CN103369866B - The manufacture method of a kind of printed wiring board containing blind hole and printed wiring board thereof - Google Patents
The manufacture method of a kind of printed wiring board containing blind hole and printed wiring board thereof Download PDFInfo
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- CN103369866B CN103369866B CN201210096525.0A CN201210096525A CN103369866B CN 103369866 B CN103369866 B CN 103369866B CN 201210096525 A CN201210096525 A CN 201210096525A CN 103369866 B CN103369866 B CN 103369866B
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Abstract
The present invention provides the manufacture method of a kind of printed wiring board containing blind hole, and described method includes: step S1): the first bit cell and the second bit cell are set on core material；Step S2): after the pressing of core material side increases layer, on described increasing layer, form X ray registration holes and blind hole registration holes according to described first bit cell, described blind hole registration holes exposes the second bit cell；Step S3): with X ray registration holes as contraposition reference, carrying out interlayer technique on described increasing layer, described interlayer technique comprises, and forms the blind hole in effective coverage with the second bit cell for contraposition reference.Use this manufacture method can be effectively improved in printed wiring board aligning accuracy between layers such that it is able to meet the making requirement of high-order HDI printed wiring board.
Description
Technical field
The invention belongs to printed wiring board manufacture technology field, relate to the manufacture method of a kind of printed wiring board containing blind hole and the printed wiring board containing blind hole.
Background technology
Along with the continuous upgrading of electronic product, multi-layered high density interconnected (High Density Interconnect is called for short HDI) printed wiring board (Print Circuit Board is called for short PCB) becomes increasingly popular.The structure of the multilayer printed wiring board (or claiming multistage printed wiring board) of standard generally comprises core material and multiple increasing layer, it is provided with circuit on described core material and multiple increasing layer, through hole is formed by the processing procedure of metallize in boring, hole (electroplate or claim copper facing) between each sandwich circuit, by the through hole between each layer, the inside realizing interlayer connects.Along with the wiring density between multilayer printed wiring board increases and the continuous renewal of the packaged type of components and parts on wiring board, in order to allow the surface of limited wiring board can place more high performance components and parts, current multilayer printed wiring board develops towards thinner direction, in addition to through-hole aperture develops towards less direction except wiring route width, have also appeared the technology that buried via hole and blind hole are set at interlayer, to reduce further, pcb board surface area is taken.Wherein, the through hole arranged between portion inner layer in buried via hole (Buried Via) i.e. multilayer printed wiring board, after pressing, imbed the inside of pcb board, this some holes cannot be seen outside pcb board, do not expose to pcb board both sides outermost layer because of it and be not take up superficies and amass；Blind hole (Blind Via) is the through hole between side outermost layer and the portion inner layer of pcb board, and this hole is due to the most through monoblock pcb board, thus referred to as blind hole, blind hole takies the superficies of pcb board side and amasss.
Along with buried via hole and the increase of blind hole in multilayer printed wiring board, the quantity of through hole, buried via hole and blind hole is more and more intensive, heat radiation power is the most, so that the heat dissipation problem within wiring board is more and more prominent, the too high electrical connection performance that can affect buried via hole and blind hole of amount of localized heat, thus affect the performance of whole multilayer printed wiring board.In the prior art, the general heat dissipation problem using blind hole filling copper technology to solve printed wiring intralaminar part, i.e. in high-order HDI printed wiring board, blind hole on each rank is arranged on the same position of each layer, when each rank substrate and Copper Foil through para-position, be laminated, hole and after plating step, i.e. form copper post in blind hole position, thus improve radiating effect and the electrical connection performance of HDI printed wiring intralaminar part, too increase the intensity of blind hole simultaneously.
