to above large-scale combined rigidity curved surface copper film and detect, curved surface copper film etching depth reaches 0.015mm, remove copper film material completely, 0.01mm is less than to carrier damage, meets the demands.Thus realize laser on-line measurement processing be detected as one function.
The above is preferred embodiment of the present utility model, but the utility model should not be confined to the content disclosed in this embodiment and accompanying drawing.The equivalence completed under not departing from spirit disclosed in the utility model so every or amendment, all fall into the scope of the utility model protection.

Claims (5)

1. a laser on-line measurement processing checkout gear, comprises the processing laser instrument, light path system and the laser Machining head that are positioned at successively in same light path; It is characterized in that, this system also comprises LDMS, computer control system, moving assembly and workbench;
LDMS, for obtaining the forward and backward measurement data of work pieces process, comprises spatial value and normal angle that workpiece often puts, and is supplied to computer control system; LDMS and laser Machining head are rigidly connected by connector and are fixed on moving assembly, and workbench is positioned at below laser Machining head, for installing described workpiece; Described LDMS, laser Machining head and workpiece can carry out three-dimensional space motion with moving assembly and workbench;
Described computer control system is connected with processing laser instrument, laser Machining head, LDMS, moving assembly and the workbench signal of telecommunication, for controlling each component working, and to from LDMS, moving assembly and and the data of four axle workbench process, to obtain process data and to detect data.
2. laser on-line measurement according to claim 1 processing checkout gear, is characterized in that, described LDMS is by send a little or the measurement laser instrument of line laser bundle, equal optical alignment convergent lens light path, condenser lens and light collector form;
Described equal optical alignment convergent lens light path comprises collimating mirror and convergent lens, is focused on again, then project on workpiece to be processed after the first all optical alignments of the light beam for being sent by measurement laser instrument by convergent lens;
Condenser lens, for receiving the reverberation of workpiece, reduces its spot diameter or width of light beam;
During work, by measurement laser instrument to processing before or processing after workpiece launch a branch of point or line laser bundle, and focus on surface of the work by equal optical alignment convergent lens light path, surface of the work by laser beam reflection to condenser lens, focal imaging forms hot spot on light collector, be the signal of telecommunication by light collector by the light signal progress of disease, after treatment measurement result outputted to computer control system.
3. laser on-line measurement processing checkout gear according to claim 1 and 2, it is characterized in that, described moving assembly is Z axis travel mechanism, and described workbench is four axle workbench.
4. laser on-line measurement processing checkout gear according to claim 1 and 2, it is characterized in that, described moving assembly is that described workbench is xy diaxon workbench by Z axis and 360 ° of rotating shaft A and ± 90 ° kinematic system that swinging axle C is formed.
5. laser on-line measurement processing checkout gear according to claim 1 and 2, it is characterized in that, described moving assembly is by XYZ tri-axle and 360 ° of rotating shaft A and ± 90 ° kinematic system that swinging axle C is formed.
CN201520350839.8U 2015-05-27 2015-05-27 Laser on line measurement processes detection device Active CN204747769U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520350839.8U CN204747769U (en) 2015-05-27 2015-05-27 Laser on line measurement processes detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520350839.8U CN204747769U (en) 2015-05-27 2015-05-27 Laser on line measurement processes detection device

Publications (1)

Publication Number Publication Date
CN204747769U true CN204747769U (en) 2015-11-11

Family

ID=54462523

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520350839.8U Active CN204747769U (en) 2015-05-27 2015-05-27 Laser on line measurement processes detection device

Country Status (1)

Country Link
CN (1) CN204747769U (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105397285A (en) * 2015-12-29 2016-03-16 苏州润昇精密机械有限公司 Automatic tracking mechanism of laser welding machine
CN106119467A (en) * 2016-07-26 2016-11-16 广东工业大学 A kind of method and apparatus controlling laser peening parameter monitoring blade surface roughness
CN106735963A (en) * 2017-01-09 2017-05-31 西安电子科技大学 A kind of machining beams space propagation pointing accuracy detection means
CN106853558A (en) * 2015-12-08 2017-06-16 彭翔 cold laser fine processing method and system
CN107297568A (en) * 2016-05-16 2017-10-27 科莱宝株式会社 Mark state estimating apparatus
CN108393579A (en) * 2017-02-07 2018-08-14 京东方科技集团股份有限公司 Laser processing device and laser processing
CN109483046A (en) * 2019-01-16 2019-03-19 长沙中拓创新科技有限公司 A kind of ultra-hard abrasive material laser mill machine and its technique
CN109530939A (en) * 2018-12-28 2019-03-29 北京中科镭特电子有限公司 A kind of method and system laser machining wafer
CN110253151A (en) * 2019-05-30 2019-09-20 兰州空间技术物理研究所 A method of improving antenna reflector surface FSS laser ablation machining accuracy
CN110369859A (en) * 2019-07-18 2019-10-25 华中科技大学 A kind of femtosecond laser closed loop processing system
CN110799301A (en) * 2017-06-23 2020-02-14 普雷茨特两合公司 Device and method for measuring a distance for a laser processing system and laser processing system
CN111174723A (en) * 2018-11-13 2020-05-19 深圳市圭华智能科技有限公司 Precision machining detection device and detection method
CN111283478A (en) * 2020-05-13 2020-06-16 西安中科微精光子制造科技有限公司 Self-adaptive positioning method for machining of similar rotary parts
CN110253151B (en) * 2019-05-30 2021-05-28 兰州空间技术物理研究所 Method for improving FSS laser etching processing precision of surface of antenna reflector

