JP2015002227A - Multilayer wiring board and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer wiring board having high reliability in which a wiring structure is laminated on a ceramic wiring board at high positional accuracy.SOLUTION: A multilayer wiring board 10 includes a ceramic wiring board 40 having a board main surface 41 and a board rear surface 42, and a wiring structure 20 laminated on the board main surface 41 of the ceramic wiring board 40. The wiring structure 20 includes a plurality of resin insulating layers 22 and 23, a wiring layer 25, and via conductors 26. The resin insulating layers 22 and 23 are each configured by a first resin layer 31 composed of a thermoset resin, and second resin layers 32 laminated on both faces of the first resin layer 31 and composed of a thermoplastic resin. In the wiring structure 20 and the ceramic wiring board 40, fixing holes 52 penetrating through the plurality of insulating resin layers 22 and 23 in those thickness directions until those tip ends reach the inside of the ceramic wiring board 40 are provided, and the fixing holes 52 are filled with a filling material 53 composed of a cured product of a photo-curing resin.

Description

  The present invention relates to a multilayer wiring board comprising a ceramic wiring board having a substrate main surface and a substrate back surface, and a wiring structure laminated on the substrate main surface of the ceramic wiring substrate and having a resin insulating layer, a wiring layer, and a via conductor. And a manufacturing method thereof.

  In recent years, semiconductor integrated circuit elements (IC chips) used as computer microprocessors and the like have become increasingly faster and more functional, with an accompanying increase in the number of terminals and a tendency to narrow the pitch between terminals. . In general, a large number of terminals are densely arranged in an array on the bottom surface of an IC chip. In order to inspect electronic components such as the IC chip, a multilayer wiring board for inspecting electronic components is used.

  As a multilayer wiring board for electronic component inspection, there is a multilayer wiring board in which a wiring structure composed of a plurality of resin insulating layers and a plurality of wiring layers is laminated on the upper side of a ceramic wiring board formed by laminating a plurality of ceramic insulating layers. It has been put into practical use. In this multilayer wiring board, each resin insulation layer and each ceramic insulation layer are provided with via conductors penetrating the insulation layers, and electrical connection between the layers is achieved by the via conductors. Further, when the multilayer wiring board is manufactured, the wiring structure composed of each resin insulating layer is pressure-bonded to the ceramic wiring board by applying heat and pressure with a plurality of resin insulating layers arranged on the ceramic wiring board. ing.

  In this multilayer wiring board, the ceramic wiring board and the resin insulating layer have different coefficients of thermal expansion, so that thermal stress is likely to be applied at the connecting portion between the ceramic wiring board and the resin insulating layer. For this reason, in the connection part of a ceramic wiring board and a resin insulating layer, there exists a concern that a thermal stress will be added and lamination | stacking shift | offset | difference may arise and a wiring may be disconnected. As a countermeasure, a through conductor is provided so as to reach the ceramic wiring board from the upper surface of the lowermost insulating resin layer in the wiring structure, and the lower insulating resin layer wiring layer and the ceramic wiring board wiring layer are formed by the through conductor. Has been proposed (see, for example, Patent Document 1). By providing such a through conductor, the connection strength of the connection portion between the ceramic wiring board and the resin insulating layer is increased, and even when thermal stress is generated, stacking deviation at the connection portion is avoided.

JP 2010-192784 A

  By the way, in the multilayer wiring board, when the wiring structure (plural resin insulating layers) is pressure-bonded to the ceramic wiring board, each resin insulating layer moves as the viscosity decreases due to heating, and the deformation and position of the wiring layer Deviation tends to occur. In the multilayer wiring board described in Patent Document 1, since the through conductor is formed only in the lowermost resin insulation layer, in the resin insulation layer on the upper layer side of the wiring structure, the movement of the resin insulation layer is regulated by the through conductor. Can not do it. Accordingly, in the resin insulating layer on the upper layer side of the wiring structure, the wiring layer is deformed or misaligned with a decrease in viscosity, which may cause problems such as disconnection of the wiring.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a highly reliable multilayer wiring board by laminating a wiring structure on a ceramic wiring board with high positional accuracy. Another object is to provide a method for manufacturing a multilayer wiring board suitable for manufacturing the multilayer wiring board.

  As means (means 1) for solving the above-mentioned problems, a plurality of resin insulation layers, a wiring layer disposed between the plurality of resin insulation layers, and a via hole penetrating the resin insulation layer are provided. A wiring structure having via conductors electrically connected to the wiring layer; a substrate main surface and a substrate back surface; and a through conductor portion that conducts between the substrate main surface and the substrate back surface is provided; A multilayer wiring board having a ceramic wiring board on which the wiring structure is laminated, wherein the wiring structure and the ceramic wiring board penetrate the plurality of insulating resin layers in their thickness direction. Then, there is a multilayer wiring board characterized in that a fixing hole is provided with a tip reaching the ceramic wiring board, and the fixing hole is filled with a filler containing a cured product of a photocurable resin.

