TWI577250B - Printed circuit board and method of manufacturing the same, and module - Google Patents

Description

Printed circuit board and manufacturing method and module thereof

The following description relates to printed circuit boards, methods of making printed circuit boards, and modules.

Recently, electronic components have become smaller and more practical. Therefore, there is a growing demand for highly integrated thin products in which heat dissipation is maximized by applying finer patterns in the printed circuit board and implementing a laminated via structure. For example, U.S. Patent Publication No. 2011/0069448 describes an example of a technique for integrating electronic components.

This summary is provided to introduce a simplified selection of concepts and is further described in the following embodiments. The Abstract is not intended to identify key features or essential features of the claimed subject matter, and is not intended to be used to assist in determining the scope of the claimed subject matter.

In a general aspect, a printed circuit board includes a plurality of insulating layers, metal layers respectively formed on the plurality of insulating layers, via holes formed for interlayer electrical connection of the metal layers, and penetration The trenches of the insulating layers and the heat transfer structures formed in the trenches.

In another general aspect, a module includes: a printed circuit board including a plurality of insulating layers, metal layers respectively formed on the plurality of insulating layers, and interlayer electrical connections formed for the metal layers Through holes, trenches penetrating the insulating layers, and heat transfer structures formed in the trenches; and components mounted on the printed circuit board.

In another general aspect, a module includes: a printed circuit board including a plurality of insulating layers, metal layers respectively formed on the plurality of insulating layers, and interlayer electrical connections formed for the metal layers a through hole, a groove penetrating the insulating layers, and a heat transfer structure formed in the groove; an element mounted on the printed circuit board; and a motherboard on which the printing is mounted The board is mounted on the motherboard.

In another general aspect, a method of fabricating a printed circuit board involves obtaining an insulating layer; forming vias and trenches in the insulating layer; forming a heat transfer structure in the trench; and forming on the insulating layer Metal layer.

Other features and aspects will be apparent from the following description, drawings, and claims.

100‧‧‧Printed circuit board

100A‧‧‧ Carrier components

101‧‧‧ core layer

102‧‧‧First metal layer

111‧‧‧Insulation

112‧‧‧Second metal layer

113‧‧‧through hole

114‧‧‧ trench

115‧‧‧ seed layer

116‧‧‧Anti-plating pattern

117‧‧‧Electroplating

121‧‧‧First metal layer

122‧‧‧Second metal layer

125‧‧‧heat transfer structure

127‧‧‧through hole

200‧‧‧Printed circuit board

200A‧‧‧ Carrier components

201‧‧‧ core layer

202‧‧‧First metal layer

203‧‧‧Separation layer

211‧‧‧Insulation

212‧‧‧Second metal layer

213‧‧‧through hole

214‧‧‧ openings

216a‧‧‧first anti-plating pattern

216b‧‧‧second anti-plating pattern

217‧‧‧through hole-metal layer

218‧‧‧ trench

219‧‧‧ outer metal layer

220‧‧ ‧ core

220a‧‧ core

221‧‧‧First metal layer

222‧‧‧Second metal layer

223‧‧‧ outer layer

225‧‧‧heat transfer structure

227‧‧‧through hole

300‧‧‧Printed circuit board

300A‧‧‧ Carrier components

301‧‧ ‧ core layer

302‧‧‧First metal layer

303‧‧‧Separation layer

311‧‧‧Insulation

312‧‧‧Second metal layer

313‧‧‧through hole

316a‧‧‧First anti-plating pattern

316b‧‧‧second anti-plating pattern

317‧‧‧through hole-metal layer

318‧‧‧ trench

319‧‧‧ outer metal layer

320‧‧ ‧ core

320a‧‧ core

321‧‧‧First metal layer

322‧‧‧Second metal layer

323‧‧‧ outer layer

325‧‧‧heat transfer structure

327‧‧‧through hole

400‧‧‧Printed circuit board

411‧‧‧Insulation

418‧‧‧ trench

420‧‧ core

421‧‧‧metal layer

422‧‧‧metal layer

423‧‧‧ outer layer

425‧‧‧heat transfer structure

427‧‧‧through hole

500‧‧‧ modules

511‧‧‧Insulation

518‧‧‧ trench

520‧‧ core

521‧‧‧First metal layer

522‧‧‧Second metal layer

523‧‧‧ outer layer

525‧‧‧heat transfer structure

527‧‧‧through hole

531‧‧‧ solder bumps

550‧‧‧ components

600‧‧‧ modules

611‧‧‧Insulation

618‧‧‧ trench

620‧‧ core

621‧‧‧metal layer

622‧‧‧metal layer

623‧‧‧ outer layer

625‧‧‧heat transfer structure

627‧‧‧through hole

630‧‧‧solder layer

650‧‧‧ components

651‧‧‧ wire

731‧‧‧ solder bumps

732‧‧‧External connection terminal

733‧‧‧External connection terminal

750‧‧‧ components

770‧‧‧ motherboard

Fig. 1 is a cross-sectional view showing an example of a printed circuit board.

Fig. 2 is a cross-sectional view showing another example of a printed circuit board.

Fig. 3 is a cross-sectional view showing another example of a printed circuit board.

Fig. 4 is a cross-sectional view showing another example of a printed circuit board.

Fig. 5 is a plan view showing another example of a printed circuit board.

Fig. 6 is a flow chart illustrating an example of a method of manufacturing a printed circuit board.

