KR100976201B1 - Printed circuit board and method for manufacturing the same - Google Patents

Printed circuit board and method for manufacturing the same Download PDF

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Publication number
KR100976201B1
KR100976201B1 KR1020070109590A KR20070109590A KR100976201B1 KR 100976201 B1 KR100976201 B1 KR 100976201B1 KR 1020070109590 A KR1020070109590 A KR 1020070109590A KR 20070109590 A KR20070109590 A KR 20070109590A KR 100976201 B1 KR100976201 B1 KR 100976201B1
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KR
South Korea
Prior art keywords
insulating layer
layer
heat
core substrate
heat dissipation
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Application number
KR1020070109590A
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Korean (ko)
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KR20090043818A (en
Inventor
신영환
오화섭
이태곤
임성진
Original Assignee
삼성전기주식회사
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Priority to KR1020070109590A priority Critical patent/KR100976201B1/en
Publication of KR20090043818A publication Critical patent/KR20090043818A/en
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Publication of KR100976201B1 publication Critical patent/KR100976201B1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

A printed circuit board and a method of manufacturing the same are disclosed. A printed circuit board on which an electronic device is mounted, comprising: a core substrate having a cavity formed therein, a radiator housed in the cavity, a first insulating layer formed to cover the radiator on one surface of the core substrate, and a core substrate. A second insulating layer formed to cover the heat dissipating member on the other surface, and a heat dissipation pad formed on the surfaces of the first insulating layer and the second insulating layer to be in contact with the heat dissipating member, and dissipating heat of the electronic device to the outside through the heat dissipating member; The printed circuit board may include a heat dissipation function and may form a fine outer layer circuit.
Radiator, electronic device

Description

Printed circuit board and method for manufacturing the same

The present invention relates to a printed circuit board and a method of manufacturing the same.

Conventionally, in order to improve thermal dissipation characteristics of a printed circuit board for an electronic device package, after processing a through hole in a portion where an electronic device is mounted, copper having a high thermal conductivity is plated thicker than 30 micrometers, A thermal via method was used to fill the epoxy resin and then plate the surface with gold.

However, as the electronic device package becomes smaller and more complex, such as a system in package (SiP) or a module package to which a plurality of chips are attached, the printed circuit board for the electronic device package has improved heat dissipation characteristics. This became necessary.

Accordingly, there is a need for a printed circuit board and a method of manufacturing the same, which can effectively discharge heat generated in an electronic device, and as a result, improve the operational reliability of the electronic device package.

The present invention provides a printed circuit board and a method of manufacturing the same, in which a heat dissipation function can be improved and a fine outer layer circuit can be formed.

According to an aspect of the present invention, a printed circuit board on which an electronic device is mounted, comprising: a core substrate having a cavity formed therein, a radiator housed in the cavity, and a cover formed on the surface of the core substrate to cover the radiator; A first insulating layer, a second insulating layer formed on the other surface of the core substrate to cover the heat sink, and a surface of the first insulating layer and the second insulating layer to be in contact with the heat radiator, through the heat radiator to A printed circuit board is provided that includes a heat dissipation pad for dissipating heat to the outside.

The size of the heat sink and the heat dissipation pad may be greater than or equal to the size of the electronic device.

The heat sink may include at least one selected from the group consisting of copper (Cu), aluminum (Al), and Invar.

In addition, according to another aspect of the invention, a method for manufacturing a printed circuit board that emits heat of the electronic device to the outside, forming a cavity in the core substrate, inserting a heat sink into the cavity, one surface of the core substrate Forming a first insulating layer to cover the heat dissipating body, forming a second insulating layer to cover the heat dissipating body on the other surface of the core substrate, and forming a heat dissipating body on the surfaces of the first insulating layer and the second insulating layer. Provided is a method of manufacturing a printed circuit board, the method including forming a heat dissipation pad so as to be in contact.

Further comprising laminating a support tape on the other surface of the core substrate between the step of forming the cavity and the step of inserting the heat sink, and between the step of forming the first insulating layer and the step of forming the second insulating layer. The method may further include removing the support tape.

The forming of the heat dissipation pad may include forming a heat dissipation groove to expose the heat dissipation body on the surfaces of the first insulation layer and the second insulation layer, and plating resist to expose the heat dissipation groove on the surfaces of the first insulation layer and the second insulation layer. Forming a layer, and plating a conductive material on the surface of the first insulating layer and the second insulating layer except for the region where the plating resist layer is formed.

