CN102548221B - Method for manufacturing circuit board - Google Patents
Method for manufacturing circuit board Download PDFInfo
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- CN102548221B CN102548221B CN201010612271.4A CN201010612271A CN102548221B CN 102548221 B CN102548221 B CN 102548221B CN 201010612271 A CN201010612271 A CN 201010612271A CN 102548221 B CN102548221 B CN 102548221B
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- circuit board
- weld pad
- copper
- base plate
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Abstract
The invention discloses a method for manufacturing a circuit body. The method comprises the following steps of: providing an inner layer circuit board comprising a product area and a peripheral area, wherein a first welding pad is formed in the product area, and a first alignment identifier is formed in the peripheral area; dividing the product area into at least two areas which are not superposed; pressing a first copper-clad base plate on one side of the inner layer circuit board; forming a first alignment hole which corresponds to the first alignment identifier one by one; forming a first blind hole in each area by using a plurality of first positioning holes in each area as a positioning reference respectively; manufacturing to form a second welding pad and a second positioning identifier; pressing a second copper-clad base plate; forming a second positioning hole which corresponds to a second alignment identifier one by one; and forming a second blind hole in each area by using a plurality of second positioning holes in each area as a positioning reference respectively.
Description
Technical field
The present invention relates to circuit board making field, relate in particular to a kind of manufacture method of circuit board.
Background technology
Printed circuit board (PCB) is widely used because having packaging density advantages of higher.Application about circuit board refers to document Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High densitymultilayer printed circuit board for HITAC M-880, IEEE Trans.onComponents, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
In prior art, with developing rapidly of circuit board high-density interconnect technology, be used widely in folded hole in circuit board.Folded hole is by mutual stacking formation of blind hole being formed in multilayer conductive circuit.In manufacturing process due to circuit board, need to repeatedly adopt the wet process such as the high-temperature process such as pressing and etching, make in circuit board making process between each layer, to produce different harmomegathus, will cause position deviation between each blind hole in the folded hole that forms.Yet along with the raising of circuit board wiring density, the heelpiece in blind hole (Target pad) designs more and more littlely, it is poor that such deviation will cause making the reliability of the high density circuit board obtain, and have the bad problem of electrical measurement.In order to improve the aligning accuracy between the folded hole of multilayer, aligning accuracy when this need to improve laser punching.
Summary of the invention
Therefore, be necessary to provide a kind of manufacture method of circuit board, can effectively improve the aligning accuracy between the folded hole in circuit board.
To a kind of manufacture method of circuit board be described with embodiment below.
A kind of manufacture method of circuit board, comprise step: provide inner layer circuit board, described inner layer circuit board comprises product area and outer peripheral areas, in described product area, be formed with the first weld pad, described outer peripheral areas is formed with a plurality of the first alignment marks, described inner layer circuit board is divided at least two non-overlapping regions along the wherein line of two the first alignment marks in a plurality of the first alignment marks, and described the first weld pad and described a plurality of the first alignment mark are positioned at the homonymy of described inner layer circuit board; The first copper-clad base plate is closed in a side pressure that is formed with described the first weld pad and the first alignment mark at described inner layer circuit board; Adopt X-ray milling target drone in pressing has the inner layer circuit board of the first copper-clad base plate, to form and the first alignment mark the first registration holes one to one, described the first registration holes runs through described copper-clad base plate and described inner layer circuit board; Take respectively that some or all of to be positioned at a plurality of first registration holes in region described in each be positioning datum, described in each, in region, form the first blind hole, described in each, the first blind hole is all corresponding with described the first weld pad, and the first blind hole inwall forms first coat of metal described in each; In the first copper-clad base plate, make to form the second weld pad and with each first alignment mark adjacent the second alignment mark one by one, described in each, the second weld pad is by first coat of metal and the first weld pad mutual conduction in the first blind hole, and the second alignment mark is formed at described outer peripheral areas; The second copper-clad base plate is closed in a side pressure that is formed with described the second weld pad and the second alignment mark at described the first copper-clad base plate; Adopt X-ray milling target drone to form in the second copper-clad base plate, the first copper-clad base plate and inner layer circuit board and the second alignment mark the second registration holes one to one; And take respectively that some or all of to be positioned at a plurality of second location holes in region described in each be positioning datum, described in each, in region, form the second blind hole, described in each, the second blind hole is all corresponding with described the second weld pad, and the second blind hole inwall forms second coat of metal described in each.