  Therefore, according to the invention described in the means 1, the fixing hole is provided through the plurality of insulating resin layers in the thickness direction so that the tip reaches the ceramic wiring substrate, and the photocurable resin is provided in the fixing hole. The filler containing the cured product is filled. In this case, the movement of the wiring structure (the plurality of resin insulating layers) on the ceramic wiring substrate in the planar direction is restricted by the filler in the fixing hole. Therefore, when laminating the wiring structure on the main surface of the ceramic wiring substrate, it is possible to reliably prevent the movement of the resin insulating layer whose viscosity decreases with heating. As a result, in the wiring structure, the deformation and misalignment of the wiring layer disposed between the plurality of resin insulation layers can be prevented, and the problem that the wiring is disconnected as in the conventional multilayer wiring board can be avoided. it can.

  The fixing hole and the filler may be disposed on the outer peripheral side of the region where the wiring layer and the via conductor are formed. If it does in this way, the influence which it has on the electrical property in a multilayer wiring board can be controlled, and the reliability of a multilayer wiring board can fully be secured.

  In the cross section orthogonal to the thickness direction, the area in the fixed hole may be larger than the area in the via hole. In this case, the size of the filler filled in the fixed hole is increased, and the strength of the filler can be sufficiently ensured, so that it is possible to reliably prevent the resin insulating layer from being displaced.

  The resin insulation layer includes a first resin layer made of a thermosetting resin and having a pair of main surfaces, and a second resin layer disposed on at least one main surface of the first resin layer and made of a thermoplastic resin. It may be configured. Moreover, the heat resistance which can endure high temperature rather than the softening temperature of a thermoplastic resin is provided to the filler. In this case, when the wiring structure is laminated, it is heated to a temperature higher than the softening temperature of the thermoplastic resin (second resin layer), but the filler can maintain sufficient strength even at that temperature. Misalignment of the layers can be reliably prevented. In addition, as photocurable resin which comprises a filler, resin materials, such as an epoxy resin and a polyimide resin, can be mentioned.

  The multilayer wiring board may be an IC inspection apparatus substrate. In this case, since the wiring layer in the IC inspection apparatus substrate can be formed with high accuracy, it is possible to reliably inspect IC chips in which a large number of terminals are densely arranged.

  As the resin insulation layer (the first resin layer and the second resin layer), a polyimide-based resin material is usually used, but it may be formed using a resin other than the polyimide-based resin, and has an insulating property and heat resistance. Further, it can be appropriately selected in consideration of moisture resistance and the like. In addition, as the first resin layer of the resin insulation layer, a composite material of resin and organic fibers such as glass fibers (glass woven fabric or glass nonwoven fabric) or polyamide fibers, or a three-dimensional network fluorine-based such as continuous porous PTFE A resin-resin composite material in which a resin base material is impregnated with a thermosetting resin may be used.

  The wiring layer is mainly made of copper, and is formed by a known method such as a subtractive method, a semi-additive method, or a full additive method. Specifically, for example, techniques such as etching of copper foil, electroless copper plating, or electrolytic copper plating are applied. It is also possible to form a wiring layer by etching after forming a thin film by a technique such as sputtering or CVD, or to form a wiring layer by printing a conductive paste or the like.

  Further, as another means (means 2) for solving the above-described problem, there is provided a method of manufacturing the multilayer wiring board according to means 1, wherein a first hole part forming a part of the fixing hole is provided. An insulating sheet with wiring for preparing a plurality of insulating sheets with wiring having the resin insulating layer, the via conductor provided in the via hole of the resin insulating layer, and the wiring layer provided on the surface of the resin insulating layer A preparation step, a ceramic wiring substrate preparation step for preparing a ceramic wiring substrate provided with a second hole portion that forms part of the through conductor portion and the fixing hole, and the wiring structure on the main surface of the substrate. In a state where a plurality of the insulating sheets with wiring are arranged in a stacked manner, by filling the filler into the fixing hole including the first hole portion and the second hole portion communicating with the first hole portion, the wiring structure and Ceramic wiring board A temporary fixing step of temporarily fixing the plurality of resin insulation layers of the wiring structure to the main surface of the substrate by heating and pressing after the temporary fixing step. There is a manufacturing method of a multilayer wiring board characterized in that it is included.