According to the embodiment of the present invention, the heat dissipation function can be improved, and a fine outer layer circuit can be formed.

An embodiment of a printed circuit board and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings. In the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals, and Duplicate explanations will be omitted.

1 is a cross-sectional view showing an embodiment of a printed circuit board according to an aspect of the present invention. Referring to FIG. 1, a printed circuit board 100, a core substrate 110, an inner layer circuit 112, a cavity 114, a radiator 120, a first insulating layer 130, and a second insulating layer 140, outer layer circuit 150, via hole 165, via 160, heat dissipation groove 175, and heat dissipation pad 170 are shown.

According to the present embodiment, by increasing the volume of the heat dissipator 120, a printed circuit board 100 capable of effectively dissipating heat of the mounted electronic device and forming a fine outer layer circuit is provided.

The core substrate 110 may be a double-sided printed circuit board having inner layer circuits 112 formed on both sides of the insulating layer, and the inner layer circuits 112 formed on both sides thereof may be electrically connected through the vias 116.

The inner circuit 112 selectively forms an etching resist layer on a copper layer of a copper clad laminate by a photo-lithography method, and the etching resist layer is not formed. The etching solution may be applied to the copper layer region to selectively remove the copper layer, and the vias 116 for electrical connection therebetween may be formed by forming through holes in the core substrate and plating them.

In addition, a cavity 114 penetrating the core substrate 110 may be formed in the core substrate 110 so that the heat sink 120 may be inserted, and the cavity 114 may include a punch or a blade ( Using a blade, the core substrate 110 may be formed to correspond to the heat sink 120.

The radiator 120 may be accommodated in the cavity 114 and may be covered by the first insulating layer 130 and the second insulating layer 140 to be embedded therein. At least one of copper (Cu), aluminum (Al), and Invar, that is, each of copper, aluminum, or invar, and a mixture or compound of two or more thereof.

The size of the heat sink 120 may be equal to or larger than the size of the electronic device to be mounted on the printed circuit board 100. Accordingly, since the volume of the heat sink 120 is increased, the conventional thermal via Compared to the case where the thermal via is used to dissipate the heat of the electronic device, the heat of the electronic device can be more effectively discharged to the outside.

The radiator 120 is fixed by a supporting tape laminated on the other surface of the core substrate 110 to temporarily block the other surface of the core substrate 110, thereby being accommodated in the cavity 114 of the core substrate 110. After that, the first insulating layer 130 is formed, and after the supporting tape is removed, the second insulating layer 140 is formed, thereby forming the first insulating layer 130 and the second insulating layer 140. Can be covered and embedded therein.

Here, the support tape may be removed after the first insulating layer 130 is formed on the other surface of the core substrate 110 so as not to affect subsequent processes by using a material that does not leave a residue upon removal.

The first insulating layer 130 may be formed to cover the heat sink 120 on one surface of the core substrate 110. For example, the first insulating layer 130 may be a prepreg, and may be formed on the surface of the first insulating layer. An outer layer circuit 150 and a heat dissipation pad 170 may be formed, and a via 160 may be formed in the first insulating layer to electrically connect the inner layer circuit 112 and the outer layer circuit 150.

As the first insulating layer 130 is formed on one surface of the core substrate 110, the space between the cavity 114 and the heat sink 120 is filled, so that the heat sink 120 forms the cavity of the core substrate 110. Can be fixed to 114.

 The second insulating layer 140 may be formed to cover the heat sink 120 on the other surface of the core substrate 110, and the second insulating layer 140, like the first insulating layer 130, may also be prepreg. The same material may be used, and an outer layer circuit 150 and a heat dissipation pad 170 may be formed on a surface of the second insulating layer, and the inner layer circuit 112 and the outer layer circuit 150 may be electrically connected to the second insulating layer. Vias 160 may be formed to connect to each other.

As the second insulating layer 140 is formed on the other surface of the core substrate 110, the heat sink 120 may be completely buried between the first insulating layer 130 and the second insulating layer 140. Accordingly, the heat sink may be an intermediate passage for dissipating heat of the electronic device to be mounted on the printed circuit board 100 to the outside.