Compared with prior art, the circuit board manufacturing method that the technical program provides, forms a plurality of alignment marks in the periphery of product area, and according to the alignment mark arranging, product area is divided into a plurality of regions.Like this, in carrying out the process of laser punching, can choose the location hole adjacent with each region as positioning datum.In board production process, the technological operations such as pressing or etching easily cause the harmomegathus of circuit board, and the harmomegathus of the larger generation of area changes also greatly.In the technical program, in laser punching process, product area is divided into a plurality of regions and carries out respectively laser punching.Thereby with respect to whole product area, directly form blind hole, can improve the folded hole aligning accuracy in circuit board, improve the reliability in the folded hole of circuit board.
Accompanying drawing explanation
Fig. 1 is the floor map of the inner layer circuit board that provides of the technical program embodiment.
Fig. 2 is the generalized section of the inner layer circuit board II-II along the line of Fig. 1.
Fig. 3 is the generalized section after inner layer circuit board pressing the first copper-clad base plate of Fig. 2.
Fig. 4 is that pressing has in the inner layer circuit board of the first copper-clad base plate and forms the floor map after the first registration holes.
Fig. 5 is that Fig. 4 forms the floor map after the first blind hole.
Fig. 6 is that Fig. 5 is along the generalized section of VI-VI line.
Fig. 7 forms the generalized section after first coat of metal in the first blind hole in Fig. 6.
Fig. 8 is that the first copper foil layer in Fig. 7 forms the generalized section after the second weld pad and the second alignment mark.
Fig. 9 is that the first copper foil layer forms the floor map after the second weld pad and the second alignment mark.
Figure 10 is the generalized section after Fig. 8 pressing the second copper-clad base plate.
Figure 11 is that Figure 10 forms the floor map after the second registration holes.
Figure 12 is that Figure 11 forms the floor map after the second blind hole.
Figure 13 is that Figure 12 is along the generalized section of XIII-XIII line.
Figure 14 is the interior generalized section forming after second coat of metal of the second blind hole of Figure 13.
Figure 15 is that the second copper foil layer in Figure 14 forms the generalized section after the second weld pad.Main element symbol description
The first registration holes 101
The first blind hole 102
First coat of metal 103
The second registration holes 104
The second blind hole 105
Second coat of metal 106
Inner layer circuit board 110
Outer peripheral areas 112
The first conducting wire 114
The first weld pad 115
The first alignment mark 116
The first copper-clad base plate 120
The first insulating barrier 121
The first copper foil layer 122
The second conducting wire 1221
The second weld pad 1222
The second alignment mark 1223
The second copper-clad base plate 130
The second insulating barrier 131
The second copper foil layer 132
The 3rd weld pad 1322
Embodiment
The manufacture method of circuit board the technical program being provided below in conjunction with drawings and Examples is described further.
The manufacture method of the circuit board that the technical program provides comprises the steps:
The first step, sees also Fig. 1 and Fig. 2, and inner layer circuit board 110 is provided.
Inner layer circuit board 110 is for being manufactured with the circuit board of conducting wire.Inner layer circuit board 110 can be single-sided circuit board or double-sided PCB, and it can be also multilayer circuit board.In the present embodiment, the inner layer circuit board 110 of take describes as single-sided circuit board as example.Inner layer circuit board 110 is roughly rectangle, and it comprises and is positioned at the product area 111 in centre position and around the outer peripheral areas 112 of product area 111.In product area 111, be formed with a plurality of circuit board units 1111, each circuit board unit 1111 is corresponding with the formation of a pre-circuit board product of making.