7 through 15 illustrate a process used in an example of a method of manufacturing a printed circuit board by illustrating a cross-sectional view of a printed circuit board during a manufacturing process.

Figure 16 is a flow chart illustrating another example of a method of manufacturing a printed circuit board.

17 through 30 illustrate a process used in another example of a method of manufacturing a printed circuit board by illustrating a cross-sectional view of the printed circuit board during the manufacturing process.

Figure 31 is a flow chart illustrating another example of a method of manufacturing a printed circuit board.

32 through 41 illustrate a process used in another example of a method of manufacturing a printed circuit board by illustrating a cross-sectional view of the printed circuit board during the manufacturing process.

Figure 42 is a cross-sectional view showing an example of a module.

Figure 43 is a cross-sectional view showing another example of the module.

Figure 44 is a cross-sectional view showing another example of the module.

Throughout the drawings and the embodiments, the same component symbols refer to the same components. The schema may not be proportionate, and for clarity, For illustration and convenience, the relative dimensions, proportions, and depictions of the elements in the drawings may be exaggerated.

The following embodiments are provided to assist the reader in a comprehensive understanding of the methods, devices, and/or systems described herein. Various changes, modifications, and equivalents of the methods, devices, and/or systems described herein will be apparent to those of ordinary skill in the art. The order of the operations described herein is by way of example only, and is not limited to the ones set forth herein, but as will be apparent to those of ordinary skill in the art, in addition to the operations that must occur in a particular order. Also, functions and construction descriptions well known to those of ordinary skill in the art may be omitted for clarity and conciseness.

Features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided so that this disclosure will be thorough and complete, and the full scope of the disclosure will be disclosed to those of ordinary skill in the art.

Unless otherwise defined, all terms used herein, including technical terms and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Any term defined in a general dictionary should be interpreted as having the same meaning in the context of the relevant field and should not be interpreted as having idealistic or over-formalism unless explicitly defined otherwise.

Regardless of the figure number, the same or corresponding elements will be given the same element symbols, and any redundant description of the same or corresponding elements will not be repeated. Throughout the description of the present disclosure, when it is described that some related conventional techniques are judged to circumvent the focus of the present disclosure, the related detailed description will be omitted. Terms such as "first" and "second" may be used to describe various elements, but the above elements are not limited to the above terms. The above terms are only used to distinguish one element from another. In the figures, some of the elements may be exaggerated, omitted or briefly illustrated, and the dimensions of the elements do not necessarily reflect the actual dimensions of these elements.

In the following disclosure, the term "cross" refers to various elongated forms of a three-dimensional shape.

Hereinafter, some embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

A printed circuit board

FIG. 1 is a cross-sectional view illustrating an example of a printed circuit board 100.

Referring to FIG. 1, the printed circuit board 100 includes a first metal layer 121 and a second metal layer 122 formed on either surface of the insulating layer 111, via holes, and a heat transfer structure 125 formed in the trenches 114.

The insulating layer 111 may be made of any resin used as an insulating material of a general printed circuit board, such as a thermosetting resin, a thermoplastic resin, and/or a photosensitive resin, or any resin having a flexure member, for example, which is filled therein. Glass fiber or inorganic filler. For example, the insulating layer 111 It may be made of a prepreg, a compound of aphrodisiac (ABF) or a resin such as flame retardant 4 (FR-4) and bismaleimide triazine (BT).

The metal layers 121, 122 are each made of a common metal for the circuit, such as aluminum or copper.

The via 127 and the heat transfer structure 125 are each composed of a seed layer (for example, an electroless plating layer) and at least one electrolytic plating layer, and are made of a metal such as copper or aluminum.

The via 127 is a general type of signal that is formed for interlayer electrical connection of circuit patterns.

The heat transfer structure 125 is formed in the cross-shaped groove 114 and formed by penetrating the insulating layer 111 to have a larger volume than the through hole 127.

The cross-shaped groove is not limited to a linear plane or a polyhedron. For example, a cross may refer to various types of three-dimensional shapes, including planar shapes having one or more curved lines.

By having the cross shape, the heat transfer structure 125 can be formed to have a large volume while avoiding concentrated circuit patterns and through holes close to the heat transfer structure 125, and can be easily designed at various positions.

The heat transfer structure 125 may have a polyhedral shape, such as a columnar or prismatic shape having a rectangular base, or various amorphous three-dimensional shapes.

The cruciform heat transfer structure 125 can be used as a power source or ground, depending on the application.

The component is first connected to the heat transfer structure 125 and then mounted or embedded in the printed circuit board 100, or is disposed at a location where the component at least partially overlaps the heat transfer structure 125.

As a result, heat generated from the element can be effectively moved to the outside through the heat transfer structure 125.

FIG. 2 is a cross-sectional view showing another example of the printed circuit board 200.

Referring to FIG. 2, the printed circuit board 200 includes a first metal layer 221 and a second metal layer 222 formed on either surface of the insulating layer 211, a via 227, a trench 218, and is formed in the trench 218. The heat transfer structure is 225.

The via 227 is a signal formed to electrically connect the layers of the circuit pattern, and is composed of a seed layer (for example, an electroless plating layer) and at least one electrolytic plating layer.

The heat transfer structure 225 is formed in the cross-shaped groove 218 and formed by penetrating the insulating layer 211 to have a larger volume than the through hole 227.