The heat dissipation pad 170 is formed on the surfaces of the first insulating layer 130 and the second insulating layer 140 so as to be in contact with the heat dissipating member 120. Can be released. That is, an electronic device is mounted on one side of the heat dissipation pad 170, and heat generated from the electronic device is transferred to the other side of the heat dissipator 120 through the heat dissipator 120 at one side of the heat dissipation pad 170. Can be.

In this case, the size of the heat dissipation pad 170 may be equal to or larger than the size of the electronic device, so that the heat of the electronic device may be more effectively released to the outside.

The outer circuit 150 may be formed on the surfaces of the first insulating layer 130 and the second insulating layer 140, and may be electrically connected to the inner circuit 112 and the via 160, and the outer circuit Part of the 150 may be a bonding pad electrically connected to the electronic device, and another part may be a bump pad for electrical connection with another printed circuit board. In addition, the via 160 may be formed on the first insulating layer 130 and the second insulating layer 140 to electrically connect the inner circuit 112 and the outer circuit 150.

The heat dissipation pad 170, the via 160, and the outer layer circuit 150 may be simultaneously formed using an additive process, which may be described as follows.

First, the heat dissipation grooves 175 and the via holes 165 may be formed on the surfaces of the first insulating layer 130 and the second insulating layer 140 to expose a part of the heat dissipator 120 and the inner layer circuit 112. Can be. That is, by partially removing the first insulating layer 130 and the second insulating layer 140 by using a laser drill, between the first insulating layer 130 and the second insulating layer 140. Heat dissipation grooves 175 and vias 160 are formed on the surfaces of the first and second insulating layers 130 and 140 so as to connect the heat sink 120 and the inner layer circuits 112 embedded therein to the outside. As a result, a portion of the surface of the radiator 120 and a portion of the inner layer circuit 112 may be exposed to the outside.

Subsequently, a plating resist layer may be formed on the surfaces of the first insulating layer 130 and the second insulating layer 140 to expose the regions where the heat dissipation grooves 175, the via holes 165, and the outer layer circuit 150 will be formed. Can be. On the surfaces of the first insulating layer 130 and the second insulating layer 140, for example, a plating resist layer such as a dry film is formed, which is selectively exposed and developed by a photolithography process. Thus, the regions where the heat dissipation grooves 175, the via holes 165, and the outer layer circuit 150 are to be formed may be exposed. Accordingly, the exposed regions may be plated to heat dissipation pads 170, vias 160, and outer layers. Circuit 150 may be formed.

Finally, after the conductive material is plated on the surfaces of the first insulating layer 130 and the second insulating layer 140 except for the region where the plating resist layer is formed, the plating resist layer may be removed. Among the first insulating layer 130 and the second insulating layer 140, a conductive material such as copper is plated on a region where the plating resist layer is not formed to form a heat radiation pad 170, a via 160, and an outer layer circuit ( 150 may be formed, and thus, as in the conventional subtractive process, a finer outer layer circuit 150 may be formed as compared with the case of forming a circuit pattern by etching the conductive layer.

After plating, the plating resist layer may be removed so that no residue remains, and then, a solder resist layer is formed, and a nickel layer for soldering to the pad portion or the heat radiation pad 170 of the outer layer circuit 150 ( Ni layer and Au layer may be formed.

In addition, the heat dissipation pad 170, the via 160, and the outer layer circuit 150 may be formed using a semi-additive process. That is, before forming the plating resist layer, a seed layer made of a conductive material is formed on the surfaces of the first insulating layer 130 and the second insulating layer 140, and the heat dissipation grooves are formed on the seed layer. 175, selectively forming a plating resist layer to expose the region where the via hole 165 and the outer layer circuit 150 will be formed, plating a conductive material on the seed layer, removing the plating resist layer, and flash etching As the surface and the seed layer of the plated conductive material are removed together by flash etching, the heat radiation pad 170, the vias 160, and the fine outer layer circuit 150 may be formed.

Next, an embodiment of a method for manufacturing a printed circuit board according to another aspect of the present invention will be described.

Figure 2 is a flow chart showing an embodiment of a printed circuit board manufacturing method according to another aspect of the present invention, Figures 3 to 11 is a cross-sectional view showing each process of one embodiment of a printed circuit board manufacturing method according to another aspect of the present invention. to be.