  According to the invention described in Means 2, after the wiring structure and the ceramic wiring board are temporarily fixed by the filler, a plurality of resin insulations of the wiring structure are formed on the main surface of the board by heating and pressing in the laminating step. The layers are crimped together. When the multilayer wiring board is manufactured in this manner, the movement of each resin insulating layer can be prevented by the filler, and therefore deformation and misalignment of the wiring layer disposed between the plurality of resin insulating layers can be prevented. Further, in the present invention, since a plurality of resin insulation layers are pressure-bonded together, the manufacturing process can be simplified and the multilayer wiring board can be shortened as compared with the case where the resin insulation layers are pressure-bonded one by one. Can be manufactured in time.

  In the temporary fixing step, after the uncured photocurable resin is filled in the fixing holes, the photocurable resin is irradiated with ultraviolet rays to be photocured. When the photocurable resin is used in this way, the filler can be easily cured at room temperature, so that workability is improved. In the temporary fixing step, a photocurable resin that has been photocured in advance may be filled in the fixing holes. However, if the photocuring is performed after filling with an uncured photocurable resin, temporary fixing with a cured product of the photocurable resin can be reliably performed, and in order to prevent deformation and misalignment of the wiring layer. This is preferable.

  The first hole and the second hole constituting the fixing hole may have the same diameter or may not have the same diameter. Specifically, the first hole part constituting the fixing hole may be larger in diameter than the second hole part or may be smaller in diameter than the second hole part. For example, when the first hole portion has a smaller diameter than the second hole portion, the deformation and misalignment of the wiring layer can be reliably prevented by the anchor effect of the filler filled in the fixing hole. Moreover, when a 1st hole part is larger diameter than a 2nd hole part, an unhardened photocurable resin can be easily filled in a fixing hole, and the workability | operativity of a temporary fixing process improves.

  The second hole portion constituting the fixing hole may be a hole portion that does not penetrate the ceramic wiring board, and is shallower than the thickness of one ceramic sintered body layer constituting the ceramic wiring board, for example. It may be. In this case, in the fixing hole, it is possible to reliably fill the uncured photocurable resin from the first hole side to the bottom of the second hole portion.

  The filler may be colored in a color different from that of the resin insulating layer, and the colored filler may also serve as an identification mark. In this way, in addition to the temporary fixing function, the filler can be used to identify the recognition mark, and the manufacturing cost of the multilayer wiring board can be reduced compared with the case where the recognition mark is provided separately. .

  Further, the filler may be formed using only a photocurable resin, or may be formed using a material in which a conductive material is included in the photocurable resin (such as a conductive paste).

Sectional drawing which shows schematic structure of the multilayer wiring board in this Embodiment. The top view which shows the multilayer wiring board in this Embodiment. Explanatory drawing which shows the wiring structure preparation process in the manufacturing method of a multilayer wiring board. Explanatory drawing which shows the wiring structure preparation process in the manufacturing method of a multilayer wiring board. Explanatory drawing which shows the wiring structure preparation process in the manufacturing method of a multilayer wiring board. Explanatory drawing which shows the wiring structure preparation process in the manufacturing method of a multilayer wiring board. Explanatory drawing which shows the ceramic wiring board preparation process in the manufacturing method of a multilayer wiring board. Explanatory drawing which shows the ceramic wiring board preparation process in the manufacturing method of a multilayer wiring board. Explanatory drawing which shows the ceramic wiring board preparation process in the manufacturing method of a multilayer wiring board. Explanatory drawing which shows the ceramic wiring board preparation process in the manufacturing method of a multilayer wiring board. Explanatory drawing which shows the temporary fixing process in the manufacturing method of a multilayer wiring board. Explanatory drawing which shows the fixing hole of another embodiment whose 1st hole part is larger diameter than a 2nd hole part. Explanatory drawing which shows the fixing hole of another embodiment whose 1st hole part is smaller diameter than a 2nd hole part. Explanatory drawing which shows the fixing hole of another embodiment which has a taper-shaped 1st hole part and 2nd hole part.

  Hereinafter, an embodiment in which the present invention is embodied in a multilayer wiring board will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing a schematic configuration of the multilayer wiring board of the present embodiment, and FIG. 2 is a top view of the multilayer wiring board.

  A multilayer wiring substrate 10 shown in FIGS. 1 and 2 is a substrate for an IC inspection apparatus for performing an electrical inspection of an IC chip. The multilayer wiring board 10 includes a wiring structure 20 and a ceramic wiring board 40 provided on the lower layer side of the wiring structure 20. The multilayer wiring board 10 is a board having a vertical and horizontal length of about 10 cm and a thickness of about 4 mm. When used, the main surface 11 (upper surface in FIG. 1) of the multilayer wiring board 10 is directed toward an IC chip to be inspected. Arranged.

