JP6058321B2 - Wiring board manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a wiring board including a resin insulating layer, a wiring conductor layer formed on the surface of the resin insulating layer, and a through conductor penetrating the wiring conductor layer and the resin insulating layer.

  In recent years, semiconductor integrated circuit elements (IC chips) used as computer microprocessors and the like have become increasingly faster and more functional, with an accompanying increase in the number of terminals and a tendency to narrow the pitch between terminals. . In general, a large number of terminals are densely arranged in an array on the bottom surface of an IC chip. In order to inspect electronic components such as the IC chip, a wiring board for inspecting electronic components is used.

  As a wiring board for inspecting electronic components, a resin insulation portion formed by laminating a plurality of resin insulation layers and a plurality of conductor layers on the upper layer side of a ceramic substrate portion obtained by laminating a plurality of ceramic insulation layers and a plurality of conductor layers. The formed wiring board has been put into practical use. In this electronic component inspection wiring board, each ceramic insulating layer and each resin insulating layer are provided with through conductors (via conductors) penetrating the insulating layers, and electrical connection between the layers is achieved by the through conductors. .

  FIG. 10 shows a connection example between the through conductor 102 formed so as to penetrate the resin insulating layer 101 in the thickness direction and the wiring conductor layer 103 formed on the surface of the resin insulating layer 101 in the wiring substrate 100. Yes. In the wiring substrate 100 of FIG. 10, a through hole 104 penetrating the resin insulating layer 101 and the wiring conductor layer 103 is formed, and the through conductor 102 is formed in the through hole 104 (see, for example, Patent Document 1). That is, the side surface of the end portion of the through conductor 102 is formed so as to contact the inner wall surface of the through hole 104 provided in the wiring conductor layer 103. Such a wiring board 100 is manufactured by the following method. Specifically, first, a resin film with a copper foil in which a copper foil is attached to the surface of the resin insulating layer 101 is prepared. Next, a through hole 104 that penetrates the resin insulating layer 101 and the copper foil of the resin film is formed by laser hole machining or the like, and the through hole 104 is filled with a conductive paste. Thereafter, the copper foil of the resin film is patterned by, for example, a subtractive method to form the wiring conductor layer 103, and the through conductor 102 connected to the wiring conductor layer 103 is formed.

JP 2011-228727 A JP 2009-43917 A

  By the way, in the wiring board 100, the through conductor 102 and the wiring conductor layer 103 are connected via the side surface of the end portion of the through conductor 102, but the area of the side surface is small and the adhesion strength is weakened. In particular, in the wiring substrate 100 in which the wiring conductor layer 103 is increased in density and miniaturization, the wiring conductor layer 103 is formed thin, and the size of the through conductor 102 tends to be reduced. In such a case, the adhesion strength between the through conductor 102 and the wiring conductor layer 103 is weakened. When the wiring conductor layer 103 is formed by patterning of copper foil and the through conductor 102 is formed of a conductive paste, the shrinkage rate between the through conductor 102 (conductive paste) and the wiring conductor layer 103 (copper foil). Is different. Due to the difference in shrinkage rate, a gap is generated at the interface between the wiring conductor layer 103 and the through conductor 102. For this reason, there arises a problem that an open defect (disconnection) is likely to occur near the interface between the through conductor 102 and the wiring conductor layer 103.

  Patent Document 2 discloses a method of forming a via conductor in a bottomed hole having a conductor layer as a bottom. Here, a copper plating layer is formed at the bottom of the bottomed hole, and a conductive paste is filled in the bottomed hole. Thus, by interposing the plating layer at the interface between the conductor layer and the via conductor, the connection reliability between the conductor layer and the via conductor is enhanced. However, since the via hole forming the via conductor is a bottomed hole, there arises a problem that a plating residue or a cleaning liquid residue adheres to the corner of the via conductor or a defective filling of the conductive paste occurs.