In the present embodiment, inner layer circuit board 110 comprises substrate 113, is formed at lip-deep many first conducting wires 114, a plurality of the first weld pad 115 and a plurality of first alignment mark 116 of substrate 113.Described the first conducting wire 114 and the first weld pad 115 are formed in each circuit board unit 1111 of product area 111 of inner layer circuit board 110, and a plurality of the first alignment marks 116 are formed at the outer peripheral areas 112 of inner layer circuit board 110.
The interior circle that is shaped as that is all formed with the first weld pad 115, the first weld pads 115 of each circuit board unit 1111, the diameter of the first weld pad 115 is 5.5 mil to 8 mils.In the present embodiment, product area 111 is roughly rectangle, and the number of the first alignment mark 116 is 6, is all arranged at outer peripheral areas 112 near the position of product area 111, and every 3 length directions along product area 111 are arranged.Be positioned at the first alignment mark 116 corresponding setting one by one of product area 111 both sides.Be positioned at 3 first alignment marks 116 of product area 111 the same sides, wherein two respectively near the two ends on the long limit of product area 111, and another one is the centre position on the long limit of close product area 111 roughly.Thereby the line of two the first alignment marks 116 in centre position that is positioned at the long limit of product area 111 is divided into adjacent first area 1112 and second area 1113 by inner layer circuit board 110.First area 1112 and second area 113 be interior all has a plurality of circuit board units 1111.Thereby two first alignment marks 116 in centre position that are positioned at the long limit of product area 111 had both been positioned at first area 1112, were also positioned at second area 1113.The size of each the first alignment mark 116 is all identical, and the diameter of each the first alignment mark 116 is 2.0 to 3.5 millimeters.The first alignment mark 116 and the first conducting wire 114 and the first weld pad 115 form by etching simultaneously, and the relative position relation between a plurality of the first alignment marks 116 and the first weld pad 115 is fixed.
Second step, refers to Fig. 3, and the first copper-clad base plate 120 is closed in a side pressure that is provided with the first conducting wire 114 at inner layer circuit board 110.
In the present embodiment, the first copper-clad base plate 120 is single-side coated copper plate (copper cladlaminate), comprises the first insulating barrier 121 and the first copper foil layer 122.A side that the first insulating barrier 121 and inner layer circuit board 110 is provided with to the first conducting wire 114 and the first alignment mark 116 is relative, by the mode of hot pressing, makes described inner layer circuit board 110 and described the first copper-clad base plate 120 in conjunction with as a whole.
The 3rd step, see also Fig. 4, by X-ray milling target drone, in pressing has the inner layer circuit board 110 of the first copper-clad base plate 120, form at least one and described a plurality of the first alignment mark 116 the first registration holes 101 one to one, described the first registration holes 101 runs through described the first copper-clad base plate 120 and described inner layer circuit board 110.
X-ray milling target drone scans the first alignment mark 116 of inner layer circuit board 110 by a side of the first copper foil layer 122 from the first copper-clad base plate 120, and the mode of the position of the first alignment mark 116 correspondences that scanned by machine drilling forms the first registration holes 101.Like this, it is adjacent that first registration holes 101 in the centre position on the long limit of close product area 111 had both been positioned at first area 1112, also be positioned at second area 1113 adjacent, four some or all of four some or all of second areas 1113 that are positioned at that are positioned in the first registration holes 101 of 1112, six of first areas in six the first registration holes 101 that form.The first registration holes 101 is for running through the through hole of the first copper-clad base plate 120 and inner layer circuit board 110.
The 4th step, refer to Fig. 5, Fig. 6 and Fig. 7, the first registration holes 101 that is positioned at described first area 1112 of take is contraposition reference, adopt the interior formation of the first copper-clad base plate 120 of mode 1112 correspondences in first area of laser ablation a plurality of with the first weld pad 115 the first blind hole 102 one to one, with take be positioned at described second area 1113 the first registration holes 101 as contraposition reference, the mode that adopts laser ablation the interior formation of the first copper-clad base plate 120 of second area 1113 correspondences a plurality of with the first weld pad 115 the first blind hole 102 one to one, and at interior formation first coat of metal 103 of described the first blind hole 102, so that described the first weld pad 115 and the first copper foil layer 122 mutual conduction.