  The wiring structure 20 includes a plurality of resin insulating layers 22 and 23, a wiring layer 25, and a via conductor 26. The wiring layer 25 is disposed between the plurality of resin insulating layers 22 and 23. Each resin insulating layer 22, 23 is formed with a via hole 29 penetrating between the front surface and the back surface. The via conductor 26 is provided in the via hole 29 and is electrically connected to the wiring layer 25.

  The resin insulating layers 22 and 23 are insulating layers made of polyimide resin, for example. Specifically, the resin insulation layers 22 and 23 include a first resin layer 31 having a pair of main surfaces 33 and 34 and a second resin layer disposed on the main surfaces 33 and 34 of the first resin layer 31. 32. In the present embodiment, the first resin layer 31 constituting the resin insulating layers 22 and 23 is made of a polyimide-based thermosetting resin and has a thickness of about 20 μm. The second resin layer 32 is made of a polyimide-based thermoplastic resin and has a thickness of about 2.5 μm. That is, the thickness of the resin insulating layers 22 and 23 is about 25 μm. The wiring layer 25 is a conductor layer made of, for example, copper and has a thickness of about 5 μm. The via hole 29 and the via conductor 26 of the wiring structure 20 have a circular cross section, and the inner diameter of the via hole 29 and the outer diameter of the via conductor 26 are about 50 μm.

  A plurality of main surface side terminals 35 are formed in an array at the central portion of the main surface 11 of the multilayer wiring substrate 10 (the upper surface of the wiring structure 20) (see FIG. 2). These main surface side terminals 35 are made of, for example, copper and have a thickness of about 5 μm. Further, the main surface side terminal 35 has a circular cross section, and the diameter thereof is set to about 60 μm, for example.

  The ceramic wiring substrate 40 has a substrate main surface 41 and a substrate back surface 42, and the wiring structure 20 is laminated on the substrate main surface 41. A plurality of ceramic insulating layers 43, 44, 45 and a plurality of conductor layers 46 are laminated on the ceramic wiring substrate 40. The ceramic insulating layers 43 to 45 are, for example, alumina sintered bodies, and the conductor layer 46 is, for example, a metallized layer of tungsten, molybdenum, or an alloy thereof. In the ceramic wiring substrate 40, each ceramic insulating layer 43 to 45 has a through hole 48 penetrating in the thickness direction, and a via conductor 49 connected to the conductor layer 46 is formed in the through hole 48. ing. Each through-hole 48 has a circular cross section, and the inner diameter thereof is about 60 μm. Each via conductor 49 also has a circular cross section, and the outer diameter thereof is about 60 μm. The via conductor 49 is made of a metallized layer of tungsten, molybdenum, or an alloy thereof, like the conductor layer 46. Each conductor layer 46 and each via conductor 49 function as a through conductor portion that conducts between the substrate main surface 41 and the substrate back surface 42.

  On the substrate back surface 42 of the ceramic wiring substrate 40 (the back surface 12 of the multilayer wiring substrate 10), a plurality of back surface side terminals 50 are formed in an array over almost the entire area. Each back terminal 50 has a circular cross section, and the diameter of the back terminal 50 is set to about 1.0 mm. A thin film conductor layer 51 is formed on the main surface 41 of the substrate. The conductor layer 51 is made of titanium and / or copper.

  Each back-side terminal 50 of the ceramic wiring board 40 is connected to the via conductor 26 of the wiring structure 20 via the via conductor 49 and the conductor layers 46 and 51, and further the wiring layer 25 and the via conductor 26 of the wiring structure 20 are connected. To the main surface side terminal 35.

  In the multilayer wiring board 10 of the present embodiment, the wiring structure 20 and the ceramic wiring board 40 penetrate through the plurality of resin insulating layers 22 and 23 in the thickness direction and the tip reaches the ceramic wiring board 40. A plurality of fixing holes 52 are provided. These fixing holes 52 are filled with a filler 53 made of a cured product of a photocurable resin. Each fixing hole 52 and each filler 53 are disposed on the outer peripheral side of the region where the wiring layer 25 and the via conductor 26 are formed. Specifically, each fixing hole 52 and each filler 53 are provided in the vicinity of four corner portions in the multilayer wiring board 10. The diameter of the fixing hole 52 is about 100 μm, and is about twice the diameter of the via hole 29. Therefore, in the cross section orthogonal to the thickness direction, the area in the fixing hole 52 (cross-sectional area of the filler 53) is larger than the area in the via hole 29 (cross-sectional area of the via conductor 26).