In the prior art, the making of multi-layer H DI printed wiring board typically uses lamination method, the most first makes internal layer, make the opposed outer layer of this internal layer the most again, after this opposed outer layer makes, become new internal layer, can be further continued for making opposed outer layer with this new internal layer.In this lamination method, when each internal layer makes, it is both needed to the opposed outer layer according to this internal layer and makes the contraposition reference of line pattern and boring, in order to the making of line pattern and boring on the opposed outer layer of this internal layer.Under this alignment mode that alignment system is set according to adjacent layer, although already having accounted for through hole between each laminate, buried via hole, the harmomegathus coupling of blind hole, but due to each laminate all with the alignment system in its adjacent inner layer line pattern as basis reference, the once setting of the alignment system on a certain layer slightly error in printed wiring board, will cause whole printed wiring board misplaces between layers, the aligning accuracy making printed wiring board reduces even scraps, and the aligning accuracy of multilayer printed wiring board requires high, the such as aligning accuracy of blind hole copper post typically requires to be set to ± 3～± 4mil (1mil=25.4 μm).Visible, use this existing this alignment system to be difficult to improve further the aligning accuracy of printed wiring board, therefore this alignment mode is normally only below second order and second order the making of HDI printed wiring board.
As previously mentioned, the blind hole copper post ensureing in three rank and above high-order HDI printed wiring board thereof to be formed between each layer qualified effectively, it is accomplished by the aligning accuracy of blind hole boring in each layer of strict guarantee, and the alignment mode employed in printed wiring board of the prior art making is obviously difficult to meet the needs of each interlayer technique in three rank and above high-order HDI printed wiring board thereof.
Summary of the invention
The technical problem to be solved is for above-mentioned deficiency present in prior art, the manufacture method of a kind of printed wiring board containing blind hole and the printed wiring board containing blind hole are provided, use this manufacture method, aligning accuracy between layers in printed wiring board can be effectively improved such that it is able to meet the making requirement of blind hole copper post in high-order HDI printed wiring board；Using the printed wiring board containing blind hole that this manufacture method is made, the aligning accuracy of its line pattern between layers is high, is effectively increased the making quality of printed wiring board.
Solving the technology of the present invention problem and be employed technical scheme comprise that the manufacture method of this printed wiring board containing blind hole, described method includes:
Step S1): the first bit cell and the second bit cell are set on core material；
Step S2): after the pressing of core material side increases layer, on described increasing layer, form X-ray registration holes and blind hole registration holes according to described first bit cell, described blind hole registration holes exposes the second bit cell；
Step S3): with X-ray registration holes as contraposition reference, carrying out interlayer technique on described increasing layer, described interlayer technique comprises, and forms the blind hole in effective coverage with the second bit cell for contraposition reference.
Preferably, in step S1) in, described first bit cell is X-ray bit cell, and the second bit cell is blind hole bit cell；Described first bit cell and the second bit cell are positioned at the border area of core material.
Preferably, described first bit cell, described second bit cell are formed on described core material by figure transfer method with the line pattern on core material, described first bit cell and the second bit cell at least need three target spots being not arranged on the same straight line be, described first bit cell is solid copper sheet with the target spot in the second bit cell, and is distributed in the border area of core material.
Preferably, described second bit cell includes that four target spots, described four target spots are respectively provided with along two relatively short sides of core material two-by-two, and in mal-distribution.
Preferably, the target spot in described first bit cell arranges identifier the most further, distinguishes the target spot often organizing the first bit cell with mark.
Preferably, in step S2) in, before forming described blind hole registration holes, farther include: described increasing layer is carried out brown and subtracts Copper treatment；Described formation X-ray registration holes is, on the basis of described first bit cell, by X-ray target-shooting machine, forms X-ray registration holes on described increasing layer；Described formation blind hole registration holes is, with described X-ray registration holes as contraposition reference, forms the blind hole registration holes on described increasing layer with radium-shine target drone.
Preferably, in step S2) in, the size of described blind hole registration holes is more than the size of the described second corresponding target spot of bit cell, and, described second bit cell respective target dot pattern is all exposed by described blind hole registration holes.
Preferably, the several number of plies relative set increasing layer that need to arrange according to core material side of group of described first bit cell and the second bit cell, the copper sheet of blind hole registration holes position to be formed on layer that increases that on the Copper Foil increased in layer that described first pressing is formed, corresponding rear pressing is formed etches away in advance.