  The present invention has been made in view of the above problems, and an object of the present invention is to improve the adhesion between the through conductor and the wiring conductor layer, and to manufacture a wiring board with excellent connection reliability. It is to provide a manufacturing method.

As means (means 1) for solving the above problems, there are a resin insulating layer, a wiring conductor layer formed on the surface of the resin insulating layer, and a through hole penetrating the wiring conductor layer and the resin insulating layer. e Bei a conductor, said resin insulating layer, a first resin layer made of a thermosetting polyimide resin, are formed on both surfaces of the first resin layer, a second resin layer of a thermoplastic polyimide resin And a preparation step of preparing a resin film in which a metal layer to be the wiring conductor layer is formed on one side or both sides of the resin insulating material to be the resin insulating layer. And forming a through hole penetrating the wiring conductor layer obtained by patterning the metal layer or the metal layer and the resin insulating layer, filling the through hole with a conductive paste, and heating. The wiring A through conductor forming step for forming the through conductor for connecting to a body layer, and an average on the end surface of the through conductor in which a gap is generated at a boundary portion with the metal layer due to heating in the through conductor forming step A fine particle conductor arranging step of forming a fine particle conductor layer using a conductive paste containing a fine particle conductor having a particle diameter smaller than the average particle diameter of the conductor particles contained in the conductive paste and not more than 1 μm; A plurality of resin insulation layers including at least one resin insulation layer on which the fine particle conductor layer is formed are stacked and heated and pressed to unify the plurality of resin insulation layers, and the metal layer A conductor layer made of the fine particle conductor is formed by inserting the dissolved fine particle conductor into the gap at the boundary portion between the wiring conductor layer and the through conductor obtained by pattern formation. There is a method for manufacturing a wiring board including an interposing conductor adhesion step.

  According to the invention described in the means 1, even when the shrinkage rates of the through conductor and the wiring conductor layer are different and a gap is formed at the interface between them, the conductor layer made of the fine particle conductor can be reliably interposed at the interface. . As a result, the problem that an open defect (disconnection) occurs near the interface between the wiring conductor layer and the through conductor as in the prior art can be avoided, and a wiring board having excellent connection reliability can be manufactured.

  In the fine particle conductor arranging step, the fine particle conductor layer may be formed in a circular shape or an annular shape in a plan view so as to cover a boundary portion between the metal layer or the wiring conductor layer and the through conductor on the end face of the through conductor. In this way, the conductor layer made of the fine particle conductor can be reliably interposed at the interface between the metal layer or the wiring conductor layer and the through conductor on the end face of the through conductor.

  In the fine particle conductor arranging step, the diameter of the fine particle conductor layer in plan view is formed to be 1.0 to 3.0 times the diameter of the through hole. The fine particle conductor layer may be formed so that the surface area is larger than the area of the end face of the through conductor and completely covers the entire end face. In this way, the conductor layer made of the fine particle conductor can be reliably interposed at the interface with the metal layer or the wiring conductor layer on the end face of the through conductor.

  The average particle diameter of the fine particle conductor may be 1/3 or less of the average particle diameter of the conductor particles contained in the conductive paste forming the through conductor. In this case, the fine particle conductor surely enters the gap between the conductor grains constituting the through conductor, and the adhesion between the through conductor and the wiring conductor layer can be improved.

  The wiring board is provided on a lower layer side of the resin insulation part, in which a plurality of resin insulation layers and a plurality of wiring conductor layers are laminated, and a plurality of ceramic insulation layers and a plurality of conductor layers are laminated. The wiring board for electronic component inspection provided with a ceramic substrate part may be sufficient. In this case, since a lamination process for laminating and integrating a plurality of resin insulation layers on which wiring conductor layers are formed can be performed as a conductor adhesion process, the manufacturing cost of the electronic component inspection wiring board can be kept low. Can do. Furthermore, since the connection reliability between the wiring conductor layer and the through conductor in the wiring board for inspecting electronic components can be ensured, it is possible to reliably inspect electronic components in which a large number of terminals are densely arranged.