By having the cross shape, the heat transfer structure 225 can be formed to have a large volume while avoiding concentrated circuit patterns and through holes close to the heat transfer structure 225, and can be easily designed at various positions.

The heat transfer structure 225 is comprised of a core 220 and an outer layer 223 that surrounds the outer surface of the core 220.

In the present example, the outer layer 223 is disposed around three surfaces of the core 220 except for the bottom surface of the core 220.

The heat transfer structure 225 may have a polyhedral shape, such as a columnar or prismatic shape having a rectangular base, or various amorphous three-dimensional shapes.

In the present example, both core 220 and outer layer 223 are comprised of at least one electroplated layer.

The core 220 (the plating accelerator functioning as the outer layer 223) can prevent the thickness of the heat transfer structure 225 from decreasing in the intermediate portion by being disposed in the intermediate portion of the heat transfer structure 225 (possibly pits are likely to occur).

The sides of the core 220 may have a tapered shape. Further, the side of the core 220 may have one of various shapes such as an elliptical shape, a rectangular shape, a dumbbell shape, or a zigzag shape, but the present disclosure is not limited thereto.

The component may be first connected to the heat transfer structure 225 and then mounted or embedded in the printed circuit board 200, or may be disposed at a location where the component at least partially overlaps the heat transfer structure 225.

As a result, heat generated from the element can be effectively moved to the outside by the heat transfer structure 225.

3 is a cross-sectional view showing another example of the printed circuit board 300, and any redundant description of the same or corresponding elements will not be repeated.

Referring to FIG. 3, the printed circuit board 300 includes a first metal layer 321 and a second metal layer 322 formed on either surface of the insulating layer 311, a via 327, a trench 318, and is formed in the trench 318. The heat transfer structure 325.

The via 327 is a signal generally formed for interlayer electrical connection of circuit patterns, and is composed of a seed layer (for example, an electroless plating layer) and at least one electrolytic plating layer.

The heat transfer structure 325 is formed in the cross-shaped groove 318 and formed by penetrating the insulating layer 311 to have a larger volume than the through hole 327.

By having the cross shape, the heat transfer structure 325 can be formed to have a large volume while avoiding concentrated circuit patterns and through holes close to the heat transfer structure 325, and can be easily designed at various positions.

The heat transfer structure 325 is comprised of a plurality of cores 320 and an outer layer 323 that surrounds the outer surfaces of the plurality of cores 320.

The heat transfer structure 325 may have a polyhedral shape, such as a columnar or prismatic shape having a rectangular base, or various amorphous three-dimensional shapes.

In this example, both core 320 and outer layer 323 are comprised of at least one electroplated layer.

A plurality of cores 320 (plating accelerators functioning as the outer layer 323) can be prevented from decreasing in thickness at the intermediate portion by being disposed in the intermediate portion of the heat transfer structure 325 (possibly pits are likely to occur).

The sides of each of the plurality of cores 220 may have a rod-shaped post having a rectangular base.

4 and 5 are cross-sectional and top views, respectively, showing another example of printed circuit board 400, and any redundant description of the same or corresponding elements will not be repeated.

Referring to FIG. 4, the printed circuit board 400 includes a plurality of metal layers 421, 422, vias 427, trenches 418, and a heat transfer structure 425 formed in the trenches 418. The plurality of metal layers 421, 422 are respectively plural The insulating layers 411 are electrically insulated, and a plurality of insulating layers 411 are sandwiched between the plurality of metal layers 421, 422.

The via 427 is a signal formed to electrically connect the layers of the circuit pattern, and is composed of a seed layer (for example, an electroless plating layer) and at least one electrolytic plating layer.

The heat transfer structure 425 is formed in the cross-shaped groove 418 and formed by penetrating the insulating layer 411 to have a larger volume than the through hole 427.

The heat transfer structure 425 has a laminated form that is laminated and connected in the vertical direction of the printed circuit board 400.

In this example, the laminated form of the heat transfer structure 425 is not limited to that illustrated herein, and may include structures that are connected in a zigzag pattern.

Referring to FIG. 5, by having the cross shape, the heat transfer structure 425 can be formed to have a large volume while avoiding concentrated circuit patterns and vias 427 close to the heat transfer structure 425, and can be easily designed at various positions. .

For example, the component can be installed in the area of the fifth icon "B".

The heat transfer structure 425 is comprised of a core 420 and an outer layer 423 surrounding the outer surface of the core 420.

The heat transfer structure 425 may have a polyhedral shape, such as a columnar or prismatic shape having a rectangular base, or various amorphous three-dimensional shapes.

In this example, both core 420 and outer layer 423 are comprised of at least one electroplated layer.

The core 420 (electroplating accelerator functioning as the outer layer 423) can prevent the thickness of the heat transfer structure 425 from decreasing in the intermediate portion by being disposed in the intermediate portion of the heat transfer structure 425 (possibly pits are likely to occur).

The sides of the core 420 may have a taper. Further, the side of the core 420 may have one of various shapes such as an elliptical shape, a rectangular shape, a dumbbell shape, or a zigzag shape, but the present disclosure is not limited thereto.

The component may be first connected to the heat transfer structure 425 and then mounted on the printed circuit board 400, or may be disposed at a location where the component at least partially overlaps the heat transfer structure 425. As a result, heat generated from the element can be effectively moved to the outside by the heat transfer structure 425.

A solder resist layer may be formed on the insulating layer 411 for exposing the connection pads and serving as a protective layer for the outermost circuit pattern.