Preferably, the several number of plies relative set increasing layer that need to arrange according to core material side of described first bit cell group；Described second bit cell group number is one group.
A kind of printed wiring board containing blind hole, this printed wiring board is adopted and is made with the aforedescribed process.
nullThe invention has the beneficial effects as follows: the manufacture method of the printed wiring board that should contain blind hole is by being all disposed within the bit cell that the making of the line pattern of each layers all in printed wiring board and the making of all of blind hole are used on core material，Whole printed wiring board is made to use same para-position standard in manufacturing process，Compared with the alignment method of high-order HDI printed wiring board in prior art，Improve each layer aligning accuracy (aligning accuracy is up to ± 2mil)，Particularly，It is effectively increased the para-position accuracy of each interlayer blind hole copper post in printed wiring board，The blind hole copper post quality being i.e. effectively guaranteed in high-order printed wiring board，Solve the alignment system used in high-order printed wiring board manufacturing method in prior art and cannot meet the problem that three rank and three rank thereof above high-order blind hole copper post aligning accuracy requires，Be conducive to the heat radiation of printed wiring intralaminar part.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of the printed wiring board that the present invention contains blind hole；
Fig. 2 is the schematic cross-section of core material in the present invention；
Fig. 3 is present invention schematic cross-section (including blind hole) after pressing first increases layer on core material；
Fig. 4 is present invention schematic cross-section (including blind hole copper post) after pressing first increases layer on core material；
Fig. 5 is the schematic cross-section (including blind hole copper post) after pressing second increases layer on the basis of Fig. 4；
Fig. 6 is the schematic cross-section (including blind hole copper post) on the basis of Fig. 5 after pressing the 3rd increasing layer；
Fig. 7 is the first bit cell and the structural representation of the second bit cell on core material in three rank HDI printed wiring boards in the embodiment of the present invention 1；
Fig. 8 is the first bit cell and the structural representation of the second bit cell on core material in three rank HDI printed wiring boards in the embodiment of the present invention 2.
In figure: 1-substrate；2-the first Copper Foil；3-the first blind hole；4-prepreg；5-the first blind hole copper post；6-the second Copper Foil；7-the 3rd Copper Foil；8-the second blind hole copper post；9-the 4th Copper Foil；10-the 3rd blind hole copper post；11-effective coverage；12-border area；13-the first para-position target spot figure；14-the second para-position target spot figure.
Detailed description of the invention
For making those skilled in the art be more fully understood that technical scheme, the manufacture method of the printed wiring board with detailed description of the invention, the present invention being contained blind hole below in conjunction with the accompanying drawings and the printed wiring board containing blind hole are described in further detail.
As it is shown in figure 1, the manufacture method of the printed wiring board of blind hole should be contained, it comprises the steps:
Step S1): the first bit cell and the second bit cell are set on core material；
Step S2): after the pressing of core material side increases layer, on described increasing layer, form X-ray registration holes and blind hole registration holes according to described first bit cell, described blind hole registration holes exposes the second bit cell；
Step S3): with X-ray registration holes as contraposition reference, carrying out interlayer technique on described increasing layer, described interlayer technique comprises, and forms the blind hole in effective coverage with the second bit cell for contraposition reference.
Embodiment 1:
In the present embodiment, made printed wiring board is three rank printed wiring boards, and this three rank printed wiring board includes that core material and three couple arranged in core material lateral symmetry increase layer, includes altogether eight layers of copper clad patterns.Wherein, core material includes substrate 1 and the first Copper Foil 2 being respectively provided with in substrate both sides, and described core material can directly use double face copper.Respectively it is arranged at intervals with three layers of prepreg and three layers of Copper Foil in the both sides of this double face copper, through three pressings formation three to increasing layer, ultimately forms the three rank printed wiring boards with eight layers of copper clad patterns.
