CN101494954A - Control method for laser drilling contraposition accuracy of high-density lamination circuit board - Google Patents
Control method for laser drilling contraposition accuracy of high-density lamination circuit board Download PDFInfo
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- CN101494954A CN101494954A CN 200910105665 CN200910105665A CN101494954A CN 101494954 A CN101494954 A CN 101494954A CN 200910105665 CN200910105665 CN 200910105665 CN 200910105665 A CN200910105665 A CN 200910105665A CN 101494954 A CN101494954 A CN 101494954A
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Abstract
The invention relates to a positioning precision control method in laser boring on high density accumulation layer circuit board. The method comprises: a, making a circuit board, and disposing an electronic circuit layer at least on one side; b, forming a medium layer on the surface of the electronic circuit; c, positioning the bores on the circuit board with medium layer using X ray boring equipment by a target positioning drill; d, forming laser blind bore positioning bore on the circuit board by mechanical boring after positioning the bores by the target positioning drill; e, drilling blind bores on the circuit board using the laser blind bore positioning bore as reference. The method in the invention can align the centers of the mechanical through bore and the laser blind bore of the high density accumulation layer circuit board, can effectively improve the positioning precision of the high density accumulation layer circuit board, and achieves the advantages of simple processing technology, short time and no deformation of the circuit board in processing, and needs no positioning figure in drilling blind bore by etching laser.
Description
[technical field]
This processing method that relates to electronic circuit board particularly relates to a kind of high-density lamination circuit board laser drill aligning accuracy control method.
[background technology]
At present, electronic product more and more develops to light, little, thin direction, and this makes that also the integrated level of consumer electronics product is more and more higher.As widely used high-density lamination circuit board in the electronic product, the circuit and the via of its transmission signals are more and more intensive, the aperture of the spacing of lead, density and via is more and more littler, the aligning accuracy requirement is more and more higher, makes that also the processing of high-density lamination plate aligning accuracy is more and more difficult.In the high-density lamination circuit board production process, aligning accuracy is required very strict, but because the contraposition mode is controlled comparatively complexity, particularly through the high-density lamination plate after the pressing repeatedly, its plate distortion is comparatively serious, this is more outstanding when the high-density lamination plate carries out laser processing, and the selection of laser drill contraposition mode then has influence on the control of the whole aligning accuracy of plate.
Existing common laser drill contraposition mode is respectively to form one deck dielectric layer on circuit surface, the both sides of a double-sided wiring board, carry out location, target hole with X line rig, on this time outer media layer, utilize the method for chemistry to form the copper window then, use laser ablation time outer media layer again, obtain laser drill to bit pattern, use then bit pattern is carried out laser contraposition boring, after laser drill is finished, carry out the power auger through hole again.
Yet, in the above-mentioned laser drill contraposition course of processing, laser drill need adopt method for chemially etching processing to bit pattern, and it need carry out multiple working procedures such as pad pasting, exposure, development, etching, and operation of every increase will make corresponding bit errors increase.Because the centre of location of power auger through hole is that the integral central with plate is a benchmark, and the centre of location of laser drill be inferior outer field figure.The method of this employing time outer contraposition is owing to centrical disunity, can cause the disunity of mechanical through hole and laser blind hole contraposition, and then can have influence on the aligning accuracy of high-density lamination circuit board.
[summary of the invention]
The present invention is intended to address the above problem, and provide a kind of mechanical through hole of high-density lamination circuit board that makes consistent with the contraposition center of laser blind hole, can effectively improve the aligning accuracy of high-density lamination circuit board, processing technology is simple, time is short, wiring board does not have distortion in the course of processing, need not etching laser drilling blind hole to the high-density lamination circuit board laser drill aligning accuracy control method of bit pattern.
For achieving the above object, the invention provides a kind of high-density lamination circuit board laser drill aligning accuracy control method, this method comprises the steps:
A, making one wiring board, it is provided with one deck electronic circuit a side at least;
B, form a dielectric layer on the surface of described electronic circuit;
C, be provided with on the wiring board of dielectric layer with X line rig by target spitting drill location hole;
D, behind target spitting drill location hole, form the laser blind hole registration holes by the power auger through hole in the circuit board;
E, be benchmark, carry out the laser drilling blind hole in the circuit board with described laser blind hole registration holes.