  In the fine particle conductor arranging step, the conductive paste containing the fine particle conductor may be applied using an inkjet head. In this case, the conductive paste containing the fine particle conductor can be quickly and accurately applied to the end face of the through conductor having a relatively small diameter.

  The thickness of the fine particle conductor layer may be 1.0 to 2.0 times that of the metal layer. With such a thickness, the volume of the fine particle conductor layer can be sufficiently secured, and the conductor layer made of the fine particle conductor can be reliably interposed in the gap between the through conductor and the wiring conductor layer.

  Moreover, when the thickness of the metal layer in the resin film is 10 μm or less, the wiring board can be densified and miniaturized.

  In the preparation step, a resin film with a metal foil in which a metal foil as a metal layer is attached to the surface of the resin insulating material may be prepared. Moreover, in a preparatory process, you may prepare the resin film which formed the plating layer and sputter | spatter layer as a metal layer on the surface of the resin insulating material.

Configuration In the above invention, dendritic fat insulating layer, a first resin layer made of a thermosetting polyimide resin, are formed on both surfaces of the first resin layer, the second resin layer of a thermoplastic polyimide resin Ru is. In this case, since the second resin layer functions as an adhesive layer by applying pressure and heating, a multilayer wiring board in which a plurality of resin insulating layers are integrated can be reliably manufactured.

  The resin insulating layer may be formed using a resin other than a polyimide-based resin, and can be appropriately selected in consideration of insulation, heat resistance, moisture resistance, and the like. In addition, the resin insulation layer is formed on a composite material of resin and glass fiber (glass woven fabric or glass nonwoven fabric) or organic fiber such as polyamide fiber, or a three-dimensional network fluorine resin base material such as continuous porous PTFE. A resin-resin composite material impregnated with a curable resin may be used.

Sectional drawing which shows schematic structure of the wiring board for electronic component inspection in this Embodiment. Explanatory drawing which shows the through-hole formation process of a ceramic substrate part. Explanatory drawing which shows the formation process of the via conductor of a ceramic substrate part, and a conductor layer. Explanatory drawing which shows the lamination process of a ceramic substrate part. Explanatory drawing which shows the preparation process of a resin film. Explanatory drawing which shows the formation process of a penetration conductor. Explanatory drawing which shows the formation process of a wiring conductor layer. Explanatory drawing which shows a fine particle conductor arrangement | positioning process. Explanatory drawing which shows the lamination process as a conductor contact | adherence process. Explanatory drawing which shows the conventional wiring board.

  Hereinafter, an embodiment in which the present invention is embodied in an electronic component inspection wiring board will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing a schematic configuration of an electronic component inspection wiring board according to the present embodiment.

  An electronic component inspection wiring board 10 shown in FIG. 1 is a component used in a part of an inspection apparatus for performing an electrical inspection of an IC chip. The electronic component inspection wiring board 10 includes a resin insulating portion 20 and a ceramic substrate portion 30 provided on the lower layer side of the resin insulating portion 20. The electronic component inspection wiring substrate 10 is a substrate having a length and width of about 10 cm and a thickness of about 4 mm, and the main surface 11 (the surface of the resin insulating portion 20) of the wiring substrate 10 is an inspection target in use. Arranged toward the electronic component.

  A plurality of ceramic insulating layers 31, 32, 33 and a plurality of conductor layers 34 are laminated on the ceramic substrate portion 30. The ceramic insulating layers 31 to 33 are, for example, alumina sintered bodies, and the conductor layer 34 is, for example, a metallized layer of tungsten, molybdenum, or an alloy thereof. In the ceramic substrate portion 30, each ceramic insulating layer 31 to 33 is formed with a through hole 36 penetrating in the thickness direction, and a via conductor 37 connected to the interlayer conductor layer 34 is formed in the through hole 36. Is formed. Each through-hole 36 has a circular cross section, and the inner diameter thereof is about 60 μm. Each via conductor 37 also has a circular cross section, and the outer diameter thereof is about 60 μm. The via conductor 37 is made of a metallized layer of tungsten, molybdenum, or an alloy thereof, similarly to the conductor layer 34. Further, on the back surface 12 of the wiring substrate 10 (the back surface of the ceramic substrate portion 30), a plurality of back-side terminals 38 are formed in an array over almost the entire area. Each back terminal 38 has a circular cross section, and the diameter of the back terminal 38 is set to about 1.0 mm.