  In the present embodiment, the first hole 57 on the wiring structure 20 side in the fixing hole 52 and the second hole 58 on the ceramic wiring board 40 side communicating therewith have the same diameter. Furthermore, the second hole 58 on the ceramic wiring substrate 40 side is formed shallower than the thickness of one layer of the ceramic insulating layer 43 (ceramic sintered body layer).

  The filler 53 is provided with heat resistance that can withstand a higher temperature (for example, a temperature of 350 ° C. or higher) than the softening temperature (for example, about 320 ° C.) of the second resin layer 32 made of a thermoplastic resin. In addition, the filler 53 in the present embodiment is made of a material colored in the same color as the resin insulating layers 22 and 23.

  Next, a method for manufacturing the multilayer wiring board 10 in the present embodiment will be described.

  First, an insulating sheet with wiring preparation process is performed. Specifically, as shown in FIG. 3, a copper foil in which a copper foil 63 that becomes the main surface side terminal 35 and the wiring layer 25 is formed on the upper surface 27 of the resin insulating material 61 that becomes the resin insulating layers 22 and 23. The attached resin film 64 is prepared and cut into predetermined dimensions. The resin insulating material 61 is provided on the first resin layer 31 made of a polyimide-based thermosetting resin and on both surfaces (a pair of main surfaces 33 and 34) of the first resin layer 31, and is a polyimide-based thermoplastic resin. The second resin layer 32 is made of. A copper foil 63 having a thickness of 5 μm is attached to the upper surface 27 side of the resin insulating material 61.

  Next, as shown in FIG. 4, via holes 29 penetrating the resin insulating material 61 and the copper foil 63 of the resin film 64 with the copper foil are formed by laser processing. Further, by this laser processing, a first hole 57 that is a through hole that penetrates the resin insulating material 61 and the copper foil 63 and forms a part of the fixing hole 52 is formed. Then, using a paste printing and filling apparatus (not shown), as shown in FIG. 5, the via hole 29 of the resin film 64 is filled with a conductive paste (copper paste) mainly composed of copper powder, and a via conductor is formed. 26 is formed. Thereafter, it is heated at 150 ° C. for 1 hour.

  Then, a photosensitive dry film is attached on the copper foil 63 formed on the upper surface 27 of the resin film 64. Further, an exposure mask in which a wiring pattern of the main surface side terminal 35 is previously formed is disposed on the dry film. Next, after the dry film is exposed through an exposure mask, development is performed, and an etching resist for etching the copper foil 63 is patterned. Also, a photosensitive dry film is attached to the lower surface 28 side of the resin film 64, and an etching resist is formed so as to cover the entire lower surface 28 by the exposure and development described above.

  Thereafter, a portion of the copper foil 63 exposed from the resist pattern of the etching resist is removed by etching to form the main surface side terminal 35. Then, by contacting with the stripping solution, the etching resist remaining on the main surface side terminal 35 is removed, and the etching resist on the lower surface 28 side is removed.

  As a result, as shown in FIG. 6, the insulating sheet 66 with wiring having the resin insulating layer 22, the main surface side terminal 35 as the wiring layer, and the via conductor 26 is formed. Moreover, the insulating sheet 67 with wiring which has the resin insulating layer 23, the wiring layer 25, and the via conductor 26 is formed by performing the process mentioned above similarly. In this manner, a plurality of insulating sheets 66 and 67 with wiring are prepared.

  Next, a ceramic wiring board preparation step is performed. Specifically, a plurality of green sheets are formed using a ceramic material mainly composed of alumina powder. Then, as shown in FIG. 7, laser processing is performed on the plurality of green sheets 71 to form a plurality of through holes 48 at predetermined positions. In addition, by this laser processing, a second hole portion 58 that forms a part of the fixing hole 52 is formed on the upper surface of the green sheet 71 that becomes the uppermost ceramic insulating layer 43. The through hole 48 may be formed by punching, drilling, or the like. The second hole 58 may be formed by punching, drilling, etching, polishing, or the like.

  Thereafter, using a conventionally known paste printing apparatus (not shown), the through holes 48 of each green sheet 71 are filled with a conductive paste (for example, tungsten paste) to form an unfired via conductor 49. Further, the conductive paste 46 is printed by using a conventionally known paste printing apparatus to form the unfired conductor layer 46 and the back-side terminal 50 (see FIG. 8). The order of filling and printing of the conductive paste may be reversed.