The manufacture method of the printed wiring board containing blind hole in the present embodiment comprises the steps:
Step S1): the first bit cell and the second bit cell are set on core material.
Preparing one piece of double face copper, wherein, the insulating laminated sheet being made up of resin and supporting material in this double face copper is substrate 1, and the Copper Foil that substrate both sides cover is the first Copper Foil 2, i.e. A layer Copper Foil in Fig. 2 and B layer Copper Foil.
As shown in Figure 7, described first Copper Foil 2 includes effective coverage 11 and border area 12, in the border area of the first Copper Foil 2, use figure transfer method to need to transfer on the first Copper Foil 2 by corresponding copper clad patterns by circuit design, i.e. transfer on the A layer Copper Foil shown in Fig. 2 and B layer Copper Foil.Wherein, described first bit cell and described second bit cell are concurrently formed on described core material by figure transfer method, on the i.e. first Copper Foil 2 with line pattern.
As it is shown in fig. 7, in the present embodiment, the second bit cell is blind hole bit cell, as contraposition reference when making blind hole when carrying out interlayer technique in follow-up increasing layer.First bit cell is X-ray bit cell, for the increasing layer in follow-up pressing, finds the first bit cell by the Figure recognition function of X-ray target-shooting machine and forms X-ray registration holes in the relative position increasing layer.First bit cell and the second bit cell are typically all solid copper sheet.
In the present embodiment, the group number of the first bit cell and the second bit cell, it it is logarithm (increasing layer when core material lateral symmetry arrange with to number scale, can be to be laminated in terms of number of times in the case of the other) relative set increasing layer that need to arrange according to core material both sides.In the present embodiment, owing to made printed wiring board is three rank printed wiring boards, i.e. including three to increasing layer, thus the first bit cell and the second bit cell respectively arrange three groups on core material, and are distributed in the border area on the A layer Copper Foil of core material and B layer Copper Foil.
In order to ensure the accuracy of follow-up para-position, each group bit cell at least needs three target spots being not arranged on the same straight line be, and the second bit cell includes four target spots the most as far as possible.Precision for figure para-position considers, in this example, one group of first bit cell uses three target spots, sees the first para-position target spot figure 13 in Fig. 7, i.e. X-Ray para-position target spot；One group of second bit cell uses four target spots, sees the second para-position target spot figure 14, i.e. blind hole para-position target spot in Fig. 7.Wherein, described four blind hole para-position target spots are arranged in the first Copper Foil border area, and two relatively short sides along the first Copper Foil are respectively provided with two-by-two, and in mal-distribution, to realize foolproof function.Concrete, in Fig. 7 four blind hole trapezoidal distributions of para-position target spot.
In the present embodiment, the single target spot in described first bit cell and the second bit cell all uses round dot, and the round dot diameter of the second bit cell can arrange less, such as 0.1-0.5mm, and the first bit cell round dot diameter is such as 1.0-1.5mm.
In the present embodiment, each group the first bit cell and the target spot of the second bit cell on described first Copper Foil are formed by exposure → development → etching step.
Step S2): after the pressing of core material side increases layer, on described increasing layer, form X-ray registration holes and blind hole registration holes according to described first bit cell, described blind hole registration holes exposes the second bit cell.
As shown in Figure 3, it is each provided with one first in the both sides of core material and increases layer, described this to the first operating procedure increasing layer particularly as follows: at upper pressing prepreg 4 and second Copper Foil 6 (the C layer Copper Foil in corresponding diagram 3 and D layer Copper Foil) respectively of A layer Copper Foil and B layer Copper Foil, thus form a pair first and increase layers.
Find with X-ray target-shooting machine and increase the position that correspond to core material X-ray para-position target spot on layer, and form X-ray registration holes on layer increasing；Then use radium-shine target drone with X-ray registration holes as contraposition reference, find and correspond to the position of blind hole para-position target spot on core material on increasing layer, use radium-shine target drone increasing formation blind hole registration holes on layer.