At the inwall of the first blind hole 102, form first coat of metal 103 and can adopt the mode of chemical plating or plating to form, described first coat of metal 103 can be copper.
The 5th step, sees also Fig. 8 and Fig. 9, and described the first copper foil layer 122 is made and formed the second conducting wire 1221, the second weld pad 1222 and the second alignment mark 1223.
In the present embodiment, adopt etched mode that the first copper foil layer 122 is made and formed the second conducting wire 1221, the second weld pad 1222 and the second alignment mark 1223.Wherein, the second conducting wire 1221 and the second weld pad 1222 are corresponding with each circuit board unit 1111, each second weld pad 1222 all with first weld pad 115 mutually over against, thereby each second weld pad 1222 and the first coat of metal 103 mutual conduction in corresponding 115 1 the first blind holes 102 of the first weld pad.The second alignment mark 1223 correspondences are formed in outer peripheral areas 112.The number of the second alignment mark 1223 is also 6, the set-up mode of the second alignment mark 1223 is identical with the set-up mode of the first alignment mark 116, each second alignment mark 1223 is all adjacent with first alignment mark 116, but not corresponding with the first registration holes 101.Equally, some or all of four the some or all of second areas 1113 that are positioned at that are positioned in the second alignment mark 1223 of 1112, six of first areas of four in six the second alignment marks 1223.
The 6th step, refers to Figure 10, and the second copper-clad base plate 130 is closed in a side pressure that is formed with the second conducting wire 1221, the second weld pad 1222 and the second alignment mark 1223 at the first copper-clad base plate 120.
The second copper-clad base plate 130 is also single-side coated copper plate, and it comprises the second insulating barrier 131 and the second copper foil layer 132.The second insulating barrier 131 is relative with a side of the second conducting wire 1221 and the second alignment mark 1223, and by the mode of hot pressing, the second copper-clad base plate 130 is combined closely in the second conducting wire 1221 and a side of the second alignment mark 1223.
The 7th step, refer to Figure 11, by X-ray milling target drone, in the second copper-clad base plate 130, the first copper-clad base plate 120 and inner layer circuit board 110, form and described a plurality of the second alignment marks 1223 the second registration holes 104 one to one, described the second registration holes 104 runs through described the second copper-clad base plate 130, the first copper-clad base plate 120 and inner layer circuit board 110.
X-ray milling target drone scans the second alignment mark 1223 by a side of the second copper foil layer 132 from the second copper-clad base plate 130, and the mode of the position of the second alignment mark 1223 correspondences that scanned by machine drilling forms the second registration holes 104.Like this, second registration holes 104 parts in the centre position on the long limit of close product area 111 are positioned at first area 1112, other parts are positioned at second area 1113, four some or all of four some or all of second areas 1113 that are positioned at that are positioned in the second registration holes 104 of 1112, six of first areas in six the second registration holes 104 that form.
The 8th step, refer to Figure 12, Figure 13 and Figure 14, some or all of the second registration holes 104 that is positioned at first area 1112 of take is contraposition reference, adopt the interior formation of the second copper foil layer 132 of mode 1112 correspondences in first area of laser ablation a plurality of with the second weld pad 1222 the second blind hole 105 one to one, some or all of the second registration holes 104 that is positioned at second area 1113 of take is contraposition reference, the mode that adopts laser ablation the interior formation of the second copper-clad base plate 130 of second area 1113 correspondences a plurality of with the second weld pad 1222 the second blind hole 105 one to one, and at interior formation second coat of metal 106 of described the second blind hole 105, so that described the second weld pad 1222 and the second copper foil layer 132 mutual conduction.
The 9th step, refers to Figure 15, and described the second copper foil layer 132 is made and formed the 3rd weld pad 1322.
