JP2005175388A - Substrate for multilayer substrate, multilevel metallization board, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain the electrical characteristics of stable interlayer conductivity, in such a way that high lamination accuracy can be acquired by suppressing flow of adhesive layer, when laminating multilayer, and by preventing interlayer deviation. <P>SOLUTION: In one substrate 10 for multilayer substrates, a pierced hole 16 which penetrates insulating substrate (insulated resin layer and adhesive layer 13), is formed at a location located separately from a circuit pattern portion 12, and the hole is filled with a resin composition 17. Further, a projection part 18 for alignment is formed which projects outward from the adhesive layer 13 of the insulating substrate. In the other substrate 20 for multilayer substrates, a concave portion 23, which receives a projecting part 18 for alignment, is formed at a location separately located from a circuit pattern 22. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate for a multilayer board, a multilayer wiring board (multilayer printed wiring board), and a method for manufacturing the same, and more particularly, a wiring pattern of two or more layers used as a wiring board for mounting electronic components, a package board, or the like. The present invention relates to a multilayer wiring board that connects the two and a manufacturing method thereof.

  As electronic devices become lighter, thinner and smaller, semiconductor chips and components are downsized, and terminals have a narrow pitch, wiring boards and package substrates on which electronic components are mounted are also being reduced in mounting area and wiring. At the same time, information-related equipment is required to shorten the wiring distance between components in response to the wider bandwidth of signal frequencies, and multilayered printed circuit boards are essential to achieve high density and high performance. Technology.

  Multi-layer wiring boards can obtain interlayer conduction with conductive paste filled in via holes formed in an insulating substrate (for example, Patent Documents 1 and 2), and the insulating substrate can be made of a flexible material such as polyimide. There exists what was comprised with the resin film (for example, patent document 2).

  With the increase in the density of multilayer wiring boards, miniaturization of wiring pattern portions formed on a wiring board has progressed, and the number of stacked layers tends to increase. In the multilayer wiring board, the lamination accuracy of the wiring board affects the performance of the multilayer wiring board. Therefore, as the number of lamination increases, development of a lamination method with high lamination accuracy is desired.

  As a technique for alignment of multilayer laminations of wiring boards, a pin lamination method (for example, non-patent literature) in which alignment holes are formed in all the wiring boards to be laminated and the holes are laminated through the laminated pins. 1), an alignment method using image processing, a method of combining these, and the like are known. Multi-layer lamination of wiring boards includes a technique of batch lamination using a heatable vacuum press apparatus or the like.

  In the conventional multilayer wiring board, each layer is aligned by various alignment methods prior to multilayer lamination. As shown in FIGS. 9A to 9C, a heatable vacuum press device or the like is used. Adhesive layer 102 that adheres each layer, especially thermoplastic adhesive layer, softens and flows between the layers during multi-layer lamination (heat bonding) using, causing lateral displacement between the layers, resulting in no alignment effect and reduced lamination accuracy Occurs.

  FIG. 9A shows a state before heat bonding, FIG. 9B shows a bonding state in which heat bonding is performed, and FIG. 9C shows a state in which a lateral shift occurs. 9A to 9C, reference numerals 101 and 111 denote insulating base materials, reference numerals 103 and 113 denote wiring patterns made of copper foil or the like, and reference numeral 104 denotes an interlayer conductive portion made of a conductive paste or the like.

  The pin lamination method provides some degree of lateral slip prevention effect, but the presence of clearance between the pin lamination jig and the guide hole of the base material for the multilayer substrate enables high alignment accuracy that is greater than the clearance. This is not possible and there is a limit to improving the stacking accuracy.

  As a conventional multilayer wiring board, as shown in FIGS. 10A and 10B, a connection protrusion 133A is formed on a portion (land portion) of the wiring pattern 133 corresponding to the position of the interlayer conductive portion 124 of the adjacent layer. There is one in which the connection protrusion 133A enters the interlayer conductive portion 124, that is, the conductive paste 124B of the via hole 124A by providing and laminating pressure (for example, Patent Document 3).

  In FIGS. 10A and 10B, 121 and 131 denote insulating substrates, 122 denotes an adhesive layer, and 123 and 133 denote wiring patterns made of copper foil or the like.