Method of manufacturing a printed circuit board

6 is a flow chart illustrating an example of a method of manufacturing a printed circuit board, and FIGS. 7 to 15 illustrate a method for manufacturing a printed circuit board by illustrating a cross-sectional view of a printed circuit board during a manufacturing process. The process of the example.

Referring to FIG. 6, a method of manufacturing a printed circuit board involves laminating an insulating layer (S110), forming via holes and trenches in the insulating layer (S120), and forming a plating layer in the via holes and the trenches by main plating ( S130), and forming a metal layer on the insulating layer on which the plating layer is formed (S140).

Hereinafter, the process used in the above method of manufacturing a printed circuit board will be described with reference to a cross-sectional view of the printed circuit board illustrated in FIGS. 7 to 15.

First, referring to Fig. 7, a carrier member 100A having a first metal layer 102 formed on both faces of the core layer 101 is obtained.

When a thin insulating layer or a metal layer for a circuit is formed, the core layer 101 is for supporting a thin insulating layer or a metal layer for a circuit, and may be made of an insulating material or a metal material.

The first metal layer 102 may be, for example, a copper foil, but the disclosure is not limited thereto.

For example, a copper clad laminate can be used for the carrier member 100A.

Further, the carrier member 100A may be constructed using only the core layer or only the first metal layer may be formed on one surface of the core layer.

The carrier member may be made of any material used as a supporting substrate in the field of circuit boards as long as the carrier member is detachable in a subsequent process.

Then, referring to Fig. 8, the insulating layer 111 is laminated on both surfaces of the carrier member 100A.

Alternatively, the insulating layer 111 may be laminated on both surfaces of the carrier member 100A together with the second metal layer 112.

The second metal layer 112 may be, for example, a copper foil.

Next, referring to FIG. 9, the via hole 113 and the cross-shaped trench 114 are formed by patterning the insulating layer 111 and the second metal layer 112.

The cross-shaped groove 114 is not limited to a linear plane or a polyhedron. For example, a cross may refer to various types of three-dimensional shapes, including planar shapes having one or more curved lines.

The insulating layer 111 and the second metal layer 112 may be patterned using general laser drilling or photolithography.

The trench 114 is for forming a heat transfer structure and is formed to have a larger volume than the via 113.

Then, referring to Fig. 10, the seed layer 115 is formed by, for example, electroless plating.

Thereafter, referring to Fig. 11, a plating resist pattern 116 having an open predetermined plating region is formed.

In this example, a dry film can be used to prevent plating.

Next, referring to Fig. 12, a plating layer 117 is formed by electrolytic plating in a predetermined plating region where the plating resist pattern 116 is opened. If necessary, electrolytic plating may be repeated to form a plurality of plating layers.

Then, referring to Fig. 13, the plating resist pattern 116 is removed, and surface smoothing treatment is performed as needed.

In this example, after forming a metal layer using a general circuit formation process (eg, flash), it may be repeated several times as needed. The process illustrated in Figures 13 to form a multilayer printed circuit board laminate having a laminated heat transfer structure.

Next, referring to Fig. 14, a pair of laminates are separated from the core layer 101 of the carrier member.

The separation process can be carried out using a wide variety of methods, depending on the structure of the carrier member.

For example, the separation process may be performed using a release agent, using a detachable copper foil, or the like, but the disclosure is not limited thereto.

Thereafter, referring to Fig. 15, a general circuit forming process (e.g., patterning or flashing) is applied to both sides of the separation layer to form a printed circuit board 100 in which the first metal layer 121 and the second metal layer 122 are formed. On either surface of the insulating layer 111.

The first metal layer 121 and the second metal layer 122 are connected to each other through the via 127 and/or the heat transfer structure 125.

Although the metal layer is illustrated and described in this example as being a termination layer on both surfaces of the heat transfer structure 125, the metal layer may be omitted from one surface or both surfaces of the heat transfer structure 125 if necessary.

The heat transfer structure 125 is formed to have a larger volume than the through hole 127.

The heat transfer structure 125 may have a polyhedral shape, such as a columnar or prismatic shape having a rectangular base, or various amorphous three-dimensional shapes.

According to the present example, the heat transfer structure 125 can be formed to have a large volume by forming the heat transfer structure 125 in the cross shape. The concentrated circuit patterns and vias are prevented from approaching the heat transfer structure 125 and can be easily designed at various locations.

Further, by performing a plurality of electroplating processes and simultaneously applying a method of manufacturing a thin plate or a coreless substrate using a carrier member, as a method of manufacturing a high-integral sheet, a general through hole and a heat transfer structure can be simultaneously formed.

16 is a flow chart illustrating another example of a method of manufacturing a printed circuit board, and FIGS. 17 to 30 illustrate a process for manufacturing a printed circuit board by illustrating a cross-sectional view of a printed circuit board during a manufacturing process. Another example of the process of the process.

Referring to Fig. 16, a method of manufacturing a printed circuit board involves laminating an insulating layer (S210), forming openings and via holes in the insulating layer (S220), and forming a first plating layer in the opening and the via hole by main plating ( S230) forming a trench in the insulating layer such that an outer surface of the first plating layer filled in the opening is exposed (S240), a second plating layer is formed in the trench by auxiliary plating (S250), and A metal layer is formed on the insulating layer (S260).

Hereinafter, the process used in the above method of manufacturing a printed circuit board will be described with reference to a cross-sectional view of the printed circuit board illustrated in FIGS. 17 to 30.