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106853558A (en) * 2015-12-08 2017-06-16 彭翔 cold laser fine processing method and system
CN105397285A (en) * 2015-12-29 2016-03-16 苏州润昇精密机械有限公司 Automatic tracking mechanism of laser welding machine
CN107297568A (en) * 2016-05-16 2017-10-27 科莱宝株式会社 Mark state estimating apparatus
CN106119467A (en) * 2016-07-26 2016-11-16 广东工业大学 A kind of method and apparatus controlling laser peening parameter monitoring blade surface roughness
CN106119467B (en) * 2016-07-26 2018-06-12 广东工业大学 A kind of method and apparatus for controlling laser peening parameter monitoring blade surface roughness
CN106735963A (en) * 2017-01-09 2017-05-31 西安电子科技大学 A kind of machining beams space propagation pointing accuracy detection means
CN106735963B (en) * 2017-01-09 2018-08-21 西安电子科技大学 A kind of machining beams space propagation pointing accuracy detection device
CN108393579A (en) * 2017-02-07 2018-08-14 京东方科技集团股份有限公司 Laser processing device and laser processing
CN110799301A (en) * 2017-06-23 2020-02-14 普雷茨特两合公司 Device and method for measuring a distance for a laser processing system and laser processing system
CN111174723A (en) * 2018-11-13 2020-05-19 深圳市圭华智能科技有限公司 Precision machining detection device and detection method
CN109530939B (en) * 2018-12-28 2020-11-24 北京中科镭特电子有限公司 Method and system for processing wafer by laser
CN109530939A (en) * 2018-12-28 2019-03-29 北京中科镭特电子有限公司 A kind of method and system laser machining wafer
CN109483046A (en) * 2019-01-16 2019-03-19 长沙中拓创新科技有限公司 A kind of ultra-hard abrasive material laser mill machine and its technique
CN110253151A (en) * 2019-05-30 2019-09-20 兰州空间技术物理研究所 A method of improving antenna reflector surface FSS laser ablation machining accuracy
CN110253151B (en) * 2019-05-30 2021-05-28 兰州空间技术物理研究所 Method for improving FSS laser etching processing precision of surface of antenna reflector
CN110369859A (en) * 2019-07-18 2019-10-25 华中科技大学 A kind of femtosecond laser closed loop processing system
CN111283478A (en) * 2020-05-13 2020-06-16 西安中科微精光子制造科技有限公司 Self-adaptive positioning method for machining of similar rotary parts
CN111283478B (en) * 2020-05-13 2020-10-27 西安中科微精光子制造科技有限公司 Self-adaptive positioning method for machining of similar rotary parts

Similar Documents

Publication Publication Date Title
Feng et al. Analysis of digitizing errors of a laser scanning system
CN102147240B (en) Method and device for measuring multiple element parameters in differential con-focus interference manner
US4457625A (en) Self calibrating contour measuring system using fringe counting interferometers
Gao Precision nanometrology: sensors and measuring systems for nanomanufacturing
US4708483A (en) Optical measuring apparatus and method
CN102607457B (en) Measuring device and measuring method for large three-dimensional morphology based on inertial navigation technology
US7209242B2 (en) Non-contact surface configuration measuring apparatus and method thereof
Takatsuji et al. Whole-viewing-angle cat's-eye retroreflector as a target of laser trackers
US3902811A (en) Electro-optical scanning system for dimensional gauging of parts
Isheil et al. Systematic error correction of a 3D laser scanning measurement device
KR20070114129A (en) Method for correcting systematic errors in a laser processing system
CN108801178B (en) Differential confocal auto-collimation center deviation and curvature radius measuring method and device
CN108267095B (en) Bilateral dislocation differential confocal detection method and device for free-form surface morphology
CN107843213B (en) Confocal auto-collimation center deviation and curvature radius measuring method and device
CN105108347B (en) A kind of method of PRK rotation etching quick Fabrication lucite curvature-adjustable lenticule
KR20020092838A (en) Profilometer and method for measuring, and method for manufacturing object of surface profiling
El-Hakim et al. Comparative evaluation of the performance of passive and active 3D vision systems
Li et al. A measurement strategy and an error-compensation model for the on-machine laser measurement of large-scale free-form surfaces
JP2003533876A (en) Method and system for precisely positioning the waist of a material processing laser beam for processing microstructures in a laser processing site
CN108406092B (en) A kind of vibration mirror scanning laser processing of coaxial real-time detection
JP5260703B2 (en) 3D measurement method
CN105404238A (en) Probe position linearization calibration method for on-machine laser measurement
TWI576563B (en) Method and device for non-contact measuring surfaces
Gao et al. High-accuracy roundness measurement by a new error separation method
CN104028890B (en) A kind of big two-photon polymerized processing method of stroke cylindrical coordinates and device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180417

Address after: 436070 Ezhou city Gedian Development Zone No. 1 Industrial Zone entrepreneurship service center in Hubei

Patentee after: Wuhan flex Laser Technology Co., Ltd.

Address before: 430074 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037

Patentee before: Huazhong University of Science and Technology