Concrete, the strong and weak thickness identifying metal level can developed by metallic pattern due to the X-ray light beam in X-ray target-shooting machine, i.e. X-ray target-shooting machine can be through the flood copper sheet (the C layer Copper Foil in corresponding diagram 3 and D layer Copper Foil) increased on layer, thus detection identifies the first bit cell i.e. X-Ray para-position target spot on core material, then through hole, i.e. X-ray registration holes are formed at this increasing layer together with the position of correspondence X-Ray para-position target spot on core material.
After forming above-mentioned X-ray registration holes, before using radium-shine target drone to get blind hole registration holes, generally the Copper Foil (the C layer Copper Foil in corresponding diagram 3 and D layer Copper Foil) increasing layer surface need to be carried out brown process, realize subtracting copper while brown, i.e. allow surface Copper Foil thinning.In general, Copper Foil is the thinnest before being laminated can subtract copper by brown to 12-14um after lamination, makes copper thickness reach 7-9um, and this is that current radium-shine target drone can be with the thickness of penetrating metal layer.On the other hand, copper foil surface could absorb the heat of radium-shine light beam because of brown, it is achieved radium-shine punching.
Then, use radium-shine target drone, to increase one group of (i.e. three) X-ray registration holes on layer as contraposition reference, find and correspond to the position of four blind hole para-position target spots on core material on increasing layer, on C layer Copper Foil and D layer Copper Foil radium-shine go out blind hole registration holes (i.e. burning out four through holes with radium-shine laser), thus first group of second bit cell (i.e. four (one group) "●" figures of trapezoidal distribution in Fig. 7) on described core material is revealed.Here, the position of above-mentioned each blind hole para-position target spot, it is to be determined by one group of common para-position of X-ray registration holes, the most radium-shine target drone, according to the coordinate relation data of three the X-ray registration holes being previously entered Yu this blind hole para-position target spot, positions the position of this blind hole para-position target spot according to the principle of " three-point fix is a bit ".
Blind hole registration holes can be circular, rectangle or the hole of other shapes, the area in this hole is greater than or at least equal to the copper sheet area of blind hole para-position target spot on core material, so that the copper sheet of blind hole para-position target spot all exposes, it is desirable that blind hole para-position target spot is enclosed in the middle of this hole, to utilize blind hole para-position target spot to carry out the processing of each blind hole in effective coverage for contraposition reference during following process, and ensure the processing precision of each blind hole in effective coverage.Such as, when blind hole registration holes is circular, vertical view can see the figure of ⊙, and " O " of figure peripheral is the hole wall of the blind hole registration holes of radium-shine formation, and "●" internal in figure is the blind hole para-position target spot on the core material seen by blind hole registration holes.Such as, when the diameter of four (one group) blind hole para-position target spots is about 0.1mm, increasing the diameter (its length of short sides when it is shaped as rectangle) of blind hole registration holes on layer is more than 0.5mm.
Step S 3): with X-ray registration holes as contraposition reference, carrying out interlayer technique on described increasing layer, described interlayer technique comprises, and forms the blind hole in effective coverage with the second bit cell for contraposition reference.
In addition to each blind hole in forming effective coverage, in this step, described interlayer technique can also include using figure transfer method to make the line pattern increased in layer on Copper Foil, and carries out the technique such as holes drilled through, plating to increasing layer.
Concrete, increase first and use radium-shine target drone on layer, using step S2) formed in hole, four blind holes location in the blind hole para-position target spot that exposes as contraposition reference, according to circuit design needs, the position arranging blind hole in the first effective coverage increasing layer burns out blind hole with radium-shine light beam.Here the blind hole formed in saying the first increasing layer effective coverage is referred to as the first blind hole 3, as shown in Figure 3.If step S2) be when having suppressed the second increasing layer and being formed on another group X-ray registration holes and another group blind hole hole, location, step S3) in second increase the blind hole of formation in layer effective coverage and be referred to as the second blind hole, the rest may be inferred.The diameter of these blind holes that radium-shine target drone is fired into is about 0.1mm.