In this multilayer wiring board, since the connection protrusion 133A enters the conductive paste 124B of the via hole 124A, the reliability of interlayer conduction is improved, and the effect of suppressing the positional displacement (lateral deviation) between the layers can be expected.
JP-A-6-302957 Japanese Patent Laid-Open No. 9-82835 JP 2000-294931 A Kiyoshi Takagi “Build-up multilayer printed circuit board technology”, published by Nikkan Kogyo Shimbun, June 15, 2001, First edition multilayer circuit board, substrate for multilayer substrate, and method for producing multilayer circuit board

  However, as shown in FIG. 10B, the paste flows out of the via hole 124A by the volume of the connection protrusion 133A entering the conductive paste 124B of the via hole 124A. The paste outflow portion 124C decreases the reliability of electrical connection and causes a decrease in electrical insulation between circuits due to migration. In addition, a process such as plating or half-etching is required to form the connection protrusion 133A, and the manufacturing cost is high.

  The present invention has been made in view of the above. The purpose of the present invention is to suppress the flow of the adhesive layer during multilayer lamination, to prevent interlayer displacement, to obtain high lamination accuracy, and to achieve stable interlayer conduction electricity. It is providing the base material for multilayer substrates which can obtain a characteristic, a multilayer wiring board, and its manufacturing method.

  In the multilayer wiring board according to the present invention, a conductive layer forming a wiring pattern is provided on one surface of an insulating substrate, and a via hole penetrating the insulating substrate is formed at a position continuous with the wiring pattern. A wiring pattern is formed on one surface of the insulating base material and at least one base material for the multilayer substrate, which is in a conductive relationship with the wiring pattern by the conductive resin composition filled in the via hole and obtains interlayer conduction. In a multilayer wiring board in which a multilayer substrate substrate provided with a conductive layer is laminated, one insulating substrate penetrates through the insulating substrate at a position electrically separated from the wiring pattern. A hole is formed, the hole is filled with a resin composition, and the resin composition has an alignment protrusion protruding outward from the other surface of the insulating base, and the other multilayer substrate base For the material, from the wiring pattern Recesses care-apart position for receiving said alignment protrusions are formed.

  In the multilayer wiring board according to this invention, the resin composition filled in the hole and including the alignment protrusion is the same resin composition as the conductive resin composition filled in the via hole, or the hole The resin composition containing the alignment protrusions filled in is a resin composition mixed with a filler made of an inorganic material, or a resin composition having a glass transition temperature lower than that of the conductive resin composition filled in the via holes It can consist of things.

  In addition, the insulating substrate of the multilayer wiring board according to the present invention has a single-layer structure in which the insulating layer also serves as an adhesive layer that performs adhesion between the insulating layers, or an adhesive layer that performs interlayer adhesion with the insulating layers. And a two-layer structure.

  In the multilayer substrate substrate according to the present invention, a conductive layer forming a wiring pattern is provided on one surface of the insulating substrate, and a via hole penetrating the insulating substrate is formed at a position continuous with the wiring pattern. In the multilayer substrate base material filled with the conductive resin composition for interlayer conduction in the via hole, a hole penetrating the insulating base material is formed at a position electrically separated from the wiring pattern, The hole is filled with a resin composition, and the resin composition has an alignment protrusion that protrudes outward from the other surface of the insulating substrate.

  In the method for manufacturing a base material for a multilayer substrate according to the present invention, a conductive layer forming a wiring pattern is provided on one surface of the insulating base material, and a via hole penetrating the insulating base material at a position continuous with the wiring pattern. And at least one multi-layer substrate base material that is electrically connected to the wiring pattern and obtains interlayer conduction by the conductive resin composition filled in the via hole, and one surface of the insulating base material In the manufacturing method of a multilayer wiring board laminated with a substrate for a multilayer substrate provided with a conductive layer forming a wiring pattern on the substrate, the insulation is located at a position electrically separated from the wiring pattern of the substrate for one multilayer substrate. Forming a hole penetrating the insulating substrate, filling the hole with a resin composition, and forming an alignment protrusion protruding outward from the other surface of the insulating substrate by the resin composition And the other process Forming a recess for receiving the alignment protrusion at a position electrically separated from the wiring pattern of the substrate for the layer substrate, and laminating a plurality of multilayer substrate substrates, and the alignment protrusion And a step of fitting the concave portions together, and a step of adhesively bonding a plurality of laminated base materials for a multilayer substrate.

  The method for producing a multilayer wiring board according to the present invention preferably includes a step of temporarily curing to curing the alignment protrusion before the step of laminating a plurality of multilayer substrate base materials.