2 to 11, a printed circuit board 200, a core substrate 210, an inner layer circuit 212, a cavity 214, a support tape 280, a radiator 220, and a first insulating layer ( 230, 230 ′), second insulating layers 240 and 240 ′, outer circuit 250, via holes 265, vias 260, heat dissipation grooves 275, heat dissipation pads 270, and plating resist layers ( 290 is shown.

According to the present embodiment, by using an additive or semi-additive method, a fine outer layer circuit 250 can be formed, and a printed circuit board 200 capable of forming a large volume heat sink 220 in a simple process. ) The manufacturing method is provided.

First, as shown in FIG. 3, the cavity 214 is formed in the core substrate 210 (S210). That is, the cavity 214 penetrating the core substrate 210 may be formed to insert the heat sink 220. The core substrate 210 may be a double-sided printed circuit board having inner layer circuits 212 formed on both sides of the insulating layer, and the inner layer circuits 212 formed on both sides may be electrically connected through the vias 216.

The inner circuit 212 of the core substrate 210 is formed by selectively forming an etching resist layer on a copper layer of a copper clad laminate by a photolithography method, and applying an etching solution to a copper layer region where the etching resist layer is not formed. It may be formed by selectively removing the layer, and the via 216 for electrical connection therebetween may be formed by forming a through hole in the core substrate and plating it.

In addition, the cavity 214 may be formed on the core substrate 210 to correspond to the heat sink 220 by using a punch or a blade.

Next, as shown in FIG. 4, the support tape 280 is laminated on the other surface of the core substrate 210 (S220). The other surface of the core substrate 210 may be temporarily blocked to fix the radiator 220 in the cavity 214. For this purpose, the support tape 280 may be stacked on the other surface of the core substrate 210.

The support tape 280 may be removed after the first insulating layer 230 is formed on the other surface of the core substrate 210 by using a material that does not leave a residue upon removal, which will be described later.

Next, as shown in FIG. 5, the radiator 220 is inserted into the cavity 214 (S230). The radiator 220 may be inserted into the cavity 214 in one direction of the core substrate 210 and fixed by the supporting tape 280 stacked on the other surface of the core substrate 210.

The heat sink 220 may be made of at least one of copper, aluminum, and invar, that is, excellent in thermal conductivity, that is, each of copper, aluminum, or invar, and a mixture or a compound of two or more thereof. In addition, the size of the heat dissipator 220 may be equal to or larger than the size of the electronic device to be mounted on the printed circuit board 200, and thus, the volume of the heat dissipator 220 is increased. Compared to the case of dissipating the heat of the electronic device using the 260, the heat of the electronic device can be more effectively emitted to the outside.

Next, as shown in FIG. 6, the first insulating layer 230 is formed on one surface of the core substrate 210 to cover the heat sink 220 (S240). The first insulating layer 230 may be, for example, a prepreg, and by forming the first insulating layer 230 on one surface of the core substrate 210, the cavity 214 and the radiator 220. By filling the space therebetween, the radiator 220 may be fixed to the cavity 214 of the core substrate 210.

Next, as shown in FIG. 7, the support tape 280 is removed (S250). After the first insulating layer 230 is formed on one surface of the core substrate 210 to fix the radiator 220 in the cavity 214, the support tape 280 may be removed. As described above, The support tape 280 may use a material that does not leave a residue upon removal so as not to affect the process thereafter.

Next, as shown in FIG. 8, the second insulating layer 240 is formed on the other surface of the core substrate 210 to cover the radiator 220 (S260). Similar to the first insulating layer 230, the second insulating layer 240 may be made of a material such as prepreg, and by forming the second insulating layer 240 on the other surface of the core substrate 210, a heat sink ( 220 may be completely embedded between the first insulating layer 230 and the second insulating layer 240, and thus, the intermediate passage for discharging the heat of the electronic device to be mounted on the printed circuit board 200 to the outside Can play a role.

Finally, as shown in FIGS. 9 to 11, the heat radiation pads 270 are formed on the surfaces of the first insulating layer 230 and the second insulating layer 240 to be in contact with the heat sink 220 (S270). The heat dissipation pad 270, the via 260, and the fine outer layer circuit 250 may be simultaneously formed using an additive process, and an electronic device is mounted on one side of the heat dissipation pad 270 to generate heat generated in the electronic device. One side of the heat dissipation pad 270 may be transferred to the other side of the heat dissipator 220 through the heat dissipator 220, and may be discharged to the outside.