In the present embodiment, adopt etched mode that the second copper foil layer 132 is made and formed the 3rd conducting wire (not shown) and the 3rd weld pad 1322.Wherein, the 3rd conducting wire 1321 and the 3rd weld pad 1322 are corresponding with each circuit board unit 1111, each the 3rd weld pad 1322 all with second weld pad 1222 mutually over against, thereby each the 3rd weld pad 1322 with corresponding the second weld pad 1222 by the second coat of metal 106 mutual conduction in second blind hole 105.
In the present embodiment, when when making the circuit board in more multi-layered folded hole, can also when forming the 3rd conducting wire, form the 3rd alignment mark, the 3rd alignment mark correspondence is formed in outer peripheral areas.The number of the 3rd alignment mark is also individual, and the set-up mode of the 3rd alignment mark is identical with the set-up mode of the first alignment mark 116, but not corresponding with the first registration holes 101 and the second registration holes 104.Equally, four in six the 3rd alignment marks are adjacent with first area 1112, and four in six the 3rd alignment marks are adjacent with second area 1113.Thereby can repeat the 6th above-mentioned step to the nine steps, thereby obtain the more multi-layered folded hole circuit board that has.
Be understandable that, the mode that in the technical program, the first alignment mark 116, the second alignment mark 1223 and the first registration holes 101 of correspondence and the set-up mode of the second registration holes 104 are not limited to arrange in the present embodiment, the number of setting is also not limited to the number in the present embodiment.When the area of product area 111 is larger, can be when design circuit plate, in the centre of product area, set out an outer peripheral areas, thereby in this outer peripheral areas, form the first alignment mark and second pair of mark, thereby can, in the process of laser punching, product area can be divided into more region.
The circuit board manufacturing method that the technical program provides, forms a plurality of alignment marks in the periphery of product area, and according to the alignment mark arranging, product area is divided into a plurality of regions.Like this, in carrying out the process of laser punching, can choose the location hole adjacent with each region as positioning datum.In board production process, the technological operations such as pressing or etching easily cause the harmomegathus of circuit board, and the harmomegathus of the larger generation of area changes also greatly.In the technical program, in laser punching process, product area is divided into a plurality of regions and carries out respectively laser punching.Thereby with respect to whole product area, directly form blind hole, can improve the folded hole aligning accuracy in circuit board, improve the reliability in the folded hole of circuit board.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (4)
1. a manufacture method for circuit board, comprises step:
Inner layer circuit board is provided, described inner layer circuit board comprises product area and outer peripheral areas, in described product area, be formed with the first weld pad, described outer peripheral areas is formed with six the first alignment marks, in the relative both sides of described product area, be respectively arranged with three the first alignment marks, be arranged in two of three the first alignment marks of product area the same side respectively near the two ends of product area, another is near the centre of product area, described inner layer circuit board is divided into two regions along the line of two the first alignment marks near in the middle of product area, described the first weld pad and described six the first alignment marks are positioned at the homonymy of described inner layer circuit board,
The first copper-clad base plate is closed in a side pressure that is formed with described the first weld pad and the first alignment mark at described inner layer circuit board;
Adopt X-ray milling target drone in pressing has the inner layer circuit board of the first copper-clad base plate, to form and the first alignment mark the first registration holes one to one, described the first registration holes runs through described copper-clad base plate and described inner layer circuit board;
Take respectively that some or all of to be positioned at a plurality of first registration holes in region described in each be positioning datum, described in each, in region, form the first blind hole, described in each, the first blind hole is all corresponding with described the first weld pad, and the first blind hole inwall forms first coat of metal described in each; In the first copper-clad base plate, make to form the second weld pad and with the first alignment mark adjacent a plurality of the second alignment marks one by one, described the first weld pad and the second weld pad mutually over against, described in each, the second weld pad is by first coat of metal and the first weld pad mutual conduction in the first blind hole, and the second alignment mark is formed at described outer peripheral areas;
The second copper-clad base plate is closed in a side pressure that is formed with described the second weld pad and the second alignment mark at described the first copper-clad base plate;
Adopt X-ray milling target drone to form in the second copper-clad base plate, the first copper-clad base plate and inner layer circuit board and the second alignment mark the second registration holes one to one; And
Take respectively that some or all of to be positioned at a plurality of second location holes in region described in each be positioning datum, described in each, in region, form the second blind hole, described in each, the second blind hole is all corresponding with described the second weld pad, and the second blind hole inwall forms second coat of metal described in each.