  In the multilayer wiring board according to the present invention, the alignment protrusion protruding outward from the other surface of the insulating base material is fitted into the concave portion of the multilayer substrate base material of the bonding partner (adjacent layer). Preventive effect can be obtained. Since the alignment protrusions and recesses are electrically separated from the wiring pattern at positions that are electrically separated from the wiring pattern, the positioning and size of the alignment protrusions and recesses are limited. It is possible to freely set an installation site and a size that can effectively prevent the lateral deviation without receiving.

  FIG. 1, FIG. 2 (a), (b), FIG. 3 has shown one Embodiment of the multilayer wiring board by this invention.

  In this embodiment, the multilayer wiring board is a two-layer wiring board composed of an upper multilayer substrate 10 and a lower multilayer substrate 20.

  The multilayer substrate 10 includes an insulating resin layer 11 that forms an insulating substrate, and a wiring pattern portion (conductive layer) 12 made of copper foil or the like on one surface of the insulating resin layer 11. An adhesive layer 13 for interlayer adhesion is formed on the other surface.

  In the FPC (flexible printed circuit board), the insulating resin layer 11 is made of a flexible resin film such as a polyimide film made of wholly aromatic polyimide (API) or a polyester film.

  The three-layer structure of the insulating resin layer 11, the wiring pattern portion 12, and the adhesive layer 13 starts with a general-purpose polyimide substrate with a single-sided copper foil (single-sided copper-clad laminate) on the opposite side of the copper foil. It can be configured by attaching a polyimide adhesive as the adhesive layer 13 to the surface. The adhesive layer 13 made of a polyimide-based adhesive can be formed by attaching a thermoplastic polyimide (TPI) or a film obtained by imparting a thermosetting function to a thermoplastic polyimide.

  The insulating resin layer 11 and the adhesive layer 13 are formed with via holes 14 penetrating them. The via hole 14 is filled with a conductive paste 15 for obtaining interlayer conduction.

  The conductive paste 15 is a paste obtained by mixing a metal powder (conductive filler) having a conductive function such as silver or copper in a thermosetting resin binder such as an epoxy resin with a viscous medium containing a solvent. The conductive resin composition. The conductive paste 15 is filled in the via hole 14 from the side of the adhesive layer 13 by squeezing or the like used in the screen printing method.

  The multilayer substrate base material 20 has an insulating resin layer 21 that forms an insulating base material, and a wiring pattern portion (conductive layer) 22 made of copper foil or the like on one surface of the insulating resin layer 21.

  The insulating resin layer 21 is composed of a flexible resin film such as a polyimide film made of wholly aromatic polyimide (API) or a polyester film, like the insulating resin layer 11 of the multilayer substrate 10.

  A through-hole 16 that penetrates the insulating resin layer 11 and the adhesive layer 13 is formed in the multilayer substrate base material 10 at an independent position electrically separated from the wiring pattern portion 12. The through hole 16 is filled with a resin composition 17, and the resin composition 17 has a columnar alignment protrusion 18 (see FIG. 2A) protruding outward from the adhesive layer 13.

  The resin composition 17 is the same resin composition as that of the conductive resin composition (conductive paste 15) filled in the via hole 14, or a filler mixed with an inorganic material such as silica, or a via hole. 14 can be comprised with thermosetting resin compositions, such as an epoxy resin, whose glass transition temperature is lower than the conductive paste 15 with which 14 was filled. The resin composition 17 that fills the through-hole 16 does not need to have conductivity because it does not aim at interlayer conduction.

  When the resin composition 17 is the same resin composition as the conductive paste 15 filled in the via hole 14, the filling of the conductive paste 15 in the via hole 14 and the resin composition 17 in the through hole 16 are performed. The alignment protrusions 18 can be formed without increasing the number of steps by, for example, one screen printing in the same process as filling.

  When the resin composition 17 is composed of a thermosetting resin composition such as an epoxy resin having a glass transition temperature lower than that of the conductive paste 15 filled in the via hole 14, a temporary curing step of the conductive paste 15 is performed. Thus, the resin composition 17 including the alignment protrusions 18 can be completely cured, and high hardness and mechanical strength can be obtained. When the resin composition 17 is composed of a thermosetting resin composition such as an epoxy resin having a glass transition temperature lower than that of the conductive paste 15 filled in the via hole 14, the filling of the conductive paste 15 and the resin composition The filling of the objects 17 is performed by individual processes, for example, two screen printings.