First, referring to Fig. 17, a carrier member 200A having a first metal layer 202 formed on both faces of the core layer 201 is obtained.

The core layer 201 may be made of a resin or a metal, and the first metal layer 202 may be, for example, a copper foil, but the disclosure is not limited thereto.

Further, a separation layer 203 such as a release film or a detachable copper foil may be interposed between the core layer 201 and the first metal layer 202.

Then, referring to Fig. 18, the insulating layer 211 is laminated on both surfaces of the carrier member 200A.

Alternatively, the insulating layer 211 may be laminated on both surfaces of the carrier member 200A together with the second metal layer 212.

The second metal layer 212 may be, for example, a copper foil.

Next, referring to FIG. 19, the via hole 213 and the cross-shaped opening 214 are formed by patterning the insulating layer 211 and the second metal layer 212.

The cross-shaped opening 214 is not limited to a linear plane or a polyhedron. For example, a cross may refer to various types of three-dimensional shapes, including planar shapes having one or more curved lines.

The insulating layer 211 and the second metal layer 212 may be patterned using general laser drilling or photolithography.

The opening 214 is formed to have a larger volume than the through hole 213.

Then, referring to Fig. 20, after forming a seed layer (not shown) by electroless plating, a first plating resist pattern 216a which opens the predetermined plating region is formed, and the predetermined opening by the first plating resist pattern 216a is formed by electroplating. The plating region is formed to form a first plating layer including a plating layer for the core 220a and a plating layer for the via-metal layer 217.

The first plating layer may include an electroless plating layer and an electrolytic plating layer.

In this example, a dry film can be used to prevent plating.

Fig. 21 is an enlarged perspective view showing a portion indicated by "A" in Fig. 20, which is a region where the plating layer of the core 220a is formed.

Thereafter, referring to FIG. 22, after the first plating resist pattern 216a is removed, the first metal layer 212 and the insulating layer 211 are removed by laser drilling in a region where the heat transfer structure is to be formed, and then the trench 218 is formed, and the trench 218 is exposed. The outer surface of the core 220 is taken out.

The groove 218 has a cross shape, and in the present example, the cross shape is not limited to a linear plane or a polyhedron. For example, a cross may refer to various types of three-dimensional shapes, including planar shapes having one or more curved lines.

Alternatively, laser drilling may be performed after forming an anti-etching pattern having a region opened for forming a heat transfer structure therein.

In the present example, during laser drilling, the plating layer of the core 220a may be additionally treated by removing the region of the insulating layer 211 where the heat transfer structure will be formed, or by additionally treating the region of the insulating layer 211 with the heat transfer structure. A core 220 is formed.

During the laser drilling, by using the diffuse reflection caused by the plating layer 220a of the core, a small amount of energy can be used to process a large area, thereby saving processing energy.

The core 220 (electroplating accelerator functioning as an outer layer) can prevent the thickness of the heat transfer structure from being reduced in the intermediate portion by being disposed in the intermediate portion of the heat transfer structure (possibly pits are likely to occur).

The sides of the core 220 may have a tapered shape. Further, the side of the core 220 may have one of various shapes such as an elliptical shape, a rectangular shape, a dumbbell shape, or a zigzag shape.

Fig. 23 is an enlarged perspective view showing a portion indicated by "A" in Fig. 22, which is an area where the cross-shaped core 220 is formed.

Next, referring to Fig. 24, after forming a seed layer (not shown) by electroless plating, a second plating resist pattern 216b which opens the predetermined plating region is formed, and the predetermined opening by the second plating resist pattern 216b is formed by electroplating. The plating region is used to form a second plating layer of the outer metal layer 219. The second plating region of the outer metal layer 219 may include an electroless plating layer and an electrolytic plating layer, and a plurality of plating layers may be provided by repeating the plating process three or more times.

Thereafter, referring to Fig. 25, the second plating resist pattern 216b is removed, and the via hole 227, the heat transfer structure 225, and the metal layer are formed by a general circuit formation process (e.g., flash).

Fig. 26 is an enlarged perspective view showing a portion indicated by "A" in Fig. 25, which is an area where the heat transfer structure 225 is formed.

Referring to Figures 25 and 26, the heat transfer structure 225 is comprised of a core 220 and an outer layer 223 that surrounds the outer surface of the core 220.

Then, referring to Fig. 27, the processes of Figs. 16 to 26 are repeated several times to form a multilayer printed circuit board laminate in which the heat transfer structure 225 is laminated in each layer.

Next, referring to Fig. 28, a pair of laminates are separated from the core layer 201 of the carrier member 200A.

The separation process can be carried out using a variety of methods depending on the structure of the carrier member 200A and the material of the separation layer 203.

For example, the separation process may be performed using a release agent, using a detachable copper foil, or the like, but the disclosure is not limited thereto.

Thereafter, referring to Fig. 29, a general circuit forming process (e.g., patterning or flashing) is applied to both sides of the separation layer to form a printed circuit board in which the first metal layer 221 and the second metal layer 222 are formed. On either surface of the insulating layer 211.

The first metal layer 221 and the second metal layer 222 are connected to each other through the via 227 and/or the heat transfer structure 225.

Fig. 30 is an enlarged perspective view showing a portion indicated by "A" in Fig. 25, which is an area where the heat transfer structure 225 is formed.