2. the manufacture method of circuit board as claimed in claim 1, is characterized in that, described the first alignment mark and described the first weld pad form by etching Copper Foil simultaneously, and described the second alignment mark and described the second weld pad form by etching Copper Foil simultaneously.
3. the manufacture method of circuit board as claimed in claim 1, it is characterized in that, the number of described the second alignment mark is also six, in the relative both sides of described product area, be respectively arranged with three the second alignment marks, be arranged in two of three the second alignment marks of product area the same side respectively near the two ends of product area, another is near the centre of product area, and what have respectively four the second alignment marks is some or all ofly positioned at a described region.
4. the manufacture method of circuit board as claimed in claim 1, it is characterized in that, the manufacture method of described circuit board is also included in the step of making the 3rd weld pad in described the second copper-clad base plate, and described the 3rd pad and the second pad are by the second electroplated metal layer mutual conduction in the second blind hole.
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| CN201010612271.4A CN102548221B (en) | 2010-12-29 | 2010-12-29 | Method for manufacturing circuit board |
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| CN201010612271.4A CN102548221B (en) | 2010-12-29 | 2010-12-29 | Method for manufacturing circuit board |
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| CN102548221A CN102548221A (en) | 2012-07-04 |
| CN102548221B true CN102548221B (en) | 2014-04-09 |
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| CN102711395B (en) * | 2012-06-25 | 2014-10-08 | 广州美维电子有限公司 | Pattern transfer processing method of multilayer printed circuit board |
| CN104113983A (en) * | 2013-04-17 | 2014-10-22 | 深南电路有限公司 | Embedded circuit board and manufacture method thereof |
| CN103249252B (en) * | 2013-05-13 | 2015-10-07 | 无锡江南计算技术研究所 | A kind of solder mask exposure accuracy control method |
| CN103943651B (en) * | 2013-08-29 | 2017-09-12 | 上海天马微电子有限公司 | A kind of OLED display and corresponding flexible PCB |
| CN104244589B (en) * | 2014-05-23 | 2017-06-13 | 胜宏科技（惠州）股份有限公司 | A kind of method of raising HDI wiring board exposure accuracies |
| CN104302125A (en) * | 2014-09-28 | 2015-01-21 | 东莞市五株电子科技有限公司 | High-density connected printed circuit board aligning system and method |
| CN104470257B (en) * | 2014-12-12 | 2017-10-13 | 东莞市康庄电路有限公司 | It is a kind of to improve the processing method that pcb board golden finger plugs positional precision |
| CN105430879B (en) * | 2015-12-29 | 2018-03-27 | 广东欧珀移动通信有限公司 | Flexible PCB and terminal |
| CN110337197B (en) * | 2019-05-31 | 2021-10-15 | 深圳市路径科技有限公司 | Manufacturing method of rigid-flexible circuit board and rigid-flexible circuit board |
| CN111315137A (en) * | 2020-02-24 | 2020-06-19 | 丽清汽车科技(上海)有限公司 | Manufacturing process of automobile PCB lamp panel |
| CN112235947A (en) * | 2020-10-09 | 2021-01-15 | 深圳市景旺电子股份有限公司 | Multilayer flexible circuit board and manufacturing method thereof |
| CN113710009B (en) * | 2021-07-30 | 2023-04-11 | 昆山丘钛微电子科技股份有限公司 | Circuit board and manufacturing method thereof |
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| JP3908610B2 (en) * | 2002-06-25 | 2007-04-25 | 大日本印刷株式会社 | Manufacturing method of multilayer wiring board |
| JP2010087168A (en) * | 2008-09-30 | 2010-04-15 | Aica Kogyo Co Ltd | Method for manufacturing multilayer printed circuit board |
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| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
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