In this case, the size of the heat radiation pad 270 may be formed to be the same as or larger than the size of the electronic device, so that the heat of the electronic device may be more effectively released to the outside.

A process of forming the heat radiation pad 270, the via 260, and the outer layer circuit 250 may be described as follows.

First, as shown in FIG. 9, the heat dissipation grooves 275 are formed on the surfaces of the first insulating layer 230 ′ and the second insulating layer 240 ′ to expose the heat dissipating member 220 (S272). The first insulating layer 230 ′ and the second insulating layer 240 ′ to connect the radiator 220 buried between the first insulating layer 230 ′ and the second insulating layer 240 ′ with the outside. A heat dissipation groove 275 may be formed on a surface of the heat dissipation groove 275, and thus, a part of the surface of the heat dissipator 220 may be exposed to the outside.

The heat dissipation groove 275 may be formed by finely removing a portion of the first insulating layer 230 ′ and the second insulating layer 240 ′ by using a laser drill. In this case, the inner layer circuit may be formed. In order to form the via 260 electrically connecting the 212 and the outer layer circuit 250, the via hole 265 is formed on the surfaces of the first insulating layer 230 ′ and the second insulating layer 240 ′. You may.

Next, as shown in FIG. 10, the plating resist layer 290 is formed on the surfaces of the first insulating layer 230 ′ and the second insulating layer 240 ′ to expose the heat dissipation grooves 275 (S274). On the surfaces of the first insulating layer 230 ′ and the second insulating layer 240 ′, for example, a plating resist layer 290 such as a dry film is formed, which is selectively exposed and developed by a photolithography process. Thus, the regions where the heat dissipation grooves 275, the via holes 265, and the outer layer circuit 250 are to be formed may be exposed. Accordingly, the exposed regions may be plated to heat dissipation pads 270, vias 260, and outer layers. Circuit 250 may be formed.

Thereafter, as shown in FIG. 11, the conductive material is plated on the surfaces of the first insulating layer 230 ′ and the second insulating layer 240 ′ except for the region where the plating resist layer 290 is formed (S276). The resist layer 290 is removed (S278). The heat dissipation pad 270 and the via 260 are plated with a conductive material, such as copper, in a region of the first insulating layer 230 ′ and the second insulating layer 240 ′ where the plating resist layer 290 is not formed. ) And the outer layer circuit 250, and thus, as in the conventional subtractive process, a finer outer layer circuit 250 may be formed as compared with the case of forming a circuit pattern by etching the conductive layer. Can be.

After plating, the plating resist layer 290 may be removed so that no residue remains, and then, a solder resist layer is formed, and for soldering to the pad portion or the heat radiation pad 270 of the outer layer circuit 250. A nickel layer and a gold layer may be formed.

In this embodiment, the heat dissipation pad 270, the via 260, and the outer layer circuit 250 are formed by the additive process, but the heat dissipation pad 270 and the outer layer circuit 250 are formed by the semi-additive process. You may.

That is, before forming the plating resist layer 290, a seed layer made of a conductive material is formed on the surfaces of the first insulating layer 230 ′ and the second insulating layer 240 ′, and radiated on the seed layer. After the plating resist layer 290 is selectively formed to expose the region where the groove 275, the via hole 265, and the outer layer circuit 250 are to be formed, the conductive material is plated on the seed layer and the plating resist layer 290 is formed. ) And the surface layer and the seed layer of the plated conductive material by flash etching are removed together to form the heat dissipation pad 270, the vias 260 and the fine outer layer circuit 250.

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

1 is a cross-sectional view showing an embodiment of a printed circuit board according to an aspect of the present invention.

Figure 2 is a flow chart showing an embodiment of a printed circuit board manufacturing method according to another aspect of the present invention.

3 to 11 are cross-sectional views showing each process of one embodiment of a method for manufacturing a printed circuit board according to another aspect of the present invention.