  Then, after the conductive paste is dried, the plurality of green sheets 71 are stacked and arranged, and a pressing force is applied in the sheet stacking direction, whereby the green sheets 71 are pressed and integrated to form a ceramic laminate 73. (See FIG. 9). Next, the ceramic laminate 73 is degreased and fired at a predetermined temperature for a predetermined time (firing step). As a result, the alumina of the green sheet 71 and tungsten in the paste are simultaneously sintered, and the ceramic wiring substrate 40 having the via conductor 49, the conductor layer 46, and the second hole 58 is formed. In this way, the ceramic wiring board 40 is prepared.

  Next, titanium and copper are sputtered to form a thin film on the substrate main surface 41, and then exposure and development are performed to form a thin-film conductor layer 51 connected to the via conductor 49 on the substrate main surface 41. (See FIG. 10).

  Thereafter, a temporary fixing step is performed. Specifically, a plurality of insulating sheets 66 and 67 with wirings, which become the wiring structure 20, are disposed on the substrate main surface 41 of the ceramic wiring substrate 40. Here, the first hole 57 of the insulating sheets 66 and 67 with wiring and the second hole 58 of the ceramic wiring substrate 40 are used as alignment marks, and the first hole 57 and the second hole 58 communicate with each other. In such a manner, insulating sheets 66 and 67 with wiring are arranged on the main surface 41 of the substrate so as to overlap each other. As a result, the fixing hole 52 is constituted by the first hole portion 57 of the insulating sheets 66 and 67 with wiring and the second hole portion 58 of the ceramic wiring substrate 40 communicating therewith. In that state, unfixed photocurable resin (for example, epoxy resin) is filled into the fixing hole 52 by using a filling device such as a dispenser device or an inkjet head. Thereafter, the filler 53 of the photocurable resin in the fixing hole 52 is irradiated with ultraviolet rays so that the filler 53 is photocured. In this manner, the wiring structure 20 and the ceramic wiring board 40 are temporarily fixed by filling the fixing holes 52 with the filler 53 made of a cured product of a photocurable resin (see FIG. 11).

After the temporary fixing step, the wiring structure 20 and the ceramic wiring substrate 40 are pressurized at a pressure of about 75 kgf / cm ² while being heated to a temperature of about 350 ° C. (lamination step). By performing this heating and pressurization, the second resin layer 32 of the resin insulating layers 22 and 23 is softened to function as an adhesive layer, and the plurality of resin insulating layers 22 and 22 of the wiring structure 20 are formed on the ceramic wiring substrate 40. 23 is pressed together. As a result, as shown in FIG. 1, the multilayer wiring board 10 in which the wiring structure 20 and the ceramic wiring board 40 are integrated is manufactured.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the multilayer wiring board 10 of the present embodiment, the wiring structure 20 and the ceramic wiring board 40 penetrate the plurality of insulating resin layers 22 and 23 in the thickness direction and the tip thereof is the ceramic wiring board 40. A fixing hole 52 extending inward is provided. The fixing hole 52 is filled with a filler 53 made of a cured product of a photocurable resin. In this case, the movement of the wiring structure 20 (resin insulating layers 22, 23) on the ceramic wiring substrate 40 in the planar direction is restricted by the filler 53 in the fixing hole 52. Therefore, when the wiring structure 20 is laminated, the movement of the resin insulating layers 22 and 23 whose viscosity decreases with heating can be reliably prevented. As a result, deformation and misalignment of the wiring layer 25 disposed between the plurality of resin insulating layers 22 and 23 can be prevented, and the problem of disconnection of wiring as in the conventional multilayer wiring board can be avoided. it can.

  (2) In the multilayer wiring board 10 of the present embodiment, the fixing hole 52 and the filler 53 are disposed on the outer peripheral side with respect to the region where the wiring layer 25 and the via conductor 26 are formed. If it does in this way, the influence which it has on the electrical property in the multilayer wiring board 10 can be suppressed, and the reliability of the multilayer wiring board 10 can fully be ensured.

  (3) In the multilayer wiring board 10 of the present embodiment, the area in the fixing hole 52 is larger than the area in the via hole 29 in the cross section orthogonal to the thickness direction. In this case, the size of the filling material 53 filled in the fixing hole 52 is increased, and the strength of the filling material 53 can be sufficiently ensured, so that the positional displacement of the resin insulating layers 22 and 23 can be reliably prevented. Can do.

  (4) In the multilayer wiring board 10 of the present embodiment, the filler 53 can withstand a higher temperature than the softening temperature of the second resin layer 32 (thermoplastic resin) that functions as an adhesive layer in the resin insulating layers 22 and 23. Heat resistance is given. In this case, when the wiring structure 20 is laminated, the wiring structure 20 is heated to 350 ° C., which is higher than the softening temperature (320 ° C.) of the thermoplastic resin, but the filler 53 can maintain sufficient strength even at that temperature. The displacement of the insulating layers 22 and 23 can be reliably prevented.