  A plurality of resin insulation layers 21 and 22 and a plurality of wiring conductor layers 23 are laminated on the resin insulation portion 20. The resin insulating layers 21 and 22 are insulating layers made of, for example, a polyimide resin. Specifically, the resin insulating layers 21 and 22 are formed on both surfaces of the first resin layer 24 made of a polyimide-based thermosetting resin and the first resin layer 24, and are made of a second resin made of a polyimide-based thermoplastic resin. And a resin layer 25. In the present embodiment, the thickness of the first resin layer 24 constituting the resin insulating layers 21 and 22 is about 20 μm, and the thickness of the second resin layer 25 is about 5 μm. That is, the resin insulating layers 21 and 22 are about 30 μm. The wiring conductor layer 23 is a conductor layer made of, for example, copper and has a thickness of about 5 μm. In the resin insulating portion 20, a through hole 26 penetrating the resin insulating layers 21 and 22 and the wiring conductor layer 23 is formed, and a via conductor 27 (connected to the interlayer wiring conductor layer 23 in the through hole 26 ( (Through conductor) is formed. The through hole 26 and the via conductor 27 of the resin insulating portion 20 also have a circular cross section. The inner diameter of the through hole 26 and the outer diameter of the via conductor 27 are about 50 μm.

  In addition, a plurality of main surface side terminals 28 (component connection terminals) constituting the wiring conductor layer 23 are formed in an array at a central portion on the main surface 11 (surface of the resin insulating portion 20) of the wiring board 10. ing. The main surface side terminal 28 has a circular cross section, and its diameter is set to about 60 μm, for example. These main surface side terminals 28 are connected to the inner wiring conductor layer 23 through via conductors 27, and are further connected to the back surface side terminals 38 through conductor layers 34 and via conductors 37 of the ceramic substrate portion 30. In the present embodiment, a conductor layer 29 made of a fine particle conductor is interposed in the boundary portion between the wiring conductor layer 23 and the via conductor 27 in the resin insulating portion 20, so that the adhesion between the wiring conductor layer 23 and the via conductor 27 is sufficient. It is secured.

  Next, a method for manufacturing the electronic component inspection wiring board 10 in the present embodiment will be described.

  First, a plurality of green sheets are formed using a ceramic material mainly composed of alumina powder. Then, a plurality of through holes 36 are formed at predetermined positions by drilling the plurality of green sheets 41 by laser irradiation processing, punching processing, drill processing, or the like (see FIG. 2). Thereafter, a conductive paste (for example, tungsten paste) is filled in the through holes 36 of each green sheet 41 by using a conventionally known paste printing apparatus (not shown), and an unfired via conductor 37 is formed. Further, using a conventionally known paste printing apparatus, the conductive paste is printed to form the unfired conductor layer 34 and the back-side terminal 38 (see FIG. 3). The order of filling and printing of the conductive paste may be reversed.

  Then, after the conductive paste is dried, the plurality of green sheets 41 are stacked and disposed, and a pressing force is applied in the sheet stacking direction, whereby the green sheets 41 are bonded and integrated to form a ceramic laminate 43. (See FIG. 4). Next, the ceramic laminate 43 is degreased and fired at a predetermined temperature for a predetermined time. As a result, the alumina of the green sheet 41 and the tungsten in the paste are simultaneously sintered, and the ceramic substrate portion 30 is formed.