Referring to Figures 29 and 30, the heat transfer structure 225 is comprised of a core 220 and an outer layer 223 that surrounds the outer surface of the core 220.

Further, the heat transfer structure 225 is provided in a form of being laminated in each layer.

In the present example, although the heat transfer structure 225 is illustrated as having a rod-shaped column having a rectangular base, the present disclosure is not limited thereto, and heat transfer The structure 225 can be formed in any of a variety of amorphous three-dimensional shapes, such as prisms having a rectangular base.

The heat transfer structure 225 has a larger volume than the through holes 227 that are electrically connected to the layers formed for the circuit patterns.

According to the present example, by forming the heat transfer structure 225 in a cross shape, the heat transfer structure 225 can be formed to have a large volume while avoiding concentrated circuit patterns and through holes close to the heat transfer structure 225, and can be easily designed in Various locations.

Further, by forming a heat transfer structure having a large volume while applying a method of manufacturing a thin plate or a coreless substrate using a carrier member as a method of manufacturing a high-profile thin plate, it is possible to increase the aspect ratio of the opening, and the opening will be used. Electroplating filling for the outer layer, thereby accelerating plating when forming the plating layer and the metal layer for the outer layer, and reducing defects caused by pits.

In addition, since smoothness can be obtained without a general smoothing process such as etching or polishing, it is possible to simplify the manufacturing process and save processing costs.

31 is a flow chart illustrating another example of a method of manufacturing a printed circuit board, and FIGS. 32 to 41 illustrate a process for manufacturing a printed circuit board by illustrating a cross-sectional view of a printed circuit board during a manufacturing process. Another example of the process of the process.

Referring to Fig. 31, a method of manufacturing a printed circuit board involves forming a pattern of a core (S310), laminating an insulating layer so that a pattern of the core is embedded (S320), forming a through hole (S330) in the insulating layer, and passing through A first plating layer is formed in the via hole through the main plating (S340), and a cross-shaped groove is formed in the insulating layer such that the outer surface of the pattern of the core is exposed (S350), and the auxiliary plating is performed in the trench A second plating layer is formed (S360), and a metal layer is formed on the insulating layer (S370).

Hereinafter, the process used in the above method of manufacturing a printed circuit board will be described with reference to a cross-sectional view of the printed circuit board illustrated in FIGS. 32 to 41.

First, referring to Fig. 32, a carrier member 300A having a first metal layer 302 formed on both faces of the core layer 301 is obtained.

The core layer 301 may be made of a resin or a metal, and the first metal layer 302 may be, for example, a copper foil, but the disclosure is not limited thereto.

Further, a separation layer 303 such as a release film or a detachable copper foil may be interposed between the core layer 301 and the first metal layer 302.

Then, referring to Fig. 33, patterns of a plurality of cores 320a (each having a cross shape) are formed on both surfaces of the carrier member 300A.

The pattern of the plurality of cores 320a may be formed using a photolithography method, but the present disclosure is not limited thereto.

The pattern function of the plurality of cores 320a is to accelerate the plating layer when forming a plating layer for the outer layer of the heat transfer structure.

Next, referring to Fig. 34, the insulating layer 311 is laminated on both faces of the carrier member 300A on which the pattern of the plurality of cores 320a is formed.

Alternatively, the insulating layer 311 may be laminated on both surfaces of the carrier member 300A together with the second metal layer 312.

The second metal layer 312 can be, for example, a copper foil.

In the present example, the insulating layer 311 may be formed to be twice as thick as the thickness of the pattern of the core 320a.

Next, referring to FIG. 35, the via hole 313 is formed by patterning the insulating layer 311 and the second metal layer 312.

The insulating layer 311 and the second metal layer 312 can be patterned using general laser drilling or photolithography.

Then, referring to Fig. 36, after forming a seed layer (not shown) by electroless plating, a first plating resist pattern 316a which opens the predetermined plating region is formed, and the predetermined opening by the first plating resist pattern 316a is formed by electroplating. The plating region is formed to form a first plating layer for the via-metal layer 317.

The first plating layer may include an electroless plating layer and an electrolytic plating layer.

Thereafter, referring to FIG. 37, after the first plating resist pattern 316a is removed, the first metal layer 312 and the insulating layer 311 are removed by laser drilling in a region where the heat transfer structure is to be formed, and then the trench 318 is formed, and the trench 318 is exposed. A plurality of cores 320 are produced.

The cross-shaped groove is not limited to a linear plane or a polyhedron. For example, a cross may refer to various types of three-dimensional shapes, including planar shapes having one or more curved lines.

Alternatively, a laser drilling may be performed after forming an anti-etching pattern having a laser drilling region that is opened for forming a heat transfer structure therein.

The trench 318 is formed to have a larger volume than the via 313.

In the present example, a plurality of cores 320 may be formed by additionally processing a pattern of a plurality of cores 320a together while removing the region of the insulating layer 311 where the heat transfer structure is to be formed while performing laser drilling.

During the laser drilling, by using the diffuse reflection caused by the plurality of patterns of the core 320a, a small amount of energy can be used to process a large area, thereby saving processing energy.

A plurality of cores 320 (electroplating accelerators functioning as outer layers) can prevent the thickness of the heat transfer structure from decreasing in the intermediate portion by being disposed in the intermediate portion of the heat transfer structure (possibly pits are likely to occur).

The plurality of cores 320 may each have, for example, a cross-shaped prism having a rectangular base.