Among the step a, the individual layer wiring board that described wiring board is made for the high-density lamination plate, double-deck circuit or multilayer circuit board.
Among the step b, described dielectric layer is to cover the resin Copper Foil or the prepreg Copper Foil that is formed by glass fabric and epoxy resin.
Among the step c, described location target is two or more, and the position in target hole, location is in the distance plate between figure 5～10mm.
Among the step e, the diameter of the formed registration holes of laser drilling blind hole is 0.5～1.0mm.
Contribution of the present invention is, it efficiently solves the centre of location disunity of the centre of location of power auger through hole in the existing method and laser drill and influences the problem of aligning accuracy.Owing to be used as the laser blind hole contraposition by mechanical through hole, compare outer laser windowing method existing time, the manufacture craft flow process is simplified greatly, only need through just finishing the making of registration holes behind the power auger through hole, thereby optimized work flow, reduce the introducing error and reached the repeatedly probability of bit errors.In addition, the laser drill in this method adopts location, hole after the machine drilling to bit pattern, and its process time is short, can not produce distortion in the wiring board course of processing.And owing to omitted flow process such as chemical etching, therefore reduced the generation of error, unified the contraposition reference that machine drilling and laser blind hole are processed, thereby can effectively improve the aligning accuracy of high-density lamination circuit board.
[description of drawings]
Fig. 1 is the schematic cross-section of the amplification of two-sided high-density lamination circuit board used in the method for the present invention.
Fig. 2 is the schematic cross-section that forms the amplification of dielectric layer on two-sided high-density lamination circuit board surface.
Fig. 3 is the schematic diagram that carries out location, target hole by X line rig.
Fig. 4 is a power auger laser blind hole registration holes schematic diagram.
Fig. 5 carries out laser drilling blind hole schematic diagram by the location hole that machine drilling forms.
[embodiment]
The following example is to further explanation of the present invention and explanation, and the present invention is not constituted any limitation.
Consult Fig. 1～Fig. 5, high-density lamination circuit board laser drill aligning accuracy control method of the present invention is that a kind of mechanical through hole of high-density lamination circuit board and contraposition center of laser blind hole of making is consistent, with the control method of keyhole aligning accuracy, it comprises the steps:
A, make a wiring board at first according to a conventional method, it is provided with one deck electronic circuit a side at least.Described wiring board can be single sided board or double sided board, and single sided board or double sided board can be individual layer, bilayer or multi-layer sheet, as shown in Figure 1, in the present embodiment, wiring board 10 is a double-sided wiring board, two side respectively is provided with one deck electronic circuit 11, is used for being undertaken by chemical method for etching the internal layer circuit making of high-density lamination circuit board.Double-sided wiring board 10 in the present embodiment can be common double sided board or multi-layer sheet, and certainly, this two-sided circuit can be the double-sided wiring board that contains buried via hole.
B, form a dielectric layer on the surface of described electronic circuit.As shown in Figure 2, form a dielectric layer 20 respectively on the circuit surface of described double-sided wiring board 10.In the present embodiment, dielectric layer can be to cover resin Copper Foil (Resin Coated Copper Foil, be called for short RCC) or the prepreg Copper Foil, prepreg is wherein formed by glass fabric and epoxy resin usually, and dielectric layer and wiring board are combined as a whole by the hot pressing fusion method.
C, be provided with on the wiring board of dielectric layer with X line rig by target spitting drill location hole.As shown in Figure 3, after dielectric layer 20 is set, carry out target spitting drill location hole 30 by X line rig, described location target is two or more, is 3 targets in this example, and the position in target hole, location is in the distance plate between the figure 5-10mm.Usually X line rig can carry out the plate deformation measurement, and can carry out corresponding all divisional processing to the location hole target according to the deformation result of measuring.
D, behind target spitting drill location hole, form the laser blind hole registration holes by machine drilling in the circuit board.As shown in Figure 4, after carrying out target spitting drill location hole 30, form laser blind hole registration holes 40 in the circuit board with the method for machine drilling, it is the location hole that is used as boring after target boring location hole 30 is finished.In this routine drilling program, adjust stroke according to the deflection behind the x-ray measurement, the diameter of laser drilling blind hole registration holes is 0.5～1.0mm, and preferred aperture is 0.75mm.