  Moreover, the resin insulation part 20 is produced with the following method. Specifically, as shown in FIG. 5, copper having a copper foil 47 to be the wiring conductor layer 23 formed on one surface 46 (upper surface in FIG. 5) of the resin insulating material 45 to be the resin insulating layers 21 and 22. A resin film 48 with foil is prepared (preparation step). The resin insulating material 45 includes a first resin layer 24 made of a polyimide-based thermosetting resin, and a second resin layer 25 made of a polyimide-based thermoplastic resin disposed on both surfaces of the first resin layer 24. Composed. A copper foil 47 having a thickness of 5 μm is attached to the upper surface 46 side of the resin insulating material 45.

  Next, the through hole 26 penetrating the resin insulating layer 22 and the copper foil 47 is formed by laser processing. Further, using a paste printing apparatus (not shown), as shown in FIG. 6, a conductive paste (copper paste) mainly composed of copper powder is filled in the through holes 26 of the resin film 48, and a resin insulating layer is formed. 22 is heated to a temperature of about 180 ° C. to form a via conductor 27 (through conductor) (through conductor forming step).

  Then, the wiring conductor layer 23 is formed on the resin insulating layer 22 by patterning the copper foil 47 of the resin film 48 by a subtractive method (see FIG. 7). Specifically, a dry film is laminated on the upper surface 46 and the lower surface 49 of the resin insulating material 45, and the dry film is exposed and developed. Thereby, an etching resist is formed on the lower surface 49 of the resin insulating layer 22 so as to cover the entire surface, and an etching resist having a predetermined pattern is formed on the upper surface 46 of the resin insulating layer 22. In this state, the wiring conductor layer 23 is formed on the resin insulating layer 22 by performing patterning by etching on the copper foil 47 of the resin film 48. Thereafter, by contacting with the stripping solution, the etching resist remaining on the wiring conductor layer 23 is removed, and the etching resist on the back surface 49 side is removed.

  Thereafter, as shown in FIG. 8, a conductive paste containing fine particle conductors is applied to the upper and lower end surfaces of the via conductors 27 using an ink jet head (not shown) to form the fine particle conductor layer 51 (see FIG. 8). Fine particle conductor placement process). Here, copper particles having an average particle size smaller than the average particle size of the conductor particles contained in the conductive paste (via conductor 27) used in the through conductor forming step and 1 μm or less are used as the fine particle conductor. The average particle diameter of the conductive paste used in the through conductor forming step is 3 μm or more, and the fine particle conductor forming the fine particle conductor layer 51 is 1/3 or less of the average particle diameter. The fine particle conductor layer 51 is a circular conductor layer in a plan view, and has a diameter of 1.0 to 3.0 times (specifically, 50 μm to 150 μm) of the through hole 26. . That is, the fine particle conductor layer 51 has a surface area larger than the area of the end face of the via conductor 27 and is formed so as to completely cover the entire end face. The fine particle conductor layer 51 is formed with a thickness of 5 μm to 10 μm.

  Through these steps, the resin insulating layer 22 having the wiring conductor layer 23, the via conductor 27 connected to the conductor layer 23, and the fine particle conductor layer 51 is formed. Moreover, the resin insulation layer 21 which has the main surface side terminal 28, the via conductor 27 connected to the terminal 28, and the fine particle conductor layer 51 is formed by performing the preparation process-fine particle conductor arrangement | positioning process mentioned above similarly. .