Next, referring to Fig. 38, after forming a seed layer (not shown) by electroless plating, a second plating resist pattern 316b which opens the predetermined plating region is formed, and the predetermined opening by the second plating resist pattern 316b is formed by electroplating. The plating region is used to form a second plating layer of the outer metal layer 319. The second plating region of the outer metal layer 319 of the heat transfer structure may include an electroless plating layer and an electrolytic plating layer, and a plurality of plating layers may be provided by repeating the plating process three or more times.

Thereafter, referring to Fig. 39, the second plating resist pattern 316b is removed.

In this example, after the metal layer is formed by a general circuit formation process (for example, flash), the processes illustrated in FIGS. 33 to 39 may be repeated as needed to form a laminate having layers laminated in each layer. Multilayer printed circuit board laminate with heat transfer structure.

Next, referring to Fig. 40, a pair of laminates are separated from the core layer of the carrier member.

The separation process can be carried out using a variety of methods depending on the structure of the carrier member 300A and the material of the separation layer 303.

For example, the separation process may be performed using a release agent, using a detachable copper foil, or the like, but the disclosure is not limited thereto.

Thereafter, referring to FIG. 41, a general circuit forming process (for example, patterning or flash etching) is applied to both sides of the separation layer to form a printed circuit board 300 in which the first metal layer 321 and the second metal layer 322 are formed. On either surface of the insulating layer 311.

The first metal layer 321 and the second metal layer 322 are connected to each other through the via 327 and/or the heat transfer structure 325.

The heat transfer structure 325 is comprised of a plurality of cores 320 and an outer layer 323 that surrounds the outer surfaces of the plurality of cores 320.

The heat transfer structure 325 may have a polyhedral shape, such as a columnar or prismatic shape having a rectangular base, or various amorphous three-dimensional shapes.

The heat transfer structure 325 has a larger volume than the through holes 327 that are electrically connected to the layers formed for the circuit patterns.

According to the present example, by forming a heat transfer structure having a large volume while applying a method of manufacturing a thin plate or a coreless substrate using a carrier member, it is possible to increase the aspect ratio of the opening as a method of manufacturing a high-profile thin plate, and the opening will be It is used for electroplating filling of the outer layer, thereby accelerating plating when forming the plating layer and the metal layer for the outer layer, and reducing defects caused by pits.

In addition, since smoothness can be obtained without a general smoothing process such as etching or polishing, it is possible to simplify the manufacturing process and save processing costs.

Although the method of manufacturing a coreless substrate using a carrier member has been described above, the present disclosure is not limited thereto, and it should be understood by those of ordinary skill in the art that a general coreless substrate can be used.

Module

Figure 42 is a cross-sectional view showing an example of a module 500, and any redundant description of the same or corresponding elements will not be repeated.

Referring to FIG. 42, the module 500 includes a first metal layer 521 and a second metal layer 522 formed on either surface of the insulating layer 511, a via 527, a trench 518, and heat formed in the trench 518. Transmission structure 525, and element 550 mounted on solder bump 531, solder bump 531 is sandwiched between element 550 and via 527 and heat transfer structure 525.

The via 527 is a signal that is often formed for interlayer electrical connection of circuit patterns.

The heat transfer structure 525 is formed to have a larger volume than the through hole 527.

The heat transfer structure 525 is comprised of a plurality of cores 520 and an outer layer 523 that surrounds the outer surface of the core 520.

Element 550 can be a heat dissipating component, such as a general integrated circuit (IC) wafer, or can be without limitation to any electronic component, as long as it can be mounted or embedded in a printed circuit board.

A solder resist layer may be formed on the insulating layer 511 for exposing the connection pads and serving as a protective layer for the outermost circuit pattern.

In accordance with the present example, heat generated by element 550 is effectively exhausted from module 500 by heat transfer structure 525.

Figure 43 is a cross-sectional view showing another example of the module 600, and any redundant description of the same or corresponding elements will not be repeated.

Referring to FIG. 43, the module 600 includes a plurality of metal layers 621, 622 electrically insulated by a plurality of insulating layers 611, vias 627, trenches 618, and heat transfer structures 625 formed in the trenches 618, a plurality of The insulating layer 611 is sandwiched between the plurality of metal layers 621, 622.

The via 627 is a signal that is often formed for interlayer electrical connection of circuit patterns.

The heat transfer structure 625 is formed in the trench 618 to penetrate the insulating layer 611 and has a larger volume than the via 627.

Element 650 is mounted on heat transfer structure 625. Element 650 is connected to the connection pad by wire 651.

The heat transfer structure 625 is comprised of a core 620 and an outer layer 623 that surrounds the outer surface of the core 620.

A solder resist layer 630 is formed on the insulating layer 611 for exposing the connection pads and serving as a protective layer for the outermost circuit pattern.

According to the present example, heat generated by element 650 is effectively exhausted from module 600 through heat transfer structure 650.

Figure 44 is a cross-sectional view of another example of the illustrated module, and any redundant description of the same or corresponding elements will not be repeated.

Referring to Fig. 44, the printed circuit board 400 on which the component 750 is mounted is mounted on the motherboard 770 by external connection terminals 732, 733.

The component is mounted on the printed circuit board 400 by using solder bumps 731 as connectors.

The printed circuit board 400 is formed with a plurality of metal layers 421, 422 electrically insulated by a plurality of insulating layers 411, vias 427, trenches 418, and heat transfer structures 425 formed in the trenches 418, a plurality of insulating layers 411 is sandwiched between a plurality of metal layers 421, 422.