<Explanation of symbols for the main parts of the drawings>

110: printed circuit board 110: core substrate

112: inner layer circuit 114: cavity

120: heat sink 130: first insulating layer

140: second insulating layer 150: outer layer circuit

165: via hole 116, 160: via

175: heat dissipation groove 170: heat dissipation pad

Claims (6)

  1. A printed circuit board on which an electronic device is mounted,
    A core substrate having a cavity formed therein and having inner layer circuits formed on both sides of the insulating layer;
    A heat sink housed in the cavity;
    A first insulating layer formed to cover the radiator on one surface of the core substrate;
    A second insulating layer formed on the other surface of the core substrate to cover the radiator;
    A heat dissipation groove formed to expose the heat dissipation body on surfaces of the first insulation layer and the second insulation layer;
    A heat dissipation pad formed on the surfaces of the first insulating layer and the second insulating layer so as to be in contact with the heat dissipating member exposed through the heat dissipating groove, and dissipating heat of the electronic device to the outside through the heat dissipating body; ,
    The size of the heat sink and the heat dissipation pad are each greater than or equal to the size of the electronic device.
  2. delete
  3. The method of claim 1,
    The heat sink is a printed circuit board comprising at least one selected from the group consisting of copper (Cu), aluminum (Al) and Invar (Invar).
  4. A method of manufacturing a printed circuit board that emits heat of an electronic device to the outside,
    Forming a cavity in a core substrate having inner layers formed on both sides of the insulating layer;
    Inserting a heat sink larger than or equal to the size of the electronic device into the cavity;
    Forming a first insulating layer on one surface of the core substrate to cover the radiator;
    Forming a second insulating layer on the other surface of the core substrate to cover the radiator; And
    Forming a heat dissipation pad on the surfaces of the first insulating layer and the second insulating layer, the heat dissipating pad being in contact with the heat dissipating element and having a size equal to or greater than that of the electronic device;
    Forming the heat radiation pad,
    Forming a heat dissipation groove on the surfaces of the first insulating layer and the second insulating layer to expose the heat dissipation body;
    Forming a plating resist layer on the surfaces of the first insulating layer and the second insulating layer to expose the heat dissipation grooves; And
    And plating a conductive material on surfaces of the first insulating layer and the second insulating layer except for the region where the plating resist layer is formed.
  5. The method of claim 4, wherein
    Between forming the cavity and inserting the heat sink,
    Laminating a support tape on the other side of the core substrate;
    Between the step of forming the first insulating layer and the step of forming the second insulating layer,
    Removing the support tape further comprises a printed circuit board manufacturing method.
  6. delete
KR1020070109590A 2007-10-30 2007-10-30 Printed circuit board and method for manufacturing the same KR100976201B1 (en)

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KR20160102727A (en) 2015-02-23 2016-08-31 삼성전기주식회사 Circuit board and manufacturing method thereof
KR20160103221A (en) 2015-02-23 2016-09-01 삼성전기주식회사 Circuit board and manufacturing method thereof
KR20160120481A (en) 2015-04-08 2016-10-18 삼성전기주식회사 Circuit board
KR101758857B1 (en) 2014-10-24 2017-07-18 삼성전기주식회사 Printed circuit board and method of manufacturing the same, and module

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WO2015199394A1 (en) * 2014-06-23 2015-12-30 삼성전기 주식회사 Circuit board and circuit board assembly
KR20160038304A (en) * 2014-09-30 2016-04-07 삼성전기주식회사 Circuit board
JP2017201679A (en) * 2016-02-22 2017-11-09 株式会社Daiwa Method for manufacturing wiring board or wiring board material

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JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
KR100602847B1 (en) * 2004-02-27 2006-07-19 럭스피아 주식회사 ??? mounted a radiator and ??? package using the ??? and method manufacturing them
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KR101758857B1 (en) 2014-10-24 2017-07-18 삼성전기주식회사 Printed circuit board and method of manufacturing the same, and module
KR20160102727A (en) 2015-02-23 2016-08-31 삼성전기주식회사 Circuit board and manufacturing method thereof
KR20160103221A (en) 2015-02-23 2016-09-01 삼성전기주식회사 Circuit board and manufacturing method thereof
KR20160120481A (en) 2015-04-08 2016-10-18 삼성전기주식회사 Circuit board
US9832856B2 (en) 2015-04-08 2017-11-28 Samsung Electro-Mechanics Co., Ltd. Circuit board

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