Next, the resin insulating layer 21 and the resin insulating layer 22 are laminated on the upper side of the ceramic substrate portion 30 and are pressurized at a pressure of about 75 kgf / cm ² while being heated to a temperature of about 350 ° C. (conductor adhesion process). . As a result, as shown in FIG. 1, the electronic component inspection wiring substrate 10 in which the resin insulating portion 20 to which the resin insulating layers 21 and 22 are bonded and the ceramic substrate portion 30 are integrated is manufactured. Further, the fine particle conductor contained in the fine particle conductor layer 51 is melted by the heating at this time, and enters the gap between the wiring conductor layer 23 and the via conductor 27. As a result, as shown in FIG. 9, the conductor layer 29 made of the fine particle conductor is interposed between the wiring conductor layer 23 and the via conductor 27 and the boundary portion. Further, a part of the fine particle conductor is fixed to the wiring conductor layer 23 and the via conductor 27 and the adhesion between the wiring conductor layer 23 and the via conductor 27 is improved.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the present embodiment, after the fine particle conductor layer 51 is formed on the end surface of the via conductor 27 in the fine particle conductor arrangement step, the via conductor 27 and the fine particle conductor layer 51 are heated in the conductor contact step. Pressurized together. In this way, even if the shrinkage rates of the wiring conductor layer 23 and the via conductor 27 are different and there is a gap at the interface between them, the conductor layer 29 made of a fine particle conductor can be reliably interposed at the interface. As a result, the problem that an open defect (disconnection) occurs in the vicinity of the interface between the wiring conductor layer 23 and the via conductor 27 as in the prior art is avoided, and the wiring board 10 for inspecting electronic components excellent in connection reliability is manufactured. can do.

  (2) In the present embodiment, in the fine particle conductor arranging step, the circular fine particle conductor layer 51 in plan view is formed so as to cover the boundary portion between the wiring conductor layer 23 and the via conductor 27 on the end surface of the via conductor 27. Is formed. Since the fine particle conductor forming the fine particle conductor layer 51 is made of nano-order fine particles, it is melted at a relatively low temperature by heating in the conductor contact process, and the gap between the wiring conductor layer 23 and the via conductor 27 is surely filled. Can do. Therefore, the wiring conductor layer 23 and the via conductor 27 can be reliably connected.

  (3) In the present embodiment, the diameter of the fine particle conductor layer 51 in plan view is formed to be 1.0 to 3.0 times the diameter of the through hole 26. In this case, the surface area of the fine particle conductor layer 51 is larger than the area of the end surface of the via conductor 27, and the entire end surface can be completely covered by the fine particle conductor layer 51. When the fine particle conductor layer 51 is formed in this manner, the conductor layer 29 made of the fine particle conductor can be reliably interposed at the interface between the wiring conductor layer 23 and the via conductor 27 in the conductor contact process.

  (4) In the present embodiment, the average particle diameter of the fine particle conductor forming the fine particle conductor layer 51 is 1/3 or less of the average particle diameter of the conductor particles included in the conductive paste forming the via conductor 27. In this case, the fine particle conductor surely enters the gap between the conductor grains constituting the via conductor 27, and the adhesion between the wiring conductor layer 23 and the via conductor 27 can be improved.

  (5) In the case of the present embodiment, a conductive paste containing a fine particle conductor is applied using an inkjet head to form the fine particle conductor layer 51. In this case, the conductive paste can be applied quickly and accurately to the end face of the via conductor 27 having a relatively small diameter.

  (6) In the electronic component inspection wiring substrate 10 of the present embodiment, the resin insulating layers 21 and 22 are formed on both surfaces of the first resin layer 24 made of a polyimide-based thermosetting resin and the first resin layer 24. The second resin layer 25 is made of a polyimide-based thermoplastic resin. In this case, since the second resin layer 25 functions as an adhesive layer by performing pressurization and heating in the conductor adhesion process, the wiring substrate 10 in which the plurality of resin insulating layers 21 and 22 are integrated is reliably manufactured. Can do.

  (7) Since the via conductor 27 is formed by filling the through hole 26 with the conductive paste in the electronic component inspection wiring substrate 10 of the present embodiment, the conventional technique for filling the bottomed hole with the conductive paste. Such poor filling of the conductive paste does not occur. Further, since it is not necessary to form a plating layer between the conductor layer and the via conductor as in the prior art, the problem of plating residue and cleaning liquid residue adhering to the corner of the through hole 26 is avoided.