  (5) In the present embodiment, in the laminating step, the plurality of resin insulating layers 22 and 23 of the wiring structure 20 are collectively pressure-bonded to the substrate main surface 41 by performing heat and pressure. When the multilayer wiring board 10 is manufactured in this way, the manufacturing process can be simplified and the multilayer wiring board 10 can be manufactured in a short time as compared with the case where the resin insulating layers 22 and 23 are pressure-bonded one by one. Can do.

  (6) In the present embodiment, in the temporary fixing step, after the fixing hole 52 is filled with an uncured photocurable resin, the photocurable resin is irradiated with ultraviolet rays and photocured. When the photocurable resin is used in this way, the filler 53 can be easily cured at room temperature, so that workability is improved.

  (7) In the present embodiment, the first hole 57 in the insulating sheets with wiring 66 and 67 is formed in the same process as the via hole 29. When the first hole 57 and the via hole 29 are formed in the same process as described above, the manufacturing process is simplified and the via hole 29 can be formed with high positional accuracy with respect to the first hole 57.

  In addition, you may change embodiment of this invention as follows.

  In the multilayer wiring board 10 of the above embodiment, the first hole portion 57 and the second hole portion 58 constituting the fixing hole 52 have the same diameter, but the present invention is not limited to this. Specifically, as shown in FIG. 12, the first hole portion 57A constituting the fixing hole 52A may be larger in diameter than the second hole portion 58A, or as shown in FIG. The first hole 57B constituting the fixing hole 52B may have a smaller diameter than the second hole 58B. In the fixing hole 52A of FIG. 12, since the first hole portion 57A has a large diameter, the filling material 53 can be easily filled in the fixing hole 52A. In addition, in the fixing hole 52B of FIG. 13, the second hole 58B has a large diameter, so that the temporary fixing can be more reliably performed by the anchor effect of the filler 53. Further, as shown in FIG. 14, the first hole portions 57C and 57D and the second hole portion 58C constituting the fixing hole 52C are formed in a tapered shape so that the diameter gradually decreases from the upper side to the lower side. May be. Even when the fixing hole 52C is formed in this manner, the filler 53 can be easily filled in the fixing hole 52C.

  In the multilayer wiring board 10 of the above embodiment, the fixing hole 52 is a non-through hole that penetrates only to the main surface 11 side, but may be a through hole that penetrates to the main surface 11 side and the back surface 12 side.

  In the above embodiment, the first hole portion 57 of the fixing hole 52 is formed in the same process as the via hole 29, but may be formed in a separate process. For example, the first hole 57 may be formed by punching, and the via hole 29 may be formed by laser processing.

  In the above embodiment, after the plurality of resin insulating layers 22 and 23 are arranged on the ceramic wiring substrate 40 so as to overlap each other, the first hole portion 57 of each resin insulating layer 22 and 23 and the second of the ceramic wiring substrate 40 are arranged. The filling material 53 is filled in the fixed hole 52 constituted by the hole 58, but the present invention is not limited to this. For example, after filling the fillers 53 into the first holes 57 of the resin insulation layers 22 and 23 and the second holes 58 of the ceramic wiring board 40 by a technique such as screen printing, A plurality of resin insulation layers 22 and 23 may be placed on top of each other. Even in this case, the filler 53 can be filled into the fixing hole 52 of the multilayer wiring board 10.

  In the multilayer wiring board 10 of the above embodiment, the filler 53 filling the fixing hole 52 is colored in the same color as the resin insulating layers 22 and 23, but in a color different from the resin insulating layers 22 and 23. A colored filler may be used, or a colorless and transparent filler may be used. Moreover, although the cross-sectional shape of the fixing hole 52 and the filler 53 (opening shape of the fixing hole 52) is circular, it may be deformed into a quadrangle or a triangle. Further, the cross-sectional shapes of the fixing hole 52 and the filler 53 may be deformed into shapes such as characters or marks indicating product names, product numbers, and the like. Then, by filling the fixing hole 52 with a filler colored in a color different from that of the resin insulating layers 22 and 23, the filler may serve as an identification mark. Furthermore, the formation position, size, and formation number of the fixing hole 52 and the filler 53 may be changed as appropriate.

  In the multilayer wiring board 10 of the above-described embodiment, an alumina sintered body is used as the ceramic insulating layers 43 to 45, but is not limited thereto. For example, glass-ceramic other than alumina may be used. When glass-ceramic is used, the conductor layer 46 and the via conductor 49 are made of silver, copper, or an alloy thereof.