E, be benchmark, carry out the laser drilling blind hole in the circuit board with described laser blind hole registration holes.As shown in Figure 5, after finishing machine drilling formation laser blind hole registration holes 40, the laser drilling blind hole is with the datum mark of laser blind hole registration holes 40 as laser drill, because the datum mark unanimity of both boring, thereby make the precision of machine drilling 51 and the precision of laser drill 50 can be accurately corresponding, thereby can improve the aligning accuracy of high-density lamination circuit board.
Claims (5)
1, a kind of high-density lamination circuit board laser drill aligning accuracy control method is characterized in that it comprises the steps:
A, making one wiring board, it is provided with one deck electronic circuit a side at least;
B, form a dielectric layer on the surface of described electronic circuit;
C, be provided with on the wiring board of dielectric layer with X line rig by target spitting drill location hole;
D, behind target spitting drill location hole, form the laser blind hole registration holes by the power auger through hole in the circuit board;
E, be benchmark, carry out the laser drilling blind hole in the circuit board with described laser blind hole registration holes.
2, the method for claim 1 is characterized in that, in the step (a), and the individual layer wiring board that described wiring board is made for the high-density lamination plate, double-deck circuit or multilayer circuit board.
3, the method for claim 1 is characterized in that, in the step (b), described dielectric layer is to cover the resin Copper Foil or the prepreg Copper Foil that is formed by glass fabric and epoxy resin.
4, the method for claim 1 is characterized in that, in the step (c), described location target is two or more, and the position in target hole, location is in the distance plate between figure 5～10mm.
5, the method for claim 1 is characterized in that, in the step (e), the diameter of the formed registration holes of laser drilling blind hole is 0.5～1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910105665 CN101494954B (en) | 2009-02-27 | 2009-02-27 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910105665 CN101494954B (en) | 2009-02-27 | 2009-02-27 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
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| CN101494954A true CN101494954A (en) | 2009-07-29 |
| CN101494954B CN101494954B (en) | 2011-04-13 |
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| CN 200910105665 Active CN101494954B (en) | 2009-02-27 | 2009-02-27 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
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| CN103369848A (en) * | 2013-07-11 | 2013-10-23 | 东莞市五株电子科技有限公司 | High-density interconnection printed circuit board laser alignment system and method |
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| CN103501579A (en) * | 2013-09-29 | 2014-01-08 | 胜华电子（惠阳）有限公司 | Circuit board aligning method |
| CN103900475A (en) * | 2013-11-22 | 2014-07-02 | 大连太平洋电子有限公司 | Laser blind hole and through hole alignment precision detection method |
| CN104244584A (en) * | 2013-06-24 | 2014-12-24 | 北大方正集团有限公司 | Laser drilling alignment method |
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| CN106170181A (en) * | 2016-08-31 | 2016-11-30 | 博敏电子股份有限公司 | Hole docking calculation is folded in a kind of wiring board production high-precision laser hole |
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| CN107949173A (en) * | 2017-11-22 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | The boring method of wiring board |
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| CN109348624A (en) * | 2018-10-11 | 2019-02-15 | 安捷利（番禺）电子实业有限公司 | A kind of alignment method of laser blind hole |
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| CN101827498A (en) * | 2010-04-30 | 2010-09-08 | 深圳崇达多层线路板有限公司 | Alignment process of matrix-shaped laser drilling blind hole of circuit board |
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| CN111465219B (en) * | 2020-04-15 | 2022-02-22 | 深圳市信维通信股份有限公司 | Circuit board processing method |
| CN112864026A (en) * | 2021-03-23 | 2021-05-28 | 成都迈科科技有限公司 | Process for processing TGV through hole by combining laser and HF wet etching |
| CN112864026B (en) * | 2021-03-23 | 2023-08-15 | 三叠纪(广东)科技有限公司 | Process for processing TGV through hole by combining laser with HF wet etching |
| CN114340225A (en) * | 2021-12-23 | 2022-04-12 | 江苏普诺威电子股份有限公司 | Multilayer packaging substrate alignment method suitable for laser blind hole |
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