  In addition, you may change embodiment of this invention as follows.

  In the above embodiment, the electronic component inspection wiring substrate 10 including the resin insulating portion 20 and the ceramic substrate portion 30 is embodied. However, the present invention may be embodied in a wiring substrate used for other applications. . For example, the present invention may be embodied at the time of manufacturing a multilayer wiring board composed of a plurality of resin insulating layers, or may be embodied at the time of manufacturing a wiring board composed of a single resin insulating layer. In the case of manufacturing a wiring board made of a single resin insulating layer, a copper foil in which a copper foil 47 to be the wiring conductor layer 23 is formed on both the upper surface 46 and the lower surface 49 of the resin insulating material 45 in the preparation step. The attached resin film 48 is prepared. Then, similarly to the above embodiment, a through conductor forming step is performed, and after the wiring conductor layer 23 is patterned on the upper surface 46 and the lower surface 49 of the resin insulating material 45 by a subtractive method, the fine particle conductor arranging step is performed. In this fine particle conductor arrangement step, the fine particle conductor layer 51 is formed on the upper end surface and the lower end surface of the via conductor 27. Thereafter, a resin insulating material 45 is laminated on the ceramic substrate portion 30 and heated and pressed to interpose a conductor layer 29 made of a fine particle conductor at the boundary between the wiring conductor layer 23 and the via conductor 27. Even when the wiring board is manufactured in this manner, the adhesion between the wiring conductor layer 23 and the via conductor 27 can be improved, and the connection reliability can be improved.

  In the above embodiment, in the conductor contact process, the conductor layer 29 made of the fine particle conductor is interposed in the boundary portion between the wiring conductor layer 23 and the via conductor 27 by heating and pressurizing, but the present invention is limited to this. It is not a thing. In the conductor contact process, only heating or only pressurization may be performed.

  -In the said embodiment, although the copper paste comprised including a copper powder was used as an electrically conductive paste, it is not limited to this. A metal paste other than copper, for example, a silver paste containing silver powder may be used, or a conductive paste containing copper powder and silver powder may be used. Furthermore, you may use what contains different metal powder by the conductive paste used at a through-conductor formation process, and the conductive paste used at a fine particle conductor arrangement | positioning process. Specifically, for example, when the via conductor 27 is formed of copper paste and the fine particle conductor layer 51 is formed of silver paste, the fine particle conductor of the fine particle conductor layer 51 is dissolved by heating, and a part of the via conductor 27 and the wiring are formed. Metal bonds are formed with the metal particles constituting the conductor layer 23. For this reason, the adhesion between the via conductor 27 and the wiring conductor layer 23 is improved, and the connection reliability is improved.

  In the above embodiment, in the fine particle conductor arranging step, the fine particle conductor layer 51 is formed by applying the conductive paste containing the fine particle conductor using the inkjet head. However, the present invention is not limited to this. For example, the fine particle conductor layer 51 may be formed by applying a conductive paste containing a fine particle conductor using a dispenser device or the like. Furthermore, the fine particle conductor layer 51 may be formed by other methods such as a printing method.

  Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the embodiments described above are listed below.

  (1) Production of a wiring board characterized in that, in the means 1, the average particle diameter of the fine particle conductor is 1/3 or less of the average particle diameter of conductor particles contained in the conductive paste forming the through conductor. Method.

  (2) In the means 1, in the fine particle conductor arranging step, the fine particle conductor layer has a surface area larger than an area of the end face of the through conductor, and is formed so as to completely cover the entire end face. A method for manufacturing a wiring board.

  (3) The method for manufacturing a wiring board according to means 1, wherein the conductive paste containing the fine particle conductor is applied using an inkjet head.

  (4) A method of manufacturing a wiring board according to means 1, wherein, in the fine particle conductor arranging step, a fine conductive layer is formed by applying a conductive paste on an end face of the through conductor.