The vias 427 are signals that are often formed for interlayer electrical connection of circuit patterns.

The heat transfer structure 425 is formed in the trench 418 to penetrate the insulating layer 411 and has a larger volume than the via 427.

The heat transfer structure 425 has a stacked form that is stacked and connected in the vertical direction of the printed circuit board 400.

The heat transfer structure 425 is comprised of a core 420 and an outer layer 423 that surrounds the outer surface of the core 420.

According to the present example, the heat generated by the component 750 is transferred to the underside of the printed circuit board 400 by the build-up heat transfer structure 425 embedded in the printed circuit board 400, and is eventually displaced to the outside through the motherboard 770.

Although the present disclosure includes specific examples, it will be apparent to those skilled in the art that various changes in form and detail can be made in these examples without departing from the spirit and scope of the invention. . The examples described herein are to be considered as illustrative only and not for the purpose of limitation. Descriptions of features or aspects in each instance are considered to be applicable to similar features or aspects in other examples. In the case that the described techniques are performed in a different order, and/or that the components in the described systems, architecture, components, or circuits are combined in various ways, and/or replaced or supplemented by other components or equivalents, Then you can achieve the appropriate results. Therefore, the scope of the present disclosure is to be construed as being limited by the scope of the invention, and the scope of the claims and the equivalents thereof are to be construed as being included in the disclosure.

400‧‧‧Printed circuit board

411‧‧‧Insulation

418‧‧‧ trench

420‧‧ core

421‧‧‧metal layer

422‧‧‧metal layer

423‧‧‧ outer layer

425‧‧‧heat transfer structure

427‧‧‧through hole

Claims (22)

A printed circuit board comprising: a plurality of insulating layers; metal layers respectively formed on the plurality of insulating layers; a via hole formed for interlayer electrical connection of the metal layers; and a penetrating the insulating layers a trench; and a heat transfer structure formed in the trench. The printed circuit board of claim 1, wherein the heat transfer structure has a cross shape. A printed circuit board according to claim 1, wherein the heat transfer structure is provided in a form of being laminated in each layer. The printed circuit board of claim 1, wherein the heat transfer structure is formed by at least one core and an outer layer, the outer layer surrounding the outer surface of the at least one core. The printed circuit board of claim 4, wherein the at least one core and the outer layer each comprise at least one plating layer. The printed circuit board of claim 1, wherein the heat transfer structure has a larger volume than the through hole. The printed circuit board of claim 1, wherein one side of the heat transfer structure has a tapered shape. A module comprising: a printed circuit board comprising a plurality of insulating layers, respectively formed in a metal layer on the plurality of insulating layers, a via hole formed to electrically connect the layers of the metal layers, a trench penetrating the insulating layers, and a heat transfer formed in the trench a structure; and an element mounted on the printed circuit board. The module of claim 8, wherein the heat transfer structure has a cross shape. The module of claim 8 wherein the component is mounted on the printed circuit board by thermal connection to the heat transfer structure. The module of claim 8, wherein the heat transfer structure is configured to be stacked in each layer. The module of claim 8, wherein the heat transfer structure is formed by at least one core and an outer layer, the outer layer surrounding the outer surface of the at least one core. A module comprising: a printed circuit board comprising a plurality of insulating layers, metal layers respectively formed on the plurality of insulating layers, a via hole formed for interlayer electrical connection of the metal layers, and a through a trench penetrating the insulating layers, and a heat transfer structure formed in the trench; an element mounted on the printed circuit board; and a motherboard on which the printed circuit board on which the component is mounted is Installed on this motherboard. The module of claim 13, wherein the heat transfer is The structure has a cross shape. The module of claim 13 wherein the component is mounted on the printed circuit board by thermal connection to the heat transfer structure. The module of claim 13, wherein the heat transfer structure is configured to be stacked in each layer. The module of claim 13 wherein the heat transfer structure is comprised of at least one core and an outer layer surrounding the outer surface of the at least one core. A method of manufacturing a printed circuit board comprising the steps of: obtaining an insulating layer; forming a via hole and a trench in the insulating layer; forming a heat transfer structure in the trench; and forming a heat on the insulating layer Metal layer. The method of claim 18, wherein the steps of requesting item 18 are repeated a number of times, and wherein the heat transfer structure is arranged to be stacked in each layer. The method of claim 18, wherein a through hole and a cross-shaped opening are formed in the insulating layer, and the through hole is formed by filling a first plating layer in the through hole and the opening, wherein The trench is formed in the insulating layer such that it is filled in the An outer surface of the first plating layer in the opening is exposed, and wherein the heat transfer structure is formed by filling a second plating layer in the trench. The method of claim 18, wherein a cross-shaped pattern for the core is formed, and the insulating layer is laminated in such a manner that the pattern for the core is embedded therein, wherein a through hole is formed in the insulating layer, And the through hole is formed by filling a first plating layer in the through hole, wherein the groove is formed in the insulating layer in a cross shape, so that an outer surface of the pattern for the core is exposed, And wherein the heat transfer structure is formed by filling a trench with a second plating layer. The method of claim 18, wherein a through hole and a cross-shaped groove are formed in the insulating layer, and wherein the through hole, the heat transfer structure and the metal layer are respectively in the through hole A trench is formed in the trench and on the insulating layer by forming two or more patterned plating layers.