  Further, when the resin composition 17 is composed of the same thermosetting resin composition as the conductive paste 15 filled in the via hole 14 such as an epoxy resin, only the resin composition 17 in the through hole 16 is used. By heating, the resin composition 17 including the alignment protrusions 18 can be completely cured, and high hardness and mechanical strength can be obtained. The resin composition 17 may be cured by freezing, not by heating.

  Further, when the resin composition 17 is mixed with a filler made of an inorganic material such as silica, the mechanical strength including the compression resistance of the alignment protrusion 18 is improved.

  A bottomed (non-through hole) recess 23 for receiving the alignment projection 18 is formed in the insulating resin layer 21 of the base material 20 for the multilayer substrate at a position away from the wiring pattern 22 (FIG. 2 ( b)). The concave portion 23 can be formed by cutting using a drill or the like, laser processing, etching (half etching), or the like.

  The depth d of the recess 23 may be substantially the same as the protrusion amount e of the alignment projection 18. The inner diameter b of the recess 23 is equal to or slightly larger than the outer diameter a of the alignment projection 18 in consideration of necessary alignment accuracy so that the alignment projection 18 fits into the recess 23. Set to dimensions. The thickness of the insulating resin layer 21 is about 30 to 50 μm, the depth d of the recess 23 and the protrusion amount e of the alignment projection 18 are about 20 μm, and the outer diameter a of the alignment projection 18 is 100 to 100 μm. It is about 200 μm.

  As described above, the resin composition 17 including the alignment protrusion 18 is temporarily cured and cured by heating before the step of laminating the multilayer substrate base materials 10 and 20, and is temporarily cured during the lamination step. The cured alignment projection 18 is fitted into the recess 23.

  By this fitting, interlayer displacement can be prevented, high lamination accuracy can be obtained, and stable electrical characteristics of interlayer conduction can be obtained. Further, since the recess 23 is a non-through hole, the alignment protrusion 18 fitted in the recess 23 is not exposed to the back surface side of the insulating resin layer 21.

  Further, the alignment protrusion 18 and the recess 23 are provided at positions separated from the wiring pattern portions 12 and 22, respectively, so as to be electrically isolated from these wiring patterns. In addition, the arrangement and size of the recess 23 are not restricted, and the installation site and size that can effectively prevent the lateral displacement can be set freely.

  As shown in FIG. 4, the alignment fitting portion 30 of the alignment projection 18 and the recess 23 is around the wiring board product portion A in the manufacturing process and is finally cut off. It is provided in the portion (margin portion) B or, as shown in FIG. 5, in the wiring board product portion A, it is provided at an appropriate position apart from the wiring pattern portions 12 and 22.

  Next, the manufacturing process of the multilayer wiring board according to the present invention will be described with reference to FIGS.

  As shown in FIG. 6A, a general-purpose single-sided copper-clad polyimide substrate (single-sided conductor-clad laminate) 40 is prepared as a starting material. A single-sided copper-clad laminate (CCL) having a copper foil 41 as a conductive layer only on one side of a single-sided copper-clad polyimide substrate 40 and an insulating resin layer 11 made of a polyimide film.

  First, as shown in FIG. 6B, the copper foil 41 of the single-sided copper-clad polyimide substrate 40 is etched to form a wiring pattern portion (copper circuit) 12.

  Next, as shown in FIG. 6 (c), thermoplastic polyimide is bonded to the surface of the insulating resin layer 11 opposite to the wiring pattern portion 12 by a hot press to form an adhesive layer 13. A peelable cover layer 43 made of PEN film, PET film, PI film or the like is bonded to the top.

  Next, as shown in FIG. 6D, a laser beam is irradiated from the cover layer 43 side to an arbitrary position where the interlayer connection is desired, and the vias penetrating the insulating resin layer 11, the adhesive layer 13, and the cover layer 43 are irradiated. While forming the hole 14, the through-hole 16 which penetrates the insulating resin layer 11, the adhesive layer 13, and the cover layer 43 in the position electrically separated from the wiring pattern part 12 and independent of the wiring pattern part 12 is opened.