nullNeeds should be mentioned that，In view of radium-shine target drone to the limited penetration capacity of metal level，Also need to be laminated the second increasing layer on layer if increased first，Use figure transfer method (can certainly process respectively while carrying out line pattern transfer increasing layer to first，But forming efficiency is higher) simultaneously，Increase on the C layer Copper Foil in layer and D layer Copper Foil first，The copper sheet that will correspond to will be formed on the second increasing layer (not the most also being laminated) blind hole registration holes position etches away in advance，It is thus possible to avoid affecting the penetrance of the radium-shine light beam that radium-shine target drone is launched because of the first existence increasing copper sheet on the C layer Copper Foil in layer and D layer Copper Foil，Make after pressure brown subtract copper layer by layer in the second increasing，Remain to be increased second the second Copper Foil 6 and the prepreg 4 that correspond on layer on core material at blind hole para-position target position by radium-shine target drone burn，Thus form the blind hole registration holes of this increasing layer，Make to be exposed by the blind hole para-position target spot core material from this increasing layer blind hole registration holes.In the present embodiment, because three need to be laminated to increasing layer, so when forming the line pattern of the first increasing layer, the second increasing layer and the 3rd need to be will correspond to increase layer and will form the C layer Copper Foil in the first increasing layer of blind hole registration holes position and Copper Foil on D layer Copper Foil etches away (relating to eight target positions altogether) the most in advance, when forming the line pattern of the second increasing layer, the 3rd increasing layer need to be will correspond to and will form the E layer Copper Foil in the second increasing layer of blind hole registration holes position and copper sheet on F layer Copper Foil etches away (relating to four target positions altogether) the most in advance.
Then, increase, to first, the first blind hole 3 made on layer to electroplate.After plating, being filled with copper post in the first blind hole, i.e. form the first blind hole copper post 5, as shown in Figure 4, the diameter of this first blind hole copper post 5 is about 0.1mm.Actual fabrication technique can cause the cross section of blind hole to be trapezoidal, and as shown in the first blind hole copper post 5 in figure, in circuit design, the desired section of blind hole is cylindrically shaped.
(include increasing layer circuit forming surface figure) after the first interlayer technique increasing layer completes, again perform step S2), after the second increasing layer 6 (being mostly a pair increasing layer) being laminated on the first increasing layer is formed, the X-ray bit cell on the second increasing layer is formed according to second group of first bit cell, again with this group X-ray bit cell as anchor point (i.e. contraposition reference), radium-shine formation second increases one group of (such as 4) blind hole registration holes on layer, aperture, after calculating the upper deviation, is enough exposed second group of second bit cell and is limited.Then, using second group of second bit cell on the core material exposed as contraposition reference, use radium-shine target drone to form the second blind hole in the described second relative position increased on layer, and then after electroplating technology, form the second blind hole copper post 8, as shown in Figure 5；In like manner, the 3rd blind hole copper post 10 is sequentially formed, as shown in Figure 6.
Fig. 6 is the three rank HDI printed wiring boards using the manufacture method of printed wiring board of the present invention to make, L1 → L8 layer of printed wiring board in each layer correspondence actual process from top to bottom in figure.Due to the making all using the bit cell on core material as basis reference of line pattern and blind hole in each increasing layer so that whole printed wiring board has identical para-position reference system, is effectively guaranteed the aligning accuracy of printed wiring board；Meanwhile, as can be seen from Figure 6, the blind hole copper post formed after each blind hole increased in layer is electroplated in printed wiring board is layered on same vertical straight line, not only increases the intensity of blind hole, and the heat radiation of beneficially printed wiring intralaminar part.
Embodiment 2:
The three rank printed wiring board finished products made in the present embodiment are identical with embodiment 1, and it is with the difference of embodiment 1: first, and in the present embodiment, the second bit cell is only with one group；Second, para-position target spot figure in first bit cell and the second bit cell is square, and the para-position target spot side in described first bit cell is additionally provided with identifier, described identifier uses Roman number or Greek alphabet or Arabic numerals, to facilitate operator to operate Figure recognition when X-ray target-shooting machine punches.