  In the above embodiment, the present invention is embodied in the multilayer wiring board 10 for the IC inspection apparatus. However, the present invention may be embodied in a multilayer wiring board used for other purposes.

  Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the embodiments described above are listed below.

  (1) The multilayer wiring board according to means 1, wherein the filler is colored in a color different from that of the resin insulating layer.

  (2) In the technical idea (1), the colored filler also serves as an identification mark.

  (3) The method of manufacturing a multilayer wiring board according to means 2, wherein the multilayer wiring board is a substrate for an IC inspection apparatus.

  (4) In the method 2, the method of manufacturing a multilayer wiring board, wherein the first hole portion and the second hole portion constituting the fixing hole have the same diameter.

  (5) The method for manufacturing a multilayer wiring board according to (2), wherein the first hole portion constituting the fixing hole has a larger diameter than the second hole portion.

  (6) The method for manufacturing a multilayer wiring board according to (2), wherein the first hole portion constituting the fixing hole has a smaller diameter than the second hole portion.

  (7) The method of manufacturing a multilayer wiring board according to the means 2, wherein the second hole part constituting the fixing hole does not penetrate the ceramic wiring board.

  (8) In the means 2, the second hole part constituting the fixing hole is shallower than the thickness of one ceramic sintered body layer constituting the ceramic wiring board. A method for manufacturing a multilayer wiring board.

DESCRIPTION OF SYMBOLS 10 ... Multilayer wiring board 20 ... Wiring structure 22,23 ... Resin insulating layer 25 ... Wiring layer 26, 49 ... Via conductor 29 ... Via hole 31 ... 1st resin layer 32 ... 2nd resin layer 33, 34 ... 1st resin Layer main surface 40 ... Ceramic wiring board 41 ... Substrate main surface 42 ... Substrate back surface 46 ... Conductor layer 52, 52A to 52C ... Fixing hole 53 ... Filler 57, 57A to 57D ... First hole 58 , 58A-58C ... 2nd hole 66, 67 ... Insulation sheet with wiring

Claims (6)

A wiring structure having a plurality of resin insulation layers, a wiring layer disposed between the plurality of resin insulation layers, and a via conductor provided in a via hole penetrating the resin insulation layer and electrically connected to the wiring layer; ,
A ceramic wiring substrate having a substrate main surface and a substrate back surface, provided with a through conductor portion for conducting between the substrate main surface and the substrate back surface, and wherein the wiring structure is laminated on the substrate main surface. A multilayer wiring board,
The wiring structure and the ceramic wiring substrate are provided with a fixing hole that penetrates the plurality of insulating resin layers in the thickness direction thereof and has a tip reaching the ceramic wiring substrate, and is light-cured in the fixing hole. A multilayer wiring board characterized by being filled with a filler containing a cured product of a conductive resin.   2. The multilayer wiring board according to claim 1, wherein the fixing hole and the filler are arranged closer to an outer peripheral portion side than a region where the wiring layer and the via conductor are formed.   3. The multilayer wiring board according to claim 1, wherein an area in the fixing hole is larger than an area in the via hole in a cross section orthogonal to the thickness direction. The resin insulating layer includes a first resin layer made of a thermosetting resin and having a pair of main surfaces, and a second resin formed on at least one main surface of the first resin layer and made of a thermoplastic resin. Composed of layers,
4. The multilayer wiring board according to claim 1, wherein the filler is provided with heat resistance capable of withstanding a temperature higher than a softening temperature of the thermoplastic resin. 5. A method for producing the multilayer wiring board according to any one of claims 1 to 4,
The resin insulating layer provided with the first hole part forming a part of the fixing hole, the via conductor provided in the via hole of the resin insulating layer, and the wiring layer provided on the surface of the resin insulating layer And a plurality of insulating sheets with wiring to prepare an insulating sheet with wiring,
A ceramic wiring board preparation step of preparing a ceramic wiring board provided with a second hole part forming part of the through conductor part and the fixing hole;
In the state in which a plurality of insulating sheets with wiring to be the wiring structure are disposed on the main surface of the substrate, the filling hole is filled with the first hole and the second hole communicating with the first hole. A temporary fixing step of temporarily fixing the wiring structure and the ceramic wiring board by filling a material;
A multilayer wiring board comprising: a laminating process for collectively pressing the plurality of resin insulating layers of the wiring structure on the main surface of the substrate by performing heat and pressure after the temporary fixing step Production method.   The multilayer wiring according to claim 5, wherein, in the temporary fixing step, after the fixing hole is filled with an uncured photocurable resin, the photocurable resin is irradiated with ultraviolet rays to be photocured. A method for manufacturing a substrate.

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