  In this embodiment, a small hole 14 </ b> A for venting air is formed in the wiring pattern portion 12. The reason why the copper foil 41A is left in the portion of the through-hole 16 is to prevent the conductive paste from dropping off when the conductive paste described later is filled, and is not essential. A small hole 16A for venting air is also formed in the copper foil 41A.

  Next, as shown in FIGS. 6 (e) and 6 (f), the conductive paste 15 is filled in the via holes 14 and the through holes 16 from the cover layer 43 side using the squeegee plate 50. Note that the conductive paste 15 filled in the through holes 16 is labeled as a resin composition 17 for convenience of illustration.

  Next, as shown in FIG. 6G, the conductive paste 15 and the resin composition 17 are temporarily cured, or the difference in glass transition temperature between the conductive paste 15 and the resin composition 17 (resin composition). Only the resin composition 17 is completely cured using the glass transition temperature of the material 17 is lower than the glass transition temperature of the conductive paste 15, and then the cover layer 43 is peeled off and removed. As a result, an interlayer conduction protrusion 15A protruding outward from the adhesive layer 13 is formed at the via hole 14 side on the adhesive layer 13 side, and similarly, from the adhesive layer 13 at the through hole 16 site. An alignment projection 18 projecting outward is formed. The protrusion lengths of the interlayer conductive protrusion 15A and the alignment protrusion 18 are equal to the thickness of the cover layer 43. Thereby, the upper layer base material 10 for multilayer substrates is completed.

  On the other hand, in the base material 20 for the lower multilayer substrate, as shown in FIG. 6 (h), the insulating resin layer is started using a single-sided copper-clad polyimide base material similar to the single-sided copper-clad polyimide base material 40 as a starting material. A wiring pattern portion 22 is formed on one surface of 21 by etching a copper foil.

  Then, as shown in FIG. 6 (i), the depth of the alignment projection 18 is half-etched at a position electrically separated from the wiring pattern portion 22 and independent of the wiring pattern portion 22. A bottomed recess 23 equivalent to the projection length is formed. Thereby, the base material 20 for the lower multilayer board is completed.

  Next, as shown in FIG. 6 (j), the upper multilayer substrate base material 10 and the lower multilayer substrate base material 20 are laminated, and the multilayer substrate base materials 10 and 20 are obtained by image recognition or the like. Next, as shown in FIG. 6 (k), the alignment projection 18 of the upper multilayer substrate base material 10 is formed in the recess 23 of the lower multilayer substrate base material 20. Fit together. The interlayer conduction protrusion 15A hits the wiring pattern portion 22, and the contact electrical resistance for interlayer conduction is reduced.

  In this fitted state, heating and pressurization are performed by a vacuum press machine, and a multilayer wiring board bonded by the adhesive layer 13 is completed.

  During this curing, the alignment protrusion 18 of the upper multilayer substrate base material 10 and the recess 23 of the lower multilayer substrate base material 20 are fitted together. It does not occur.

  Thereby, without using a special instrument or device for preventing displacement, interlayer displacement can be prevented, high lamination accuracy can be obtained, and stable electrical characteristics of interlayer conduction can be obtained.

  In addition, since both the alignment protrusion 18 and the recess 23 are formed in the same process as the conventional one, there is no additional process, and the time required for manufacturing is increased only to prevent misalignment. Absent.

  In the multilayer wiring board according to the present invention, the insulating substrate is not limited to the one having the two-layer structure of the insulating resin layer 11 and the adhesive layer 13 that performs interlayer adhesion as described above. As shown, the insulating base material is composed of an insulating layer 51 having adhesive properties such as thermoplastic polyimide and liquid crystal polymer, and the insulating layer 51 also has a one-layer structure that also serves as an adhesive layer that performs interlayer adhesion. The same applies. 7, parts corresponding to those in FIG. 1 are denoted by the same reference numerals as those in FIG. 1, and description thereof is omitted.

  Examples of the insulating layer 51 having adhesiveness include thermoplastic polyimide (TPI), a thermoplastic polyimide provided with a thermosetting function, and a liquid crystal polymer.

  Further, the recess 23 is not limited to the bottomed non-through hole, and may be provided by a through hole penetrating the insulating resin layer 21 as shown in FIG.