Concrete, as it is shown in fig. 7, in embodiment 1, core material includes three groups of totally ten two second para-position target spot figures 14；And in the present embodiment, as shown in Figure 8, core material has only included four the second para-position target spot figures 14.
Accordingly, when the manufacture method using printed wiring board of the present invention makes three rank HDI printed wiring board same as in Example 1, as previously mentioned, para-position target spot in the second bit cell of the blind hole made in each increasing layer in effective coverage is arranged on core material, and each layer that increases shares same group (4) second para-position target spot figure.In view of radium-shine target drone to the limited penetration capacity of metal level, in the present embodiment, first increases layer can find the position of blind hole para-position target spot on core material by radium-shine target drone after brown subtracts copper, it is thus possible to use radium-shine target drone to form the blind hole registration holes of the first increasing layer, and then forms the first blind hole；After pressing second increases layer, blind hole registration holes (including the through hole in Copper Foil and prepreg) is formed by radium-shine target drone owing to the first increasing layer correspond to the position of blind hole para-position target spot on core material, therefore the second increasing layer can be found easily by radium-shine target drone after brown subtracts copper and correspond to the position of blind hole para-position target spot on core material on the second increasing layer, it is thus possible to use radium-shine target drone to form the blind hole registration holes of the second increasing layer, and then form the second blind hole；In like manner, after continuing pressing the 3rd increasing layer, radium-shine target drone also can be readily formed the blind hole registration holes on the 3rd increasing layer, and then forms the 3rd blind hole.Visible, due in the present embodiment for the blind hole para-position target spot in each increasing layer only with one group, make the blind hole registration holes being correspondingly formed in each increasing layer on same vertical straight line, therefore, correspondingly save as described in Example 1 need on the Copper Foil increased in layer that first pressing is formed corresponding rear pressing formed increase the step that on layer, the copper sheet of blind hole registration holes position to be formed to etch away in advance so that processing technology is simpler, make efficiency is the highest.
In the present embodiment, other steps of the manufacture method of printed wiring board are same as in Example 1, repeat no more here.
The invention provides the manufacture method of a kind of printed wiring board containing blind hole and multistage printed wiring board, bit cell all of in printed wiring board is all disposed within core material by this manufacture method, the line pattern made in whole printed wiring board on each layer Copper Foil makes and all uses same alignment system, compared with printed wiring board manufacturing method in prior art, improve the aligning accuracy (aligning accuracy is up to ± 2mil) of each layer pattern, can more effectively ensure the blind hole copper post quality in printed wiring board, it is more beneficial for the heat radiation of printed wiring intralaminar part.
It is understood that the principle that is intended to be merely illustrative of the present of embodiment of above and the illustrative embodiments that uses, but the invention is not limited in this.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (9)
1. the manufacture method of the printed wiring board containing blind hole, it is characterised in that institute
The method of stating includes:
Step S1: the first bit cell and the second bit cell are set on core material；
Step S2: after the pressing of core material side increases layer, according to described first para-position list
Unit forms X-ray registration holes and blind hole registration holes, described blind hole pair on described increasing layer
The second bit cell is exposed in hole in position；
Step S3: with X-ray registration holes as contraposition reference, carries out layer on described increasing layer
Between technique, described interlayer technique comprises, and is formed with the second bit cell for contraposition reference
Blind hole in effect region；
Described first bit cell is X-ray bit cell, i.e. X-ray para-position target spot；
Second bit cell is blind hole bit cell, i.e. blind hole para-position target spot；
In step s 2, before forming described blind hole registration holes, farther include: right
Described increasing layer carries out subtracting Copper treatment；
Described formation X-ray registration holes is, is known through increasing layer by X-ray target-shooting machine
Do not go out the X-ray para-position target spot on core material, then at this increasing layer together with core material
The position of upper corresponding X-ray para-position target spot forms through hole, is X-ray registration holes；
Described formation blind hole registration holes is, with described X-ray registration holes as contraposition reference,
Find and correspond to the position of blind hole para-position target spot on core material on increasing layer, use radium-shine target drone
Described increasing layer is formed blind hole registration holes；
It is to use with the blind hole that the second bit cell is formed in effective coverage for contraposition reference
Radium-shine target drone, the blind hole para-position target spot exposed in described blind hole registration holes is as para-position base
Standard, forms blind hole in having the effective coverage of described increasing layer of blind hole registration holes.