  (5) The method for manufacturing a wiring board according to means 1, wherein the thickness of the fine particle conductor layer is 1.0 to 2.0 times that of the metal layer.

  (6) The method for manufacturing a wiring board according to means 1, wherein the fine particle conductor contains silver powder and / or copper powder.

  (7) A method of manufacturing a wiring board according to means 1, wherein the metal layer has a thickness of 10 μm or less.

  (8) The method for manufacturing a wiring board according to the method 1, wherein in the preparation step, a resin film with a metal foil is prepared by attaching a metal foil as the metal layer on the surface of the resin insulating material.

  (9) In the means 1, the wiring board is provided on a lower layer side of the resin insulating portion in which a plurality of the resin insulating layers and the plurality of wiring conductor layers are laminated, and a plurality of ceramic insulating layers. A wiring board for inspecting electronic components comprising a ceramic substrate portion on which a layer and a plurality of conductor layers are laminated, wherein the conductor adhesion step comprises laminating the plurality of resin insulation layers on which the wiring conductor layers are formed. A method of manufacturing a wiring board, which is a lamination process for integration.

  (10) In means 1, the resin insulation layer is formed on both surfaces of the first resin layer made of polyimide thermosetting resin and the first resin layer, and made of polyimide thermoplastic resin. A method of manufacturing a wiring board, comprising: a layer.

DESCRIPTION OF SYMBOLS 10 ... Wiring board for electronic component inspection as a wiring board 21, 22 ... Resin insulating layer 23 ... Wiring conductor layer 26 ... Through hole 27 ... Via conductor as penetrating conductor 28 ... Main surface side terminal constituting wiring conductor layer 29 ... Conductor layer made of fine particle conductor 45 ... resin insulating material 46 ... upper surface as one surface of resin insulating material 47 ... copper foil as metal layer 48 ... resin film 49 ... lower surface as one surface of resin insulating material 51 ... fine particle conductor layer

Claims (3)

A resin insulating layer, wherein a resin insulating layer wiring conductor layer formed on the surface of, e Bei a through conductor that passes through the wiring conductor layer and the resin insulating layer, the resin insulation layer is a polyimide heat A method of manufacturing a wiring board comprising a first resin layer made of a curable resin and a second resin layer formed on both surfaces of the first resin layer and made of a polyimide-based thermoplastic resin ,
A preparation step of preparing a resin film in which a metal layer to be the wiring conductor layer is formed on one side or both sides of the resin insulating material to be the resin insulating layer;
While forming a through hole penetrating the wiring conductor layer obtained by patterning the metal layer or the metal layer and the resin insulating layer, filling the through hole with a conductive paste, heating, A through conductor forming step of forming the through conductor for connecting to the wiring conductor layer;
On the end face of the through conductor in which a gap is generated at the boundary with the metal layer due to heating in the through conductor forming step, the average particle diameter is smaller than the average particle diameter of the conductor grains contained in the conductive paste. And a fine particle conductor disposing step of forming a fine particle conductor layer using a conductive paste containing a fine particle conductor of 1 μm or less,
A plurality of resin insulation layers including at least one resin insulation layer in which the through conductors and the fine particle conductor layers are formed are stacked and heated while being pressed, thereby integrating the plurality of resin insulation layers, Conductor in which the dissolved fine particle conductor is inserted into the gap at the boundary portion between the wiring conductor layer and the through conductor obtained by patterning the metal layer and the conductor layer made of the fine particle conductor is interposed. A method for manufacturing a wiring board, comprising: an adhesion step.   In the fine particle conductor arranging step, the fine particle conductor layer is formed in a circular shape or an annular shape in plan view so as to cover a boundary portion between the metal layer or the wiring conductor layer and the through conductor on the end surface of the through conductor. The method of manufacturing a wiring board according to claim 1.   3. The method of manufacturing a wiring board according to claim 2, wherein a diameter of the fine particle conductor layer in a plan view is 1.0 to 3.0 times the diameter of the through hole.

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