It is sectional drawing which shows one Embodiment of the multilayer wiring board by this invention. (A), (b) is an expanded sectional view of the principal part of the multilayer wiring board by one Embodiment. It is an expansion perspective view of the principal part of the multilayer wiring board by one embodiment. 1 is an overall plan view showing one embodiment of a multilayer wiring board according to the present invention. It is a whole top view which shows other embodiment of the multilayer wiring board by this invention. (A)-(k) is process drawing which shows the manufacturing process of one Embodiment of the multilayer wiring board by this invention. It is sectional drawing which shows other embodiment of the multilayer wiring board by this invention. It is sectional drawing which shows other embodiment of the multilayer wiring board by this invention. (A)-(c) is sectional drawing which shows the prior art example of a multilayer wiring board. (A), (b) is sectional drawing which shows the prior art example of a multilayer wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Base material 11 for multilayer substrates Insulating resin layer 12 Wiring pattern part 13 Adhesive layer 14 Via hole 15 Conductive paste 16 Through-hole 17 Resin composition 18 Positioning protrusion 20 Multilayer substrate base material 21 Insulating resin layer 22 Wiring pattern Part 23 concave part 30 alignment fitting part 40 single-sided copper-clad polyimide base material 51 insulating layer

Claims (8)

A conductive layer forming a wiring pattern is provided on one surface of the insulating substrate, and a via hole penetrating the insulating substrate is formed at a position continuous with the wiring pattern, and the via hole is filled with the conductive material. A multilayer substrate provided with at least one base material for a multilayer substrate in a conductive relationship with the wiring pattern by the resin composition and obtaining interlayer conduction, and a conductive layer forming the wiring pattern on one surface of the insulating base material In a multilayer wiring board laminated with a base material for use,
One multilayer substrate is formed with a hole penetrating the insulating substrate at a position electrically separated from the wiring pattern, the hole is filled with a resin composition, and the resin composition is Having an alignment protrusion protruding outward from the other surface of the insulating base;
A multilayer wiring board in which a recess for receiving the positioning projection is formed at a position electrically separated from the wiring pattern on the other multilayer substrate base material.   The multilayer wiring board according to claim 1, wherein the resin composition filled in the hole and including the alignment protrusion is the same resin composition as the conductive resin composition filled in the via hole.   The multilayer wiring board according to claim 1, wherein the resin composition including the alignment protrusions filled in the holes is mixed with a filler made of an inorganic material.   4. The multilayer according to claim 1, wherein the resin composition filled in the hole and including the alignment protrusion is a resin composition having a glass transition temperature lower than that of the conductive resin composition filled in the via hole. Wiring board.   The insulating base material has a single-layer structure that also serves as an adhesive layer that has adhesiveness and an insulating layer performs interlayer adhesion, or has a two-layer structure that includes an insulating layer and an adhesive layer that performs interlayer adhesion. Item 5. The multilayer wiring board according to any one of Items 1 to 4. A conductive layer forming a wiring pattern is provided on one surface of the insulating base material, and a via hole penetrating the insulating base material is formed at a position continuous with the wiring pattern. In the base material for a multilayer substrate filled with the conductive resin composition,
A hole penetrating the insulating base material is formed at a position electrically separated from the wiring pattern, the hole is filled with a resin composition, and the resin composition is outside the other surface of the insulating base material. A base material for a multilayer substrate having an alignment projection protruding in the direction. A conductive layer forming a wiring pattern is provided on one surface of the insulating substrate, and a via hole penetrating the insulating substrate is formed at a position continuous with the wiring pattern, and the via hole is filled with the conductive material. A multilayer substrate provided with at least one base material for a multilayer substrate in a conductive relationship with the wiring pattern by the resin composition and obtaining interlayer conduction, and a conductive layer forming the wiring pattern on one surface of the insulating base material In the manufacturing method of the multilayer wiring board laminated with the base material for use,
Forming a hole penetrating the insulating base material at a position electrically separated from the wiring pattern of the base material for one multilayer substrate; and
Filling the hole with a resin composition, and forming the alignment protrusion protruding outward from the other surface of the insulating base by the resin composition;
Forming a recess for receiving the alignment protrusion at a position electrically separated from the wiring pattern of the other multilayer substrate base material;
A step of laminating a plurality of base materials for a multi-layer substrate, and fitting the positioning projections and the recesses;
Adhering and bonding a plurality of laminated base materials for a multilayer substrate;
The manufacturing method of the multilayer wiring board which has this. The method for manufacturing a multilayer wiring board according to claim 7, further comprising a step of temporarily curing to curing the alignment protrusion before the step of laminating a plurality of multilayer substrate base materials.

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