Method the most according to claim 1, it is characterised in that
Described first bit cell and the second bit cell are positioned at the edge district of core material
Territory.
Method the most according to claim 2, it is characterised in that described first para-position
Unit, described second bit cell are shifted by figure with the line pattern on core material
Method is formed on described core material, and described first bit cell and the second bit cell are extremely
Need three target spots being not arranged on the same straight line be, described first bit cell and second less
Target spot in bit cell is solid copper sheet, and is distributed in the border area of core material.
Method the most according to claim 3, it is characterised in that described second para-position
Unit includes four target spots, and described four target spots are two-by-two along two relatively short sides of core material
It is respectively provided with, and in mal-distribution.
Method the most according to claim 3, it is characterised in that described first para-position
Target spot in unit arranges identifier the most further, distinguishes with mark and often organizes the first para-position list
The target spot of unit.
Method the most according to claim 1, it is characterised in that in step s 2,
The size of described blind hole registration holes is more than the size of the described second corresponding target spot of bit cell,
Further, described second bit cell respective target dot pattern is all revealed by described blind hole registration holes
Go out.
Method the most according to claim 1, it is characterised in that described first para-position
The several layer increasing layer that need to arrange according to core material side of group of unit and the second bit cell
Number relative set, on the Copper Foil increased in layer that first pressing is formed, corresponding rear pressing is formed
Increase the copper sheet of blind hole registration holes position to be formed on layer to etch away in advance.
Method the most according to claim 1, it is characterised in that described first para-position
The several number of plies relative set increasing layer that need to arrange according to core material side of unit group；Described
Second bit cell group number is one group.
9. the printed wiring board containing blind hole, it is characterised in that this printed wiring board
The arbitrary described method of claim 1-8 is used to make.
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| CN201210096525.0A CN103369866B (en) | 2012-04-01 | 2012-04-01 | The manufacture method of a kind of printed wiring board containing blind hole and printed wiring board thereof |
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| CN201210096525.0A CN103369866B (en) | 2012-04-01 | 2012-04-01 | The manufacture method of a kind of printed wiring board containing blind hole and printed wiring board thereof |
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| CN103369866B true CN103369866B (en) | 2016-08-03 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105491791A (en) * | 2014-10-08 | 2016-04-13 | 深南电路有限公司 | Circuit board with blind hole and processing method of circuit board |
| CN104955266A (en) * | 2015-06-17 | 2015-09-30 | 安徽达胜电子有限公司 | Circuit board capable of facilitating blind hole alignment |
| CN106170181B (en) * | 2016-08-31 | 2018-12-21 | 博敏电子股份有限公司 | A kind of wiring board production folded hole interconnection method in high-precision laser hole |
| CN109922602B (en) * | 2019-04-02 | 2021-09-14 | 博敏电子股份有限公司 | Multi-functional target error-proofing design method for Analyyer plate |
| CN114302564B (en) * | 2021-12-29 | 2023-12-08 | 黄石广合精密电路有限公司 | Intelligent fool-proofing method for alignment holes of HDI (high-density interconnect) board and HDI board |
| CN114786326A (en) * | 2022-04-28 | 2022-07-22 | 广东世运电路科技股份有限公司 | Circuit board, alignment drilling method of circuit board and composite circuit board |
| CN115397117A (en) * | 2022-08-10 | 2022-11-25 | 中山芯承半导体有限公司 | Circuit board manufacturing method for improving interlayer and layer alignment |
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| CN101372071A (en) * | 2008-09-12 | 2009-02-25 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
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